CN204538014U - A kind of COB binding board - Google Patents
A kind of COB binding board Download PDFInfo
- Publication number
- CN204538014U CN204538014U CN201420791633.4U CN201420791633U CN204538014U CN 204538014 U CN204538014 U CN 204538014U CN 201420791633 U CN201420791633 U CN 201420791633U CN 204538014 U CN204538014 U CN 204538014U
- Authority
- CN
- China
- Prior art keywords
- thickness
- lead frame
- aluminium lamination
- copper foil
- foil layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a kind of COB binding board, it is characterized in that comprising with lower component: substrate, lead frame (6), chip (8) and column (7), described substrate comprises the first aluminium lamination (1) from bottom to top successively, composite plate (2), the second aluminium lamination (3), insulating barrier (4) and copper foil layer (5).The utility model structure is simple, reasonable in design, easy to operate, has high practicality.
Description
Technical field
The utility model patent relates to a kind of COB binding board.
Background technology
Electronic product is to high density future development, and COB encapsulation has been integrated product main in industry, because the difficulty of encapsulation technology is comparatively large, and the volume production of little COB binding board in industry.
COB encapsulate key technology with routing and sizing shaped, refer to and exposed body circuit chip encapsulated, form the processing procedure of electronic component.
The connection of crystal chip encapsulation completing circuit, the function that competence exertion is existing, use black colloid by chip package after general binding, be implanted in the circuit of speciality by the measured wafer body of survey, be then connected in FPC with gold thread by wafer circuit, this bonding process gold thread and FPC need good adhesion, the reliability of guarantee product, compare with SMT, not only increase package power density, and reduce packaging thermal resistance.
Utility model content
The object of the utility model patent is to provide a kind of COB binding board, it is characterized in that comprising with lower component: substrate, lead frame (6), chip (8) and column (7);
Described substrate comprises the first aluminium lamination (1) from bottom to top successively, composite plate (2), second aluminium lamination (3), insulating barrier (4) and copper foil layer (5), the thickness of described first aluminium lamination is 1-5mm, and the thickness of composite plate (2) is 2-6mm, and the thickness of the second aluminium lamination (3) is 2-6mm, the thickness of insulating barrier (4) is 2-4mm, and the thickness of copper foil layer (5) is 1-3mm;
Described lead frame (6) is positioned at the top of copper foil layer (5), the both sides of this lead frame (6) have column (7), described chip (8) is positioned at the middle part of lead frame (6), this chip (8) is fixed on lead frame (6) by crystal-bonding adhesive (9), is connected between described chip (8) and lead frame (6) by bonding line (11).
Described lead frame (6) is fixed on copper foil layer (5) by solder(ing) paste (10).
The material of described column (7) is PPA.
Described crystal-bonding adhesive (9) is selected from LED crystal-bonding adhesive.
The thickness of described first aluminium lamination is 1.5mm, and the thickness of composite plate (2) is 3mm, and the thickness of the second aluminium lamination (3) is 2mm, and the thickness of insulating barrier (4) is 2.5mm, and the thickness of copper foil layer (5) is 1.2mm.
Beneficial effect:
1, the utility model structure is simple, reasonable in design, easy to operate, has high practicality, and COB package strength promotes;
2, the substrate of multi-layer material is adopted, instead of only adopt the compound of aluminium sheet and copper foil layer, adopt the structure of adding composite plate in the middle of aluminium lamination, save material greatly, thickness in addition for two aluminium laminations has made further restriction, and the thickness through large quantifier elimination first aluminium lamination is 1.5mm, and the thickness of composite plate (2) is 3mm, the thickness of the second aluminium lamination (3) is 2mm, and the cost performance of this basal plate can be made the highest;
3, described crystal-bonding adhesive is selected from LED crystal-bonding adhesive chip can be made more to be fixed.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with specific embodiment, set forth the utility model further.
A kind of COB binding board, is characterized in that comprising with lower component: substrate, lead frame (6), chip (8) and column (7);
Described substrate comprises the first aluminium lamination (1) from bottom to top successively, composite plate (2), second aluminium lamination (3), insulating barrier (4) and copper foil layer (5), the thickness of described first aluminium lamination is 1-5mm, and the thickness of composite plate (2) is 2-6mm, and the thickness of the second aluminium lamination (3) is 2-6mm, the thickness of insulating barrier (4) is 2-4mm, and the thickness of copper foil layer (5) is 1-3mm;
Described lead frame (6) is positioned at the top of copper foil layer (5), the both sides of this lead frame (6) have column (7), described chip (8) is positioned at the middle part of lead frame (6), this chip (8) is fixed on lead frame (6) by crystal-bonding adhesive (9), is connected between described chip (8) and lead frame (6) by bonding line (11).
This bonding line is circular at the upper solder joint shape of lead frame (6), its size is set as the 2.6-2.7 of bonding line wire diameter doubly, the bonding strength between bonding line and lead frame is effectively enhanced through this set, and the impact that the less effective reduction solder joint of this solder joint brings;
Described lead frame (6) is fixed on copper foil layer (5) by solder(ing) paste (10).
The material of described column (7) is PPA.
Described crystal-bonding adhesive (9) is selected from LED crystal-bonding adhesive.
The thickness of described first aluminium lamination is 1.5mm, and the thickness of composite plate (2) is 3mm, and the thickness of the second aluminium lamination (3) is 2mm, and the thickness of insulating barrier (4) is 2.5mm, and the thickness of copper foil layer (5) is 1.2mm.
Should be understood that these embodiments are only not used in restriction scope of the present utility model for illustration of the utility model.In addition should be understood that those skilled in the art can make various changes or modifications the utility model, and these equivalent form of values fall within the application's appended claims limited range equally after the content of having read the utility model instruction.
Claims (5)
1. a COB binding board, is characterized in that, comprises with lower component: substrate, lead frame (6), chip (8) and column (7);
Described substrate comprises the first aluminium lamination (1) from bottom to top successively, composite plate (2), second aluminium lamination (3), insulating barrier (4) and copper foil layer (5), the thickness of described first aluminium lamination is 1-5mm, and the thickness of composite plate (2) is 2-6mm, and the thickness of the second aluminium lamination (3) is 2-6mm, the thickness of insulating barrier (4) is 2-4mm, and the thickness of copper foil layer (5) is 1-3mm;
Described lead frame (6) is positioned at the top of copper foil layer (5), the both sides of this lead frame (6) have column (7), described chip (8) is positioned at the middle part of lead frame (6), this chip (8) is fixed on lead frame (6) by crystal-bonding adhesive (9), is connected between described chip (8) and lead frame (6) by bonding line (11).
2. a kind of COB binding board as claimed in claim 1, is characterized in that, described lead frame (6) is fixed on copper foil layer (5) by solder(ing) paste (10).
3. a kind of COB binding board as claimed in claim 1, is characterized in that, the material of described column (7) is PPA.
4. a kind of COB binding board as claimed in claim 1, is characterized in that, described crystal-bonding adhesive (9) is selected from LED crystal-bonding adhesive.
5. a kind of COB binding board as claimed in claim 1, it is characterized in that, the thickness of described first aluminium lamination is 1.5mm, the thickness of composite plate (2) is 3mm, the thickness of the second aluminium lamination (3) is 2mm, the thickness of insulating barrier (4) is 2.5mm, and the thickness of copper foil layer (5) is 1.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420791633.4U CN204538014U (en) | 2014-12-12 | 2014-12-12 | A kind of COB binding board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420791633.4U CN204538014U (en) | 2014-12-12 | 2014-12-12 | A kind of COB binding board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204538014U true CN204538014U (en) | 2015-08-05 |
Family
ID=53751984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420791633.4U Expired - Fee Related CN204538014U (en) | 2014-12-12 | 2014-12-12 | A kind of COB binding board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204538014U (en) |
-
2014
- 2014-12-12 CN CN201420791633.4U patent/CN204538014U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161012 Address after: 518101, Guangdong, Shenzhen, Baoan District Songgang Street East community field fog fog Gang Huafeng hi tech park, No. 1 building, two floor Patentee after: Shenzhen poly imaging Co., Ltd. Address before: 518105, Guangdong, Shenzhen, Baoan District Songgang Street East community, Daejeon Industrial Zone (colorful section) A1 building, B District, two, third floor Patentee before: Shenzhen United Opto-Electronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150805 Termination date: 20161212 |