CN107454737A - A kind of electronic equipment and its circuit board assemblies - Google Patents
A kind of electronic equipment and its circuit board assemblies Download PDFInfo
- Publication number
- CN107454737A CN107454737A CN201710795875.9A CN201710795875A CN107454737A CN 107454737 A CN107454737 A CN 107454737A CN 201710795875 A CN201710795875 A CN 201710795875A CN 107454737 A CN107454737 A CN 107454737A
- Authority
- CN
- China
- Prior art keywords
- heat
- radome
- substrate
- conducting piece
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention is applied to technical field of electronic equipment, there is provided a kind of electronic equipment and its circuit board assemblies.Wherein, circuit board assemblies include substrate, radome, heater element and heat-conducting piece, and heater element is arranged on the surface of substrate, and radome is fixed on the surface of substrate, and housing heater element.Heat-conducting glue is connected between heater element and radome.The inside of substrate has at least one layer of metal level, and radome realizes heat transfer by heat-conducting piece and metal level.The heat-conducting piece of the present embodiment is bonded with the metal level inside radome and substrate simultaneously, so as to realize heat transfer.When accumulation has heat on radome, its temperature is higher than the temperature of the metal level inside substrate, so, heat can be delivered in metal level by heat-conducting piece.Radiated compared to only with radome, the present embodiment is radiated jointly using radome and metal level so that area of dissipation obtains larger increase, improves radiating rate, optimizes the heat dispersion of electronic equipment.
Description
Technical field
The invention belongs to technical field of electronic equipment, more particularly to a kind of electronic equipment and its circuit board assemblies.
Background technology
With the intelligentized development of electronic equipment, it is integrated with increasing function, and the thing followed is electronic equipment
Heating problem it is increasingly severe.Especially for the electronic equipment of some small volumes, such as smart mobile phone, the space of radiating has
Limit, therefore heater element radiating is mostly helped using radome.At present, existing radome is arranged on PCB upper surface, is being sent out
Upper heat conductive silica gel is pasted between thermal element and radome, so as to which the heat of heater element is transferred into radome by heat conductive silica gel
On radiated.
However, the position of radiating radome can be only installed on pcb board, other places need the others such as placing battery
Structural detail, also, radome can not be made too big, if doing too much, more circuit modules certainly will be needed to shield exist
Together, interference can be formed between this egf block.So the area of dissipation of radome is limited, radiating rate is slow, and radiating effect is not
It is good.For this reason, it may be necessary to a kind of new radiator structure or radiating mode are researched and developed to help electronic equipment dissipating heat.
The content of the invention
Embodiments of the invention can solve limited using the area of dissipation present in radome electron equipment cooling
Problem.
In order to solve the above technical problems, a kind of circuit board assemblies are present embodiments provided, including substrate and radome, institute
State and heater element is provided with the surface of substrate, the radome is fixed on the surface of the substrate, and hair described in housing
Thermal element, is connected with heat-conducting glue between the heater element and the radome, the inside of the substrate has at least one layer of gold
Belong to layer；The circuit board assemblies also include heat-conducting piece, and the radome passes through the metal inside the heat-conducting piece and the substrate
Layer fitting.
Further, the heat-conducting piece is fixed on the side of the substrate；The end face of the metal level exposes outside described
The side of substrate, and be bonded with the heat-conducting piece；The radome is bonded with the heat-conducting piece.
Further, the heat-conducting piece is the pad being fixed in the substrate side surfaces.
Further, the bottom of the radome is bonded with the top of the heat-conducting piece.
Further, the side of the radome is bonded with the side of the heat-conducting piece.
Further, hole slot is offered on the substrate, the heat-conducting piece is embedded in the hole slot, the heat-conducting piece
One end is bonded with the radome, and its other end is bonded with the metal level.
Further, the heat-conducting piece includes intermediate thermal conductivity part and edge heat-conducting piece, and hole slot is offered on the substrate,
The intermediate thermal conductivity part is in the hole slot, also, its top is bonded with the side of the radome bottom；The edge
Heat-conducting piece is fixed on the side of the substrate, and the metal level exposes outside the side of the substrate, and with the edge heat conduction
Part is bonded；The opposite side of the radome bottom is bonded with the edge heat-conducting piece.
Further, the heat-conducting glue is pasted onto on top surface or the side of the heater element.
Further, the inside of the substrate have at least two layers between the upper and lower every metal level, also, all metal levels
It is bonded with the heat-conducting piece.
For the present embodiment in order to solve the above technical problems, additionally providing a kind of electronic equipment, it includes above-mentioned circuit board group
Part.
Compared with prior art, beneficial effect is the present embodiment：In being provided with heat-conducting piece on substrate, this leads the present embodiment
Warmware is bonded with the metal level inside radome and substrate simultaneously, so as to realize heat transfer.When accumulation has heat on radome
When, its temperature is higher than the temperature of the metal level inside substrate, so, heat can be delivered in metal level by heat-conducting piece.
Radiated compared to only with radome, the present embodiment is radiated jointly using radome and metal level so that area of dissipation obtains
To larger increase, radiating rate is improved, optimizes the heat dispersion of electronic equipment.
Brief description of the drawings
One or more embodiments are illustrative by the picture in corresponding accompanying drawing, these exemplary theorys
The bright restriction not formed to embodiment, the element for having same reference numbers label in accompanying drawing are expressed as similar element, removed
Non- have a special statement, and composition does not limit the figure in accompanying drawing.
Fig. 1 is a kind of longitudinal schematic cross-sectional view for circuit board assemblies that the embodiment of the present invention one provides；
Fig. 2 is the internal structure schematic diagram for a kind of electronic equipment that the embodiment of the present invention one provides；
Fig. 3 is a kind of longitudinal schematic cross-sectional view for circuit board assemblies that the embodiment of the present invention two provides；
Fig. 4 is the longitudinal schematic cross-sectional view for the first circuit board assemblies that the embodiment of the present invention three provides；
Fig. 5 is the longitudinal schematic cross-sectional view for second of circuit board assemblies that the embodiment of the present invention three provides；
Fig. 6 is the longitudinal schematic cross-sectional view for the third circuit board assemblies that the embodiment of the present invention three provides；
Fig. 7 is a kind of longitudinal schematic cross-sectional view for circuit board assemblies that the embodiment of the present invention four provides.
Embodiment
In order that technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Drawings and Examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
Embodiment one：
Refer to Fig. 1, present embodiments provide a kind of circuit board assemblies, including substrate 1, heater element 2, radome 3 with
And heat-conducting piece 4.
Heater element 2 is arranged on the surface of substrate 1, and radome 3 is fixed on the surface of substrate 1, and housing generates heat
Element 2, is connected with heat-conducting glue 5 between heater element 2 and radome 3, the inside of substrate 1 has layer of metal layer 11.Radome 3
It is bonded by heat-conducting piece 4 with the metal level 11 inside substrate 1, so as to realize heat transfer.Wherein, the side of the heat transfer of the present embodiment
Formula can be that both faces are brought into close contact with face or both are Nian Jie by the cohesive material of heat conduction.
Specifically, heat-conducting glue 5 is pasted onto on the top surface of heater element 2, and the top and the top of radome 3 of heat-conducting glue 5 are glued
Connect.Heat-conducting piece 4 is fixed on the side of substrate 1, and the end face of metal level 11 exposes outside the side of substrate 1, and is pasted with heat-conducting piece 4
Close, the bottom of radome 3 is bonded with the top of heat-conducting piece 4.
Above-mentioned heat-conducting piece 4 is the pad being fixed on the side of substrate 1, and metal level 11 is the copper sheet inside substrate 1.
Fig. 2 is referred to, the present embodiment additionally provides a kind of electronic equipment, and it includes housing 100 and above-mentioned circuit board
Component, circuit board assemblies are installed in housing 100.
The present embodiment in being provided with heat-conducting piece 4 on substrate 1, the heat-conducting piece 4 simultaneously with inside radome 2 and substrate 1
Metal level 11 is bonded, so as to realize heat transfer.When accumulation has heat on radome 3, its temperature is than the metal level inside substrate 1
11 temperature is high, so, heat can be delivered in metal level 11 by heat-conducting piece 4.Dissipated compared to only with radome 2
Heat, the present embodiment are radiated jointly using radome 2 and metal level 11 so that area of dissipation obtains larger increase, improves
Radiating rate, optimize the heat dispersion of electronic equipment.
Embodiment two：
Fig. 3 is referred to, the present embodiment and the difference of embodiment one are, two are provided with the substrate 1 of the present embodiment
Spaced metal level 11, the side of two metal layers 11 are exposed independent from the side of substrate 1 to layer up and down, and with being fixed on substrate 1
Heat-conducting piece 4 on side is bonded.Compared to embodiment one, the heat-conducting piece 4 of the present embodiment is bonded with more metal levels 11, so as to
Heat can be distributed in bigger region, can further improve radiating rate.
Embodiment three：
The present embodiment and the difference of embodiment one are, hole slot 12 is offered on substrate 1, and heat-conducting piece 4 is embedded at hole
In groove 12, one end of heat-conducting piece 4 is bonded with radome 2, and its other end is bonded with metal level 11.
Specifically, three kinds of ways of realization of said structure are present embodiments provided：
The first way of realization refers to Fig. 4, and the top of heat-conducting piece 4 is bonded with the bottom of radome 3, and heat-conducting glue 5 is bonded
Between the roof of the top of heater element 2 and radome 3.
Second of way of realization refers to Fig. 5, and the top of heat-conducting piece 4 is bonded with the bottom of radome 3, and heat-conducting glue 5 is bonded
Between the lateral surface of heater element 2 and the madial wall of radome 4.
The third way of realization refers to Fig. 6, and the side of heat-conducting piece 4 is bonded with the lateral surface of radome 3, and heat-conducting glue 5 is viscous
It is connected between the side of heater element 2 and the madial wall of radome 3.
The present embodiment is not limited to above-mentioned three kinds of ways of realization, in actual applications, can be selected according to specific demand
Above-mentioned way of realization or the more ways of realization of combination.For example, when the heating of the top of heater element 2 is more, or top compared with
When easily transmitting heat, heat-conducting glue 5 can be bonded on the top surface of heater element 2.Correspondingly, if the side of heater element 2
Face heating it is more, or side be easier to transmit heat when, heat-conducting glue 5 can be bonded on the side of heater element 2.Work as screen
Cover the bottom of cover 3 size it is larger when, the bottom of radome 3 can be bonded with heat-conducting piece 4, and when radome 3 bottom compared with
It is narrow, and when side is wider, the lateral surface of radome 3 can be bonded with the side of heat-conducting piece 4.It should be noted that ensureing
On the premise of radiating effect, heat-conducting glue 5 can be bonded on the side of heater element 2, can so avoid heater element 2 with
Heat-conducting glue 5 is stacked on the thickness direction of electronic equipment, advantageously reduces the thickness of electronic equipment,
Example IV：
The present embodiment and the difference of embodiment one be, refers to Fig. 7, heat-conducting piece include intermediate thermal conductivity part 41 and
Edge heat-conducting piece 42.Hole slot 12 is offered on substrate 1, intermediate thermal conductivity part 41 is in hole slot 12, also, its top and shielding
Cover the side fitting of 3 bottoms.Edge heat-conducting piece 42 is fixed on the side of substrate 1, and metal level 11 exposes outside the side of substrate 1,
And it is bonded with edge heat-conducting piece 42；The opposite side of the bottom of radome 3 is bonded with edge heat-conducting piece 42.When radome 3 width compared with
When big, the intermediate thermal conductivity part 41 of the present embodiment can quickly export the heat of the side of radome 3, and edge heat-conducting piece 42 can be with
The heat of the opposite side of radome 3 is quickly exported.It can be seen that the present embodiment is by increasing the quantity and distributing position of heat-conducting piece 4
The speed of heat transfer is improved, improves radiating efficiency.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of circuit board assemblies, including substrate and radome, heater element, the screen are provided with the surface of the substrate
Cover is covered to be fixed on the surface of the substrate, and heater element described in housing, between the heater element and the radome
Heat-conducting glue is connected with, the inside of the substrate has at least one layer of metal level；Characterized in that, the circuit board assemblies also include
Heat-conducting piece, the radome are bonded by the heat-conducting piece with the metal level inside the substrate.
2. circuit board assemblies as claimed in claim 1, it is characterised in that the heat-conducting piece is fixed on the side of the substrate
On；The end face of the metal level exposes outside the side of the substrate, and is bonded with the heat-conducting piece；The radome is led with described
Warmware is bonded.
3. circuit board assemblies as claimed in claim 2, it is characterised in that the heat-conducting piece is to be fixed in the substrate side surfaces
Pad.
4. circuit board assemblies as claimed in claim 1, it is characterised in that the bottom of the radome and the top of the heat-conducting piece
Portion is bonded.
5. circuit board assemblies as claimed in claim 1, it is characterised in that the side of the radome and the side of the heat-conducting piece
Face is bonded.
6. circuit board assemblies as claimed in claim 1, it is characterised in that hole slot, the heat-conducting piece are offered on the substrate
In the hole slot, one end of the heat-conducting piece is bonded with the radome, and its other end is bonded with the metal level.
7. circuit board assemblies as claimed in claim 1, it is characterised in that the heat-conducting piece includes intermediate thermal conductivity part and edge
Heat-conducting piece, hole slot is offered on the substrate, the intermediate thermal conductivity part in the hole slot, also, its top with it is described
The side fitting of radome bottom；The edge heat-conducting piece is fixed on the side of the substrate, and the metal level exposes outside institute
The side of substrate is stated, and is bonded with the edge heat-conducting piece；The opposite side of the radome bottom pastes with the edge heat-conducting piece
Close.
8. circuit board assemblies as claimed in any of claims 1 to 7 in one of claims, it is characterised in that the heat-conducting glue is pasted onto institute
State on the top surface or side of heater element.
9. circuit board assemblies as claimed in any of claims 1 to 7 in one of claims, it is characterised in that the inside of the substrate has
At least two layers between the upper and lower every metal level, also, all metal levels are bonded with the heat-conducting piece.
10. a kind of electronic equipment, it is characterised in that it includes the circuit board assemblies described in any one in claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710795875.9A CN107454737B (en) | 2017-09-06 | 2017-09-06 | A kind of electronic equipment and its circuit board assemblies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710795875.9A CN107454737B (en) | 2017-09-06 | 2017-09-06 | A kind of electronic equipment and its circuit board assemblies |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107454737A true CN107454737A (en) | 2017-12-08 |
| CN107454737B CN107454737B (en) | 2019-08-16 |
Family
ID=60494986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710795875.9A Active CN107454737B (en) | 2017-09-06 | 2017-09-06 | A kind of electronic equipment and its circuit board assemblies |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107454737B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513515A (en) * | 2018-06-11 | 2018-09-07 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
| CN114449729A (en) * | 2020-11-06 | 2022-05-06 | 中移物联网有限公司 | Mainboard protection structure and assembling method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548365A (en) * | 2012-01-18 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Mobile terminal with high heat radiation performance |
| CN203289736U (en) * | 2013-03-07 | 2013-11-13 | 杭州华三通信技术有限公司 | PCB structure |
| CN106061099A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal having the same |
| US9510452B2 (en) * | 2014-03-25 | 2016-11-29 | Kitagawa Industries Co., Ltd. | Electromagnetic shielding member and electromagnetic shielding structure |
-
2017
- 2017-09-06 CN CN201710795875.9A patent/CN107454737B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548365A (en) * | 2012-01-18 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Mobile terminal with high heat radiation performance |
| CN203289736U (en) * | 2013-03-07 | 2013-11-13 | 杭州华三通信技术有限公司 | PCB structure |
| US9510452B2 (en) * | 2014-03-25 | 2016-11-29 | Kitagawa Industries Co., Ltd. | Electromagnetic shielding member and electromagnetic shielding structure |
| CN106061099A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal having the same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513515A (en) * | 2018-06-11 | 2018-09-07 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
| CN108513515B (en) * | 2018-06-11 | 2020-10-02 | Oppo广东移动通信有限公司 | Shell assembly and electronic device |
| CN114449729A (en) * | 2020-11-06 | 2022-05-06 | 中移物联网有限公司 | Mainboard protection structure and assembling method thereof |
| CN114449729B (en) * | 2020-11-06 | 2023-11-10 | 中移物联网有限公司 | Main board protection structure and assembly method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107454737B (en) | 2019-08-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |