CN102689065A - Method for welding circuit board components - Google Patents
Method for welding circuit board components Download PDFInfo
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- CN102689065A CN102689065A CN2012101820314A CN201210182031A CN102689065A CN 102689065 A CN102689065 A CN 102689065A CN 2012101820314 A CN2012101820314 A CN 2012101820314A CN 201210182031 A CN201210182031 A CN 201210182031A CN 102689065 A CN102689065 A CN 102689065A
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Abstract
The embodiment of the invention discloses a method for welding circuit board components, which is used for merging or reducing production processes and improving production efficiency. Corresponding tin leaking holes are manufactured on a tin printing steel mesh according to positions of components to be plugged on a circuit board. The circuit board is printed with tin through the tin printing steel mesh, thereby enabling tin cream to be adhered onto corresponding pads, above plug holes and onto walls of the plug holes through the tin leaking holes. Components which need to be plugged are plugged into corresponding plug holes, thereby enabling tin cream adhered above the plug holes and onto walls of the plug holes to be pushed to pin positions of the components to be plugged. The circuit board plugged with the components is put into reflow welding equipment to be welded, thereby enabling the components to form welding connection with the pads from the front face of the circuit board and enabling tin cream pushed to the pin positions of the components on the back face of the circuit board to form tin welding points.
Description
Technical field
The present invention relates to the production technical field of electronic product and small-sized solar cell panel, especially a kind of welding method of circuit board element.
Background technology
Nowadays because updating of electronics manufacturing become the active demand of every profession and trade to the improvement of manufacturing process; For example, the components and parts pin of PCBA reverse side is exposed the position add tin-welding process, wherein; PCBA is the abbreviation of English Printed Circuit Board+Assembly; That is to say that printing board PCB hollow plate process SMT (Surface Mount Technology, electronic circuit surface installation technique) goes up part, passes through DIP (Dual Inline-pin Package again; The dual-inline package technology) the whole processing procedure of plug-in unit is called for short PCBA.At present, its common implementation of this technology has three kinds:
Mode one:, adopt Wave soldering apparatus that plug-in unit components and parts pin corresponding bonding pad is added soldering and connect at the PCBA reverse side;
Mode two:, use electric iron that plug-in unit components and parts pin is added soldering and connect at the PCBA reverse side.
Mode three: utilize existing equipment that front is once mounted PCBA after (comprise short leads ends subclass components and parts, or claim paster components and parts and sheet components and parts, like rivet-like terminal components and parts) and carry out again that the reverse side secondary prints tin, secondary is crossed stove.
Practice finds that mode one following problem can occur with mode two described technical schemes: have more scaling powder remaining after adding tin, influence product appearance; Add the tin process and can cause the tin amount inhomogeneous, cause bad phenomenon such as rosin joint, empty weldering; And these three kinds of modes also need drop into more personnel, manufacturing equipment, tool fixture etc. if be applied in when producing in enormous quantities, and cost is bigger, thereby influences production efficiency.
Summary of the invention
The embodiment of the invention provides a kind of welding method of circuit board element, is used for merging or minimizing production process, enhances productivity.
In view of this, the embodiment of the invention provides:
A kind of welding method of circuit board element comprises:
According to insert subsides components and parts on circuit board, insert the position of pasting, on the seal tin steel-screen, produce corresponding leakage tin hole;
Use said seal tin steel-screen, said circuit board is carried out Yin Xi, make tin cream stick to corresponding bonding pad and insert on the top and hole wall thereof of pasting the hole through leaking the tin hole;
Needs are plugged in the components and parts that paste insert in the corresponding slotting subsides hole, make to stick to and insert the pin place that the tin cream that pastes on top, hole and the hole wall thereof is pushed through the components and parts that paste of inserting;
The circuit board that inserts components and parts is put into Reflow Soldering equipment weld, make said components and parts weld, and make the tin cream that is pushed through circuit board reverse side components and parts pin place form tin welding spot positive formation of circuit board with pad.
Wherein, said according to insert subsides components and parts insert the position of pasting at circuit board and specifically comprise:
According to plug in the components and parts of subsides at the size and shape of pad on the circuit board correspondence position, insert the size and shape that pastes the hole and the relative position between each pad.
Saidly produce corresponding leakage tin hole on the tin steel-screen, comprising at seal:
Need insert the pad that pastes components and parts for each, respective production goes out corresponding two or more leakage tin hole on the seal tin steel-screen.
The said components and parts that paste of will inserting insert in the corresponding slotting subsides hole, comprising:
The pin that uses chip mounter or inserter will plug in the components and parts that paste inserts in the corresponding slotting subsides hole.
Said pad is a circular pad, and said slotting subsides hole is that circular inserting pasted the hole.
Has the more than one leakage tin hole that mounts all kinds of electronic devices and components on the said seal tin steel-screen.
Said tin welding spot is the dome shape tin welding spot, forms with welding lead or with circuit to be connected.
Can find out from above technical scheme; The welding method of a kind of circuit board element that the embodiment of the invention provides, wherein, according to the pin shape of insert being pasted components and parts with size, the shape and size of inserting the shape of pasting the hole and size, pad; On the seal tin steel-screen, make the corresponding tin hole of leaking; After circuit board being implemented the operation of seal tin, guarantee outside the normal tin amount on the pad that some tin cream is suspended on the top of inserting subsides hole periphery edge and inserts and paste on the hole wall with it; And make this part tin cream not drip; After insert pasting components and parts, the tin cream that this part tin cream can be pushed through circuit board reverse side components and parts pin place forms uniform tin welding spot, exposes the position and adds tin-welding process thereby accomplished components and parts pin to the circuit board reverse side.This method is removed or merged the multiple tracks complicated procedures of forming, and is simple, with low cost, effectively raises production efficiency.
Description of drawings
In order to be illustrated more clearly in the technical scheme of the embodiment of the invention; The accompanying drawing do introduction simply of required use will be described embodiment below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The flow chart of the welding method of a kind of circuit board element that Fig. 1 provides for the embodiment of the invention;
Fig. 2 a-2e is the welding process sketch map of the welding method of the circuit board element that provides of the embodiment of the invention.
The specific embodiment
The embodiment of the invention provides a kind of welding method of circuit board element, is used for merging or minimizing production process, enhances productivity.
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making all other embodiment that obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Below be elaborated respectively.
Please refer to Fig. 1; The flow chart of the welding method of a kind of circuit board element that Fig. 1 provides for the embodiment of the invention please combine the 2a-2e with reference to figure, and Fig. 2 a-2e is the welding process sketch map of the welding method of the circuit board element that provides of the embodiment of the invention; Wherein, this method comprises:
S101, according to insert subsides components and parts on circuit board, insert the position of pasting, on the seal tin steel-screen, produce corresponding leakage tin hole;
It is understandable that; Plug in the circuit board that pastes and to be common printing board PCB; Also can be PCBA, wherein, PCBA is the abbreviation of English Printed Circuit Board+Assembly; That is to say that the PCB hollow plate goes up part through SMT, the circuit board of making through the whole processing procedure of DIP plug-in unit again.
SMT is surface installation technique (surface mounting technology), is the abbreviation of Surface Mounted Technology, is most popular a kind of technology and technology in the present electronics assembling industry.SMT a kind ofly will not have on the surface of surface or other substrate that pin or short leg surface-assembled components and parts (be called for short SMC/SMD, the sheet components and parts claimed in Chinese) are installed in PCB, through methods such as Reflow Soldering or the immersed solder circuit load technology of welding assembly in addition.
Preferably, can according to plug in the components and parts of subsides at the size and shape of pad on the circuit board correspondence position, insert the size and shape that pastes the hole and the relative position between each pad etc., come on the seal tin steel-screen, to produce corresponding leakage tin hole.
Preferably, said pad can be circular pad, and the slotting subsides hole in the middle of the said pad can be inserted for circle and pasted the hole;
Need to prove; Said pad also can be non-circular pad; Said slotting subsides hole also can be inserted for circle and pasted the hole, and this can design according to the size shape and slotting size shape or other actual conditions of pasting the hole of actual pad, does not do concrete qualification here.
Understand for ease, below insert with circular pad and circular that to paste the hole be example, this method is described:
Please refer to Fig. 2 a, Fig. 2 a is for leaking the making sketch map in tin hole on the seal tin steel-screen, and wherein, 1 for printing tin steel-screen, and 2 for leaking the tin hole, and 3 is pad, and 4 is circuit board, and the hole in the middle of the pad 3 is exactly the slotting subsides hole 31 that components and parts are inserted subsides;
In some embodiments, can be according to the size of pad 3, insert the size of pasting hole 31, and the spacing between each pad, on seal tin steel-screen 1, make the corresponding tin hole 2 of leaking;
It is understandable that, need insert the pad 3 that pastes components and parts, on seal tin steel-screen 1, can produce corresponding two or more leakage tin hole 2 for each; In the present embodiment; Shown in Fig. 2 a; Need insert the pad 3 that pastes components and parts for each, 1 produces two corresponding leakage tin holes 2 on the seal tin steel-screen, implements under scene at this; Leak tin hole 2 and can be two relative arc settings up and down, its arc height is about 1/3 of corresponding circular pad 3 diameters; And two leak between the tin holes 2 and leave not perforate part, and promptly two leak between the tin hole 2 not connectedly, can be known that by diagram two leak the tin hole 2 and the not perforate gross areas partly, are equivalent to the area of corresponding pad 3.
It is understandable that; In existing circuit board making process, the seal tin steel-screen is to be used for printing to the tin of paste slurry on the pcb board, and at present popular circuit board uses surface mounting technology mostly except that power panel; A lot of Surface Mount pads are arranged on its pcb board; Promptly do not have the sort of of via hole, and the leakage tin hole on the seal tin steel-screen just in time is the pad on the corresponding pcb board, the leakage tin hole of with the hard brush of level the tin of semiliquid semi-solid state being starched through printing on the tin steel-screen during seal tin is printed onto on the pcb board; Up paste components and parts through chip mounter again, and then cross reflow soldering; Generally, on steel mesh, except that having the leakage tin hole shown in the present embodiment, can also have the more than one leakage tin hole that mounts other all kinds of electronic devices and components simultaneously, not do concrete qualification here.
S102, use seal tin steel-screen carry out Yin Xi to circuit board, make tin cream stick on the top and hole wall thereof in corresponding bonding pad and slotting subsides hole through leaking the tin hole;
In embodiments of the present invention, use the made seal tin steel-screen 1 of step S101, circuit board 4 is printed the tin operation;
Like Fig. 2 b; Fig. 2 b is the sketch map of the circuit board behind the seal tin; Behind the Yin Xi, can leave normal tin amount on the pad, and make a part of tin cream 6 stick to corresponding bonding pad 3 and insert on the top and hole wall thereof of pasting hole 31 through leaking the tin hole; And do not drip naturally, it can be referring to overlooking enlarged drawing and A-A direction enlarged drawing behind the 3 seal tin of pad shown in Fig. 2 b.
S103, will plug in the components and parts that paste and insert in the corresponding slotting subsides hole, and make to stick to and insert the tin cream that pastes on top, hole and the hole wall thereof and be pushed through the pin place that institute plugs in the components and parts of subsides;
It is understandable that in some embodiments, the pin that is to use chip mounter or inserter will plug in the components and parts 5 that paste inserts in the corresponding slotting subsides hole 31;
Like Fig. 2 c, Fig. 2 c is for inserting the preceding sketch map of subsides, and wherein, in embodiments of the present invention, it is example that the plug in components and parts 5 that paste are inserted the subsides components and parts with rivet-like; Please combine 2d with reference to figure; Fig. 2 d, makes to stick to and inserts the pin place that the tin cream that pastes on 31 tops, hole and the hole wall thereof is pushed through the components and parts 5 of subsides of inserting after slotting the subsides for inserting the sketch map of the circuit board after pasting; It can paste the enlarged drawing that subsides hole 31A-A direction is inserted in the back referring to inserting shown in Fig. 2 d; And can know by diagram, stick to after the tin cream 6 that insert to paste on 31 tops, hole and the hole wall thereof is pushed through the pin place of components and parts 5 that institute inserts subsides, form irregular tin cream group.
S104, the circuit board that will insert components and parts are put into Reflow Soldering equipment and are welded, and make components and parts form welding with pad in that circuit board is positive, and make the tin cream that is pushed through circuit board reverse side components and parts pin place form tin welding spot.(because the content of these descriptions of S101-S104 is corresponding exclusive rights 1, therefore deletion " comparatively smooth dome shape " is mentioned getting final product in the following specifically describes.)
After the slotting subsides of accomplishing components and parts; Circuit board 4 is put into Reflow Soldering equipment weld, take out circuit board after the Reflow Soldering excessively, components and parts 5 (inserting the subsides components and parts like rivet-like) have formed effective welding in circuit board 4 fronts through tin cream 6 and pad 3; And the tin cream 6 that is pushed through circuit board reverse side components and parts pin place forms tin welding spot 7; Shown in Fig. 2 e, Fig. 2 e was the circuit board sketch map and the enlarged drawing of inserting subsides hole 31A-A direction after the Reflow Soldering, wherein; Tin welding spot 7 is comparatively smooth dome shape, can directly be used for welding lead or form with other circuit being connected.
It is understandable that; Reflow welding is claimed in Reflow Soldering again; Form solder joint through the prepositioned scolder of refuse, in welding process, need not add a kind of welding method of any extra solder, the process of Reflow Soldering comprises preheating, intensification, backflow, cooling; Its effect is that solder(ing) paste is melted, and surface-assembled components and parts and circuit board are firmly welded together.Common employed Reflow Soldering equipment is called reflow soldering, places the equipment of surface mount production line chip mounter back.
Can find out from above technical scheme; The embodiment of the invention provides a kind of welding method of circuit board element; According to the pin shape of insert being pasted components and parts with size, the shape and size of inserting the shape of pasting the hole and size, pad, on the seal tin steel-screen, make the corresponding tin hole of leaking, after circuit board being implemented the operation of seal tin with it; Guarantee outside the normal tin amount on the pad; Some tin cream is suspended on the top of inserting subsides hole periphery edge and inserts and paste on the hole wall, and makes this part tin cream not drip, after inserting the subsides components and parts; The tin cream that this part tin cream can be pushed through circuit board reverse side components and parts pin place forms uniform tin welding spot, exposes the position and adds tin-welding process thereby accomplished components and parts pin to the circuit board reverse side.This method is removed or merged the multiple tracks complicated procedures of forming, and is simple, with low cost, effectively raises utilization rate of equipment and installations and production efficiency.
More than the welding method of a kind of circuit board element provided by the present invention has been carried out detailed introduction; For one of ordinary skill in the art; Thought according to the embodiment of the invention; The part that on the specific embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (7)
1. the welding method of a circuit board element is characterized in that, comprising:
According to insert subsides components and parts on circuit board, insert the position of pasting, on the seal tin steel-screen, produce corresponding leakage tin hole;
Use said seal tin steel-screen, said circuit board is carried out Yin Xi, make tin cream stick to corresponding bonding pad and insert on the top and hole wall thereof of pasting the hole through leaking the tin hole;
Needs are plugged in the components and parts that paste insert in the corresponding slotting subsides hole, make to stick to and insert the pin place that the tin cream that pastes on top, hole and the hole wall thereof is pushed through the components and parts that paste of inserting;
The circuit board that inserts components and parts is put into Reflow Soldering equipment weld, make said components and parts weld, and make the tin cream that is pushed through circuit board reverse side components and parts pin place form tin welding spot positive formation of circuit board with pad.
2. method according to claim 1 is characterized in that, said according to insert subsides components and parts insert the position of pasting at circuit board and specifically comprise:
According to plug in the components and parts of subsides at the size and shape of pad on the circuit board correspondence position, insert the size and shape that pastes the hole and the relative position between each pad.
3. method according to claim 1 is characterized in that,
Saidly produce corresponding leakage tin hole on the tin steel-screen, comprising at seal:
Need insert the pad that pastes components and parts for each, respective production goes out corresponding two or more leakage tin hole on the seal tin steel-screen.
4. method according to claim 1 is characterized in that,
The said components and parts that paste of will inserting insert in the corresponding slotting subsides hole, comprising:
The pin that uses chip mounter or inserter will plug in the components and parts that paste inserts in the corresponding slotting subsides hole.
5. according to each described method of claim 1 to 4, it is characterized in that,
Said pad is a circular pad, and said slotting subsides hole is that circular inserting pasted the hole.
6. according to each described method of claim 1 to 4, it is characterized in that,
Has the more than one leakage tin hole that mounts all kinds of electronic devices and components on the said seal tin steel-screen.
7. according to each described method of claim 1 to 4, it is characterized in that,
Said tin welding spot is the dome shape tin welding spot, forms with welding lead or with circuit to be connected.
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| CN201210182031.4A CN102689065B (en) | 2012-06-05 | 2012-06-05 | A kind of welding method of circuit board element |
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| CN103317203A (en) * | 2013-06-20 | 2013-09-25 | 成都九洲迪飞科技有限责任公司 | Welding technology for microwave substrate |
| CN104125721A (en) * | 2014-08-04 | 2014-10-29 | 太仓市同维电子有限公司 | Method and device for firmly welding SMD (surface mounted devices) nuts on printed circuit boards |
| CN105234517A (en) * | 2015-10-31 | 2016-01-13 | 成都海沃斯电气技术有限公司 | Penetrating-welding hole welding and tin-penetrating method for double-face PCB |
| CN105338757A (en) * | 2015-12-04 | 2016-02-17 | 深圳威迈斯电源有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN105578795A (en) * | 2015-12-16 | 2016-05-11 | 深圳市大德激光技术有限公司 | Automatic drag soldering method used for flexible bonding pads |
| CN106229370A (en) * | 2016-08-31 | 2016-12-14 | 福建省晶鼎光电股份有限公司 | Solar panel and manufacture method thereof |
| CN106937490A (en) * | 2015-12-30 | 2017-07-07 | 马夸特开关(上海)有限公司 | A kind of process for printed circuit plate weld |
| CN107665963A (en) * | 2017-10-23 | 2018-02-06 | 陈志勇 | Paster battery |
| CN107889374A (en) * | 2017-11-14 | 2018-04-06 | 北京计算机技术及应用研究所 | A kind of compensation reflow soldering method of the solder of via devices |
| CN109447280A (en) * | 2018-09-20 | 2019-03-08 | 国营芜湖机械厂 | A method of it is shaped for gull wing component fast and high quality |
| CN111315152A (en) * | 2019-11-27 | 2020-06-19 | 浪潮商用机器有限公司 | Welding method of PIH (plasma enhanced H) element |
| CN111482670A (en) * | 2020-05-27 | 2020-08-04 | 东莞市点精电子有限公司 | Electronic component soldering method |
| CN111654981A (en) * | 2020-07-02 | 2020-09-11 | 四川耀讯电子科技有限公司 | SMT reflow soldering process of PCBA flexible circuit board |
| CN112153826A (en) * | 2019-06-28 | 2020-12-29 | 株洲中车时代电气股份有限公司 | Contact pin welding method |
| CN112911826A (en) * | 2021-01-14 | 2021-06-04 | 苏州浪潮智能科技有限公司 | Uniform welding assembly for direct-insert pins |
| CN113923890A (en) * | 2021-09-16 | 2022-01-11 | 景旺电子科技(龙川)有限公司 | Circuit board mounting method and circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103317203A (en) * | 2013-06-20 | 2013-09-25 | 成都九洲迪飞科技有限责任公司 | Welding technology for microwave substrate |
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| CN105234517A (en) * | 2015-10-31 | 2016-01-13 | 成都海沃斯电气技术有限公司 | Penetrating-welding hole welding and tin-penetrating method for double-face PCB |
| CN105234517B (en) * | 2015-10-31 | 2017-10-31 | 成都海沃斯电气技术有限公司 | The saturating welding hole of double-sided PCB board welds saturating tin method |
| CN105338757A (en) * | 2015-12-04 | 2016-02-17 | 深圳威迈斯电源有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN105578795A (en) * | 2015-12-16 | 2016-05-11 | 深圳市大德激光技术有限公司 | Automatic drag soldering method used for flexible bonding pads |
| CN106937490A (en) * | 2015-12-30 | 2017-07-07 | 马夸特开关(上海)有限公司 | A kind of process for printed circuit plate weld |
| CN106229370A (en) * | 2016-08-31 | 2016-12-14 | 福建省晶鼎光电股份有限公司 | Solar panel and manufacture method thereof |
| CN106229370B (en) * | 2016-08-31 | 2017-10-24 | 福建省晶鼎光电股份有限公司 | Solar panel and its manufacture method |
| CN107665963A (en) * | 2017-10-23 | 2018-02-06 | 陈志勇 | Paster battery |
| CN107889374A (en) * | 2017-11-14 | 2018-04-06 | 北京计算机技术及应用研究所 | A kind of compensation reflow soldering method of the solder of via devices |
| CN109447280A (en) * | 2018-09-20 | 2019-03-08 | 国营芜湖机械厂 | A method of it is shaped for gull wing component fast and high quality |
| CN112153826A (en) * | 2019-06-28 | 2020-12-29 | 株洲中车时代电气股份有限公司 | Contact pin welding method |
| CN111315152A (en) * | 2019-11-27 | 2020-06-19 | 浪潮商用机器有限公司 | Welding method of PIH (plasma enhanced H) element |
| CN111482670A (en) * | 2020-05-27 | 2020-08-04 | 东莞市点精电子有限公司 | Electronic component soldering method |
| CN111654981A (en) * | 2020-07-02 | 2020-09-11 | 四川耀讯电子科技有限公司 | SMT reflow soldering process of PCBA flexible circuit board |
| CN112911826A (en) * | 2021-01-14 | 2021-06-04 | 苏州浪潮智能科技有限公司 | Uniform welding assembly for direct-insert pins |
| CN112911826B (en) * | 2021-01-14 | 2022-05-24 | 苏州浪潮智能科技有限公司 | Uniform welding assembly for direct-insert pins |
| CN113923890A (en) * | 2021-09-16 | 2022-01-11 | 景旺电子科技(龙川)有限公司 | Circuit board mounting method and circuit board |
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