CN204145866U - Low temperature plasma material handling device under large discharging distance - Google Patents
Low temperature plasma material handling device under large discharging distance Download PDFInfo
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- CN204145866U CN204145866U CN201420628455.3U CN201420628455U CN204145866U CN 204145866 U CN204145866 U CN 204145866U CN 201420628455 U CN201420628455 U CN 201420628455U CN 204145866 U CN204145866 U CN 204145866U
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Abstract
The utility model discloses low temperature plasma material handling device under a kind of large discharging distance, comprise vacuum cavity, be arranged at top electrode and the bottom electrode of vacuum cavity inside, be arranged at the additional atmosphere interface of vacuum cavity upper end, be arranged at bleeding and disappointing interface of vacuum cavity lower end, be arranged at the vacuum chamber door of vacuum cavity side, also comprise through vacuum cavity respectively with upper, the driving power that bottom electrode is connected, described driving power is pulse modulation driving power, simultaneously, on the top electrode lower surface be oppositely arranged and bottom electrode upper surface, one deck rare earth oxide coating is set respectively.The electric discharge that the utility model exists for existing low temperature plasma material handling device can produce a large amount of heat energy problems simultaneously, proposes the material handling device that one can produce uniform glow discharge and the glow discharge low-temp plasma close to normal temperature under 500 ~ 5000pa air pressure conditions.
Description
Technical field
The utility model discloses low temperature plasma material handling device under a kind of large discharging distance, relate to low temperature plasma material processed technical field.
Background technology
Containing a large amount of, miscellaneous active particle in the low temperature plasma that gas discharge produces, these active particles and material, the reactions such as its surface etches, is oxidized, reduces, is cross-linked, is polymerized, grafting can be made, cause the change of material surface chemical composition and physicochemical properties.This surface treatment method has the features such as technique is simple, easy and simple to handle, low, the environmentally safe of consuming energy.Particularly in medical material industry, this method is for etching activation, graft modification, polymerization or deposition overlay film etc., top layer is cleaned, activates, roughening, or by introducing active particle in new chemical group, low-temperature plasma at material surface and material surface reactive polymeric deposits the object that processes such as forming film reaches surface modification.
When surface treatment is carried out to macromolecular material, usually utilize low pressure glow discharge mode to obtain the low temperature plasma needed for material surface process, or under atmospheric pressure carry out corona discharge, arc discharge, dielectric barrier discharge produce low temperature plasma material surface is processed.But all these produce the method for low temperature plasma at present, in the process of electric discharge, all can produce heat energy, namely apply how many energy and substantially just produce how many Joule heats, the processing time is longer, and discharge temp is namely higher.This is to the material of the many not heatproofs of process, as artificial lens, artificial blood vessel, contact lenses, nonwoven fabrics, macromolecule membrane, the materials such as biochip, if produce with these conventional at present discharge modes low temperature plasma will damage these types material because of the heat produced in discharge process and the temperature compared, or make material because of thermal deformation, or scantling is shunk, or make material breakdown.
In the dielectric barrier discharge of routine, can only produce filament-like discharges, particularly large discharging distance (more than tens millimeters) is difficult to produce uniform glow discharge, can only produce several ebb-flow discharge under smaller discharge power drives.Meanwhile, in conventional treatment means, can produce a large amount of heat energy while electric discharge, safety and stability is all a large hidden danger.
In Chinese patent application " glow discharge low-temp plasma device " in (application number 200620074948.2) disclosed technical scheme, when not providing solution discharging distance larger, still produce the problem of uniform glow discharge, also well do not solve the problem of electric discharge heating.
Utility model content
Technical problem to be solved in the utility model is: for the defect of prior art, low temperature plasma material handling device under a kind of large discharging distance is provided, the electric discharge existed for existing low temperature plasma material handling device can produce a large amount of heat energy problems simultaneously, proposes the material handling device that one can produce uniform glow discharge and the glow discharge low-temp plasma close to normal temperature under 500 ~ 5000pa air pressure conditions.
The utility model is for solving the problems of the technologies described above by the following technical solutions:
Low temperature plasma material handling device under a kind of large discharging distance, comprise vacuum cavity, be arranged at top electrode and the bottom electrode of vacuum cavity inside, be arranged at the additional atmosphere interface of vacuum cavity upper end, be arranged at bleeding and disappointing interface of vacuum cavity lower end, be arranged at the vacuum chamber door of vacuum cavity side, also comprise through vacuum cavity respectively with upper, the driving power that bottom electrode is connected, it is characterized in that: described driving power is pulse modulation driving power, simultaneously, on the top electrode lower surface be oppositely arranged and bottom electrode upper surface, one deck rare earth oxide coating is set respectively.
As further preferred version of the present utility model, the material of described rare earth oxide coating is lanthana, rubidium oxide or praseodymium oxide.
As further preferred version of the present utility model, described pulse modulation driving power, for adopting the modulating pulse power supply of differential feed mode.
As further preferred version of the present utility model, described vacuum cavity is dielectric chamber.
As further preferred version of the present utility model, described vacuum cavity is metallic cavity, has wire chamber body wall insulating barrier the inwall of vacuum cavity is coated.
As further preferred version of the present utility model, the material of described metallic cavity insulating barrier is pottery, glass, polyethylene, polyvinyl chloride, polypropylene or nylon.
As further preferred version of the present utility model, described upper and lower electrode is connected with driving power by upper and lower contact conductor, and described upper and lower contact conductor penetrates vacuum cavity through being arranged at the upper and lower electrode extraction insulator on vacuum cavity side.
As further preferred version of the present utility model, the outside of described top electrode and bottom electrode is enclosed with electrode dielectric layer, and the skin of described upper and lower contact conductor is also coated with insulation material layer.
As further preferred version of the present utility model, the material of described electrode dielectric layer is pottery, toughened glass, quartz glass or devitrified glass; The material of described insulation material layer is silicon rubber or fluorubber.
As further preferred version of the present utility model, between described vacuum cavity and vacuum chamber door, be provided with sealing ring.
The utility model adopts above technical scheme compared with prior art, has following technique effect:
1) any gaseous material can be made under several one hundred air pressure conditions to several kPas to produce uniform and close to the low temperature plasma (only higher 1 ~ 3 degree than ambient temperature) of normal temperature.The macromolecular material of various not heatproof, the surface low-temperature plasma treatment of fiber material can be applied to.Particularly to the medical material of many not heatproofs, as artificial lens, artificial blood vessel, contact lenses etc. carry out Low Temperature Plasma Treating.
2) because the region of discharge of low temperature plasma is without any metal, carrying out in Low Temperature Plasma Treating process, processed material can not be subject to any metallic pollution.
3) low to the vacuum level requirements of equipment, use the vacuum requirement reaching hundreds of to several kPas that common oil-sealed rotary pump can be simple and quick.
4) gas concentration due to plasma slab is high, fast for technique medium velocities such as material surface process, grafting and polymerizations, is more conducive to the chemical synthesis of material surface in the reaction of gaseous material, decomposes and grafting.
Accompanying drawing explanation
Fig. 1 is the structural map of the utility model first embodiment, when for dielectric chamber;
Fig. 2 is the structural map of the utility model second embodiment, when for metallic cavity inner surface insulation;
In figure: 1 vacuum cavity, 2 insulated cavity body walls, 3 wire chamber body walls, 4 wire chamber body wall insulating barriers, 5 sealing rings, 6 vacuum chamber doors, 7 bleed and disappointing interface, 8 additional atmosphere interfaces, 9 top electrodes, 10 top electrode insulating barriers, 11 top electrode lead-in wires, 12 top electrode lead wire insulation layers, 13 top electrodes draw insulator, 14 top electrode extraction electrodes, 15 bottom electrodes, 16 bottom electrode insulating barriers, 17 bottom electrode lead-in wires, 18 bottom electrode lead wire insulation layers, 19 bottom electrodes draw insulator, 20 bottom electrode extraction electrodes, 21 differential type pulse modulation driving powers, 22 discharge of plasma in low temperature regions, 23 rare earth oxide coating.
Embodiment
Be described below in detail execution mode of the present utility model, the example of described execution mode is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the execution mode be described with reference to the drawings, only for explaining the utility model, and can not being interpreted as restriction of the present utility model.
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail:
The technical solution adopted in the utility model is:
1) glow discharge low-temp plasma device, comprises cavity, top electrode, bottom electrode, and the upper and lower metal electrode in seal chamber is all by such as glass, and quartz glass, the insulation material layers such as devitrified glass are coated.
2) one deck rare earth oxide is all coated with at the glass surface of the forward surface of two electrodes.In the dielectric barrier discharge of routine, can only produce filament-like discharges, particularly large discharging distance (more than tens millimeters) is difficult to produce uniform glow discharge, can only produce several ebb-flow discharge under smaller discharge power drives.If be coated with one deck rare earth oxide (as lanthana at the glass surface of the forward surface of two electrodes, rubidium oxide, praseodymium oxide) or by rare earth oxide direct sintering inside glass, then can produce uniform glow discharge at large discharging distance (more than tens millimeters), even if smaller discharge power drives also can produce uniform glow discharge.The atomic structure of rare earth element can represent with 4fx5d16s2, x is from 0 → 14, and after rare earth element becomes ion from metal, the outside of 4f track still surrounds the electron cloud of 5s25p6, lose 6s2 electronics and 5d1 or 4f loses an electronics, form the electronic structure of 4fx5s25p6.In rare earth metal, 6s electronics and 5d electronics form conduction band, 4f electronics is localization in atom then, the localization of this 4f electronics and not exclusively fill and all 4f electronics among being reflected in their all physical property is positioned at intratomic layer track, 5s25p6 electron cloud has shielding action to it, the space that 4f track stretches is very little, so very little by the impact of crystalline field, ligand field etc.; In contrast, its spin (MS) is all very large with the interaction of track (ML), make f-f electron orbit L and the mutual coupling of spin S-phase, E4f splits into the energy level subgrade that many energy levels have minute differences, under high voltage electric field, the micro-electronics of the periphery of rare earth element just forms seed electrons than being easier to overflow and causing glow discharge in sparking electrode.
3) driving power adopts modulating pulse power supply, and the first-harmonic of power supply is sinusoidal wave, and frequency is at 2000 ~ 20000Hz, and modulation waveform is square wave, and frequency is at 20 ~ 200Hz, and duty ratio is 1% ~ 99%.After the discharge of plasma in low temperature of routine, gas is ionized as electronics and ion, electronics and ion are buried in oblivion in region of discharge generation irregular movement and collision rift, annihilation process is luminous and generate heat, and namely applies how many energy and substantially just produces how many Joule heats, under vacuum conditions, because sparking electrode is be in adiabatci condition substantially, processing time is longer, and discharge power is larger, and discharge temp is namely higher.After adopting modulating pulse power supply, drive waveforms adopts discontinuous excitation, electronics and ion are produced in the space of region of discharge and is separated, reduce electronics and interionic collision probability, namely decrease heating.Because electronics does not almost have quality, quality concentrates on ion substantially, and when region of discharge applies discontinuous high voltage electric field, its plasma discharge is also discontinuous, when applying high voltage electric field electric discharge, the quality of electronics is very little, and electronics acceleration of motion is in the electric field than very fast, and the quality of ion is much larger than electronics, the speed of its motion is slow, namely electronics and ion are layered, and the probability of collision also reduces greatly, and the heat thus produced after electric discharge also significantly reduces.
4) feeding classification of two electrodes adopts differential feed mode, on two electrodes, namely presents amplitude equal and opposite in direction (AC500V ~ AC3000V) respectively, the modulating pulse power supply of phase 180 degree.Because sparking electrode is placed in cavity, if adopt conventional unipolarity power drives, then the output voltage of power supply is higher, spacing between electrode and metallic cavity needs larger, otherwise high-field electrode and metallic cavity are easy to produce invalid electric discharge, both off-energy, is also easy to burn out insulation.Adopt differential feed mode, then the voltage between electrode and metallic cavity reduces half, and the insulation clearance between electrode and metallic cavity can reduce half, and the effective rate of utilization of cavity can double.
5) if the closer and volume of the distance of electrode and seal chamber is little again, then the material of insulation can be selected to do cavity.
6) if cavity is metal, then at the coated insulation material layer of metallic cavity inwall.
7) back side of top electrode and bottom electrode is coated with insulation material layer, and the lead-out wire of top electrode and bottom electrode is coated with insulation material layer.Top electrode and bottom electrode also can all be wrapped in insulation material layer.
8) other the various gaseous material comprising air can be applied in cavity, the low temperature plasma of corresponding gaseous state thing can be produced.
Embodiment one
Fig. 1 is an embodiment of the utility model patent, discharge to prevent electrode and chamber walls, the cavity wall of the present embodiment vacuum cavity 1 adopts insulated cavity body wall 2, and the insulating material of insulated cavity body wall 2 can be the materials such as pottery, glass, polyethylene, polyvinyl chloride, polypropylene, nylon.Be vacuum chamber door 6 on the right side of vacuum cavity 1, material can be toughened glass, and vacuum chamber door 6 is provided with sealing ring 5 between contacting with cavity.Cavity of resorption body wall is provided with bleeds and disappointing interface 7, and epicoele body wall is provided with additional atmosphere interface 8.Top electrode 9 is relative with bottom electrode 15 to be located in vacuum cavity 1, top electrode 9 to be held with (+) of differential type pulse modulation driving power 21 by top electrode lead-in wire 11 and is connected, and bottom electrode 15 is gone between by bottom electrode and 17 to be connected with differential type pulse modulation driving power (-) 21.The appearance of top electrode 9 is coated with insulating barrier 10, insulating material can be pottery, toughened glass, quartz glass, devitrified glass, top electrode lead-in wire 11 is coated with top electrode lead wire insulation layer 12, material is silicon rubber, fluorubber, is connected with differential type pulse modulation driving power (+) 21 by top electrode extraction electrode 14, and top electrode extraction electrode 14 is coated on top electrode and draws in insulator 13.Bottom electrode 15 is coated with bottom electrode insulating barrier 16, insulating material can be pottery, toughened glass, quartz glass, devitrified glass, bottom electrode lead-in wire 17 is coated with bottom electrode lead wire insulation layer 18, by bottom electrode extraction electrode 20 and differential type pulse modulation driving power 21(-) be connected, bottom electrode extraction electrode 20 is coated on bottom electrode and draws in insulator 19.The forward surface surface of the electrode dielectric layer 10 and 16 that upper/lower electrode 9 and 15 appearance is coated is coated with one deck rare earth oxide coating.
During practical operation, first close additional atmosphere interface 8 and vacuum chamber door 6, with vacuum pump by the gas in vacuum cavity 1 from bleed and disappointing interface 7 extract out, make the air pressure in vacuum cavity 1 be about 500 ~ 5000pa.The differential type pulse modulation driving power of certain power is applied again, then 22 low temperature plasmas that just can produce normal temperature glow discharge in the clearance space between top electrode 9, bottom electrode 15 on top electrode 9, bottom electrode 15 extraction electrode 14 and 20.
If needed, various gas can be applied by additional atmosphere interface 8, namely can produce the low temperature plasma of corresponding atmosphere.
The outer surface of top electrode 9, bottom electrode 15 must use certain thickness dielectric, as coated in materials such as pottery, glass, toughened glass, quartz glasss, and in other region of interest, as the back side, electrode outlet line etc. of electrode, apply good insulation processing when there is unwanted electric discharge, make glow discharge only be confined to the interior generation of forward surface of upper and lower two electrodes.
Top electrode 9, bottom electrode 15 can be the metal materials such as metal coating, wire netting, metal foil or metallic plate, also can be the nonmetallic electric conducting materials such as graphite.
Embodiment two
Fig. 2 is second embodiment of the present utility model, the cavity wall of the present embodiment vacuum cavity 1 is wire chamber body wall 3, discharge to prevent electrode and wire chamber body wall 3, be coated with insulating barrier 4 at the inner surface of wire chamber body wall 3, wire chamber body wall insulating barrier 4 have employed the materials such as such as glass, polyethylene, polypropylene, nylon, silicon rubber.Other structure of the present embodiment is identical with embodiment one, and when specifically implementing, its method of operation is also identical with embodiment one.The present embodiment is applicable on the larger equipment of the volume ratio of vacuum cavity 1.
By reference to the accompanying drawings execution mode of the present utility model is explained in detail above, but the utility model is not limited to above-mentioned execution mode, in the ken that those of ordinary skill in the art possess, can also make a variety of changes under the prerequisite not departing from the utility model aim.The above, it is only preferred embodiment of the present utility model, not any pro forma restriction is done to the utility model, although the utility model discloses as above with preferred embodiment, but and be not used to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be do not depart from technical solutions of the utility model content, according to technical spirit of the present utility model, within spirit of the present utility model and principle, to any simple amendment that above embodiment is done, equivalent replacement and improvement etc., within the protection range all still belonging to technical solutions of the utility model.
Claims (10)
1. low temperature plasma material handling device under large discharging distance, comprise vacuum cavity, be arranged at top electrode and the bottom electrode of vacuum cavity inside, be arranged at the additional atmosphere interface of vacuum cavity upper end, be arranged at bleeding and disappointing interface of vacuum cavity lower end, be arranged at the vacuum chamber door of vacuum cavity side, also comprise through vacuum cavity respectively with upper, the driving power that bottom electrode is connected, it is characterized in that: described driving power is pulse modulation driving power, simultaneously, on the top electrode lower surface be oppositely arranged and bottom electrode upper surface, one deck rare earth oxide coating is set respectively.
2. low temperature plasma material handling device under large discharging distance as claimed in claim 1, is characterized in that: the material of described rare earth oxide coating is lanthana, rubidium oxide or praseodymium oxide.
3. low temperature plasma material handling device under large discharging distance as claimed in claim 1 or 2, is characterized in that: described pulse modulation driving power, for adopting the modulating pulse power supply of differential feed mode.
4. low temperature plasma material handling device under large discharging distance as claimed in claim 3, is characterized in that: described vacuum cavity is dielectric chamber.
5. low temperature plasma material handling device under discharging distance as claimed in claim 3 large, is characterized in that: described vacuum cavity is metallic cavity, has wire chamber body wall insulating barrier the inwall of vacuum cavity is coated.
6. low temperature plasma material handling device under large discharging distance as claimed in claim 5, is characterized in that: the material of described metallic cavity insulating barrier is pottery, glass, polyethylene, polyvinyl chloride, polypropylene or nylon.
7. low temperature plasma material handling device under large discharging distance as claimed in claim 1, it is characterized in that: described upper and lower electrode is connected with driving power by upper and lower contact conductor, described upper and lower contact conductor penetrates vacuum cavity through being arranged at the upper and lower electrode extraction insulator on vacuum cavity side.
8. low temperature plasma material handling device under large discharging distance as claimed in claim 6, it is characterized in that: the outside of described top electrode and bottom electrode is enclosed with electrode dielectric layer, the skin of described upper and lower contact conductor is also coated with insulation material layer.
9. low temperature plasma material handling device under large discharging distance as claimed in claim 8, is characterized in that: the material of described electrode dielectric layer is pottery, toughened glass, quartz glass or devitrified glass;
The material of described insulation material layer is silicon rubber or fluorubber.
10. low temperature plasma material handling device under large discharging distance as claimed in claim 1, is characterized in that: be provided with sealing ring between described vacuum cavity and vacuum chamber door.
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| CN105442297A (en) * | 2016-01-08 | 2016-03-30 | 南京苏曼等离子科技有限公司 | Uniform discharge low-temperature plasma fabric processing device and method under intelligent atmospheric pressure |
| CN105555000A (en) * | 2014-10-28 | 2016-05-04 | 南京苏曼等离子科技有限公司 | Normal temperature glow discharge low-temperature plasma material processing device under large discharge interval |
| CN108322991A (en) * | 2018-01-08 | 2018-07-24 | 青海师范大学 | A kind of semiclosed normal pressure double frequency large area glow discharge experimental provision |
| CN109803477A (en) * | 2019-03-20 | 2019-05-24 | 河南先途智能科技有限公司 | A kind of equal dissolubilities ion generator |
| EP3531804A1 (en) * | 2018-02-21 | 2019-08-28 | Christof-Herbert Diener | Low pressure plasma chamber, low pressure plasma system and method for producing a low pressure plasma chamber |
| CN110739109A (en) * | 2019-10-10 | 2020-01-31 | 华北电力大学 | Increase C4F7System and method for electrical strength of insulator surface in N gas |
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- 2014-10-28 CN CN201420628455.3U patent/CN204145866U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105555000A (en) * | 2014-10-28 | 2016-05-04 | 南京苏曼等离子科技有限公司 | Normal temperature glow discharge low-temperature plasma material processing device under large discharge interval |
| CN105442297A (en) * | 2016-01-08 | 2016-03-30 | 南京苏曼等离子科技有限公司 | Uniform discharge low-temperature plasma fabric processing device and method under intelligent atmospheric pressure |
| CN108322991A (en) * | 2018-01-08 | 2018-07-24 | 青海师范大学 | A kind of semiclosed normal pressure double frequency large area glow discharge experimental provision |
| EP3531804A1 (en) * | 2018-02-21 | 2019-08-28 | Christof-Herbert Diener | Low pressure plasma chamber, low pressure plasma system and method for producing a low pressure plasma chamber |
| US11532465B2 (en) | 2018-02-21 | 2022-12-20 | Christof-Herbert Diener | Low-pressure plasma chamber, low-pressure plasma installation and method for producing a low-pressure plasma chamber |
| CN109803477A (en) * | 2019-03-20 | 2019-05-24 | 河南先途智能科技有限公司 | A kind of equal dissolubilities ion generator |
| CN110739109A (en) * | 2019-10-10 | 2020-01-31 | 华北电力大学 | Increase C4F7System and method for electrical strength of insulator surface in N gas |
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