CN105916354A - Power supply module with cofferdam - Google Patents
Power supply module with cofferdam Download PDFInfo
- Publication number
- CN105916354A CN105916354A CN201610347491.6A CN201610347491A CN105916354A CN 105916354 A CN105916354 A CN 105916354A CN 201610347491 A CN201610347491 A CN 201610347491A CN 105916354 A CN105916354 A CN 105916354A
- Authority
- CN
- China
- Prior art keywords
- cofferdam
- electronic devices
- components
- band
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a power supply module with a cofferdam, which comprises a bottom plate, a cofferdam arranged around the bottom plate, multiple supporting columns with screw holes arranged on the bottom plate, a circuit board fixed on the supporting columns via screws, electronic elements arranged on the upper surface and the lower surface of the circuit board, a lower heat conductive adhesive layer filling the cofferdam to fill the lower surface of the circuit board and an upper heat conductive adhesive layer laying the upper surface of the circuit board and surrounding the electronic elements. Cooling can be well carried out, normal operation of the power supply module is protected, and the service life of the power supply module is longer.
Description
Technical field
The present invention relates to the power module in band cofferdam, particularly relate to the power module method in the band cofferdam of a kind of good heat dispersion performance.
Background technology
Owing to the electric drive energy has environmental protection, the various advantages such as energy-conservation, therefore, open power module is widely used in the eco-friendly power source cars such as pure electric automobile, hybrid-electric car and forklift.Owing to the conversion of electrically driven (operated) energy needs acting, the conversion of power can make converter (core is: electronic devices and components) produce heat, increase along with the working time, the heat of converter is also required to conduction release, existing power module cannot be carried out dispelling the heat well, the power module temperature when acting making electric automobile is too high, affects service life.
Summary of the invention
The present invention is to solve technical problem present in above-mentioned prior art, propose the power module in a kind of band cofferdam, the cofferdam of including: base plate, being located at base plate surrounding, be located at multiple support columns of band screw on base plate, the circuit board being fixed by screws on described support column, be located at the electronic devices and components on the upper and lower surface of circuit board, fill and in cofferdam, fill the lower heat conduction glue-line of full circuit board lower surface and be paved with circuit board upper surface and be centered around the upper heat conduction glue-line of electronic devices and components surrounding.
In the technical program, the electronic devices and components of described circuit board lower surface are divided into the electronic devices and components of band metal shell and the electronic devices and components of non-metal shell.
Preferably, described base plate is provided with the dielectric film corresponding with the electronic devices and components position of described band metal shell, described dielectric film is provided with the electronic devices and components with described band metal shell and carries out the U-lag of interference fit, and described lower heat conduction glue-line is laid on described dielectric film and is centered around described U-lag surrounding.
Preferably, described base plate is provided with the electronic devices and components edge to described non-metal shell and carries out spacing frame portion, being provided with the heat conduction mud layer that the electronic devices and components bottom connection with described non-metal shell touches in described frame portion area defined, described lower heat conduction glue-line is centered around described heat conduction mud layer surrounding.
Preferably, described base plate is formed around multiple fixing hole, and described cofferdam caves inward at described fixing hole and forms the curved surface being perpendicular to described base plate, makes described fixed hole position outside the scope that cofferdam is surrounded.
The present invention uses the bottom surface large area laminating of power module to carry out heat conduction, the heat that the space filled between heat radiation of heat-conducting glue/cream comes out it is borrowed in the open power module conducting band cofferdam between aluminum and aluminum, aluminum and ferrum, metal and metal, the temperature making the open power module in band cofferdam is maintained at one can be with the level of steady operation, electronic device in the open power module in anti-leukorrhagia stopping cofferdam damages because heat radiation is bad, and increases the service life.Wherein, heat-conducting glue/cream acts on the increase thermal conducting function of the products such as electronic devices and components, processor, radiator, blind, protection against the tide, the effect such as shockproof；Make the open power module energy sufficiently wetting contact surface in band cofferdam, thus radiating efficiency is more superior than other series products a lot.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the base plate of tape insulation film of the present invention；
Fig. 2 is the base plate schematic diagram in band U-lag of the present invention and frame portion；
Fig. 3 is the first sectional view after the present invention installs；
Fig. 4 is the second sectional view after the present invention installs.
Detailed description of the invention
Principle and structure to the present invention are described in detail below in conjunction with the accompanying drawings.
As shown in Figures 1 to 4, the power module in the band cofferdam that one embodiment of the invention provides, this power module is open power module, and concrete structure includes base plate 1, base plate 1 is formed around surrounding into base plate 1 cofferdam 2 of an enclosed environment, can be used to fill heat-conducting glue.
According to safety requirement; conducting metal and component's feet on circuit board 3 are more than 2.0mm to casing distance; therefore on base plate, it is provided with the support column 4 of multiple band screw; circuit board 3 can be fixed by screws on support column 4; these support columns 4 are except the height of location and installation circuit board 3, it is also possible to the edges of boards of locating circuit board 3 and the distance in cofferdam, while protection device; have passed through high-voltage breakdown test, meet the safety distance of automobile.The upper and lower surface of circuit board 3 is provided with electronic devices and components, can fill heat conduction glue-line on full at the lower surface of cofferdam interior circuit board, then proceed to encapsulating, be paved with the upper heat conduction glue-line being centered around electronic devices and components surrounding at circuit board 3 upper surface.
Wherein, the electronic devices and components of circuit board 3 lower surface are divided into the electronic devices and components of band metal shell and the electronic devices and components of non-metal shell.On base plate 1, the electronic devices and components position corresponding with band metal shell is fixed with dielectric film 5, U-lag 9 is set on dielectric film 5, this U-lag carries out interference fit with the electronic devices and components of band metal shell, lower heat conduction glue-line is laid on dielectric film and is centered around U-lag surrounding, conduct heat to discharge on the open base plate in band cofferdam, making power module can significantly reduce temperature, thus the time of the open power module in band cofferdam work can be longer, the life-span is the most longer.
Base plate 1 carries out spacing multiple frame portions 6 to the electronic devices and components edge of non-metal shell, these frame portions 6 are provided with the heat conduction mud layer 10 that the electronic devices and components bottom connection with non-metal shell touches in surrounding region one by one, lower heat conduction glue-line is centered around heat conduction mud layer surrounding, the heat-conducting effect of heat conduction mud is better than heat-conducting glue, the electronic devices and components of these not easy heat radiation can be carried out quick conductive, it is ensured that the operating temperature of electronic devices and components is within normal range.
Circuit board under the electronic devices and components that circuit board upper surface has is provided with through hole, and base plate is provided with being provided with boss 8 in the through hole on circuit board, and boss is provided with heat conduction mud layer, and the electronic devices and components that heat conduction mud is positioned at through hole with circuit board upper surface contact.
Base plate is formed around multiple fixing hole 7, and cofferdam caves inward at fixing hole and forms the curved surface being perpendicular to base plate, makes described fixed hole position outside the scope that cofferdam is surrounded.In addition, suitably increasing screw fastening in the centre of product is feasible program, be also required to cofferdam prevents encapsulating from leaking outside simultaneously, therefore can be provided with the installation stud contour with cofferdam in cofferdam, and this scheme allows the flatness of large area coating surface obtain more preferable solution；The effect of reinforcement can be played with cofferdam, thus meet and answer mechanics, make the open power module in band cofferdam when vigorous exercise, remain the fastening of conceptual location, meet so safety demand, make product obtain optimal fixed solution.
Cofferdam can be when encapsulating, accumulation liquid glue solidifies at weir internal solid, under meeting heat dissipation for circuit board demand, the height in cofferdam can determine that the number of encapsulating amount, the Solid Solidification heat-conducting glue filled in cofferdam can distribute outside heat from the teeth outwards, can conduct heat on base plate, base plate go conduction or release, so that device is difficult to burn on the circuit board of the open power module in band cofferdam, the performance of power supply is made most preferably to be ensured.
The power module of the present invention can protect temperature too high, at AC-DC power source change circuit, DC-DC power source translation circuit, drives and produce huge heat release control when crossing stream, overvoltage.Wherein: AC-DC power conversion is belonging to charged state, it is by being electrolysed, dissociate, recombining, makes electric energy be converted into chemical energy and be stored in the battery；Thus the heat that power supply produces is transmitted on the housing of open power module in band cofferdam by heat-conducting glue, heat is passed to extraneous release by heat conduction shell；DC-DC power source converts and is belonging to discharge condition, it is that chemical energy dress is changed to electric energy, electric energy is exported in circuit by power supply frequency conversion, vehicle-mounted when motion, electric energy translates into mechanical energy, so that power supply produces huge heat, heat is transmitted on the housing of open power module in band cofferdam by heat-conducting glue, and heat is passed to extraneous release by heat conduction shell.
Embodiments above is only in order to illustrate the structure of the present invention, and those of ordinary skill in the art can make various deformation and change under the design of the present invention, within these deformation and change are included in protection scope of the present invention.
Claims (7)
1. the power module in a band cofferdam, it is characterized in that, the cofferdam of including: base plate, being located at base plate surrounding, be located at multiple support columns of band screw on base plate, the circuit board being fixed by screws on described support column, be located at the electronic devices and components on the upper and lower surface of circuit board, fill and in cofferdam, fill the lower heat conduction glue-line of full circuit board lower surface and be paved with circuit board upper surface and be centered around the upper heat conduction glue-line of electronic devices and components surrounding.
2. the power module in band cofferdam as claimed in claim 1, it is characterised in that the electronic devices and components of described circuit board lower surface are divided into the electronic devices and components of band metal shell and the electronic devices and components of non-metal shell.
3. the power module in band cofferdam as claimed in claim 1, it is characterized in that, described base plate is provided with the dielectric film corresponding with the electronic devices and components position of described band metal shell, described dielectric film is provided with the electronic devices and components with described band metal shell and carries out the U-lag of interference fit, and described lower heat conduction glue-line is laid on described dielectric film and is centered around described U-lag surrounding.
4. the power module in band cofferdam as claimed in claim 1, it is characterized in that, described base plate is provided with the electronic devices and components edge to described non-metal shell and carries out spacing frame portion, being provided with the heat conduction mud layer that the electronic devices and components bottom connection with described non-metal shell touches in described frame portion area defined, described lower heat conduction glue-line is centered around described heat conduction mud layer surrounding.
5.
The power module in band cofferdam as claimed in claim 1, it is characterized in that, described base plate is provided with the boss of through hole on corresponding circuits plate, and described boss is provided with heat conduction mud layer, and the electronic devices and components that described heat conduction mud is positioned at described through hole with circuit board upper surface contact.
6. the power module as described in claim 1 to 5 any one claim, it is characterized in that, described base plate is formed around multiple fixing hole, and described cofferdam caves inward at described fixing hole and forms the curved surface being perpendicular to described base plate, makes described fixed hole position outside the scope that cofferdam is surrounded.
7. the power module in the band cofferdam that claim 6 is stated, it is characterised in that be provided with the installation stud contour with cofferdam in described cofferdam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610347491.6A CN105916354B (en) | 2016-05-24 | 2016-05-24 | A kind of power module with cofferdam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610347491.6A CN105916354B (en) | 2016-05-24 | 2016-05-24 | A kind of power module with cofferdam |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105916354A true CN105916354A (en) | 2016-08-31 |
| CN105916354B CN105916354B (en) | 2018-09-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610347491.6A Active CN105916354B (en) | 2016-05-24 | 2016-05-24 | A kind of power module with cofferdam |
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| Country | Link |
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| CN (1) | CN105916354B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108701791A (en) * | 2016-10-10 | 2018-10-23 | 株式会社Lg化学 | battery module assembly |
| CN109348670A (en) * | 2018-09-11 | 2019-02-15 | 陕西千山航空电子有限责任公司 | A kind of power module structure |
| CN109699143A (en) * | 2019-02-15 | 2019-04-30 | 中国科学院高能物理研究所 | Mounting device, electronic component module and spacecraft |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201104377Y (en) * | 2007-10-19 | 2008-08-20 | 浩然科技股份有限公司 | Encapsulated power supplier |
| CN203166744U (en) * | 2013-03-22 | 2013-08-28 | 胜美达电机（香港）有限公司 | Power source supply module |
| CN204291736U (en) * | 2014-12-31 | 2015-04-22 | 东风汽车公司 | Electrically-controlled component radiator structure |
| CN104682670A (en) * | 2013-11-26 | 2015-06-03 | 台达电子企业管理（上海）有限公司 | Power conversion device and power conversion board component thereof |
| TWM506371U (en) * | 2014-04-21 | 2015-08-01 | Yangzhou Hy Technology Dev Co Ltd | A whole structure of an intelligent power semiconductor module having an integrated heat sink |
-
2016
- 2016-05-24 CN CN201610347491.6A patent/CN105916354B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201104377Y (en) * | 2007-10-19 | 2008-08-20 | 浩然科技股份有限公司 | Encapsulated power supplier |
| CN203166744U (en) * | 2013-03-22 | 2013-08-28 | 胜美达电机（香港）有限公司 | Power source supply module |
| CN104682670A (en) * | 2013-11-26 | 2015-06-03 | 台达电子企业管理（上海）有限公司 | Power conversion device and power conversion board component thereof |
| TWM506371U (en) * | 2014-04-21 | 2015-08-01 | Yangzhou Hy Technology Dev Co Ltd | A whole structure of an intelligent power semiconductor module having an integrated heat sink |
| CN204291736U (en) * | 2014-12-31 | 2015-04-22 | 东风汽车公司 | Electrically-controlled component radiator structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108701791A (en) * | 2016-10-10 | 2018-10-23 | 株式会社Lg化学 | battery module assembly |
| CN108701791B (en) * | 2016-10-10 | 2021-07-16 | 株式会社Lg化学 | Battery module assembly |
| CN109348670A (en) * | 2018-09-11 | 2019-02-15 | 陕西千山航空电子有限责任公司 | A kind of power module structure |
| CN109699143A (en) * | 2019-02-15 | 2019-04-30 | 中国科学院高能物理研究所 | Mounting device, electronic component module and spacecraft |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105916354B (en) | 2018-09-25 |
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Address after: 518000, 5 floor, Fengyun mansion, five road north, Nanshan District science and Technology Park, Shenzhen, Guangdong Patentee after: Shenzhen Weimei New Energy Co., Ltd. Address before: 518000, 5 floor, Fengyun mansion, five road north, Nanshan District science and Technology Park, Shenzhen, Guangdong Patentee before: Shenzhen Vmax Power Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |