CN203618221U - Bonding pad structure - Google Patents
Bonding pad structure Download PDFInfo
- Publication number
- CN203618221U CN203618221U CN201320674836.0U CN201320674836U CN203618221U CN 203618221 U CN203618221 U CN 203618221U CN 201320674836 U CN201320674836 U CN 201320674836U CN 203618221 U CN203618221 U CN 203618221U
- Authority
- CN
- China
- Prior art keywords
- pad
- bonding pad
- solder resist
- resist coating
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 28
- 239000011248 coating agent Substances 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 27
- 239000003292 glue Substances 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a bonding pad structure and relates to the technical field of electronic circuits. The bonding pad includes a bonding pad arranged on a circuit board. The bonding pad is used for being connected with the circuit board and an electric element electrically. The electric element is fixed on the bonding pad through conducting glue. A part of the bonding pad that is not coated with the conducting glue is covered with a solder resist coating extending towards the conducting glue. A part of the conducting glue is pasted on the upper part of the solder resist coating. According to the utility model, a technical problem that the electric element is easy to separate from the bonding pad is solved. The electric element is prevented from separating from the bonding pad effectively, so that performance stability of the circuit board is enhanced and service lifetime of an electric device is prolonged.
Description
Technical field
The utility model relates to electronic circuit technology field, particularly a kind of for being electrically connected the pad structure of electronic component on circuit board and circuit board.
Background technology
Pad is the Copper Foil for soldering of electronic components or wire on circuit board, and major function is that electronic component or wire are fixed on circuit board and by electronic component or wire and are electrically connected with the circuit on circuit board.Conventionally between electronic component and pad, weld by scolding tin, but, along with the continuous miniaturization of electronic component, microminiaturization, and printed circuit board (PCB) is constantly to the development of densification and Highgrade integration, and scolding tin has been not suitable for being applied in hypomegetic circuit.At electronic component and circuit board, constantly in the process of microminiaturized development, conducting resinl can be made slurry with it, realizes very high linear resolution, and conducting resinl technique simply, easy operating, the advantage such as can enhance productivity become the best substitute of scolding tin.
As shown in Figure 1, electronic component 50 is pasted and fixed on pad 10 by conducting resinl 30a, and the position that does not scribble conducting resinl 30a on pad 10 is coated with solder resist coating 20a, and solder resist coating 20a plays insulating effect.In the connected mode of this kind of electronic component and pad: due to pad 10 smooth surfaces, bonding fastness between conducting resinl 30a and pad 10 is poor, electronic component 50 is easy to depart from from pad 10, thereby cause the unstable properties of circuit board, and then can cause the afunction of electronic equipment, shorten useful life.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of pad structure, this pad structure has strengthened firmness bonding between electronic component and pad, electronic component can not departed from from pad, thereby improved the stability of circuit board, extended the useful life of electronic equipment.
For solving the problems of the technologies described above, the technical solution of the utility model is:
A kind of pad structure, comprise the pad being arranged on circuit board, described pad is used for being electrically connected described circuit board and electronic component, described electronic component is fixed on described pad by conducting resinl, the position that does not scribble conducting resinl on described pad is coated with solder resist coating, described solder resist coating is extended to described conducting resinl direction, and the described conducting resinl of part is pasted on described solder resist coating top.
Wherein, described solder resist coating extends to the bottom of described electronic component.
Wherein, described electronic component is chip.
Adopted after technique scheme, the beneficial effects of the utility model are:
Because electronic component in the utility model pad structure is adhesively fixed by conducting resinl and pad, the part of conducting resinl is bonded in the solder resist coating of bond pad surface covering.Because of solder resist coating surface so smooth unlike bond pad surface, more coarse, therefore conducting resinl part is bonded in solder resist coating, contact area between conducting resinl and solder resist is larger, bonding firmness is large, thereby electronic component very firmly can be bonded on pad, solve the technical problem that electronic component easily departs from from pad, effectively prevent that the phenomenon that electronic component departs from from pad from occurring, and then strengthened the stability of circuit board, extend the useful life of electronic equipment.
Accompanying drawing explanation
Fig. 1 is the structural representation of pad structure in background technology;
Fig. 2 is the structural representation of the utility model pad structure;
Wherein: 10, pad, 20a, solder resist coating, 20b, solder resist coating, 30a, conducting resinl, 30b, conducting resinl, 40, chip, 50, electronic component.
Embodiment
Below in conjunction with drawings and Examples, further set forth the utility model.
As shown in Figure 2, a kind of pad structure, comprises the pad 10 being arranged on circuit board, and pad 10 is for chip 40 being fixed on circuit board and chip 40 being electrically connected with the circuit on circuit board, and chip 40 is by conducting resinl 30b and pad 10 secure bond.
As shown in Figure 2, on pad 10, do not need the position of welding chip 40 to be coated with solder resist coating 20b.Definition solder resist coating 20b is inward flange near the edge of chip 40, is outward flange away from the edge of chip 40, and the inward flange of solder resist coating 20b extends to the bottom of chip 40, and the part of conducting resinl 30b is adhered to the top of solder resist coating 20b.
The bottom that the inward flange of solder resist coating 20b extends to chip 40 can increase the contact area between conducting resinl 30b and solder resist coating 20b to greatest extent, again due to the rough surface of the surface ratio pad 10 of solder resist coating 20b, strengthen the firmness of combination between chip 40 and pad 10 therefore partially conductive glue 30b is bonded in the top of solder resist coating 20b, effectively prevented that the phenomenon that chip 40 departs from from pad 10 from occurring.
The bottom of the chip 40 of above mentioning as shown in Figure 2, refers to the side of chip 40 near pad 10; The top of solder resist coating 20b refers to the side of solder resist coating 20b away from pad 10.
In the present embodiment, electronic component is chip, and in actual applications, the technical solution of the utility model also can be for strengthening the firmness of combination between the electronic components such as paster type resistor, electric capacity and pad, consistent in conjunction with the embodiment of firmness and the execution mode of said chip for strengthening between the electronic component such as paster type resistor, electric capacity and pad, therefore this is no longer going to repeat them.
The utility model is not limited to above-mentioned concrete execution mode, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion of having done, within all dropping on protection range of the present utility model.
Claims (3)
1. pad structure, comprise the pad being arranged on circuit board, described pad is used for being electrically connected described circuit board and electronic component, described electronic component is fixed on described pad by conducting resinl, the position that does not scribble conducting resinl on described pad is coated with solder resist coating, it is characterized in that: described solder resist coating is extended to described conducting resinl direction, the described conducting resinl of part is pasted on described solder resist coating top.
2. pad structure according to claim 1, is characterized in that: described solder resist coating extends to the bottom of described electronic component.
3. pad structure according to claim 1, is characterized in that: described electronic component is chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320674836.0U CN203618221U (en) | 2013-10-29 | 2013-10-29 | Bonding pad structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320674836.0U CN203618221U (en) | 2013-10-29 | 2013-10-29 | Bonding pad structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203618221U true CN203618221U (en) | 2014-05-28 |
Family
ID=50770835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320674836.0U Expired - Lifetime CN203618221U (en) | 2013-10-29 | 2013-10-29 | Bonding pad structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203618221U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373901A (en) * | 2016-08-31 | 2017-02-01 | 北京无线电测量研究所 | Dispersion glue patch method for microwave bare chip |
| CN109152230A (en) * | 2018-08-28 | 2019-01-04 | 上海幂方电子科技有限公司 | Flexible circuit and its manufacturing method |
| CN110062522A (en) * | 2018-01-18 | 2019-07-26 | 施赖纳集团两合公司 | Flexible circuit with the connection between the conductive structural detail of energy |
-
2013
- 2013-10-29 CN CN201320674836.0U patent/CN203618221U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373901A (en) * | 2016-08-31 | 2017-02-01 | 北京无线电测量研究所 | Dispersion glue patch method for microwave bare chip |
| CN110062522A (en) * | 2018-01-18 | 2019-07-26 | 施赖纳集团两合公司 | Flexible circuit with the connection between the conductive structural detail of energy |
| CN109152230A (en) * | 2018-08-28 | 2019-01-04 | 上海幂方电子科技有限公司 | Flexible circuit and its manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140528 |