CN204180450U - Ultra thin substrate ultrathin heat pipe array radiator - Google Patents
Ultra thin substrate ultrathin heat pipe array radiator Download PDFInfo
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- CN204180450U CN204180450U CN201420583216.0U CN201420583216U CN204180450U CN 204180450 U CN204180450 U CN 204180450U CN 201420583216 U CN201420583216 U CN 201420583216U CN 204180450 U CN204180450 U CN 204180450U
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- heat pipe
- metal substrate
- groove
- ultra thin
- radiating fins
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Abstract
A kind of ultra thin substrate ultrathin heat pipe array radiator, comprise radiator body, radiator body comprises a metal substrate, more than one heat pipe and some radiating fins, some radiating fins are separately positioned on the two ends of metal substrate, more than one first groove is provided with on the surface at one of metal substrate, heat pipe is arranged in the first groove, and the surface of heat pipe flushes with the surface of metal substrate.The utility model is respectively equipped with the first capillary structure, the second capillary structure and the 3rd capillary structure in the hollow structure of the inwall of heat pipe, the annular seal space of metal substrate and radiating fin, can effectively the heat that heater element produces be left and improve heat conduction efficiency, make heater element for a long time normal work at its temperature of permitting, have heat conduction efficiency high, easy to use, save installing space, extend the useful life of heater element, increase the advantage such as structural strength and reliability.
Description
Technical field
the utility model relates to the technical field of heat dissipation of heater element, particularly relates to a kind of ultra thin substrate ultrathin heat pipe array radiator.
Background technology
Along with scientific and technological industry develops fast; make electronic component more and more faster on computing performs, and the caloric value produced during its running is also more and more high, for this heat effectively being left; can operate under permissive temperature to maintain electronic component, usually heat abstractor can be set on electronic component.And common heat abstractor installs radiating fin on a metal plate, make metallic plate contact electronic component and absorb its heat energy sent, then thermal energy conduction is dispelled the heat to radiating fin.But along with the arithmetic speed of electronic component higher, the caloric value produced is also more and more high, and the general heat abstractor using metallic plate and radiating fin cannot the caloric value of load electronic element, and its heat conduction efficiency is low.
utility model content
In order to overcome the problems referred to above, the utility model provides a kind of to society and can effectively be left and improve the ultra thin substrate ultrathin heat pipe array radiator of heat conduction efficiency by the heat that heater element produces.
The technical solution of the utility model is: provide a kind of ultra thin substrate ultrathin heat pipe array radiator, comprise radiator body, described radiator body comprises a metal substrate, more than one heat pipe and some radiating fins, some described radiating fins are separately positioned on the two ends of described metal substrate, more than one first groove is provided with on the surface at one of described metal substrate, described heat pipe is arranged in described first groove, and the surface of described heat pipe flushes with the surface of described metal substrate.
As to improvement of the present utility model, some described radiating fins be separately positioned on the two ends of described metal substrate another on the surface.
As to improvement of the present utility model, some described radiating fins are separately positioned on the end face at the two ends of described metal substrate, and the bottom surface of some described radiating fins and a surface of described metal substrate are in same plane.
As to improvement of the present utility model, the bottom surface of described radiating fin is provided with more than one second groove, the middle part of described heat pipe is arranged in described first groove, and the two ends of described heat pipe are arranged in described second groove.
As to improvement of the present utility model, the number of described radiator body is several, and radiator body described in several is installed together successively mutually accordingly.
As to improvement of the present utility model, the inwall sintering of described heat pipe has the first capillary structure, and has appropriate working fluid in the storage inside of described heat pipe.
As to improvement of the present utility model, described heat pipe and described first groove utilize solder tightly to bond.
Radiating fin is separately positioned on the two ends of metal substrate by the utility model, the first groove is provided with on the surface at one of metal substrate, heat pipe is arranged in the first groove, and at the inwall of heat pipe, the first capillary structure is respectively equipped with in the annular seal space of metal substrate and the hollow structure of radiating fin, second capillary structure and the 3rd capillary structure, can effectively the heat that heater element produces be left and improve heat conduction efficiency, make heater element normal work for a long time at its temperature of permitting, there is heat conduction efficiency high, easy to use, save installing space, extend the useful life of heater element, increase the advantage such as structural strength and reliability.
Accompanying drawing explanation
Fig. 1 is perspective view of the present utility model.
Fig. 2 is the perspective view of the radiator body shown in some Fig. 1 when being installed together.
Wherein: 1. radiator body; 2. metal substrate; 3. heat pipe; 4. radiating fin; 5. heater element.
Embodiment
Refer to Fig. 1 and Fig. 2, what Fig. 1 and Fig. 2 disclosed is a kind of ultra thin substrate ultrathin heat pipe array radiator, and comprise radiator body 1, described radiator body 1 comprises a metal substrate 2, more than one heat pipe 3 and some radiating fins 4.Some described radiating fins 4 are separately positioned on the two ends of described metal substrate 2, more than one first groove (not shown) is provided with on the surface at one of described metal substrate 2, described heat pipe 3 is arranged in described first groove, and the surface of described heat pipe 3 flushes with the surface of described metal substrate 2.Described heat pipe 3 and described first groove utilize solder tightly to bond.
In the present embodiment, some described radiating fins 4 be separately positioned on the two ends of described metal substrate 2 another on the surface, namely described heat pipe 3 is all arranged in described first groove.Some described radiating fins 4 can also be separately positioned on the end face at the two ends of described metal substrate 2, and the bottom surface of some described radiating fins 4 and a surface of described metal substrate 2 are in same plane, namely the sidewall of described radiating fin 4 is connected with the end face at the two ends of described metal substrate 2, the bottom surface of described radiating fin 4 is provided with more than one second groove, the middle part of described heat pipe 3 is arranged in described first groove, and the two ends of described heat pipe 3 are arranged in described second groove.Two ends and described second groove of described heat pipe 3 utilize solder tightly to bond.
In the present embodiment, on the surface that heater element 5 can be arranged on described metal substrate 2 or another on the surface, also can be arranged on two relative surfaces of described metal substrate 2.The heat energy that heater element 5 sends can simultaneously by the rapid absorption of described metal substrate 2 and described heat pipe 3, and heat energy is left, and described radiating fin 4 can help heat radiation, the heat energy that described metal substrate 2 and described heat pipe 3 conduct is discharged smoothly, and then the heat making heater element 5 constantly produce can continue to be conducted to far-end by described metal substrate 2 and described heat pipe 3, to maintain heater element 5 at its temperature of permitting, can normal operation.
In the present embodiment, described metal substrate 2 can be copper coin or aluminium sheet.The number of described radiator body 1 is several, radiator body 1 described in several is installed together successively mutually accordingly, namely the direction of the described radiating fin 4 of some described radiator bodies 1 is all towards same direction, or the direction of the described radiating fin 4 of some described radiator bodies 1 is not towards same direction (not shown).The inwall sintering of described heat pipe 3 has the first capillary structure, and have appropriate working fluid in the storage inside of described heat pipe 3, described first capillary structure is plough groove type capillary structure, porousness capillary structure, netted capillary structure, powder sintered capillary structure or combined capillary structure.
In the present embodiment, be provided with annular seal space in the inside of described metal substrate 2, in described annular seal space, be filled with working fluid, the inwall of described annular seal space is provided with the second capillary structure, described annular seal space is pumped into low pressure, working fluid can be water, ethanol or other there is the liquid of low coefficient of viscosity.
In the present embodiment, described second capillary structure is some grooves arranged in parallel, and each described groove is extended transversely to the other end by one end of described metal substrate 2, and the cross section of described groove is V type or rectangle.Described capillary structure can also be woven wire, cellulose, sintered powder, carbon nano pipe array.Described second capillary structure can strengthen the back-flow velocity of working fluid, thus strengthens heat-conductive characteristic.The inwall of described annular seal space can also be provided with foamed aluminium.Can be provided with supporter in described annular seal space, described strutting piece is for supporting the inwall of described annular seal space.
In the present embodiment, the surface of every a slice fin of described radiating fin 4 is rough, and the benefit of design is like this increasing heat radiation area, improves radiating efficiency.In order to improve radiating efficiency further, described in every a slice, the inside of fin is hollow structure, and in described hollow structure, be provided with the 3rd capillary structure, and described 3rd capillary structure is identical with described first capillary structure.
Claims (7)
1. a ultra thin substrate ultrathin heat pipe array radiator, comprise radiator body, described radiator body comprises a metal substrate, more than one heat pipe and some radiating fins, it is characterized in that, some described radiating fins are separately positioned on the two ends of described metal substrate, be provided with more than one first groove on the surface at one of described metal substrate, described heat pipe is arranged in described first groove, and the surface of described heat pipe flushes with the surface of described metal substrate.
2. ultra thin substrate ultrathin heat pipe array radiator according to claim 1, is characterized in that: some described radiating fins be separately positioned on the two ends of described metal substrate another on the surface.
3. ultra thin substrate ultrathin heat pipe array radiator according to claim 1, it is characterized in that: some described radiating fins are separately positioned on the end face at the two ends of described metal substrate, and the bottom surface of some described radiating fins and a surface of described metal substrate are in same plane.
4. ultra thin substrate ultrathin heat pipe array radiator according to claim 3, it is characterized in that: on the bottom surface of described radiating fin, be provided with more than one second groove, the middle part of described heat pipe is arranged in described first groove, and the two ends of described heat pipe are arranged in described second groove.
5. the ultra thin substrate ultrathin heat pipe array radiator according to claim 1,2 or 3, it is characterized in that: the number of described radiator body is several, radiator body described in several is installed together successively mutually accordingly.
6. the ultra thin substrate ultrathin heat pipe array radiator according to claim 1,2 or 3, is characterized in that: the inwall sintering of described heat pipe has the first capillary structure, and has appropriate working fluid in the storage inside of described heat pipe.
7. the ultra thin substrate ultrathin heat pipe array radiator according to claim 1,2 or 3, is characterized in that: described heat pipe and described first groove utilize solder tightly to bond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420583216.0U CN204180450U (en) | 2014-10-10 | 2014-10-10 | Ultra thin substrate ultrathin heat pipe array radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420583216.0U CN204180450U (en) | 2014-10-10 | 2014-10-10 | Ultra thin substrate ultrathin heat pipe array radiator |
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| Publication Number | Publication Date |
|---|---|
| CN204180450U true CN204180450U (en) | 2015-02-25 |
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| CN201420583216.0U Active CN204180450U (en) | 2014-10-10 | 2014-10-10 | Ultra thin substrate ultrathin heat pipe array radiator |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017198029A1 (en) * | 2016-05-19 | 2017-11-23 | 深圳市光峰光电技术有限公司 | Heat dissipation apparatus and projection device |
| CN111451729A (en) * | 2020-04-24 | 2020-07-28 | 江苏明利嘉科技有限公司 | Preparation method of ultra-thin heat pipe for mobile phone |
-
2014
- 2014-10-10 CN CN201420583216.0U patent/CN204180450U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017198029A1 (en) * | 2016-05-19 | 2017-11-23 | 深圳市光峰光电技术有限公司 | Heat dissipation apparatus and projection device |
| CN111451729A (en) * | 2020-04-24 | 2020-07-28 | 江苏明利嘉科技有限公司 | Preparation method of ultra-thin heat pipe for mobile phone |
| CN111451729B (en) * | 2020-04-24 | 2024-03-26 | 昆山品岱电子有限公司 | Preparation method of ultra-thin heat pipe for mobile phone |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170118 Address after: 610037 Sichuan, Chengdu, Chengdu Jinniu hi tech Industrial Park Road, No. 46, No. 5, No. 2, building No. 1 Patentee after: Sichuan Lei Zidun Electronic Technology Co. Ltd. Address before: No. 2, No. 5, No. 46, Shu Xi Road, Chengdu Jinniu hi tech Industrial Park, Chengdu, Sichuan, China Patentee before: Chengdu saab electronic application Science and Technology Ltd. |