CN111451729B - Preparation method of ultra-thin heat pipe for mobile phone - Google Patents
Preparation method of ultra-thin heat pipe for mobile phone Download PDFInfo
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- CN111451729B CN111451729B CN202010332048.8A CN202010332048A CN111451729B CN 111451729 B CN111451729 B CN 111451729B CN 202010332048 A CN202010332048 A CN 202010332048A CN 111451729 B CN111451729 B CN 111451729B
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- metal substrate
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- mobile phone
- heat
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- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 78
- 239000002184 metal Substances 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 72
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 238000005498 polishing Methods 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 238000005219 brazing Methods 0.000 claims description 22
- 239000000945 filler Substances 0.000 claims description 17
- 239000011261 inert gas Substances 0.000 claims description 14
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 11
- 229910000838 Al alloy Inorganic materials 0.000 claims description 10
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 10
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 10
- 239000012153 distilled water Substances 0.000 claims description 10
- 229910052700 potassium Inorganic materials 0.000 claims description 10
- 239000011591 potassium Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 238000011049 filling Methods 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 5
- 230000004907 flux Effects 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 5
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 239000001307 helium Substances 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- 239000012258 stirred mixture Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 2
- 229910000570 Cupronickel Inorganic materials 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims 1
- 238000012546 transfer Methods 0.000 abstract description 20
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of mobile phone heat dissipation accessories, and discloses a preparation method of an ultrathin heat pipe for a mobile phone, which comprises the following steps: 1) And (3) polishing the surface of the metal substrate by using a polisher, and then placing the metal substrate in an ultrasonic cleaner for cleaning. According to the preparation method of the ultra-thin heat pipe for the mobile phone, the formed heat pipe is bent after being processed and bent through the eight grooves, the phenomenon that copper powder is separated from the heat pipe in the processing process of the formed heat pipe is avoided, the heat transfer efficiency is higher by using copper powder to transfer heat medium to replace copper wires to transfer heat medium, the heat transfer is conducted in a net-shaped mode when copper powder is used for transferring heat, heat can be conducted through all copper powder in the grooves, and the distance between copper powder is very small relative to copper wires, so that the heat transfer efficiency is higher.
Description
Technical Field
The invention relates to the technical field of mobile phone radiating accessories, in particular to a preparation method of an ultrathin heat pipe for a mobile phone.
Background
The heat pipe technology is a heat transfer element called a 'heat pipe' invented by George Luo Fo of American Loose Alamos national laboratory in 1963, fully utilizes the heat conduction principle and the rapid heat transfer property of a phase change medium, rapidly transfers the heat of a heating object to the outside of a heat source through the heat pipe, has the heat conduction capacity exceeding that of any known metal, has been widely applied to aerospace, military and other industries before, has been introduced into the radiator manufacturing industry, so that people change the design thought of the traditional radiator, get rid of a single heat dissipation mode which simply relies on a high-air-volume motor to obtain a better heat dissipation effect, and adopts the heat pipe technology to enable the radiator to obtain a satisfactory effect even if adopting a low-rotation-speed and low-air-volume motor, so that the noise problem which puies the heat dissipation of air cooling is well solved, opens up a new world of the heat dissipation industry, and is commonly seen on the cpu, from the thermodynamic point of view why the heat pipe has the good heat conduction capacity is very good? The heat absorption and the heat release of the object are opposite, and when the temperature difference exists, the phenomenon that heat is transferred from a high temperature position to a low temperature position is inevitable.
The heat pipe on the market always welds the metal substrate into a tube shape by directly using a welding mode in the production process, the copper wire is fixedly connected to the inner part of the metal substrate after the metal substrate is welded, and then sealing treatment is carried out, in the process, the copper wire is separated from the metal substrate in the process of bending the metal substrate due to the fact that the copper wire is directly fixed to the inner part of the metal substrate, and the heat radiation effect of the processed heat pipe is greatly influenced, so that the preparation method of the ultra-thin heat pipe for the mobile phone is provided for solving the problems.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides a preparation method of an ultrathin heat pipe for a mobile phone, which has the advantages of excellent heat dissipation effect and the like, and solves the problem of poor heat dissipation effect caused by bending of the heat pipe.
(II) technical scheme
In order to achieve the purpose of excellent heat dissipation effect, the invention provides the following technical scheme: a preparation method of an ultra-thin heat pipe for a mobile phone comprises the following steps:
1) Polishing the surface of the metal substrate by using a polisher, placing the metal substrate into an ultrasonic cleaner for cleaning, and placing the cleaned metal substrate into a drying device for drying;
2) Placing the dried metal substrate in a metal engraving machine to engrave a plurality of grooves, placing the metal substrate in an ultrasonic cleaner to clean after the grooves are engraved, placing the cleaned metal substrate in drying equipment again to dry again, and placing the metal substrate for later use;
3) Fully stirring the copper powder and the adhesive after mixing, injecting the stirred mixture into the groove through a dispensing machine, and placing the metal substrate after injecting the mixture for two hours to solidify the mixture;
4) Taking out the metal substrate after the mixture is solidified, bending, bonding the capillary structure and the substrate by high-temperature sintering, and then welding, wherein brazing filler metal and brazing flux are added at the welding position during welding;
5) Filling one half of working medium into the tubular object and filling inert gas so that the pressure of the working medium is one to two hours under one to three megapascals, and then extracting the inert gas so that the working medium is welded and sealed under the pressure of minus quadratic of the pressure to minus quadratic of the pressure;
the number of the grooves is eight, the eight grooves are divided into a left group and a right group, one group of four grooves are distributed at equal intervals in an annular mode, the two groups of grooves are distributed in a staggered mode, the grooves are vertical rectangular grooves, and the width of each groove is between three and ten millimeters in zero point.
Preferably, the brazing filler metal is an aluminum alloy foil, the brazing filler metal consists of potassium fluoroaluminate, distilled water and a binder, the potassium fluoroaluminate is five to thirty-five percent, the distilled water is five to sixty percent, the binder is five to thirty percent, and the binder consists of sixty-two percent propylene glycol and thirty-eight percent propanol ether.
Preferably, the metal substrate is any one of an aluminum substrate, a stainless steel substrate and an aluminum alloy substrate, and the thickness of the metal substrate is between zero and zero.
Preferably, the copper powder is three hundred to five hundred mesh copper powder, and the adhesive is a high temperature resistant adhesive.
(III) beneficial effects
Compared with the prior art, the invention provides a preparation method of an ultrathin heat pipe for a mobile phone, which has the following beneficial effects:
1. according to the preparation method of the ultra-thin heat pipe for the mobile phone, the formed heat pipe is bent after being processed and bent through the eight grooves, the phenomenon that copper powder is separated from the heat pipe in the processing process of the formed heat pipe is avoided, the heat transfer efficiency is higher by using copper powder to transfer heat medium to replace copper wires, the heat transfer is conducted in a net-shaped mode when the copper powder is used for transferring heat, the heat can be conducted through all copper powder in the grooves, the distance between the copper powder is very tiny relative to the copper wires, the heat transfer efficiency is higher, the contact area between the copper wires and the copper wires, including the contact area between the copper wires and the metal substrate, is linear contact, and the contact area is smaller relative to the copper powder, so that the heat transfer is reduced.
2. According to the preparation method of the ultra-thin heat pipe for the mobile phone, the metal substrate is cleaned thoroughly by using the ultrasonic machine, the groove is engraved in a laser engraving mode after being cleaned, so that the groove is firmer and is not easy to break, heat can be transferred to the outer surface of the metal substrate more completely in a staggered mode, the metal substrate can be better in tightness after being welded by using the brazing filler metal and the brazing flux, the sealing effect is better, the heat pipe firmness degree of the metal substrate after being processed is better by using the brazing filler metal, the working medium can be fully contacted with the inner wall of the tubular by filling the working medium into the inert gas after the tubular is filled, and the working medium is easy to vaporize by using the internal negative pressure of the tubular after the inert gas is extracted, so that the heat transfer is accelerated.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
A preparation method of an ultra-thin heat pipe for a mobile phone comprises the following steps:
1) Polishing the surface of the metal substrate by using a polisher, placing the metal substrate into an ultrasonic cleaner for cleaning, and placing the cleaned metal substrate into a drying device for drying;
2) Placing the dried metal substrate in a metal engraving machine to engrave a plurality of grooves, placing the metal substrate in an ultrasonic cleaner to clean after the grooves are engraved, placing the cleaned metal substrate in drying equipment again to dry again, and placing the metal substrate for later use;
3) Fully stirring the copper powder and the adhesive after mixing, injecting the stirred mixture into the groove through a dispensing machine, and placing the metal substrate after injecting the mixture for two hours to solidify the mixture;
4) Taking out the metal substrate after the mixture is solidified, bending the metal substrate into a tubular object, and then welding, wherein brazing filler metal and brazing flux are added at the welding position during welding;
5) Filling one half of working medium into the tubular object and filling inert gas to ensure that the pressure of the working medium is one to two hours under one to three megapascals, and then extracting the inert gas to ensure that the working medium is welded and sealed under the pressure of minus quadratic of the pressure to minus quadratic of the pressure.
Embodiment one: the brazing filler metal is an aluminum alloy foil, the brazing filler metal consists of potassium fluoroaluminate, distilled water and an adhesive, the potassium fluoroaluminate is twenty percent, the distilled water is fifty percent, the adhesive is thirty percent, the adhesive consists of sixty-two percent of monopropylene glycol and thirty-eight percent of propanol ether, the metal substrate is any one of an aluminum substrate, a stainless steel substrate and an aluminum alloy substrate, the thickness of the metal substrate is between zero and one-five zero, the grooves are divided into two groups of left and right grooves, one group of four grooves are distributed in an annular equidistant manner, the two groups of grooves are distributed in a staggered manner, the grooves are vertical rectangular grooves, the width of each groove is ten millimeters, copper powder adopts three hundred to five-hundred-mesh copper powder, the adhesive adopts a high-temperature-resistant adhesive, and the inert gas can be any one of nitrogen, argon or helium.
Embodiment two: the brazing filler metal is an aluminum alloy foil, the brazing filler metal consists of potassium fluoroaluminate, distilled water and an adhesive, the potassium fluoroaluminate is twenty-three percent, the distilled water is fifty-two percent, the adhesive is twenty-five percent, the adhesive consists of sixty-two percent of monopropylene glycol and thirty-eight percent of propanol ether, the metal substrate is any one of an aluminum substrate, a stainless steel substrate and an aluminum alloy substrate, the thickness of the metal substrate is between zero and one-five, the grooves are eight, the eight grooves are divided into left and right groups, one group of four grooves are distributed in an annular equidistant manner, the two groups of grooves are distributed in a staggered manner, the grooves are vertical rectangular grooves, the width of each groove is five millimeters, copper powder adopts three hundred to five hundred-mesh copper powder, the adhesive adopts a high-temperature-resistant adhesive, and inert gas can be any one of nitrogen, argon or helium.
Embodiment III: the brazing filler metal is an aluminum alloy foil, the brazing filler metal consists of potassium fluoroaluminate, distilled water and an adhesive, the potassium fluoroaluminate is thirty percent, the distilled water is sixty percent, the adhesive is ten percent, the adhesive consists of sixty percent of two propylene glycol and thirty-eight percent of propanol ether, the metal substrate is any one of an aluminum substrate, a stainless steel substrate and an aluminum alloy substrate, the thickness of the metal substrate is between zero and one-fifth, the grooves are divided into left and right two groups, one group of four grooves are distributed in an annular equidistant manner, the two groups of grooves are distributed in a staggered manner, the grooves are vertical rectangular grooves, the width of each groove is three millimeters, copper powder adopts three hundred to five hundred mesh copper powder, the adhesive adopts a high-temperature-resistant adhesive, and inert gas can be any one of nitrogen, argon or helium.
The beneficial effects of the invention are as follows: the preparation method of the ultra-thin heat pipe for the mobile phone ensures that the formed heat pipe can not bend copper powder after being processed and bent through eight grooves, avoids the phenomenon that copper powder is separated from the heat pipe in the processing process of the formed heat pipe, ensures higher heat transfer efficiency by using copper powder to transfer heat medium instead of copper wire to transfer heat medium, ensures that heat can be transferred through all copper powder in the grooves in a net-shaped manner when the copper powder is used for transferring heat, ensures that the heat transfer efficiency is higher because the interval between the copper powder is very tiny relative to the copper wire, ensures that the contact area between the copper wire and the copper wire, comprising the copper wire and a metal substrate, is in linear contact, and ensures that the contact area is smaller relative to the copper powder, thereby reducing the heat transfer, through wash more thoroughly when using the ultrasonic machine with the metal substrate to wash, reuse laser sculpture mode sculpture slot after the metal substrate washs for the slot is more firm and be difficult for breaking, and can more complete the transmission to the surface of metal substrate when making heat transfer through the form of a plurality of slots dislocation each other, can make metal substrate welding back leakproofness better after using brazing filler metal and brazing flux to weld, and sealed effect is better, can make the heat pipe firmness that metal substrate processing was after using the brazing filler metal to weld more, fill inert gas after filling working medium in through with the tubular material and make the working medium can fully contact with the inner wall of tubular material, and thereby make the inside negative pressure of tubular material easy vaporization after taking out inert gas, accelerate thermal transmission.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The preparation method of the ultra-thin heat pipe for the mobile phone is characterized by comprising the following steps of:
1) Polishing the surface of the metal substrate by using a polisher, placing the metal substrate into an ultrasonic cleaner for cleaning, and placing the cleaned metal substrate into a drying device for drying;
2) Placing the dried metal substrate in a metal engraving machine to engrave a plurality of grooves, placing the metal substrate in an ultrasonic cleaner to clean after the grooves are engraved, placing the cleaned metal substrate in drying equipment again to dry again, and placing the metal substrate for later use;
3) Fully stirring the copper powder and the adhesive after mixing, injecting the stirred mixture into the groove through a dispensing machine, and placing the metal substrate after injecting the mixture for two hours to solidify the mixture;
4) Taking out the metal substrate after the mixture is solidified, bending, bonding the capillary structure and the substrate by high-temperature sintering, and then welding, wherein brazing filler metal and brazing flux are added at the welding position during welding;
5) Filling one half of working medium into the tubular object and filling inert gas so that the pressure of the working medium is one to two hours under one to three megapascals, and then extracting the inert gas so that the working medium is welded and sealed under the pressure of minus quadratic of the pressure to minus quadratic of the pressure;
the number of the grooves is eight, the eight grooves are divided into a left group and a right group, one group of four grooves are distributed at equal intervals in an annular mode, the two groups of grooves are distributed in a staggered mode, the grooves are vertical rectangular grooves, and the width of each groove is between three and ten millimeters in zero point.
2. The method for manufacturing an ultra-thin heat pipe for a mobile phone according to claim 1, wherein the brazing filler metal is an aluminum alloy foil, the brazing filler metal is composed of potassium fluoroaluminate, distilled water and a binder, the potassium fluoroaluminate is five to thirty-five percent, the distilled water is five to sixty percent, the binder is five to thirty percent, and the binder is composed of sixty-two percent propylene glycol and thirty-eight percent propanol ether.
3. The method for manufacturing an ultra-thin heat pipe for a mobile phone according to claim 1, wherein the metal substrate is any one of an aluminum substrate, red copper, copper-nickel alloy, stainless steel and aluminum alloy, and the thickness of the metal substrate is between zero and zero.
4. The method for manufacturing an ultra-thin heat pipe for a mobile phone according to claim 1, wherein the copper powder is three hundred to five hundred mesh copper powder, and the adhesive is a high temperature resistant adhesive.
5. The method for manufacturing an ultra-thin heat pipe for a mobile phone according to claim 1, wherein the inert gas is any one of nitrogen, argon or helium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010332048.8A CN111451729B (en) | 2020-04-24 | 2020-04-24 | Preparation method of ultra-thin heat pipe for mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010332048.8A CN111451729B (en) | 2020-04-24 | 2020-04-24 | Preparation method of ultra-thin heat pipe for mobile phone |
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| Publication Number | Publication Date |
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| CN111451729A CN111451729A (en) | 2020-07-28 |
| CN111451729B true CN111451729B (en) | 2024-03-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202329314U (en) * | 2011-06-20 | 2012-07-11 | 北京芯海节能科技有限公司 | Improved capillary structure for heat pipe |
| CN102748972A (en) * | 2011-04-19 | 2012-10-24 | 泰硕电子股份有限公司 | Method for producing heat pipe |
| CN103317137A (en) * | 2012-03-19 | 2013-09-25 | 富瑞精密组件（昆山）有限公司 | Manufacturing method for heat pipe |
| CN204180450U (en) * | 2014-10-10 | 2015-02-25 | 成都萨伯电子应用科技有限公司 | Ultra thin substrate ultrathin heat pipe array radiator |
| CN106500533A (en) * | 2016-10-31 | 2017-03-15 | 东莞仁海科技股份有限公司 | A kind of ultrathin heat pipe laser preparation method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6911231B2 (en) * | 1996-10-25 | 2005-06-28 | New Qu Energy Limited | Method for producing a heat transfer medium and device |
| US7293601B2 (en) * | 2005-06-15 | 2007-11-13 | Top Way Thermal Management Co., Ltd. | Thermoduct |
| US10470291B2 (en) * | 2017-07-21 | 2019-11-05 | Chintung Lin | Process for preparing an energy saving anti-burst heat dissipation device |
-
2020
- 2020-04-24 CN CN202010332048.8A patent/CN111451729B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102748972A (en) * | 2011-04-19 | 2012-10-24 | 泰硕电子股份有限公司 | Method for producing heat pipe |
| CN202329314U (en) * | 2011-06-20 | 2012-07-11 | 北京芯海节能科技有限公司 | Improved capillary structure for heat pipe |
| CN103317137A (en) * | 2012-03-19 | 2013-09-25 | 富瑞精密组件（昆山）有限公司 | Manufacturing method for heat pipe |
| CN204180450U (en) * | 2014-10-10 | 2015-02-25 | 成都萨伯电子应用科技有限公司 | Ultra thin substrate ultrathin heat pipe array radiator |
| CN106500533A (en) * | 2016-10-31 | 2017-03-15 | 东莞仁海科技股份有限公司 | A kind of ultrathin heat pipe laser preparation method |
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| Publication number | Publication date |
|---|---|
| CN111451729A (en) | 2020-07-28 |
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