CN203618221U - Bonding pad structure - Google Patents
Bonding pad structure Download PDFInfo
- Publication number
- CN203618221U CN203618221U CN201320674836.0U CN201320674836U CN203618221U CN 203618221 U CN203618221 U CN 203618221U CN 201320674836 U CN201320674836 U CN 201320674836U CN 203618221 U CN203618221 U CN 203618221U
- Authority
- CN
- China
- Prior art keywords
- pad
- bonding pad
- solder resist
- resist coating
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 28
- 239000011248 coating agent Substances 0.000 claims abstract description 27
- 238000000576 coating method Methods 0.000 claims abstract description 27
- 239000003292 glue Substances 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320674836.0U CN203618221U (en) | 2013-10-29 | 2013-10-29 | Bonding pad structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320674836.0U CN203618221U (en) | 2013-10-29 | 2013-10-29 | Bonding pad structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203618221U true CN203618221U (en) | 2014-05-28 |
Family
ID=50770835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201320674836.0U Expired - Lifetime CN203618221U (en) | 2013-10-29 | 2013-10-29 | Bonding pad structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203618221U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106373901A (en) * | 2016-08-31 | 2017-02-01 | 北京无线电测量研究所 | Dispersion glue patch method for microwave bare chip |
CN109152230A (en) * | 2018-08-28 | 2019-01-04 | 上海幂方电子科技有限公司 | Flexible circuit and its manufacturing method |
CN110062522A (en) * | 2018-01-18 | 2019-07-26 | 施赖纳集团两合公司 | Flexible circuit with the connection between the conductive structural detail of energy |
-
2013
- 2013-10-29 CN CN201320674836.0U patent/CN203618221U/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106373901A (en) * | 2016-08-31 | 2017-02-01 | 北京无线电测量研究所 | Dispersion glue patch method for microwave bare chip |
CN110062522A (en) * | 2018-01-18 | 2019-07-26 | 施赖纳集团两合公司 | Flexible circuit with the connection between the conductive structural detail of energy |
CN109152230A (en) * | 2018-08-28 | 2019-01-04 | 上海幂方电子科技有限公司 | Flexible circuit and its manufacturing method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20140528 |