CN204127691U - Lamp and lighting device - Google Patents

Lamp and lighting device Download PDF

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Publication number
CN204127691U
CN204127691U CN201290001175.9U CN201290001175U CN204127691U CN 204127691 U CN204127691 U CN 204127691U CN 201290001175 U CN201290001175 U CN 201290001175U CN 204127691 U CN204127691 U CN 204127691U
Authority
CN
China
Prior art keywords
cover
lamp
suppression component
bar
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201290001175.9U
Other languages
Chinese (zh)
Inventor
松田次弘
大村考志
三贵政弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
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Publication of CN204127691U publication Critical patent/CN204127691U/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/04Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The utility model provides a kind of lamp and lighting device, and described lamp is formed by the LED of support unit supporting as light source in the container of spherical shell opening tegmentum parts shutoff; Spherical shell and cover are made up of glass material, and the circumference welding of cover is in the opening circumference of spherical shell; In container, enclose the fluid with the heat conductivity higher than air; Support unit has the bar that is installed on cover and is installed on bar and is provided with the support main body of LED; Between support main body and cover, be provided with heat when suppressing the welding because of spherical shell and cover and suppression component that the temperature of cover that temperature rises declines.

Description

Lamp and lighting device
Technical field
It is lamp and the lighting device of light source that the utility model relates to the semiconductor light-emitting elements of LED (Light Emitting Diode) etc.
Background technology
In recent years, from the view point of energy-conservation, the instead bulb-like light of incandescent lamp, proposes the lamp (following, to be denoted as LED) utilizing high efficiency, long-life LED.
In LED, such as, the installation base plate installing many LED being attached to the end of housing, making the circuit unit of LED luminescence be accommodated in (patent document 1) in housing by being used for.
Comprise the part that can not bear thermic load at the electronic component of forming circuit unit, on the other hand, LED produces heat when luminescence.The electronic component that can not bear thermic load becomes high temperature to housing in housing due to the heat trnasfer of LED during LED luminescence, therefore likely causes its action to become unstable, or lifetime.
Therefore, in order to suppress the thermic load to circuit unit, propose for the various technology of heat when LED is luminous to the external cooling of LED.Specifically, technology radiating groove (patent document 2) being set on the surface of housing or enclosing inert gas (patent document 3) in the sealing part of enclosing LED is had.
Prior art document
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2006-313717 publication
Patent document 2: Japanese Unexamined Patent Publication 2010-003580 publication
Patent document 3: Japanese Unexamined Patent Publication 08-153896 publication
Utility model summary
The problem that utility model will solve
In recent years, be not only the requirement of high-quality for LED and cost degradation, the requirement of high brightness also becomes strong, can not be tackled the requirement of high brightness, high-quality and cost degradation by above-mentioned technology.
That is, in the technology of above-mentioned patent document 2, along with high brightness, the caloric value of LED increases, and in order to this heat be released, conduct heat, housing maximizes.If housing maximizes, then causing LED to maximize, can not be applied in existing lighting device, its result, having the problem can not tackling the requirement of high brightness when considering actual use.
In addition, utilizing the technology of above-mentioned patent document 3, when enclosing in the container of spherical shell opening tegmentum parts shutoff as the LED of light source and the high fluid of the heat conductivity of heat trnasfer, if known spherical shell by being formed by glass material and cover form container, and by spherical shell and cover welding, then the probability broken at the peripheral part comprising weld uprises.The generation of breaking like this can cause the leakage of the enclosure of fluid in container etc., brings harmful effect, causes the decline of the yields of lamp etc., have the problem of the requirement that can not respond cost degradation to modulation characteristic.
Utility model content
The utility model is made to solve such problem, and object is to provide the structure that semiconductor light-emitting elements and the high fluid of heat conductivity are enclosed in a kind of employing in container, and can suppress the lamp that breaks at weld and lighting device.
For the means of dealing with problems
Relevant lamp of the present utility model, in the container of spherical shell opening tegmentum parts shutoff, formed by the semiconductor light-emitting elements of support unit supporting as light source, it is characterized in that, described spherical shell and cover are made up of glass material, and the circumference welding of described cover is in the opening circumference of described spherical shell; In described container, enclose the fluid with the heat conductivity higher than air; Described support unit has: more than one bar, is installed on described cover; And support main body, be installed on described bar with described cover opposition side, and be provided with described semiconductor light-emitting elements; Between described support main body and described cover, be provided with suppression component, this suppression component suppresses the temperature of the heat when the welding of described spherical shell and described cover suffered by described cover to decline; Described in the ratio of heat capacities of described suppression component, the thermal capacity of support main body is little.
In " supporting of semiconductor light-emitting elements supported portion part " described here, comprise semiconductor light-emitting elements and be directly installed on support unit by situation that the situation, the semiconductor light-emitting elements that support support via miscellaneous part (such as installation base plate) supported portion part.
In order to achieve the above object, relevant lighting device of the present utility model, possess lamp and install above-mentioned lamp and the ligthing paraphernalia making it light, it is characterized in that, above-mentioned lamp is the lamp comprising said structure.
Utility model effect
According to said structure, owing to having the fluid-filled in container of the pyroconductivity higher than air, so the heat produced from semiconductor light-emitting elements can be made to be conducted to container by fluid.As a result, container can be utilized heat during luminescence externally to be dispelled the heat.
In addition, due to the supporting of semiconductor light-emitting elements supported portion part, support unit is installed on container (cover) in addition, so can by the waste heat of failing to transmit to container via fluid from support unit to container transmission.
In addition, owing to having the suppression component suppressing the temperature of cover to decline between described support main body and described cover, so the temperature difference of the peripheral part of the weld of the cover after comprising welding and spherical shell can be made to diminish, the generation of breaking of periphery office can be prevented.
In addition, it is characterized in that, described suppression component is made up of the material that support main body described in luminance factor is high.Thereby, it is possible to the radiant heat be effectively used in from cover and make heat to cover lateral reflection.
In addition, it is characterized in that, described in the ratio of heat capacities of described suppression component, the thermal capacity of support main body is little.Thus, the temperature of suppression component rises, and the heat of cover can be suppressed to move to support unit side.
In addition, it is characterized in that, described suppression component is tabular, is disposed between the weld of described cover and described support main body.Thus, the heat of cover is suppressed to move to support main body side.
In addition, it is characterized in that, described suppression component is installed on described bar.Thus, do not need the miscellaneous part installing suppression component, can implement with simple structure.
In addition, it is characterized in that, described support main body possesses flat pedestal portion and from this pedestal portion to the extension that described spherical shell inside extends, is provided with the installation base plate installing semiconductor light-emitting elements in the front end of extension.
Accompanying drawing explanation
Fig. 1 is the front section view (eliminating a part) about the LED of the 1st embodiment.
Fig. 2 is the figure of the structure representing LED module, and (a) is the plane of LED module, and (b) is that the A-A ' alignment of (a) looks sectional view.
Fig. 3 is the stereogram of the cover periphery open side end of spherical shell being cut away, represented container.
Fig. 4 is that the B-B' alignment of Fig. 1 looks sectional view.
Fig. 5 is that the C-C' alignment of Fig. 4 looks sectional view.
Fig. 6 is that the D-D' alignment of Fig. 5 looks sectional view.
Fig. 7 is the front view of the LED about the 2nd embodiment.
Fig. 8 is the front section view (eliminating a part) about the LED of the 2nd embodiment.
Fig. 9 is the enlarged section of the cover periphery of container about the 2nd embodiment.
Figure 10 is the cross-sectional perspective view of the 1st parts.
Figure 11 is the cross-sectional perspective view of the 2nd parts.
Figure 12 is the stereogram of the 1st parts of housing about the 3rd embodiment.
Figure 13 is the skeleton diagram of the lighting device about the 4th embodiment.
Figure 14 is the figure of the variation of the clamping configuration representing suppression component.
Figure 15 is the figure of the variation representing suppression component.
Description of reference numerals
1 LED
3 containers
5 housings
7 lamp holders
9 support units
11 LED modules
13 circuit units
23 LED (semiconductor light-emitting elements)
40 bars
41 support main bodys
42 pedestals
43 extend rod
52 suppression component
Detailed description of the invention
<< the 1st embodiment >>
1. overall structure
Fig. 1 is the front section view (eliminating a part) about the LED 1 of the 1st embodiment.
As shown in Figure 1, LED 1 possesses the container 3 of opening tegmentum parts 37 shutoff of spherical shell 35, the housing 5 being installed in one end (end of open side) of container 3, the lamp holder 7 being arranged at housing 5, the semiconductor light-emitting elements as light source, the i.e. LED module 11 that are disposed in the support unit 9 in container 3 and are supported by support unit 9.In container 3, enclosed the fluid that heat conductivity is higher than air, and be equipped with suppression component 52, this suppression component 52 suppresses the temperature of the cover 37 that temperature rises by heat during welding with cover 37 of spherical shell 35 to decline.
The LED 1 of present embodiment have in housing 5 powered via lamp holder 7, for making the circuit unit 13 of LED module 11 luminescence, global shape is in the shape similar with incandescent lamp in the past.
Below, each several part forming LED 1 is described.In addition, in this manual, on the direction that the lamp axle (central shaft) of LED 1 extends, side residing for lamp holder 7 is set to downside, side residing for spherical shell 35 is set to upside.
2. each portion structure
(1) LED module 11
Fig. 2 is the figure of the structure representing LED module 11, and (a) is the plane of LED module 11, and (b) is that the A-A ' alignment of Fig. 2 (a) looks sectional view.
LED module 11 as Fig. 1 and Fig. 2, particularly shown in Fig. 2, the sealing body 25 possessing installation base plate 21, be arranged on multiple LED23 of the upper surface of installation base plate 21 and multiple LED23 is covered.
Installation base plate 21 is as shown in (a) of Fig. 2, and plan view shape is rectangular shape such as, such as, be made up of the translucent material of glass or aluminium oxide etc., to make the light transmission sent from LED23 downwards.
Installation base plate 21 has conductive path 27, and this conductive path 27 is made up of with terminal patterns 27b, the 27c for being connected with the lead-in wire 67,69 be connected on circuit unit 13 the connection pattern 27a for connecting multiple LED23 (be connected in series and/or be connected in parallel).
In addition, conductive path 27 also uses the translucent material of such as ITO etc., to make the light transmission from LED23.
Lead-in wire 67,69 is as shown in (b) of Fig. 2, and the leading section of inserting the through hole 29 of installation base plate 21 from downside to upside is connected with terminal patterns 27b, 27c by solder 31.
LED23 is arranged on installation base plate 21 with the form of so-called chip.As shown in Figure 2, (such as at equal intervals) spaced apart is configured to 2 column-shaped with the length direction of installation base plate 21 to multiple LED23 abreast.In addition, the number, arrangement etc. of LED23 suitably determine according to the brightness required LED 1 etc.
Sealing body 25 is such as made up of the translucent material of silicones etc., is that the LED23 of 2 column-shaped covers with position of itemizing, prevents air, moisture to the intrusion of LED23 by arranging.
Sealing body 25 has wavelength conversion function when needs convert the wavelength of the light sent from LED23.Wavelength conversion function is such as by being mixed into translucent material to implement by the wavelength shifter of fluorophor particle etc.
Such as, when LED23 take blue light as illuminant colour, the wavelength shifter blue light of LED23 being transformed to sodium yellow is utilized.Thus, LED module 11 penetrates by the blue light sent from LED23 and the white light by the sodium yellow colour mixture after wavelength shifter wavelength conversion.
LED module 11 central portion is overleaf formed for the chimeric recess 33 chimeric with the fitting projection 51 of support unit 9.
(2) container 3
Container 3 as shown in Figure 1, possesses: the spherical spherical shell 35 with circular opening; And under the state that LED module 11 is placed on the substantial middle in spherical shell 35 by the opening of spherical shell 35 with the cover 37 of the circle of airtight shape shutoff.In addition, as described later, the periphery of cover 37 is fused the periphery of the opening at spherical shell 35 to container 3, is closed airtightly.
In the inside of container 3, be sealed with the high helium of thermal conductivity ratio air (He) gas.Thereby, it is possible to the heat of the LED module 11 produced in lighting is transmitted to spherical shell 35 efficiently via helium.
Spherical shell 35 is so-called A types, is made up of the glass material as translucent material.Spherical shell 35 as shown in Figure 1, the lower ending opening tegmentum parts 37 shutoff (sealing) of the globular part 35a with hollow form and the cylindrical portion 35b extended downwards from globular part 35a, cylindrical portion 35b.
Cover 37 is so-called button core posts, is made up of the glass material as translucent material.Cover 37 is tabular (that is, discoideus) rounded in overlooking.At cover 37, except there is the blast pipe 39 of the exhaust be used in container 3 etc., be also packaged with breakthrough status the lead-in wire 67,69 that the electric power to LED module 11 supply, the bar 40 of formation support unit 9 is installed.
Spherical shell 35 is undertaken (so-called welding) by the glass material melting of both plan junctions being heated, being made this position with the joint of cover 37.
(3) support unit 9
Fig. 3 is the stereogram of the cover periphery open side end of spherical shell being cut away, represented container.
Fig. 4 is that the B-B' alignment of Fig. 1 looks sectional view.Fig. 5 is that the C-C' alignment of Fig. 4 looks sectional view.Fig. 6 is that the D-D' alignment of Fig. 5 looks sectional view.
As shown in Figure 1, what have multiple bars 40 of being installed on cover 37 and be arranged on multiple bar 40 supports the support main body 41 of LED module 11 with lamp holder 7 opposition side to support unit 9.Multiple bar 40 is made up of the material high with the contiguity power of cover 37 with the contiguity force rate support main body 41 of cover 37.
In addition, here, the total of the surface area of the multiple bar of the surface area ratio of support main body 41 40 is large.That is, the multiple bar of area ratio 40 contacted with the fluid be enclosed in container 3 (being helium here) large with the total of the area of the fluid contact be enclosed in container 3 of support main body 41.
Bar 40 has many, has 8 in the present embodiment.Article 8, bar 40 as shown in Figure 6, circumferentially circumferentially configuring of O centered by the central shaft of the cover 37 of circle.Here, bar 40 separates at equal intervals (angularly) arranging.
As shown in Figure 5, soldered under the state that upper end 40a is inserted in the hole 45 of pedestal 42, bottom 40b is inserted in cover 37 affixed bar 40.
Bar 40 by metal material, particularly as forming with Dumet copper-clad iron-nickel alloy wire (dumet) material of lead-in wire that electric power supplies 67,69 identical materials (use in incandescent lamp in the past and bulb type fluorescence lamp, with the adhesion of glass in have actual effect).Thereby, it is possible to the heat of the LED module 11 when lighting is transmitted to container 3 via bar 40.
Support main body 41 possess flat pedestal (being equivalent in " pedestal portion " of the present utility model) 42 and inner from this pedestal 42 to spherical shell 35 (container 3) (to lamp holder 7 opposition side) the extension rod (being equivalent to " extension " of the present utility model) 41 that extends, in the front end extending rod 43, LED module 11 is installed.
Pedestal 42, in discoideus, engage in the central portion and extends rod 43.Extension rod 43 and pedestal 42 are made up of metal material, such as aluminum, and both joints are such as undertaken by welding.
Pedestal 42, on the imaginary line segment at the center through pedestal 42, the position clipping center has the lead-in wire 67 of electric power supply, 69 through through holes 47,49.
Extend rod 43 as shown in Figure 4, be the rounded column in cross section, as shown in Figure 1, top 43b is larger than other 43a diameter.The top extending rod 43 is flat, and its width is identical with the width (size of short side direction) of the installation base plate 21 of LED module 11, and length (size of the length direction of installation base plate 21) is larger than width.
The total extending the area of the cross section of the area ratio bar 40 of the cross section of the middle body (other 43a) of rod 43 is large, and the total extending the surface area of the surface area ratio bar 40 of the middle body (other 43a) of rod 43 is large.
The upper surface of top 43b is tabular surface, and as shown in Fig. 2 (b), centre has the fitting projection 51 chimeric with the chimeric recess 33 of LED module 11 wherein.In addition, making the upper surface of top 43b (also i.e. support unit 9, support main body 41, extension excellent 43) smooth, is that the thermal capacitance of the LED module 11 when making luminescence to make to become large with the contact area of LED module 11 (installation base plate 21) is easily transmitted to extending rod 43 (support unit 9, support main bodys 41).
As concrete example, the diameter extending the middle body of rod 43 is 3 [mm] ~ 29 [mm], and length is 5 [mm] ~ 45 [mm], and the diameter of 1 bar 40 is 0.5 [mm] ~ 3 [mm], and length is 1 [mm] ~ 10 [mm].
(4) suppression component 52
Suppression component 52 is here in discoideus.This suppression component 52 is disposed between support main body 41 and cover 37.Here, suppression component 52 is installed on support unit 9 with the state opposed relative to cover 37.Specifically, suppression component 52 is installed on the bar 40 installed at cover 37 with the state parallel with cover 37.Suppression component 52 to the installation example of bar 40 as undertaken by welding.
Suppression component 52 corresponds to multiple bars 40 of support unit 9 and pair of lead wires 67,69 and has multiple through hole 52a.
The size of suppression component 52 as shown in Figure 4, in overlooking, is less than the size of cover 37, is greater than the size of pedestal 42.Here, suppression component 52 by metal material, such as, is made up of aluminum.
(5) housing 5
As shown in Figure 1, in tubular, the spherical shell 35 side half on its central axis direction (for the direction that the central shaft of housing 5 extends) is large-diameter portion 5a to housing 5, and lamp holder 7 side half is minor diameter part 5b.Housing 5 by resin material, such as, is made up of polybutylene terephthalate (PBT) (PBT).
Large-diameter portion 5a is installed on the bottom of container 3 with outer state, and minor diameter part 5b engages with lamp holder 7 with the state covered by lamp holder 7.Be formed with pin thread in the periphery of minor diameter part 5b, screw togather with the negative thread of the lamp holder 7 of screw socket type.
In the periphery of the minor diameter part 5b of housing 5, the fixing holddown groove 5c of lead-in wire for being connected with lamp holder 7 65 is formed abreast with the central shaft of housing 5, in the inside of housing 5, be provided with for the fixing fixed mechanism (locking mechanism 53) of the circuit substrate 55 by circuit unit 13.About fixed mechanism, carry out when the explanation of circuit unit 13.
In container 3 side of the inside of housing 5, possess from lamp holder 7 side joint by the bearing plate 54 by bonding agent 56 affixed to container 3 and housing 5.Bearing plate 54 arranges close to the cover 37 of container 3 in the inside of large-diameter portion 5a.
The plan view shape of bearing plate 54 is discoideus, with the inner peripheral surface making its periphery be connected to large-diameter portion 5a.Bearing plate 54 has except the through hole that the blast pipe 39 for extending from cover 37 inserts except centre wherein, also has a pair through hole of lead-in wire 67,69 in the both sides of the through hole of this blast pipe 39.
Bearing plate 54 to housing 5 fixing in, if be inserted in large-diameter portion 5a by bearing plate 54, then the circumference of final bearing plate 54 is connected to the inner peripheral surface of large-diameter portion 5a.Further, in this condition, flowed down the inner side (i.e. lamp holder 7 side) of bonding agent 56 affixed to housing 5 and container 3 to large-diameter portion 5a, the bonding agent 56 flowed down by this is affixed.
(6) circuit unit 13
Circuit unit 13 as shown in Figure 1, possess circuit substrate 55 and be arranged on the various electronic components 58,59 on this circuit substrate 55, by various electronic component 58,59, formation will via the rectification circuit of the powered commercial electric power of lamp holder 7 (interchange) rectification, by the various circuit of the smoothing circuit of the direct current power smoothing after rectification etc.
Rectification circuit is made up of the diode bridge 57 of the upper surface side of circuit substrate 55, and smoothing circuit is made up of the capacitor 59 of the lower face side of circuit substrate 55, and the main body section of capacitor 59 is in the inside of lamp holder 7.
Circuit substrate 55 is fixed by the locking mechanism 53 of the inside of housing 5.Specifically, the peripheral part of the lower surface of circuit substrate 55 is connected to the stage portion 61 of the inside of housing 5, is engaged by the upper surface of 55 of circuit substrate by fastener 62.Fastener 62 in the circumferential (such as at equal intervals) spaced apart is formed multiple (such as 4), along with the central shaft side close to stage portion 61 to housing 5 is stretched out.
Circuit unit 13 is connected with lamp holder 7 by lead-in wire 63,65,67,69 to be connected with LED module 11 by going between.
(7) lamp holder 7
Lamp holder 7, except the installation function (with reference to Figure 12) with the ligthing paraphernalia to LED 1, also has the function be electrically connected with commercial power.Lamp holder 7 is the screw socket types utilized in incandescent lamp, by tubular and perisporium be screw-shaped shell portion 71 and form via the eyelet portion 75 that insulating materials 73 is installed in shell portion 71.
One that is connected with circuit unit 13 goes between and 65 to turn back to outer peripheral face side in the openend of the minor diameter part 5b of housing 5, and is covered by shell portion 71 under state in the holddown groove 5c being embedded in housing 5, thus is connected to shell portion 71.Another root lead-in wire 63 is connected to eyelet portion 75 by welding.
Under the state that lamp holder 7 screws togather with the minor diameter part 5b of housing 5 in shell portion 71, the upper end in shell portion 71 is installed on housing 5 by riveting.
3. manufacture method
One example of the manufacture method of the LED 1 about present embodiment is described.
LED 1 comprises: the cover production process of band module, makes the structure (hereinafter referred to as " cover of band module ") being supported LED module 11 by the support unit 9 being installed on cover 37; Container production process, is encapsulated into the open side end of spherical shell 35 by the cover of band module and makes container 3; Helium encloses operation, after by exhaust in container 3, enclose helium (being called by the container 3 having enclosed helium " ball bubble (bulb) "); Circuit loads operation, and circuit unit 13 is encased in housing 5; Spherical shell installation procedure, is installed to housing by ball bubble; And lamp holder installation procedure, lamp holder 7 is installed to housing 5.
Circuit in above-mentioned operation loads operation and lamp holder installation procedure can utilize the known technology in the past just had, so explanation is here omitted.
(1) the cover production process of module is with
In the cover production process of band module, such as comprise by blast pipe 39 with tubule tubule installation procedure, the support unit installation procedure that the support unit 9 with suppression component 52 is installed to cover 37, the module installation procedure that LED module 11 is installed to support unit 9 and by LED module 11 and 67, the 69 connection operations be connected that go between installed to cover 37 with airtight shape.
These operations might not need to carry out with said sequence, such as tubule installation procedure also can carry out after support unit installation procedure, pole member installation procedure described later, or also after installing LED module 11 to support unit 9, the support unit 9 with suppression component 52 can be installed to cover 37.
Support unit installation procedure comprise bar 40 is installed to pedestal 42 bar pedestal installation procedure (A), extensions rod pedestals installation procedure (B) that rod 43 installs to pedestal 42, the suppression component installation procedure (C) installing suppression component 52 to bar 40 and the bar installation procedure (D) installed to cover 37 with airtight shape by bar 40 will be extended.
As long as the support unit 9 with suppression component 52 can finally be installed on cover 37 just passable by above-mentioned each operation, might not need to carry out with said sequence.Such as also can with suppression component installation procedure (C), bar installation procedure (D), extend excellent pedestal installation procedure (B), the order of bar pedestal week installation procedure (A) carries out, also can carry out with bar installation procedure (D), suppression component installation procedure (C), bar pedestal installation procedure (A), the order that extends excellent pedestal installation procedure (B).
In bar pedestal installation procedure (A), such as by the upper end 40a of bar 40 by welded and installed on pedestal 42.In the excellent pedestal installation procedure (B) of extension, such as, will extend rod 43 by welded and installed on pedestal 42.In suppression component installation procedure (C), lead-in wire 67,69 and bar 40 are inserted in the through hole of suppression component 52, under the state making suppression component 52 orthogonal relative to bar 40, such as, pass through welded and installed.
In bar installation procedure (D), such as the bottom 40b of bar 40 is heated, former state pushing and pressing, at the cover 37 as glass material, make the glass material melting with the contact portion of bottom 40b, while pushed in cover 37 by bottom 40b.
In the present embodiment, cover 37 glass material is formed, bar 40 Dumet copper-clad iron-nickel alloy wire material is formed.Thus, such as heat conductivity can also be used good as support main body 41 but the material of adhesion difference with glass material.Or, more cheap than bar 40, poor with the adhesion of glass material material can also be used as support main body 41.
Like this, if only the bar 40 engaged with cover 37 is used the material high with cover 37 adhesion, even if then select the material of other functions of the operability of attention heat conductivity, price, processability etc. etc. as support main body 41, also can prevent support unit 9 from departing from from cover 37.
(2) container production process
In container production process, because spherical shell 35 and cover 37 are made up of glass material, so under the state making the opening circumference of spherical shell 35 abut with the outer peripheral edge of cover 37, the abutting periphery heating of abutment portion, melting and will both weldings will be comprised.
Now, owing to being configured with suppression component 52 between cover 37 and pedestal 42, so can suppress by the generation of breaking of the abutting part periphery that the thermal strain abutting the heating such as periphery burner is caused.Namely, if inventor to when said vesse is consisted of the spherical shell that formed by glass material and cover by these spherical shells and cover welding; the situation of breaking at the peripheral part comprising weld is studied, found that, broken by following such mechanism.Below, the mechanism of breaking is described.
A () does not have the situation of suppression component
When welding with cover 37 of spherical shell 35, by heating such as both abutting periphery burners.Heat trnasfer is now to spherical shell 35 and cover 37.
The heat of spherical shell 35 side for the top side (with open opposite sides) of starting point to spherical shell 35 spreads, and is released to ambient air with abutment portion (heating part).
On the other hand, the heat of cover 37 side for the central authorities of starting point to cover 37 spread, and is discharged into ambient air with abutment portion (heating part), and is released as radiant heat.Owing to being provided with the metal support unit 9 of supporting LED module 11 at cover 37, so the heat of cover 37 is conducted to support unit 9 side that heat conductivity is good, be discharged into the air of the periphery in container 3 from support unit 9.
Therefore, after the heating, the trend that the temperature of the abutting periphery of spherical shell 35 not easily declines, the temperature of the abutting periphery of cover 37 easily declines is had.As a result, after the heating, become greatly at spherical shell 35 with the periphery temperature difference that abuts of cover 37, thermal strain is comparatively large, becomes the state of easily breaking.
B () has the situation of suppression component
When welding with cover 37 of spherical shell 35, same with not having the situation of above-mentioned suppression component, the heat trnasfer of burner etc. is to spherical shell 35 and cover 37.The heat of spherical shell 35 side with abutment portion (heating part) for the top side (namely and open opposite sides) of starting point to spherical shell 35 spreads, and be discharged into ambient air (about spherical shell 35, identical with not having the situation of suppression component).
On the other hand, the heat of cover 37 side for the central authorities of starting point to cover 37 spread, and is discharged into ambient air with abutment portion (heating part), and is released as radiant heat.Due to the position opposed with inner face at cover 37 (in other words, position between the pedestal 42 of cover 37 and support main body 41) be provided with suppression component 52, so radiant heat suppressed parts 52 antireflection part, the absorption part that discharge from cover 37.
Cover 37 is heated by the radiant heat reflected by suppression component 52, so suppress the temperature of cover 37 to decline.In addition, the heat absorbed by suppressed parts 52, the temperature of suppression component 52 and the bar 40 that is installed with this suppression component 52 rises, and cover 37 diminishes with the temperature difference of bar 40, suppresses from cover 37 to bar 40, the heat of pedestal 42 moves.
Therefore, after the heating, have the trend that the temperature of the abutting periphery of cover 37 also not easily declines, result, after fusing, diminish with the periphery temperature difference that abuts of cover 37 at spherical shell 35, thermal strain is also less, becomes the state of not easily breaking.
In addition, in order to make suppression component by radiant heat temperature rising efficiently, the thermal capacity of suppression component is the smaller the better, specifically, preferably at least little than the thermal capacity of support main body.
(3) helium encloses operation
Enclose in operation at helium, first, via tubule (39), the air in container 3 discharged, then inject helium, finally by the cutaway being positioned at the outside of container 3 of tubule (39) and sealing carry out.
(4) ball bubble installation procedure
Ball bubble installation procedure comprises the bearing plate arrangement step be configured in by bearing plate 54 in housing 5, make the lead-in wire 67 of deriving from the cover 37 of container 3, 69 to this lead-in wire 67, operation inserted by the lead-in wire that the through hole of bearing plate 54 of 69 and the through hole of the circuit substrate 55 of circuit unit 13 are inserted, by the affixed adhesive applicating adhesive applicating operation housing 5 in of container 3 with housing 5, and the cap be inserted in the large-diameter portion 5a of housing 5 inserts operation by cover 37 side of container 3.
In bearing plate arrangement step, bearing plate 54 is inserted in the large-diameter portion 5a of housing 5, under the parallel plane state that bearing plate 54 becomes with the opening edge comprising large-diameter portion 5a, makes the circumference of bearing plate 54 be connected to the inner peripheral surface of large-diameter portion 5a.Now be configured to, make the through hole of the through hole of the bearing plate 54 of lead-in wire 67,69 and the circuit substrate 55 of circuit unit 13 on the imaginary line almost parallel with lamp axle.
Insert in operation at lead-in wire, make ball steep (container 3) large-diameter portion 5a near housing 5, while make the front end of lead-in wire 67,69 insert to the through hole of the bearing plate 54 be positioned on imaginary line and circuit substrate 55.
In adhesive applicating operation, to the inner peripheral surface adhesive-applying of the open side of the large-diameter portion 5a of housing 5.Now, owing to there is bearing plate 54 at the open opposite sides with large-diameter portion 5a therein, even so bonding agent situation about flowing down, also can be flowed down and stopped (suppression).
(adhesion of container 3 with housing 5 is remained necessarily) thereby, it is possible to the amount being used for the bonding agent be combined with housing 5 by container 3 is remained necessarily, do not have the bonding agent flowed down in addition and be attached to situation on circuit unit 13.In addition, if adhere to bonding agent on the electronic component of forming circuit, then only this part becomes high temperature, and action likely becomes unstable.
Insert in operation at cover, insert in the cover 37 side direction housing 5 of container 3, until the periphery of spherical shell 35 is connected to the opening edge of the large-diameter portion 5a of housing 5.Now, along with the insertion of container 3, be coated in bonding agent on the inner peripheral surface of large-diameter portion 5a by the inner side of housing 5 and inboard (lamp holder 7 side) push.By the bonding agent that this is pushed into, housing 5 and bearing plate 54 affixed, on the other hand, be pushed into the bonding agent of inside existed for bearing plate 54 and also can not be attached to circuit unit 13.
In addition, lead-in wire 67,69 and the connection of lighting unit 13, by before lamp holder 7 is attached to housing 7, utilize the solder that inserts from the opening of minor diameter part 5b that the through hole of the circuit substrate 55 going between inserted partial fixing to carry out.
<< the 2nd embodiment >>
In the LED 1 about the 1st embodiment, the bottom 40b of bar 40 engages with cover 37, with the outside making it not reach container 3, but bar also can be made externally to stretch out from container.Below, the situation of stretching out is described as the 2nd embodiment.
1. overall
Fig. 7 is the front view of the LED 101 about the 2nd embodiment, and Fig. 8 is the front section view (eliminating a part) about the LED 101 of the 2nd embodiment, and Fig. 9 is the enlarged section of the cover periphery of container.
LED 101 as shown in Figures 7 and 8, possesses container 103, housing 105, lamp holder 7, support unit 107, LED module 11 and circuit unit 108.The bar 109 forming support unit 107 stretches out from container 103, and suppression component 111 is installed on the bar 109 in container 103.
2. each portion structure
(1) container 103
Container 103 in a same manner as in the first embodiment, is made up of spherical shell 121 and cover 123.Spherical shell 121 and cover 123 are made up of glass material, cover 123 by the opening of spherical shell 121 with airtight shape shutoff.That is, cover 123 welding is in the open circumferential part of spherical shell 121.
Installation (encapsulation) blast pipe 124 on cover 123 is utilized to enclose helium in the inside of container 103.In container 103, be placed with support unit 107 with the state being installed on cover 123.
(2) support unit 107
Support unit 107 in a same manner as in the first embodiment, is made up of plural parts.Here, support unit 107 possesses support main body 131 and bar 109.Support main body 131 is made up of 1 parts, the extension 133 of the pedestal portion 135 with the pedestal 42 being equivalent to the 1st embodiment and the extension rod 43 being equivalent to the 1st embodiment.
Support main body 131 in present embodiment is made up of metal material (specifically aluminum).
The leading section of extension 133 is same with the front end geometry of the extension rod 43 of the 1st embodiment in flat.The upper surface of the leading section of extension 133 is tabular surface, abuts with the back side of the installation base plate 21 of LED module 11.In constant cylindric of cross sectional shape beyond the leading section of support main body 131.Pedestal portion 135 is discoideus, the through hole 137,139 that the lead-in wire 67,69 being formed with electric power supply is inserted.
Bar 109 has many, has 8 here.Each bar 109, with the state of through cover 123, installs (encapsulation) in cover 123 with airtight shape.
The upper end 109a of each bar 109 as shown in Figure 9, be inserted into support main body 131 pedestal portion 135 lower surface recess 135a in state under such as by welding affixed the diagram of the welding portion (omit).The lower end part of each bar 109 is in the outside of container 103, and its front end reaches near the circuit substrate 177 of circuit unit 108.
In multiple parts 109, as shown in Figure 9, clipping blast pipe 124, be located across on the imaginary line at the center of this blast pipe 124 a pair bar 109A, 109B on, be provided with the fixed mechanism for fixing suppression component 111.
The part that the through hole 143a that here inserted by the bar than suppression component 111 of fixed mechanism is large is located on bar 109.Specifically, bar 109A has extension 109Aa in the part of the downside being equivalent to suppression component 111, and bar 109B has extension 109Ba at the part place corresponding with the upside of suppression component 111.
(3) suppression component 111
In the present embodiment, also between the pedestal portion 135 and the cover 123 of container 103 of support unit 107, suppression component 111 is provided with.Suppression component 111 is made up of the plate member of metal material, have central portion plectane portion 143 and from the periphery in plectane portion 143 to the reflex part 145 turned back with cover 123 opposition side.In addition, the through hole 143a corresponding with the thickness of bar 109 is provided with in plectane portion 143.
Installation from suppression component 111 to bar 109 as shown in figure 11, by the extension 109Ba clamping of suppression component 111 with the extension 109Aa of bar 109A and bar 109B is carried out.In addition, extension 109Aa and other bars 109 are such as inserted into after in the through hole of cover 123 in downside by assembling, make the through hole 143a of suppression component 111 chimeric with bar 109.Further, to be inserted into by extension 109Ba in upside after in the through hole 143a of suppression component 111, the through hole to cover 123 inserts, and makes these bars 109 and cover 123 welding.
(4) housing 105
Housing 105 be by plural parts form packaging.Here, be made up of two parts, be made up of the 1st parts 151 and the 2nd parts 153.In addition, the 1st parts 151 are positioned at container 103 side on the central axis direction of housing 105, and the 2nd parts 153 are positioned at lamp holder 7 side.
Figure 10 is the cross-sectional perspective view of the 1st parts, and Figure 11 is the cross-sectional perspective view of the 2nd parts.
1st parts 151 as shown in Figure 10, in cross sectional shape at the tubular of last point of central axis direction change, are formed with partition wall 161 in the substantial middle of length direction.Partition wall 161 is equivalent to the bearing plate 54 of the 1st embodiment.In addition, if the shape of the 1st parts 151 rephrased the statement, be then equivalent to the bowl-shape of bearing plate 54 in base plate (partition wall 161).
The end of the upside covering container 103 of the central axis direction of the 1st parts 151, the downside of central axis direction is inserted into the 2nd parts 153 of tubular.In addition, the 1st parts 151 and container 103 are such as affixed by bonding agent 155.
(A) the 1st parts
1st parts 151 on the central axis direction of housing 105, become the outer outer cylinder portion 163 being embedded in the end of container 103 than the part of the top side of partition wall 161.In addition, ratio partition wall 161 part on the lower of the 1st parts 151 becomes insertion (embedded) in the embedded cylinder portion 165 of the 2nd parts 153.
The cross sectional shape in outer cylinder portion 163 is circular, is along with away from partition wall 161, diameter becomes large cone tubular on the central axis direction of housing 105.
Recess 167 recessed is in a thickness direction provided with at the inner peripheral surface of the open end in outer cylinder portion 163.Here, separate at equal intervals in the circumferential and be formed with 4.Bonding agent 155 affixed with container 103 for 1st parts 151 is entered into recess 167, thus, even if the bonding agent 155 after sclerosis peels off from the inner peripheral surface of the 1st parts 151, the bonding agent 155 also by entering into recess 167 engages with recess 167 and can prevent falling of bonding agent 155.
The weld of spherical shell 121 and cover 123 that the open end in outer cylinder portion 163 is positioned at container 103 is more by top (with opposition side, the openend) side of spherical shell 121.Thus, such as when weld periphery there occurs break, also can prevent coming off of spherical shell 121.
Partition wall 161 is by one end shutoff in outer cylinder portion 163.Conversely, partition wall 161 is by the other end shutoff in embedded cylinder portion 165.In partition wall 161, the outer peripheral portion 161a linked with the one end in outer cylinder portion 163 and middle body 161b is lower.That is, in partition wall 161, mid portion (part between outer peripheral portion 161a and the middle body 161b) 161c close to periphery is the protrusion swelled.In addition, here, middle body 161b is lower than outer peripheral portion 161a.
Mid portion 161c as shown in Figure 9, is connected to the outer surface of the cover 123 of container 103.Prevent the bonding agent 155 be disposed between outer cylinder portion 163 and container 103 from flowing between cover 123 central portion of container 103 and the middle body 161b of partition wall 161.
In the periphery of the bottom of container 103, be provided with protuberance 169 (with reference to Fig. 9) outstanding in the thickness direction thereof.Here, formed continuously in the circumferential.In addition, protuberance 169 also can formation spaced apart be multiple in the circumferential.Thus, even if the bonding agent 155 after sclerosis peels off from the outer peripheral face of container 103, also because protuberance 169 enters (engaging) to bonding agent 155, so can prevent falling of container 103.
Middle body 161b is corresponding with the concaveconvex shape of the cover 123 of container 103 relative to the recessed amount of mid portion 161c.As shown in Figure 9, in order to improve the seal with the bar 109 of through cover 123, have along the outstanding protuberance 170 of bar 109, this overhang is corresponding with above-mentioned recessed amount for cover 123.
The middle body 161b wherein heart has the through hole 161d of blast pipe 124 and multiple through hole 161d of lead-in wire 67,69 and bar 109.
Embedded cylinder portion 165 has the structure of a part for the combining mechanism that the 1st parts 151 are combined with the 2nd parts 153.Combining mechanism is such as spirally connected mechanism, snap fastener etc., adopts snap fastener here, possesses the holding section 171 engaged with the engaged part 185 of the 2nd parts 153.Holding section 171 has multiple (being 4 here) in the circumferential at spaced intervals.
Holding section 171 also circumferentially extends from the cylinder part in embedded cylinder portion 165 is outstanding outward.Embedded cylinder portion 165 has a pair extension 173 extended along the central axis direction of housing 105 to partition wall 161 side from each end of the circumference of holding section 171.
The maintaining body of holding circuit unit 108 is provided with in the bottom 175 in embedded cylinder portion 165.Maintaining body such as has snap fastener, be spirally connected mechanism, embeding mechanism etc., adopts embeding mechanism here.
Maintaining body carrys out holding circuit unit 108 by the bottom 175 that the circuit substrate 177 of circuit unit 108 is pushed into embedded cylinder portion 165.The inner circumferential footpath of the bottom 175 in embedded cylinder portion 165 than and adjacent other parts in the upside of bottom 175 large, if moved along side face from the bottom to the top on inner peripheral surface, be then the higher stage portion 175a in upside.
By this stage portion 175a, position is defined in the upper direction (container 103 side) of the circuit substrate 177 of circuit unit 108.
At the inner peripheral surface of bottom 175, spaced apart in the circumferential and be provided with multiple (separate at equal intervals and be provided with 4) protuberance 179 outstanding to the central shaft side of housing 105 here.Protuberance 179 extends along central shaft.Protuberance 179 with cross section triangular in shape give prominence to.Thus, when being pushed to bottom 175 by circuit substrate 177, the distortion of the leading section of protuberance 179, can holding circuit substrate 177 more firmly.
(B) the 2nd parts
2nd parts 153 as shown in figure 11, have the lamp holder installing department 183 of circuit the incorporating section 181 and installing lamp holder 7 receiving circuit unit 108 in inside.Cylindrically, the diameter of circuit incorporating section 181 is larger than the diameter of lamp holder installing department 183 for circuit incorporating section 181 and lamp holder installing department 183.
The engaged part 185 engaged with the holding section 171 of the 1st parts 151 is formed at the inner peripheral surface of circuit incorporating section 181.Engaged part 185 corresponds to holding section 171 and has 4 at spaced intervals in the circumferential.
Engaged part 185 is given prominence to from inner peripheral surface towards the central shaft of housing 105, and the face on the upside of it is that lower surface is relative to orthogonality of center shaft along with moving the inclined plane of giving prominence to from the upper side to the lower side.Thereby, it is possible to easily carry out the insertion of the 1st parts 151 (embedded cylinder portion 165) to the 2nd parts 153 (side, circuit incorporating section 181), mutually not easily depart from afterwards in engaging.
Engaged part 185 circumferentially extends, and its length is equivalent between a pair extension 173 in embedded cylinder portion 165 of the 1st parts 151.Thus, under the state that holding section 171 is fastened on engaged part 185, engaged part 185 is positioned between a pair extension 173, and restriction the 2nd parts 153 move (rotation) to circumference relative to the 1st parts 151.
At the inner peripheral surface of circuit incorporating section 181, be formed with the Anti-fall portion 187 of circuit substrate 177 in the below of the holding section 171 of the 1st parts 151.Anti-fall portion 187 is same with engaged part 185 gives prominence to from inner peripheral surface towards the central shaft of housing 105, the face on the downside of it be along with from downside upwards side move the inclined plane of giving prominence to, lower surface is relative to orthogonality of center shaft.In addition, Anti-fall portion 187 is formed in the position identical with engaged part 185 around central shaft, is formed with 4 with engaged part 185 equal number here.
This part (not form the part in Anti-fall portion 187 for benchmark) has correspondingly only been stretched out in circuit substrate 177 and the Anti-fall portion 187 of circuit unit 108, and the holding section 171 of this extension 177a and the 1st parts 151 is clamped between the lower surface of engaged part 185 and Anti-fall portion 187.Thereby, it is possible to prevent dropping of circuit unit 108.
Lamp holder installing department 183 in a same manner as in the first embodiment, has the threaded portion 186 be spirally connected with lamp holder 7 at outer peripheral face.
(5) circuit unit 108
Circuit unit 108 with about the circuit unit 13 of the 1st embodiment same, be made up of circuit substrate 177 and the multiple electronic components be arranged on circuit substrate 177.
Circuit substrate 177 is on the whole in discoideus, and the part corresponding with the Anti-fall portion 187 of the 2nd parts 153 is the extension 177a stretched out to the inner peripheral surface side of the 2nd parts 153.Extension 177a as shown in Figure 8, stretches out in the mode that periphery is positioned in Anti-fall portion 187.
In circuit substrate 177, the part beyond periphery, i.e. extension 177a between 4 extension 177a is in the circumferential in the arc-shaped same with the inner peripheral surface of the bottom 175 of the 1st parts 151.The external diameter of the part beyond extension 177a is compressed the such size of power when being inserted to the bottom 175 in the embedded cylinder portion 165 of the 1st parts 151 by circuit substrate 177 from protuberance 179.
(6) lamp holder 7
Lamp holder 7 with about the lamp holder 7 of the 1st embodiment same, have shell portion 71 and eyelet portion 75, the lead-in wire 67 be connected with circuit unit 108 is connected in shell portion 71, and lead-in wire 63 is connected in eyelet portion 75.
<< the 3rd embodiment >>
The housing 105 of the 2nd embodiment is made up of two the 1st parts 151 combined on central axis direction and the 2nd parts 153, but such as also can form housing by two the 1st parts in the direction (left and right directions) with orthogonality of center shaft and the 2nd parts.Below, the housing be made up of the 1st parts and the 2nd parts that are divided into two is in the lateral direction described.
Figure 12 is the stereogram of the 1st parts.
Housing by combining the 1st parts with the 2nd parts and forming under the state of docking.Here, the 1st parts and the 2nd parts are identical structures, below, are described the 1st parts 201.
1st parts 201 are in the housing face of the central shaft comprising housing is cut off such shape.The face shaping of face shaping in the entirety of the housing 105 illustrated in the 2nd embodiment of the entirety of housing.That is, as housing, in a same manner as in the second embodiment, have in upside outer be embedded in cover 123 side of container 103 end and install the container installing department of container 103, there is in downside the lamp holder installing department of installing lamp holder 7.
The upper side of the 1st parts 201 is half container installing department 203 of the half forming container installing department, and lower side is half lamp holder installing department 205 of the half forming lamp holder installing department.The inner peripheral portion of the 1st parts 201 is place half placement section 207 of circuit unit 108.
Recess 209 is formed at the inner peripheral surface of the upper end of half container installing department 203 of the 1st parts 201.Recess 209 when making housing in the circumferential spaced apart be formed multiple.Recess 209 has the function same with the recess 167 about the 2nd embodiment.
In the bottom of half container installing department 203, be provided with the mechanism for mounting for installing discoideus sheet material 211.Mechanism for mounting has installing, snap fastener etc. based on screw, and the insertion groove 213 being inserted into sheet material 211 by the opening of the 2nd component side from the 1st parts 201 is here formed.In addition, in fig. 12, sheet material 211, in semicircle tabular, forms the bearing plate 54 of the 1st embodiment by two panels, but also can for forming the discoideus of bearing plate with 1.
Sheet material 211 in a same manner as in the first embodiment, for preventing flowing down container and the affixed adhesives of housing.In addition, sheet material 211 is same with the partition wall 161 of the 2nd embodiment, has bar 109 and uses and the lead-in wire through hole 211a of 67, the 69 and through hole 211b of blast pipe 124.In addition, sheet material 211 also has the booster action to the load of the circumference from housing.
1st parts 201 are more being provided with the mechanism for mounting of the circuit substrate 177 for installing circuit unit 108 by half lamp holder installing department 205 side than insertion groove 213.Mechanism for mounting has installing, snap fastener etc. based on screw, mechanism for mounting 215 here by spaced apart in the circumferential the opening of the 2nd component side from the 1st parts 201 and form that multiple upper surface with circuit substrate 177 and lower surface abut abut projection 215a, 215b a pair up and down and form.In addition, half placement section 207 is formed in than sheet material 211 more by lamp holder 7 side.
Half lamp holder installing department 205 is formed with the half of threaded portion at outer peripheral face, to make having threaded portion at outer peripheral face under the state being combined as housing.
The combining mechanism for being combined with the 2nd parts is provided with in two openends of the 2nd component side of the 1st parts 201.Combining mechanism to have to the 2nd component side with the outstanding projecting plate portion 217 of tabular in an end of two openends, have the recess 219 chimeric with the projecting plate portion 217 of giving prominence to from the 2nd parts in another end.
<< the 4th embodiment >>
In the 4th embodiment, situation about the LED 1 about the 1st embodiment being attached on ligthing paraphernalia (lower illuminator type) is described.
Figure 13 is the skeleton diagram of the lighting device about the 4th embodiment.
Lighting device 301 is such as installed on ceiling 303 and uses.
Lighting device 301 as shown in figure 13, possesses LED (LED 1 such as, illustrated in the 1st embodiment) 1 and installs LED 1 and the ligthing paraphernalia 305 making it light, extinguish.
Ligthing paraphernalia 305 such as possesses the appliance body 307 that is installed on ceiling 303 and is installed in appliance body 307 and covers the cover 309 of LED 1.Here, cover 309 is open-types, has the reflectance coating 313 making to reflect from the light of LED 1 injection to prescribed direction (being below) at inner face here.
Appliance body 307 possesses the lamp socket 311 of the lamp holder 7 of installation (being spirally connected) LED 1, powers via this lamp socket 311 pairs of LED 1.
In the present embodiment, owing to installing the allocation position of the allocation position of LED23 (LED module 11) and the filament of incandescent lamp of the LED 1 of ligthing paraphernalia 305 comparatively closely, thus the centre of luminescence of LED 1 and the centre of luminescence of incandescent lamp nearer.
Therefore, even if being equiped with ligthing paraphernalia (305) the upper installing LED 1 of incandescent lamp, also because the position of the centre of luminescence as lamp is similar to, so the light distribution characteristic similar with incandescent lamp can be obtained.
In addition, here ligthing paraphernalia is an example, it also can be such as the cover 309 without open-type, and there is the structure of case type cover, also can be make LED with the ligthing paraphernalia lighted towards the posture (lamp axle is relative to the posture of the inclined of ligthing paraphernalia) of laterally such posture (lamp axle is the posture of level) or inclination.
In addition, lighting device is the straight dress type installing ligthing paraphernalia with the state contacted with ceiling or wall, but also can be the baried type of the state installing ligthing paraphernalia be embedded in ceiling or wall, also can be the mounted model etc. hung from ceiling by the cable of ligthing paraphernalia.
And then ligthing paraphernalia makes 1 of installing LED light, but also can install multiple, such as 3 LED here.
<< variation >>
Above, describe structure of the present utility model based on the 1st ~ 4th embodiment, but the utility model is not limited to above-mentioned embodiment.Such as, also can be by the part-structure of the LED about the 1st ~ 3rd embodiment and about the appropriately combined LED of the structure of following variation or lighting device.
In addition, the material recorded in above-mentioned embodiment, numerical value etc. merely illustrate preferably, are not limited thereto.And then, in the scope not departing from technological thought scope of the present utility model, suitably can be changed the structure of LED and lighting device.
1. container
In embodiments, make the shape that container 3,103 (spherical shell) is A type, but also can be other types, such as the shape of G type, R type, E type etc., also can be shape diverse with the shape of bulb etc.And then being formed with discoideus (so-called button core post) by cover 37,123, but also can be the shape that such as so-called tubaeform stem stem is such, also can be the shape of other types.
2. suppression component
(1) material
In embodiments, using the sheet material of the round shape be made up of aluminum, but be not limited to aluminum as suppression component, also can be other metal materials, resin material, ceramic material.But if will make to decline from the reflect radiation heat of cover, the temperature of suppression cover, then the material of temperature decline parts preferably uses the material that reflectivity is high, specifically uses aluminum, brass, copper, silver, zinc etc.
In addition, when only utilizing the reflection function of suppression component, suppression component does not need to be installed to support unit (bar), such as, can support (fixing) by the miscellaneous part only with the function (not having the function of support body abutment etc.) of stretching out from cover yet.
In embodiments, using the size of thickness 1 [mm], external diameter 28 [mm], but be not particularly limited to this size, also can be other sizes.
If consider that the temperature because bringing from the radiant heat of cover rises, then surface area is the bigger the better, and thickness gets over Bao Yuehao in addition.Surface area is larger, and can accept more heat from cover radiation, the temperature of cover more easily rises.In addition, thickness is less, and the less and temperature of volume more easily rises.
(2) install
The suppression component 52 of the 1st embodiment by welded and installed in bar 40.The suppression component 111 of the 2nd embodiment is clamped by extension 109Aa, 109Ba of bar 109A, 109B.That is, as long as it is just passable to support suppression component, also can be other forms.
Figure 14 is the figure of the variation of the clamping configuration representing suppression component.
The suppression component 401 of this example is also by the bar clamping of stretching out from cover (diagram is omitted).Multiple bar has two kinds at least.1 kind as shown in Figure 14 (a), it is the bar 403 of the lower surface (face of side, cover place) being connected to suppression component 401, another a kind as shown in Figure 14 (b), be the bar 405 of the upper surface (face of side, pedestal place) being connected to suppression component 401.
Bar 403 has stage portion 407 in the lower face side of suppression component 401, near the lower surface of suppression component 401, have step-like bend.That is, bar 403 has from cover (diagram omit) towards straight the 1st straight portion 403a, the orthogonal part 403b extended along the direction orthogonal with the 1st straight portion 403a from the upper end (with the end of suppression component compared with nearside) of the 1st straight portion 403a of pedestal (diagram is omitted) with from the elongated end (with the end of the 1st 403a opposition side, straight portion) of orthogonal part 403b towards the 2nd straight straight portion 403c of pedestal.
The orthogonal part 403b of bar 403 is connected to the lower surface of suppression component 401, and the 2nd straight portion 403c inserts the through hole 401a of suppression component 401.
Bar 405 has stage portion 407 in the upper surface side of suppression component 401, near the upper surface of suppression component 401, have step-like bend.That is, bar 405 has from cover (diagram omit) towards straight the 1st straight portion 405a, the orthogonal part 405b extended along the direction orthogonal with the 1st straight portion 405a from the upper end (with the end of suppression component compared with nearside) of the 1st straight portion 405a of pedestal (diagram is omitted) with from the elongated end (with the end of the 1st 405a opposition side, straight portion) of orthogonal part 405b towards the 2nd straight straight portion 405c of pedestal.
1st straight portion 405a of bar 405 inserts the through hole 401b of suppression component 401, and orthogonal part 405b is connected to the upper surface of suppression component 401.
The bar 403 that suppression component 401 is connected on the face of cover side clamps with the bar 405 be connected on the face of pedestal side.
In addition, in above-mentioned bar 403,405, by adjusting the position of through hole 401a, 401b of suppression component 401, the extended position of the bar 403,405 on cover can be made to be in circumferentially same, in addition, the installation position of the bar 403,405 on pedestal can be made to be in circumferentially same.On the contrary, if the installation position of the extended position of bar on adjustment cover and the bar on pedestal, then the position of the through hole of suppression component can be made to be in circumferentially same.
(3) shape
The suppression component of the 1st embodiment is discoideus, and the suppression component 111 of the 2nd embodiment is in having plectane portion 143 and from the periphery in plectane portion 143 shape such relative to the rake (reflex part 145) of the face tilt in plectane portion 143.These suppression component have the through hole of the through hole of bar, the through hole gone between and blast pipe, but such as also can utilize breach.
Figure 15 is the figure of the variation representing suppression component.
Suppression component 451 as shown in figure 15, in discoideus.Suppression component 451 has the through hole 453 of blast pipe at central portion.The through hole 455 of bar is provided with around through hole 453.In the face of suppression component 451 and through through hole 453 straight line on, be formed with a pair notch part 457.
By the existence of notch part 457, when by pair of lead wires so that along with moving from cover side direction LED module side, interval becomes large mode and also can use to when oblique extension.
3. fluid
In embodiments, make use of helium as the fluid be sealing in container, but also can enclose the gas (gas) of other high kinds of thermal conductivity ratio air.As other gas, there are hydrogen, neon etc.
In addition, as fluid, also liquid can be used in addition to a gas.As the liquid that thermal conductivity ratio air is high, be silicone oil, water etc.
4. bar
(1) number
The number of the bar 40,109 in embodiment is 8, but also can be the number beyond this number, such as, also can be 1, also can be many.But, in order to stably support support main body, be preferably more than 3.
(2) cross sectional shape
Bar 40,109 in embodiment be circular with the cross sectional shape of the bonding part of cover 37,123.The cross sectional shape of bonding part is not limited to circle.But, if consider adhesion when encapsulating to cover, be then preferably circular, oval or Long Circle.
(3) material
In embodiments, consider with as the cover 37,123 of glass material packaging effects and use Dumet copper-clad iron-nickel alloy wire material to form bar 40,109, but such as also only can use Dumet copper-clad iron-nickel alloy wire material in the bonding part with cover, other material of other parts, such as aluminium, steel, tungsten material are formed.In the case, need the parts be made up of multiple material welding etc. is engaged and makes the bar of the length of 1 regulation.
(4) configure
In the 1st embodiment, multiple bar 40 is disposed in circumferentially, and in other joint examples of the 2nd embodiment, multiple bar is disposed on two imaginary lines of mutual intersection (such as orthogonal).But, as long as support Soil stability can be fixed just passable by multiple bar, be not particularly limited about its configuration.
5. support main body
In the 1st embodiment, pedestal 42 and the extension rod 43 of support main body 41 are made up of different parts.Extend rod 43 and there is the function heat of LED module 11 transmitted to pedestal 42 and fluid (being helium in embodiments).In addition, there is the function heat being delivered to pedestal 42 transmitted to bar 40.
But, such as, be sometimes difficult to the heat trnasfer of LED module 11 to housing 5 side.As an example, be the poor situation of the heat resistance of electronic component of forming circuit unit.Under these circumstances, as long as material (specifically, thermal conductivity ratio extends the low material of rod) poor for pedestal pyroconductivity is formed just passable.Like this, when using support main body by as different materials pedestal and extend bar construction, can suitably determine the material of each parts and make it have various function.
6. the combination of container and housing
In embodiments, container 3,103 and housing 5,105 are by bonding agent 56,155 affixed.Therefore, the heat being formed in container 3,103 when lighting also is delivered to housing 5,105 from container 3,103.But if enclose the high fluid of pyroconductivity in container, then the temperature of container rises, and this heat trnasfer is to housing, and the temperature of housing also likely rises.Under these circumstances, in order to cut down the thermic load to the circuit unit in housing, also at the ball bubble material low with clamping pyroconductivity between spherical shell, both can be engaged.
On the contrary, the temperature of the circuit unit in housing has a surplus, also can be mixed into metal filler in the bonding agent of container and housing, make the heat transfer from container to spherical shell become many.
7.LED module
(1) light-emitting component
In embodiment etc., light-emitting component is LED23, but also can be such as LD (laser diode), also can be EL element (electroluminescent cell).
In addition, LED23 is arranged on installation base plate with chip-shaped, but LED such as also can be arranged on installation base plate with surface installing type (so-called SMD) or bullet cut.And then multiple LED also can be chip-shaped and mixing that is surface installing type.
(2) installation base plate
Installation base plate 21 in embodiment is rectangular in overlooking.
But installation base plate also can be other shapes, such as, be the polygon (comprising regular polygon) of square, 5 limit shapes etc., ellipse, circle, ring-type etc.
In addition, installation base plate number is also not limited to 1, also can be more than 2 multiple.And then, in embodiments, LED23 is installed on the surface of installation base plate 21, but also on the back side of installation base plate, also LED can be installed.
(3) sealing body
In embodiments, arranging is that the LED23 of 2 column-shaped covers with position of itemizing by sealing body 25, but the covering that also two row can be added up to, also the LED group of multiple some can be covered by 1 sealing body, also whole LED 1 sealing body can be covered.
(4) configuration of LED
In the 1st and the 2nd embodiment, it is 2 column-shaped that multiple LED23 arranges, but also along 4 limit configurations of quadrangle, can being configured to become quadrangle when overlooking, also can being configured to be positioned at ellipse (comprising circle) circumferentially.Can also arrange as rectangular.
(5) other
LED module 11 by utilizing the LED23 of injection blue light and being the fluorophor particle of sodium yellow and penetrate white light by blue light wavelength conversion, but also can be such as by the semiconductor light-emitting elements of luminescence-utraviolet with the structure of the luminous assorted fluorophor particle combination of three primary colors (red, green, blue).
And then, as wavelength shifter, semiconductor, metal complex, organic dyestuff, pigment etc. also can be utilized to send the material of the material of the light of the wavelength different from the light absorbed containing the light absorbing certain wavelength.
8. housing
In the 1st and the 2nd embodiment etc., housing 5,105 is made up of resin material, but also can be made up of other materials.When using metal material as other materials, need to guarantee the insulating properties with lamp holder.Such as can by the minor diameter part coating coating insulating film of housing or carry out insulation processing etc. to minor diameter part and guarantee with the insulating properties of lamp holder, in addition also can by respectively the spherical shell side metal material of housing being formed, the lamp holder side resin material of housing formed (being combined by plural parts) guarantee.
In embodiments above-mentioned, the surface for housing 5,105 is not particularly illustrated, such as, can arrange fin, also can carry out the process for improving radiance.
9. lamp holder
In the 1st embodiment etc., use the lamp holder 7 of screw socket type, but also can use other types, such as needle-like (specifically the G type of GY, GX etc.).
In addition, in the above-described embodiment, lamp holder 7 installs (joint) in housing 5,105 by utilizing the negative thread in shell portion 71 to screw togather with the threaded portion of housing 5,105, but also can be engaged with housing by additive method.As additive method, there are the joint based on bonding agent, the joint based on riveted joint, based on the joint etc. be pressed into, also the two or more of these methods can be combined.

Claims (10)

1. a lamp, in the container of spherical shell opening tegmentum parts shutoff, is formed by the semiconductor light-emitting elements of support unit supporting as light source, it is characterized in that,
Described spherical shell and cover are made up of glass material, and the circumference welding of described cover is in the opening circumference of described spherical shell;
In described container, enclose the fluid with the heat conductivity higher than air;
Described support unit has:
Bar, is installed on described cover; And
Support main body, is installed on described bar, and is provided with described semiconductor light-emitting elements;
Between described support main body and described cover, be provided with suppression component, this suppression component suppresses the temperature of the heat when the welding of described spherical shell and described cover suffered by described cover to decline;
Described in the ratio of heat capacities of described suppression component, the thermal capacity of support main body is little.
2. lamp as claimed in claim 1, is characterized in that,
Described suppression component is made up of the material that support main body described in luminance factor is high.
3. lamp as claimed in claim 1, is characterized in that,
Described suppression component is tabular, is configured between the weld of described cover and described support main body.
4. lamp as claimed in claim 2, is characterized in that,
Described suppression component is tabular, is configured between the weld of described cover and described support main body.
5. lamp as claimed in claim 1, is characterized in that,
Described suppression component is installed on described bar.
6. lamp as claimed in claim 2, is characterized in that,
Described suppression component is installed on described bar.
7. lamp as claimed in claim 4, is characterized in that,
Described suppression component is installed on described bar.
8. lamp as claimed in claim 1, is characterized in that,
Described support main body possesses flat pedestal portion and from this pedestal portion to the extension that described spherical shell inside extends, is provided with the installation base plate installing semiconductor light-emitting elements in the front end of extension.
9. lamp as claimed in claim 7, is characterized in that,
Described support main body possesses flat pedestal portion and from this pedestal portion to the extension that described spherical shell inside extends, is provided with the installation base plate installing semiconductor light-emitting elements in the front end of extension.
10. a lighting device, possesses lamp and installs described lamp and the ligthing paraphernalia making it light, it is characterized in that,
Described lamp is the lamp according to any one of claim 1 ~ 9.
CN201290001175.9U 2012-02-14 2012-11-16 Lamp and lighting device Expired - Fee Related CN204127691U (en)

Applications Claiming Priority (3)

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JP2012-029481 2012-02-14
JP2012029481 2012-02-14
PCT/JP2012/007375 WO2013121484A1 (en) 2012-02-14 2012-11-16 Lamp and lighting device

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Cited By (2)

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CN105179983A (en) * 2015-10-26 2015-12-23 苏州汉克山姆照明科技有限公司 Bulb with showing function
US11486567B2 (en) * 2020-06-18 2022-11-01 JK Lighting Co., Ltd Incandescent bulb-type LED lamp having heat dissipation function

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JP7017400B2 (en) * 2017-12-26 2022-02-08 パナソニックIpマネジメント株式会社 Lighting equipment

Family Cites Families (3)

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Publication number Priority date Publication date Assignee Title
US20040201990A1 (en) * 2003-04-10 2004-10-14 Meyer William E. LED lamp
JP2005005546A (en) * 2003-06-13 2005-01-06 Hitachi Lighting Ltd Led lighting device
US20100187961A1 (en) * 2009-01-27 2010-07-29 Keith Scott Phosphor housing for light emitting diode lamp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105179983A (en) * 2015-10-26 2015-12-23 苏州汉克山姆照明科技有限公司 Bulb with showing function
US11486567B2 (en) * 2020-06-18 2022-11-01 JK Lighting Co., Ltd Incandescent bulb-type LED lamp having heat dissipation function

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