CN204144060U - A kind of film capacitor surface erecting and welding deriving structure - Google Patents
A kind of film capacitor surface erecting and welding deriving structure Download PDFInfo
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- CN204144060U CN204144060U CN201420612895.XU CN201420612895U CN204144060U CN 204144060 U CN204144060 U CN 204144060U CN 201420612895 U CN201420612895 U CN 201420612895U CN 204144060 U CN204144060 U CN 204144060U
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- boss
- housing
- caulking groove
- film capacitor
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Abstract
The utility model discloses a kind of film capacitor surface erecting and welding deriving structure, comprise housing and by housing as the lead-in wire that electrode is drawn; The bottom of described housing protrudes out the boss of preset height downwards, and the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing; Described lead-in wire is embedded in corresponding boss place after the bending of the bottom of housing, and boss is provided with the caulking groove for holding lead-in wire.The utility model by the shell structure of film capacitor and the improvement of pin configuration, when making film capacitor be surface mounted on circuit board, has the advantage of low cost, easy to operate, high efficiency, high reliability.
Description
Technical field
The utility model relates to a kind of surface and installs film capacitor, particularly relates to a kind of film capacitor surface erecting and welding deriving structure.
Background technology
Capacitor is one of a large amount of electronic component used in electronic equipment, is widely used in, every directly, being coupled, bypass, filtering, resonant tank, power conversion, the aspects such as control circuit.
Surface mounting technology (SMT) is a systemic complex art comprising components and parts, material, equipment, technique and surface-assembled circuit substrate design and manufaction.Be widely used in the industries such as communication, computer, household electrical appliances at present, and to high density, high-performance, high reliability and low cost future development.In actual applications, film capacitor is installed on surface, main adopts that metalized film is stacked to be made, then in the spraying of two ends solderability metal as the solder side of product; Surface mount capacitor when mounted, that the solder side of product is directly welded on circuit boards as leg, namely, general thin capacitor adopts to carry welding region or auxiliary welding region and circuit board and carry out surface mount, and complex process, cost be higher, store transport moisture-sensitive class requirement.
Utility model content
The purpose of this utility model is the deficiency overcoming prior art, a kind of film capacitor surface erecting and welding deriving structure is provided, by to the shell structure of film capacitor and the improvement of pin configuration, when making film capacitor be surface mounted on circuit board, there is the feature of low cost, easy to operate, high efficiency, high reliability.
The utility model solves the technical scheme that its technical problem adopts: a kind of film capacitor surface erecting and welding deriving structure, comprise housing and by housing as the lead-in wire that electrode is drawn; The bottom of described housing protrudes out the boss of preset height downwards, and the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing; Described lead-in wire is embedded in corresponding boss place after the bending of the bottom of housing, and boss is provided with the caulking groove for holding lead-in wire.
The height of described boss is 0.2mm-2.0mm.
Some second boss that described boss is located by first boss of corner of bottom and two relative edges of the bottom of housing that are distributed in housing are formed, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the second boss place, and described lead-in wire is embedded in the caulking groove of the second corresponding boss after the bending of the bottom of housing.
3rd boss of the strip that described boss is located by two relative edges of the bottom being distributed in housing is formed, and the length of the 3rd boss is identical with the length of two relative edges of the bottom of described housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 3rd boss place, and caulking groove arranges along the length direction of the 3rd boss, and described lead-in wire is embedded in the caulking groove of the 3rd corresponding boss after the bending of the bottom of housing.
Described boss is made up of the 4th boss of V-arrangement shape of the bottom being distributed in housing, and the 4th boss is crossed between two relative edges of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 4th boss place, and caulking groove arranges along the V-arrangement shape of the 4th boss, and described lead-in wire is embedded in the caulking groove of the 4th corresponding boss after the bending of the bottom of housing.
Described boss is made up of the 5th boss of circle-arc profile of the bottom being distributed in housing, and the 5th boss is located at the centre of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 5th boss place, and caulking groove arranges along the circle-arc profile of the 5th boss, and described lead-in wire is embedded in the caulking groove of the 5th corresponding boss after the bending of the bottom of housing.
A kind of film capacitor surface of the present utility model erecting and welding deriving structure arranges auxiliary boss in the bottom of housing, and the bending that will go between, be close to part boss.The distribution of boss can have various ways, and paste just passable on circuit boards with enabling the bottom balance and stability of housing as long as can support housing, and the requirement for height of boss is between 0.2mm-2.0mm.Lead-in wire needs bending, and will be close to part boss, can realize being electrically connected with circuit board when film capacitor surface is installed.During surface mount, be that film capacitor is accurately installed to pad locations by paste application on the pad of circuit board, Reflow Soldering makes soldering paste melt, and film capacitor and circuit board are firmly welded together.
Compared with prior art, the beneficial effects of the utility model are:
Owing to have employed the boss protruding out preset height in the bottom of housing downwards, the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing; Described lead-in wire is embedded in corresponding boss place after the bending of the bottom of housing, boss is provided with the caulking groove for holding lead-in wire, when this structure of the present utility model makes film capacitor be surface mounted on circuit board, there is the advantage of low cost, easy to operate, high efficiency, high reliability.
Below in conjunction with drawings and Examples, the utility model is described in further detail; But a kind of film capacitor surface of the present utility model erecting and welding deriving structure is not limited to embodiment.
Accompanying drawing explanation
Fig. 1 is embodiment one D structure schematic diagram of the present utility model;
Fig. 2 is embodiment one front view of the present utility model;
Fig. 3 is embodiment one end view of the present utility model;
Fig. 4 is embodiment one upward view of the present utility model;
Fig. 5 is embodiment two D structure schematic diagram of the present utility model;
Fig. 6 is embodiment two front view of the present utility model;
Fig. 7 is embodiment two end view of the present utility model;
Fig. 8 is embodiment two upward view of the present utility model.
Embodiment
Embodiment one
See shown in Fig. 1 to Fig. 4, a kind of film capacitor surface of the present utility model erecting and welding deriving structure, comprise housing 1 and by housing as the lead-in wire 2 that electrode is drawn; The bottom of described housing 1 protrudes out the boss of preset height downwards, and the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing; Described lead-in wire 2 is embedded in corresponding boss place after the bending of the bottom of housing, and lead-in wire 2 has kink 21, and boss is provided with the caulking groove for holding lead-in wire.
The height of described boss is 0.2mm-2.0mm.
Some second boss 12 that described boss is located by first boss 11 of corner of bottom and two relative edges of the bottom of housing that are distributed in housing are formed, to paste on circuit boards with enabling the bottom balance and stability of housing 1; Described caulking groove 121 is located at the second boss 12 place, and described lead-in wire 2 is embedded in the caulking groove 121 of the second corresponding boss after the bending of the bottom of housing.
Embodiment two
See shown in Fig. 5 to Fig. 8, a kind of film capacitor surface of the present utility model erecting and welding deriving structure, be with the difference of embodiment one, 3rd boss 13 of the strip that described boss is located by two relative edges of the bottom being distributed in housing is formed, and the length of the 3rd boss 13 is identical with the length of two relative edges of the bottom of described housing 1, to paste on circuit boards with enabling the bottom balance and stability of housing 1; Described caulking groove 131 is located at the 3rd boss 13 place, and caulking groove 131 arranges along the length direction of the 3rd boss 13, and described lead-in wire 2 is embedded in the caulking groove 131 of the 3rd corresponding boss after the bending of the bottom of housing.
A kind of film capacitor surface of the present utility model erecting and welding deriving structure arranges auxiliary boss in the bottom of housing, and the bending that will go between, be close to part boss.The distribution of boss can have various ways, as long as can to housing support paste with enabling the bottom balance and stability of housing just passable on circuit boards, such as, described boss is made up of the 4th boss of V-arrangement shape of the bottom being distributed in housing, and the 4th boss is crossed between two relative edges of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 4th boss place, and caulking groove arranges along the V-arrangement shape of the 4th boss, and described lead-in wire is embedded in the caulking groove of the 4th corresponding boss after the bending of the bottom of housing; For another example, described boss is made up of the 5th boss of circle-arc profile of the bottom being distributed in housing, and the 5th boss is located at the centre of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 5th boss place, and caulking groove arranges along the circle-arc profile of the 5th boss, and described lead-in wire is embedded in the caulking groove of the 5th corresponding boss after the bending of the bottom of housing.Certainly, some distribution cannot, be such as only provided with the first boss at two angles place of the bottom of housing, like this, the bottom of housing just can not the subsides of balance and stability ground on circuit boards, the bottom of housing can tilt, and cannot carry out surface mount.In addition, the requirement for height of boss is between 0.2mm-2.0mm.Lead-in wire needs bending, and will be close to part boss, can realize being electrically connected with circuit board when film capacitor surface is installed.During surface mount, be that film capacitor is accurately installed to pad locations by paste application on the pad of circuit board, Reflow Soldering makes soldering paste melt, and film capacitor and circuit board are firmly welded together.Feature of the present invention is that housing mounting surface protrudes out any shape of certain altitude, " boss " of quantity downwards.
Above-described embodiment is only used for further illustrating a kind of film capacitor surface of the present utility model erecting and welding deriving structure; but the utility model is not limited to embodiment; every above embodiment is done according to technical spirit of the present utility model any simple modification, equivalent variations and modification, all fall in the protection range of technical solutions of the utility model.
Claims (6)
1. a film capacitor surface erecting and welding deriving structure, comprise housing and by housing as the lead-in wire that electrode is drawn; It is characterized in that: the bottom of described housing protrudes out the boss of preset height downwards, the distribution of described boss is pasted on circuit boards with enabling the bottom balance and stability of housing; Described lead-in wire is embedded in corresponding boss place after the bending of the bottom of housing, and boss is provided with the caulking groove for holding lead-in wire.
2. film capacitor surface according to claim 1 erecting and welding deriving structure, is characterized in that: the height of described boss is 0.2mm-2.0mm.
3. film capacitor surface according to claim 1 erecting and welding deriving structure, it is characterized in that: some second boss that described boss is located by first boss of corner of bottom and two relative edges of the bottom of housing that are distributed in housing are formed, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the second boss place, and described lead-in wire is embedded in the caulking groove of the second corresponding boss after the bending of the bottom of housing.
4. film capacitor surface according to claim 1 erecting and welding deriving structure, it is characterized in that: the 3rd boss of the strip that described boss is located by two relative edges of the bottom being distributed in housing is formed, and the length of the 3rd boss is identical with the length of two relative edges of the bottom of described housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 3rd boss place, and caulking groove arranges along the length direction of the 3rd boss, and described lead-in wire is embedded in the caulking groove of the 3rd corresponding boss after the bending of the bottom of housing.
5. film capacitor surface according to claim 1 erecting and welding deriving structure, it is characterized in that: described boss is made up of the 4th boss of V-arrangement shape of the bottom being distributed in housing, and the 4th boss is crossed between two relative edges of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 4th boss place, and caulking groove arranges along the V-arrangement shape of the 4th boss, and described lead-in wire is embedded in the caulking groove of the 4th corresponding boss after the bending of the bottom of housing.
6. film capacitor surface according to claim 1 erecting and welding deriving structure, it is characterized in that: described boss is made up of the 5th boss of circle-arc profile of the bottom being distributed in housing, and the 5th boss is located at the centre of the bottom of housing, to paste on circuit boards with enabling the bottom balance and stability of housing; Described caulking groove is located at the 5th boss place, and caulking groove arranges along the circle-arc profile of the 5th boss, and described lead-in wire is embedded in the caulking groove of the 5th corresponding boss after the bending of the bottom of housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420612895.XU CN204144060U (en) | 2014-10-22 | 2014-10-22 | A kind of film capacitor surface erecting and welding deriving structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420612895.XU CN204144060U (en) | 2014-10-22 | 2014-10-22 | A kind of film capacitor surface erecting and welding deriving structure |
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| CN204144060U true CN204144060U (en) | 2015-02-04 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104377033A (en) * | 2014-10-22 | 2015-02-25 | 厦门法拉电子股份有限公司 | Thin film capacitor surface mounting welding lead-out structure and mounting method thereof |
| CN105047439A (en) * | 2015-08-11 | 2015-11-11 | 湖南艾华集团股份有限公司 | Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method |
-
2014
- 2014-10-22 CN CN201420612895.XU patent/CN204144060U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104377033A (en) * | 2014-10-22 | 2015-02-25 | 厦门法拉电子股份有限公司 | Thin film capacitor surface mounting welding lead-out structure and mounting method thereof |
| CN105047439A (en) * | 2015-08-11 | 2015-11-11 | 湖南艾华集团股份有限公司 | Method for flattening terminal pins of chip aluminum electrolytic capacitor and application of method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |