CN204153488U

CN204153488U - Lamp and lighting device

Info

Publication number: CN204153488U
Application number: CN201390000310.2U
Authority: CN
Inventors: 冈崎亨
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 2012-05-23
Filing date: 2013-03-14
Publication date: 2015-02-11
Anticipated expiration: 2023-03-14
Also published as: WO2013175689A1; JP5363687B1; JPWO2013175689A1

Abstract

A kind of lamp and lighting device, semiconductor light-emitting elements is provided with in the framework be made up of enclosed globe shade and housing, a part for the film that heat conductivity is good contacts with the conductive area of the heat in the luminescence from described semiconductor light-emitting elements, and another part contacts with the inner surface of described enclosed globe shade.

Description

Lamp and lighting device

Technical field

The utility model relates to semiconductor light-emitting elements as the lamp of light source and lighting device.

Background technology

In recent years, from the view point of energy-conservation, the bulb-shaped lamp of incandescent lamp bulb as an alternative, proposes the lamp (hereinafter referred to as LED) utilized as light source by the LED of one of semiconductor light-emitting elements.

This LED lamp has following structure: on installation base plate, install multiple LED, this installation base plate is assembled in the other end that one end possesses the housing of lamp holder, is incorporated in enclosure interior (patent document 1) for making the circuit unit of LED luminescence (lighting).

LED produces heat when luminescence, when the excessive temperature of LED rises, and the lifetime of LED, or luminous efficiency declines.Therefore, in existing LED, in order to suppress LED excessive temperature rise when luminescence, make housing become large, and the material adopting heat dissipation characteristics good is formed, and makes housing possess heat sinking function.

Prior art document

Patent document

Patent document 1: Japanese Unexamined Patent Publication 2006-313717 publication

Utility model content

Utility model problem to be solved

The heat sent from LED when the LED with above-mentioned formation will light (luminescence), energetically from housing release, does not utilize enclosed globe shade to dispel the heat.

The purpose of this utility model is, provides a kind of and can utilize enclosed globe shade and the lamp dispelled the heat energetically from this enclosed globe shade and lighting device.

For solving the means of problem

The lamp of a mode of the present utility model, semiconductor light-emitting elements is provided with in the framework be made up of enclosed globe shade and housing, the part of the film that heat conductivity is good contacts with the conductive area from heat during described semiconductor light-emitting elements luminous, and another part contacts with the inner surface of described enclosed globe shade.

In addition, the lighting device of a mode of the present utility model, possess lamp and assemble described lamp and the ligthing paraphernalia lighted, described lamp is the lamp comprising above-mentioned formation.

The effect of utility model:

According to above-mentioned formation, by film, heat during semiconductor light-emitting elements luminous can be passed to enclosed globe shade energetically, enclosed globe shade can be effective as thermal component and utilize.

Accompanying drawing explanation

Fig. 1 is the stereogram of the structure of the LED representing the 1st embodiment.

Fig. 2 is the sectional view of LED.

Fig. 3 (a) is the top view of the structure representing LED module, and Fig. 3 (b) is that the A-A ' alignment in Fig. 3 (a) looks sectional view, and Fig. 3 (c) is that the B-B ' alignment in Fig. 3 (a) looks sectional view.

Fig. 4 is the stereogram of the situation of the heat transfer plate represented in housing, and Fig. 4 (a) is figure when observing heat transfer plate from upside, Fig. 4 (b) is from the figure during observation heat transfer plate of downside.

Fig. 5 is the figure of the manufacture that stem stem is described.

Fig. 6 is the figure of the assembling procedure that lamp is described.

Fig. 7 is the figure of the assembling procedure that lamp is described.

Fig. 8 is the stereogram of the LED of the 2nd embodiment.

Fig. 9 is the front cross-sectional view of LED.

Figure 10 is the exploded perspective view of LED.

Figure 11 is the schematic diagram of the lighting device of the 3rd embodiment.

Figure 12 is the main portion sectional view of the lamp of variation 1.

Figure 13 is the main portion sectional view of the lamp of variation 2.

Figure 14 is the main portion sectional view of the lamp of variation 3.

Figure 15 is the main portion sectional view of the lamp of variation 4.

Figure 16 is the sectional view of the lamp of variation 5.

Figure 17 is the exploded perspective view of the enclosed globe shade of variation 6.

Detailed description of the invention

The material used in the embodiment of utility model, numerical value illustrate only preferred example, are not limited to which.In addition, can suitably change in the scope not departing from technological thought of the present utility model.In addition, also can combine with other embodiments in the scope do not conflicted.In addition, the ratio of the parts in each accompanying drawing is different from actual.

A mode involved by utility model, a kind of lamp, semiconductor light-emitting elements is provided with in the framework be made up of enclosed globe shade and housing, it is characterized in that, a part for the film that heat conductivity is good contacts with the conductive area of the heat in the luminescence from described semiconductor light-emitting elements, and another part contacts with the inner surface of described enclosed globe shade.

In addition, a mode involved by utility model, the opening of described enclosed globe shade is closed by pedestal, described semiconductor light-emitting elements and film can be accommodated with in the space be closed, or in the described space be closed, be accommodated with the conducting parts of more than 1, this conducting parts and described semiconductor light-emitting elements thermal coupling, give described pedestal by the heat trnasfer in the luminescence of described semiconductor light-emitting elements, described conductive area can be formed on the conducting parts of described more than 1.

In addition, a mode involved by utility model, the conducting parts of described more than 1 can also comprise: installation base plate, for installing described semiconductor light-emitting elements; Support unit, the central portion in described enclosed globe shade is extended to from described pedestal, support described installation base plate, or described conductive area is formed on described installation base plate, in addition, described film be banded and space in described framework to arrange around state, described film is formed by pressing from both sides copper wire hyaline membrane material.

Well refer in this heat conductivity, when being received by film, heat conductivity is more excellent than the gas contacted with this film.

" the 1st embodiment "

1. overall formation

Fig. 1 is the stereogram of the structure of the LED 1 representing the 1st embodiment.Fig. 2 is the sectional view of LED 1.

As shown in Figure 1, LED 1 possesses: bulb 3, encloses the heat conductivity fluid higher than air in inside; Housing 5, is assemblied in one end of bulb 3; Lamp holder 7, is arranged on housing 5; Bar-like member 9, runs through bulb 3 and extends inward; And LED module 11, end inside the bulb 3 being arranged on bar-like member 9, possess heat transfer film (example of the film that heat conductivity of the present utility model is good) 13 in bulb 3, the heat sent from LED module 11 when lighting is conducted to bulb 3 side by heat transfer film 13.

LED 1 is accommodated with circuit unit 15 in housing 5, and this circuit unit 15 makes LED module 11 luminous for accepting electric power via lamp holder 7, the global shape of LED 1 is formed as the shape similar with existing incandescent lamp bulb.

The each several part forming LED 1 is below described.In addition, in this manual, the direction that the lamp axle X (see Fig. 2) for LED 1 extends, using the side at lamp holder 7 place as downside, using the side at enclosed globe shade place as upside.

2. each portion is formed

(1) LED module

Fig. 3 is the figure of the structure representing LED module 11.Fig. 3 (a) is the top view of LED module 11, and Fig. 3 (b) is the sectional view along A-A ' the line arrow in Fig. 3 (a), and Fig. 3 (c) is the sectional view along B-B ' the line arrow in Fig. 3 (a).

As shown in FIG. 1 to 3, especially as shown in Figure 3, LED module 11 seal 25 that possesses installation base plate 21, be installed on multiple LED23 of the upper surface of installation base plate 21 and multiple LED23 is covered.

As shown in Fig. 3 (a), the plan view shape of installation base plate 21 is rectangle, such as, be made up of the translucent material such as glass, aluminium oxide, to make the light transmission sent from LED23 downwards.

Installation base plate 21 has conductive path 27, this conductive path 27 is made up of connection pattern 27a and terminal patterns 27b, 27c, above-mentioned connection pattern 27a is used for being connected by multiple LED23 (series connection and/or parallel connection), and terminal patterns 27b, 27c are used for being connected with the lead-in wire 67,69 being connected to circuit unit 15.

In addition, conductive path 27 adopts the transparency electrodes such as such as ITO, makes the light transmission from LED23.

As shown in Fig. 3 (b), the terminal part of lead-in wire 67,69 is connected with terminal patterns 27b, 27c by scolding tin 31, and the through hole 29 of installation base plate 21 is inserted from downside to upside by the terminal part of this lead-in wire 67,69.

LED23 is installed on installation base plate 21 with so-called chip form.As shown in Fig. 3 (b), multiple LED23 (such as at equal intervals) spaced apart is configured to 2 column-shaped abreast with the long side direction of installation base plate 21.In addition, LED23 the brightness required by LED 1 such as number, arrangement mode etc. and suitably determine.

Seal 25 is made up of translucent materials such as such as silicones, and to itemize, position covers the LED23 being configured to 2 column-shaped, prevents air or moisture from entering LED23.

When needing to convert the wavelength of the light sent from LED23, seal 25 has wavelength conversion function.Wavelength conversion function is such as implemented by being mixed in translucent material by fluorophor particle equiwavelength coversion material.

In the present embodiment, blue light is set to glow color by LED23, and blue light is transformed to sodium yellow by wavelength shifter.Thus, LED module 11 is penetrated by the blue light sent from LED23 and the white light of sodium yellow colour mixture having been carried out wavelength conversion by wavelength shifter.

(2) bulb

As shown in Figure 2, bulb 3 has: the enclosed globe shade 35 with opening; And stem stem (example of pedestal of the present utility model) 37, the opening of enclosed globe shade 35 is closed airtightly by this stem stem 37 under the state of substantial middle LED module 11 being accommodated in enclosed globe shade 35, and the inside of bulb 3 is sealed with the high helium of thermal conductivity ratio air (He) gas.Thereby, it is possible to the heat of the LED module 11 when lighting is delivered to enclosed globe shade 35 effectively.In addition, framework of the present utility model is formed by enclosed globe shade 35 and housing 5.

Enclosed globe shade 35 is so-called A types, is made up of the glass material as translucent material.As shown in Figure 2, the globular part 35a that enclosed globe shade 35 has hollow form and the cylindrical portion 35b extended downwards from globular part 35a, the lower ending opening of cylindrical portion 35b is closed by stem stem 37.

Stem stem 37 is so-called flared, is made up of the glass material as translucent material.The blast pipe 39 for the exhaust in bulb 3 etc. is provided with in stem stem 37, in addition, for supplying the lead-in wire 67,69 of electric power to LED module 11 and being also mounted to respectively in stem stem 37 as the bar-like member 9 that the supporting mass of supporting LED module 11 plays a role.

The joint of stem stem 37 and enclosed globe shade 35, by heating both joint predetermined positions, makes the glass material melting at this position and carries out.A part, the heat transfer film 13 of LED module 11, lead-in wire 67,69 and bar-like member 9 is accommodated with in bulb 3.

(3) bar-like member

Bar-like member 9 is with the state extended at above-below direction, and intermediate portion is packaged into stem stem 37, and stem stem 37 is mounted on enclosed globe shade 35 and is run through by bulb 3.Bar-like member 9 is made up of metal material, such as Dumet wire (dumet) material.

Bar-like member 9 has many (in this case 4), is being positioned at the overhang bracket LED module 11 of bulb 3.In addition, bar-like member 9 is examples for support unit of the present utility model.

The supporting of LED module 11 is engaged with the part near 4 angles overlooking rectangular LED module 11 by the end of 4 bar-like members 9 and carries out.As shown in Fig. 3 (c), undertaken by adhesive 43 under the state that the end being bonded on bar-like member 9 of bar-like member 9 is inserted into the recess 41 of the installation base plate 21 of LED module 11.

Connect the bottom of bar-like member 9 and heat transfer plate 17 heat transfer that contacts with housing 5.Thus, the heat of the LED module 11 in lighting is discharged into outside bulb 3 via bar-like member 9, by the heat of release from heat transfer plate 17 energetically to lamp socket heat radiation (heat transfer) of housing 5, lamp holder 7, lighting device.

(4) housing

Housing 5 is formed as tubular by resin material, such as polybutylene terephthalate (PBT) (PBT), central shaft to enclosed globe shade 35 side half become large-diameter portion 5a, lamp holder 7 side half becomes minor diameter part 5b.

Large-diameter portion 5a is to be embedded to the state assembling of the bottom of bulb 3, and minor diameter part 5b is nested and arrange by lamp holder 7.External screw thread is formed with, with the internal screw-thread screw of the lamp holder 7 of Edison-type in the periphery of minor diameter part 5b.

In the periphery of the minor diameter part 5b of housing 5, be formed with holddown groove 5c abreast with the central shaft of housing 5, this holddown groove 5c is used for the lead-in wire 65 be connected with lamp holder 7 to fix.Be provided with in the inside of housing 5 for the fixing fixed cell (locking unit) 59 of the circuit substrate 55 by circuit unit 15.For fixing means, be described when circuit unit 15 is described.

Housing 5 has the Thermal release that produced when lighting by the circuit unit 15 being contained in housing 5 inside to outside function.Heat radiation is by from housing 5, externally the heat transfer of air, the convection current, radiation etc. of extraneous air are carried out.

(5) heat transfer plate

Fig. 4 is the stereogram of the appearance of the heat transfer plate representing housing, and Fig. 4 (a) is figure when watching heat transfer plate from upside, Fig. 4 (b) is from the figure during viewing heat transfer plate of downside.

In addition, in the diagram, the diagram of housing, bulb etc. is omitted.

The LED 1 of present embodiment adopts the heat of the LED module 11 in lighting also from the structure that housing 5 discharges energetically.Specifically, the end outside the bulb 3 in bar-like member 9 is connected via heat transfer plate 17 heat transfer with housing 5.

Heat transfer plate 17 uses material, the in this case aluminum of heat conductivity excellence, is formed as corresponding with the inner circumferential shape of the large-diameter portion 5a of housing 5 discoideus.As shown in the drawing, heat transfer plate 17 is in the virtual circumference centered by the through hole 46 of blast pipe 39, with 4 through holes 47 of 2 through holes 45 and bar-like member 9 equidistantly with lead-in wire 67,69, LED module 11 is connected with circuit unit 15 by this lead-in wire 67,69.

Lead-in wire 67,69 directly passes through hole 45, and the state that bar-like member 9 is given prominence to from through hole 47 a little with its bottom is secured to the lower surface of heat transfer plate 17 by adhesive 49.Adhesive 49 has or its above pyroconductivity equal with the pyroconductivity of housing 5.

Heat transfer plate 17 has minor diameter part 15a in upside, there is in downside large-diameter portion 15b, the outer peripheral face of minor diameter part 15a is secured to the inner peripheral surface of stem stem 37 by adhesive (mineral-type or organic) 51, the outer peripheral face of large-diameter portion 15b is secured to the inner peripheral surface of housing 5 by adhesive (mineral-type or organic) 51.

Adhesive 51 has or its above pyroconductivity equal with the pyroconductivity of housing 5.Thus, establish from LED module 11 via bar-like member 9, heat transfer plate 17 energetically to housing 5 dispel the heat heat transfer road.

In addition, about the pyroconductivity of adhesive 49,51, when adopting the resin material identical with the material of housing 5, certainly there is the pyroconductivity equal with housing 5, when utilizing material (such as the resin material) lower than the pyroconductivity of housing 5, such as by being mixed into metal filler etc., pyroconductivity also can be made to reach equal with housing 5 or more than it.

(6) circuit unit

Circuit unit 15 possesses circuit substrate 55 and is installed to the various electronic units 57,58 on this circuit substrate 55, by various electronic unit 57,58 form to the commercial electric power accepted via lamp holder 7 (interchange) carry out rectification rectification circuit and by the smoothing circuit of the direct current smoothing after rectification.In addition, circuit unit 15 is connected with lamp holder 7 by lead-in wire 63,65,67,69 to be connected with LED module 11 by going between.

Rectification circuit is made up of the diode bridge 57 of the upper surface side of circuit substrate 55, and smoothing circuit is made up of the capacitor 58 of the lower face side of circuit substrate 55, and the main body section of capacitor 58 is in the inside of lamp holder 7.

Circuit substrate 55 is fixed by the locking unit 59 of housing 5 inside.Specifically, the peripheral part of the lower surface of circuit substrate 55 is connected to the stage portion 59a of the inside of housing 5, and the upper surface engaged part 59b of circuit substrate 55 engages.Fastener 59b in a circumferential direction (such as at equal intervals) spaced apart is formed multiple (such as 4), stretches out to the central shaft side of housing 5 along with near stage portion 59a, fastener 59b.

When wiring harness substrate 55, the large-diameter portion 5a side of circuit unit 15 from housing 5 is inserted, when the lower surface (face of lamp holder 7 side) of circuit substrate 55 arrives fastener 59b, pressing circuit substrate 55, makes circuit substrate 44 by fastener 59b further.Thus, circuit substrate 55 engaged part 59b engages, and circuit unit 15 is mounted on housing 5.

(7) lamp holder

Lamp holder 7 has installation function LED 1 be installed on ligthing paraphernalia, in addition also has the function be electrically connected with commercial power.Lamp holder 7 is the Edison-type utilized in incandescent lamp bulb, is made up of shell portion 71 and lamp eye 75, and this shell portion 71 is formed as tubular and perisporium is formed as shape of threads, and this lamp eye 75 is assembled in shell portion 71 by insulating materials 73.

One that is connected with circuit unit 15 goes between and 65 to turn back to outer peripheral face side in the openend of the lower end of the minor diameter part 5b of housing 5, is fitted in the holddown groove 5c of housing 5, is covered in this case by shell portion 71, thus be connected with shell portion 71.Another lead-in wire 63 is connected with lamp eye 75 by welding.

Under the state screwed togather with the minor diameter part 5b of housing 5 in shell portion 71, the upper end in shell portion 71 is riveted on lamp holder 7, and lamp holder 7 is installed to housing 5.

(8) heat transfer film

Heat transfer film 13 is arranged in the framework that is made up of enclosed globe shade 35 and housing 5, specifically, with the spatial loop in bulb 3 around state arrange.The parts (except the gases such as the helium in bulb 3) that heat transfer film 13 conducts with the heat produced when LED23 lights and enclosed globe shade 35 contact.The parts that above-mentioned heat is conducted have LED module 11 (precisely installation base plate 21), bar-like member 9, lead-in wire 67,69 etc., in the 1st embodiment, are LED module 11.

At this, from the direction orthogonal with lamp axle and the direction orthogonal with the long limit of the LED module 11 of rectangle is watched time (Fig. 2), as a whole shape, heat transfer film 13 forms ring-type.In addition, as long as ring-type is here formed as ring-type as a whole, the situation heat transfer film (13) of band shape being set to arch shape (the removed shape of a part of ring-type) is also included within the concept of ring-type.

Heat transfer film 13 has flexibility.Therefore, heat transfer film 13 abuts with the inner peripheral surface of enclosed globe shade 35 and is out of shape, thus contacts with the inner peripheral surface of enclosed globe shade 35.

Heat transfer film 13 forms band shape, and both ends utilize adhesive to be secured to the interarea being provided with the side of LED23 on the installation base plate 21 of LED module 11.More particularly, be secured on installation base plate 21 2 row seal 25 between.

Heat transfer film 13 is formed by the resin material that heat conductivity is good.When heat transfer film 13 is configured on the emergent ray of the light of LED module 11 (being the top of LED module 11 in fig. 2), heat transfer film 13 is preferably made up of the material with light transmission.

On the contrary, (be such as in the below of LED module 11 in fig. 2) on the emergent ray that heat transfer film 13 is not configured at the light of LED module 11, the material that heat transfer film 13 also can can't help to have light transmission is formed.In addition, when being mounted on LED module 11, if there is the possibility contacted with conducting pathway, be preferably made up of insulating materials.

As the concrete material of heat transfer film 13, there is folder copper wire hyaline membrane etc.Particularly, needing in better conductive situation, can adopt there is mesomorphic skeleton epoxy resin, containing the resin material etc. of pottery etc. possessing good heat conductivity.

3. manufacture method

The main manufacture method that the LED 1 of the 1st embodiment is described according to Fig. 5 ~ 7.

The figure that the assembling procedure of Fig. 5 to be the figure of the manufacturing instructions of stem stem, Fig. 6 and Fig. 7 be lamp illustrates.

(1) manufacture of stem stem

Blast pipe 39, pair of lead wires 67,69 and 4 bar-like members 9 are installed on stem stem 37 with airtight shape.At this, the manufacture method of the assembly 93 that they become to be integrated is described.

First, as shown in Fig. 5 (a), prepare the end gradually tubule 83 of the flared tube 81 of wide shape, blast pipe 39, lead-in wire 2 wires 85 of 67,69, the metal bar 87 of bar-like member 9, the upper end of tubule 83 is configured at the top in flared tube 81,2 wires 85 and 4 metal bars 87 are inserted from an end of flared tube 81, and pulls out from the two ends of flared tube 81.About the position relationship of tubule 83, metal wire 85 and metal bar 87, in the virtual circumference centered by tubule 83, it is opposed that 2 wires 85 clip tubule 83, and 2 wires 85 being 1 group each group with 2 clip tubule 83 opposed (with reference to Fig. 4).

Under the state maintaining this position relationship, burner 89 is adopted to heat the top of flared tube 81.By heating, the top of the flared tube 81 of melting and the upper end distortion also melting of tubule 83, the glass material of melting enters between 2 wires 85 and 4 metal bars 87, and the opening 81a on the top of flared tube 81 is blocked.Thus, as shown in Fig. 5 (b), complete the stem stem 37 by flared tube 81 and tubule 83 welding, and metal wire 85 and metal bar 87 are sealed in stem stem 37.

Then, as shown in Fig. 5 (b), utilize the part be positioned at above tubule 83 in burner 89 pairs of stem stems 37 to heat, when heating part starts melting, be blown into air from the lower ending opening of tubule 83.So air sprays from the part of melting, as shown in Fig. 5 (c), stem stem 37 forms the exhaust outlet 91 be communicated with tubule 83.Thus, the assembly 93 for keeping LED module 11 is completed.

(2) assembling of lamp

Then, use Fig. 6 and Fig. 7 that the assembling of LED 1 is described.

As shown in Fig. 6 (a), prepare assembly 93 and LED module 11, under the state of recess 41 (see Fig. 3 (c)) that 4 metal bars 87 are inserted into installation base plate 21, by adhesive 43 by the terminal part of metal bar 87 and installation base plate 21 affixed.Thus, LED module 11 is supported by metal bar 87.

Then, by the through hole 29 of 2 wires 85 through installation base plate 21, with scolding tin 31, the terminal part of metal wire 85 and terminal patterns 27b, 27c (see Fig. 3 (a)) are fixed.

As shown in Fig. 6 (b), prepare the film (13) of banded heat transfer film 13, between the 2 row seals 25 by the high adhesive of heat conductivity, each end being secured to the installation base plate 21 of LED module 11.Thus, metal wire 85 is connected with LED module 11, and as shown in Fig. 6 (c), the assembly 93 being provided with LED module 11 assembles heat transfer film 13.In addition, the assembly 93 of the band LED module 11 being equipped with heat transfer film 13 is called the assembly 93 of the band LED module of high conductance.

Then, as shown in Fig. 6 (c), the LED module 11 of the assembly 93 of the band LED module of high conductance is inserted into inside from the opening of enclosed globe shade 35 from heat transfer film 13 side, heat transfer film 13 contacted with the inner surface of enclosed globe shade 35.And, LED module 11 (assembly 93 of the band LED module of high conductance) is inserted into further enclosed globe shade 35 inner, the open end of the circumference of stem stem 37 and enclosed globe shade 35 is aimed at.Now, because heat transfer film 13 has flexibility, so be out of shape with the insertion of LED module 11, increase with the contact area of enclosed globe shade 35.

Under the state that the open end of the circumference of stem stem 37 and enclosed globe shade 35 is aimed at, heat with burner 89 and aim at position, by stem stem 37 and enclosed globe shade 35 welding.Thus, complete bulb 3, utilize blast pipe 39 to carry out to after the exhaust in bulb 3 and helium are filled with, (chip off) sealing that blast pipe 39 is pruned.

Then, as shown in Fig. 7 (a), blast pipe 39,2 wires 85 extended lower end from bulb 3 and 4 metal bars 87 are inserted in corresponding through hole 95a, 95b, 95c of the metallic plate 95 of heat transfer plate 17, make metallic plate 95 near bulb 3, utilize adhesive 51 by affixed for the outer peripheral edge of the minor diameter part of the inner peripheral surface of the bottom of bulb 3 and metallic plate 95.

Then, as shown in Fig. 7 (b), circuit unit 15 is accommodated in housing 5, after being connected on circuit substrate 55 by 2 wires 85, utilizes adhesive 51 that housing 5 is secured to the bottom of bulb 3.In addition, become housing 5 and to be connected with metallic plate 95 and can by the heat trnasfer of LED module 11 (also not lighting) to the state of housing 5 time, metal bar 87, metallic plate 95 become bar-like member 9, heat transfer plate 17.

Then, lamp holder 7 is screwed to the minor diameter part 5b of housing 5, the metal wire be connected with circuit unit 15 is connected to lamp holder 7.Thus, the LED 1 shown in Fig. 7 (c) is completed.In addition, metal wire 85 grade is electrically connected with circuit unit 15, LED module 11 and becomes lead-in wire 67,69 etc.

4. heat dissipation characteristics

The heat produced by LED23 is delivered to enclosed globe shade 35 by multiple path.

1st path is the path of transmitting to enclosed globe shade 35 via heat transfer film 13 from LED module 11.2nd path is the path of transmitting to enclosed globe shade 35 via the helium in bulb 3 from LED module 11.3rd path is the path of transmitting to enclosed globe shade 35 via bar-like member 9, stem stem 37 from LED module 11.

From above-mentioned path to the heat of enclosed globe shade 35 from the outer surface of enclosed globe shade 35 by the release of conductive-convective radiation direction air.Particularly, on the 1st path, heat transfer film 13 is secured on the installation base plate 21 of LED23, so the heat that thermotropism conductive membranes 13 is conducted becomes many, the temperature of LED23 can be suppressed to rise.

The heat being transmitted to heat transfer film 13 is conducted to enclosed globe shade 35 side that temperature is low.Now, heat is transmitted to from heat transfer film 13 helium contacted with this heat transfer film 13, can promote the heat transfer from LED module 11 thermotropism conductive membranes 13.

In addition, owing to have employed the structure heat from LED23 being transmitted to enclosed globe shade 35 via the helium of heat conductivity excellence, so compared with the structure of the heat of LED23 being carried out via the air in enclosed globe shade conducting, can heat transfer effect be increased substantially.

In addition, owing to LED module 11 to be configured at the substantial middle of the globular part 35a of enclosed globe shade 35, so to the helium Transmit evenly heat in bulb 3.In addition, enclosed globe shade 35 is set to the size shape similar with the glass bulb of incandescent lamp bulb, so the envelope size of enclosed globe shade 35 increases, the heat dissipation characteristics from enclosed globe shade 35 to air can be improved.

On the other hand, the adhesive 49,51 of heat conductivity excellence is utilized bar-like member 9, heat transfer plate 17 and housing 5 to be connected (conducting the heat from LED module 11 to housing 5 energetically).Therefore, the heat of LED23 passes to housing 5, lamp holder 7 (the 4th path) from LED module 11 via bar-like member 9, heat transfer plate 17.The heat of housing 5 by the release of conductive-convective radiation direction air, or is transmitted to lamp holder 7.The heat transmitted to lamp holder 7 is transmitted from lamp socket to ligthing paraphernalia side.

Like this, there is multiple hot path for dispelling the heat, thus high heat dissipation characteristics can be obtained.Such as, the temperature of bulb 3 is made to increase by the heat transmitted in the 1st ~ 3rd above-mentioned path, when can not heat be shed further, the 4th path also can be utilized heat residual on LED module 11 to be passed to the parts beyond bulb 3 via bar-like member 9 and does not also become the housing 5 of high temperature, lamp holder 7.

< the 2nd embodiment >

Explain for implementing the 2nd embodiment of the present utility model with reference to accompanying drawing.

1. overall formation

Fig. 8 is the stereogram of the LED of the 2nd embodiment, and Fig. 9 is the front cross-sectional view of LED, and Figure 10 is the exploded perspective view of LED.

LED (example of lamp of the present utility model) 100, has LED module 105 in enclosed globe shade 107, and this LED module 105 possesses the LED103 (amplification see Fig. 9 is shone) as light source.Housing 109 is equipped with in the end of the open side of enclosed globe shade 107.Framework of the present utility model is formed by enclosed globe shade 107 and housing 109.

Housing 109 is formed as tubular.Lamp holder 111 is equipped with in one end (downside of Fig. 8) of housing 109.In addition, the opening of another side of housing 109 is closed by pedestal 113.

Container is formed by housing 109 and pedestal 113.In container, be accommodated with LED module 105 and heat transfer film 119, heat transfer film 119 to be mounted on this LED module 105 and to contact with enclosed globe shade 107.

Circuit unit 115 is accommodated with in the inside of housing 109.Pedestal 113 is equipped with the extension component 117 extended in enclosed globe shade 107.LED module 105 is equipped with at the extending end of extension component 117.In addition, extension component 117 in container, is an example of support unit of the present utility model by collecting.

2. each portion is formed

(1) LED module

LED module 105 possesses installation base plate 121, LED103 and seal 123.

At this, installation base plate 121 is also made up of translucent material, and plan view shape is rectangle.In addition, installation base plate 121 has conductive path, and this conductive path comprises and connects pattern and terminal patterns.Conductive path is made up of the ITO etc. as translucent material.

As shown in the enlarged drawing of Fig. 9, LED103 (such as at equal intervals) spaced apart is configured with 4 row along the long side direction of the installation base plate 121 of the rectangle shape that is in line, seal 123 by be configured to column-shaped multiple LED103 with 2 row for unit covers.

Installation base plate 121 has through hole in the part be connected with conductive path with the lead-in wire 149,151 that circuit unit 115 is electrically connected or its periphery, and the other end through the lead-in wire 149,151 of this through hole is connected with the terminal patterns of conductive path by scolding tin 124 etc.

(2) enclosed globe shade

Enclosed globe shade 107 is so-called A types of the shape similar with common incandescent lamp bulb (having the bulb of filament).In a same manner as in the first embodiment, enclosed globe shade 107 has globular part 107a and cylindrical portion 107b, and enclosed globe shade 107 is made up of translucent material.Along with leaving from globular part 107a, diameter diminishes cylindrical portion 107b.In addition, there is opening at cylindrical portion 107b with the end of globular part 107a opposition side, this end is called open side end 107c.

(3) housing

Housing 109 is formed as the shape identical with the part of the lamp base part of the close bulb of incandescent lamp bulb.In a same manner as in the first embodiment, housing 109 has large-diameter portion 109a and minor diameter part 109b, between large-diameter portion 109a and minor diameter part 109b, form stage portion 109c.The end of the large-diameter portion 109a of housing 109 is closed by pedestal 113 as mentioned above.On the large-diameter portion 109a that enclosed globe shade 107 is secured to housing 109 and pedestal 113.

The minor diameter part 109b of housing 109 installs lamp holder 111.Lamp holder 111 is Edison-type.Therefore, the periphery of minor diameter part 109b is formed as external screw thread, and this male thread portion screws in lamp holder 111.Thus, lamp holder 111 and housing 109 combine.

In addition, be formed with groove 109d at the minor diameter part 109b of housing 109, the direction that the central shaft of this groove 109d and housing 109 extends extends (see Figure 10) abreast.This groove 109d is by fixing for lead-in wire 133 (restriction lead-in wire 133 moves), and lamp holder 111 described later is connected with circuit unit 115 by this lead-in wire 133.

The opening of the upper end side of housing 109 is closed by above-mentioned pedestal 113, and the opening of lower end side is closed by lamp holder 111, thus has the space of sealed shape in inside.Circuit unit 115 is accommodated with in this space.For the assembly method of circuit unit 115, identical with the 1st embodiment, to engage with circuit unit 115 and the locking unit 147 assembled is set in housing 109.

(4) lamp holder

Lamp holder 111 is for accepting the parts of electric power from the lamp socket of ligthing paraphernalia when LED 100 to be mounted on ligthing paraphernalia and to light.In a same manner as in the first embodiment, lamp holder 111 is made up of shell portion 127, insulating materials 129 and lamp eye 131.

Shell portion 127 is connected with circuit unit 115 by lead-in wire 133, and lamp eye 131 is connected with circuit unit 115 by lead-in wire 135.In addition, reach outside from the inner side of the minor diameter part 109b of housing 109 via the opening of lower end at lead-in wire 133 and under being embedded in the state the groove 109d of housing 109, covered by shell portion 127.Thus, lead-in wire 133 is clamped by the inner circumferential in the periphery of housing 109 and shell portion 127, and lead-in wire 133 is electrically connected with lamp holder 111.

(5) pedestal

Pedestal 113 is inserted into the large-diameter portion 109a of housing 109.Pedestal 113 is inserted into the inside of housing 109, so have the outer surface (side face) corresponding with the inner surface of the large-diameter portion 109a of housing 109.At this, the inner peripheral surface of housing 109 is corresponding with the outer peripheral face of pedestal 113, and the shape of the inner peripheral surface of the cross section of large-diameter portion 109a is formed as toroidal, so it is the discoid of toroidal that pedestal 113 is also formed as shape of cross section.

Pedestal 113 has minor diameter part 113a and the diameter large-diameter portion 113b larger than minor diameter part 113a.The outer peripheral face of large-diameter portion 113b corresponding with the inner peripheral surface of the large-diameter portion 109a of housing 109 (abutting).When pedestal 113 is inserted into housing 109, between minor diameter part 113a and the inner peripheral surface of housing 109, form the groove 137 along the inner peripheral surface of housing 109.

As shown in Figure 9, in groove 137, be inserted with the open side end 107c of enclosed globe shade 107, undertaken affixed by adhesive 139.In addition, pedestal 113, under the state of large-diameter portion 109a being inserted into housing 109, is engaged with housing 109 and enclosed globe shade 107 by adhesive 139.

Pedestal 113, except having except the function of the closure of openings of the large-diameter portion 109a of housing 109, also has and will be accommodated in the heat trnasfer of generation when inner circuit unit 115 makes LED103 luminous to the function of housing 109.In addition, have the heat produced by LED103 in lighting and transmit the heat trnasfer that comes from extension component 117 to the function of enclosed globe shade 107 and housing 109.Therefore, pedestal 113 is made up of the material that heat conductivity is good.Specifically, be made up of metal, resin etc.

(6) circuit unit

In a same manner as in the first embodiment, circuit unit 115 is made up of circuit substrate 141 and the various electronic units 143,145 be installed on this circuit substrate 141.In a same manner as in the first embodiment, circuit substrate 141 utilizes locking structure to be fixed to the inside of housing 109.In addition, in the present embodiment, rectification circuit is made up of diode bridge 145, and smoothing circuit is made up of capacitor 143.

(7) extension component

Extension component 117 is at the middle position of enclosed globe shade 107 supporting LED module 105.Extension component 117 is formed as bar-shaped, and upper end is combined with LED module 105, and bottom is mounted to pedestal 113.That is, extension component 117 is being arranged at pedestal 113 from pedestal 113 under the state that the inside of enclosed globe shade 107 extends.

The upper end of extension component 117 and the combination of LED module 105 such as utilize snap-in structure.As shown in Figure 10, be formed with protuberance 117a at the upper surface of extension component 117, form porose portion 121a in the substantial middle of the installation base plate 121 of LED module 105.The shape of protuberance 117a is mutually corresponding with the shape of hole portion 121a, and the protuberance 117a of the upper surface of extension component 117 inserts (being fitted together to) hole portion 121a to LED module 105, thus makes both combine.

The bottom of extension component 117 and the combination of pedestal 113 such as utilize bonded structure.The lower surface of extension component 117 is smooth.The smooth lower surface of extension component 117 passes through adhesive (diagram is omitted) by affixed (combination) the smooth upper surface to pedestal 113.

Extension component 117 have with pedestal 113 support LED module 105 function, by the heat trnasfer that produced by LED103 during luminescence to the function of pedestal 113.This heat transmission function is implemented by using the material of high thermal conductivity.As this material, there is metal material, such as, when being made up of aluminium, the lightweight of extension component 117 can be realized.

LED module 105 rearward can penetrate light by forming installation base plate 121 by translucent material.Therefore, extension component 117 is formed as close to bar-shaped shape as far as possible, makes to cover the light rearward sent from LED103 (LED module 105).

That is, the zone line of extension component 117 is the cylindrical portion 117b of the circular shape in cross section.The upper-side area of extension component 117 becomes plat part 117c, and this plat part 117c is formed as the shape of flat on the short side direction of the installation base plate 121 of rectangle (thickness on short side direction is thin).The underside area of extension component 117 becomes along with the Frusto-conical conus portion 117d of enlarged-diameter near pedestal 113.Thus, the light rearward sent from LED103 and the light arriving the bottom of extension component 117 are easily reflected.

Extension component 117 is made up of the material (such as glass material) of light transmission, the light at the rear from LED103d can not be covered.In addition, extension component 117 contacts with the part at the back side of the installation base plate 121 of LED module 105, is supported by LED module 105.Thus, LED module 105 can from the broad range injection light at the back side of installation base plate 121.

In addition, extension component 117 is formed through hole 153,155, lead-in wire 149,151 is inserted respectively in through hole 153,155, circuit unit 115 and LED module 105 are electrically connected by lead-in wire 149,151 respectively, in addition, the through hole 157,159 inserted for lead-in wire 149,151 is also formed at pedestal 113.

(8) heat transfer film

Heat transfer film 119 contacts with the parts and enclosed globe shade 107 transmitting the heat that LED103 produces when lighting.The parts of above-mentioned transmission heat refer to LED module 105 (being precisely installation base plate 121), extension component 117, lead-in wire 149,151 etc., and at this, described parts are LED modules 105.

Heat transfer film 119 from the direction orthogonal with lamp axle and the direction orthogonal with the long limit of the LED module 105 of rectangle is watched time (Fig. 9), shape is formed as ring-type as a whole.Heat transfer film 119 has flexibility, is contacted with the inner peripheral surface of enclosed globe shade 107 by distortion.

The both ends of heat transfer film 119 utilize the interarea of the opposition side of the interarea of side that adhesive is secured to the installation base plate 121 of LED module 105, that be provided with LED103.Heat transfer film 119 has notch part with lead-in wire 149,151 corresponding parts.In addition, in a same manner as in the first embodiment, heat transfer film 119 by have high thermal conductivity, insulating properties, light transmission material form.

3. heat dissipation characteristics

Validation test has been carried out to effect when make use of heat transfer film.

In test, practically the LED 100 shown in Fig. 8 ~ Fig. 9 and the LED of having taken away heat transfer film from this lamp are lighted, measure the junction temperature (Tj) of LED103.

The LED module 105 testing lamp used has installed 48 LED103 and connected in the mode of 12 series connection 4 parallel connections, and connecting power is 7 [W].Junction temperature measures carries out after 1 time from lighting start.

The width of heat transfer film 119 is 5 [mm], thickness is 0.5 [mm], be 125 [mm with the contact area of LED module 105 ²], be 380 [mm with the contact area of enclosed globe shade 107 ²].

In the LED 100 possessing heat transfer film 119, junction temperature is 120 [DEG C], in contrast, in the LED not possessing heat transfer film 119, junction temperature is 125 [DEG C].That is, confirmed by arranging heat transfer film 119, junction temperature declines about 5 [DEG C].

< the 3rd embodiment >

In the 1st and the 2nd embodiment, specify LED 1,101, the utility model also can be applied to the lighting device that make use of above-mentioned LED.In the 3rd embodiment, the situation LED 1 of the 1st embodiment being assembled to ligthing paraphernalia (lower illuminated lamp) is described.

Lighting device 201 is such as mounted to ceiling 202 and uses.

As shown in figure 11, lighting device 201 possesses LED (LED 1 such as illustrated in the 1st embodiment) 1 and assembling LED 1 and is lighted the ligthing paraphernalia 203 of extinguishing.

Ligthing paraphernalia 203 such as possesses and is mounted to appliance body on ceiling 202 205 and is mounted to the cover 207 covered on appliance body 205 and by LED 1.Cover 207 is open-type at this, and inner surface has the reflectance coating 211 reflected to predetermined direction (in this case below) by the light penetrated from LED 1.

Appliance body 205 possesses lamp socket 209, lamp socket 209 assembles the lamp holder 7 of (screwing togather) LED 1, powers via this lamp socket 209 to LED 1.

In the present embodiment, be mounted to the allocation position of allocation position near the filament of incandescent lamp bulb of the LED23 (LED module 11) of the LED 1 on ligthing paraphernalia 203, thus the centre of luminescence of LED 1 and the centre of luminescence of incandescent lamp bulb close.

In addition, this ligthing paraphernalia be one example, such as also can not have the cover 207 of open-type, and there is case type cover, also can be LED with the ligthing paraphernalia lighted towards posture (central axis of lamp is in the posture of level) or the posture (central shaft of lamp is relative to the posture of the inclined of ligthing paraphernalia) that tilts of transverse direction.

In addition, lighting device is the direct mount type assembling ligthing paraphernalia under the state contacted with ceiling or wall, but also can be the baried type assembling ligthing paraphernalia under the state being embedded to ceiling or wall, also can be by the cable of the ligthing paraphernalia hanging type etc. from ceiling hanging.

In addition, at this, assembled 1 LED 1 is lighted by ligthing paraphernalia, but also can assemble multiple, such as 3 LED.

< variation >

Describe formation of the present utility model according to the 1st ~ 3rd embodiment above, but the utility model is not limited to above-mentioned embodiment etc.Such as, variation as follows can be enumerated.

1. heat transfer film

In the 1st embodiment and the 2nd embodiment, the installed surface side of the LED in LED module is configured with 1 heat transfer film, but as long as by the heat trnasfer in the luminescence of LED to enclosed globe shade, also can be configured at other positions, also can configure multiple.

The following describes the configuration of heat transfer film and the variation of number.

Figure 12 ~ Figure 15 is the main portion sectional view of the lamp of variation.

(1) variation 1

Figure 12 is the main portion sectional view of the lamp of variation 1.

Lamp 301 receives LED module 307, support unit 309 and heat transfer film 311 in the container 305 be made up of enclosed globe shade 303 and pedestal.In addition, support unit 309 extends from pedestal to the central authorities of enclosed globe shade 303.

LED module 307 is supported by the support unit 309 of tubular.LED module 307 is being possessed LED by the interarea of the opposition side of support side (surface).In addition, the lead-in wire 313,315 that circuit unit and LED module 307 are electrically connected is inserted the blank part in support unit 309.

Heat transfer film 311 is configured between the interarea (back side) being provided with the opposition side of the interarea of LED of LED module 307 and enclosed globe shade 303.Heat transfer film 311 is configured to, in banded ring-type, be secured to the back side of LED module 307.

Heat transfer film 311 is herein 2, configures in the mode of the short side direction of the LED module 307 from rectangle clamping support unit 309.The heat transfer film 311 of Figure 12 is the heat transfer film 311 of the inside being configured in support unit 309.As shown in figure 12, each heat transfer film 311 contacts with 2 places (2 regions) at the inner surface of enclosed globe shade 303.

(2) variation 2

Figure 13 is the main portion sectional view of the lamp of variation 2.

Lamp 351 receives LED module 357, support unit 359 and heat transfer film 361 in the container 355 be made up of enclosed globe shade 353 and pedestal.Figure 13 is the figure watched from the direction that the minor face of the LED module 357 with rectangle is orthogonal.

LED module 357 is supported by the support unit 359 of tubular.LED module 357 is being possessed LED by the interarea of the opposition side of support side (surface).Support unit 359 extends from pedestal to the central authorities of enclosed globe shade 353.In addition, the lead-in wire 363,365 that circuit unit and LED module 357 are electrically connected is inserted the blank part in support unit 359.

Heat transfer film 361 is formed as banded, and its end is mounted to the interarea (back side) being provided with the opposition side of the interarea of LED of LED module 357, and pars intermedia is configured at the face side of LED module 357.That is, be assembled to the state before LED module 357, the pars intermedia of band shape be configured at the face side of LED module 357 in the mode of the long side direction along LED module 357, both ends are being installed to the back side of LED module 357.

Heat transfer film 361 is herein 2, along LED module 357 2 row seals 367 (parallel with seal 367) and configure.In addition, the end of heat transfer film 361 is positioned at the dorsal part of the LED installation region on installation base plate 369.

(3) variation 3

Figure 14 is the main portion sectional view of the lamp of variation 3.

Lamp 401 receives LED module 409, support unit 411 and heat transfer film 413 in the container 407 be made up of enclosed globe shade 403 and pedestal 405.Support unit 411 extends from pedestal 405 to the central authorities of enclosed globe shade 403.

LED module 409 is supported by the support unit 411 of tubular.LED module 409 is being possessed LED by the interarea of the opposition side of support side (surface).In addition, the lead-in wire 415,417 that circuit unit and LED module 409 are electrically connected is inserted through the blank part in support unit 411.

Heat transfer film 413 is configured in LED module 409 and between support unit 411 and enclosed globe shade 403.Heat transfer film 413 is configured to, in banded ring-type, be secured to the back side and the support unit 411 of LED module 307.

Heat transfer film 413 is herein 2, configures in the mode of the long side direction of the LED module 409 from rectangle clamping support unit 411.In Figure 14, be configured with heat transfer film 413 in the left and right of support unit 411.As shown in figure 14, each heat transfer film 413 contacts in 1 place (1 region) with the inner surface of enclosed globe shade 403.

(4) variation 4

Figure 15 is the main portion sectional view of the lamp of variation 4.

Lamp 451 receives LED module 459, support unit 461 and heat transfer film 463 in the container 457 be made up of enclosed globe shade 453 and pedestal 455.Support unit 461 extends from pedestal 455 to the central authorities of enclosed globe shade 453.

LED module 459 is supported by the support unit 461 of tubular.LED module 459 is being possessed LED by the interarea of the opposition side of support side (surface).In addition, the lead-in wire 465,467 that circuit unit and LED module 459 are electrically connected is inserted the blank part in support unit 461.

Heat transfer film 463 contacts with the inner surface of enclosed globe shade 453, and contacts with the face being equipped with support unit 461 of pedestal 455.At this, pedestal 455 also stretches out to the inner side of enclosed globe shade 453 than the pedestal in variation 1 ~ 3.Heat transfer film 463 is configured to, in banded ring-type, be secured on pedestal 455 and enclosed globe shade 453 at this.

(5) other

The allocation position etc. of heat transfer film also can be by position appropriately combined to above-mentioned embodiment, variation 1 ~ 4, and number also can be by number appropriately combined to embodiment, variation 1 ~ 4.In addition, as long as the width of heat transfer film is considered to decide with the contact area of enclosed globe shade, heat output.

In addition, heat transfer film may not be ring-type, such as, can be configured to band shape, and arranges with modes that heat-conduction component contacts, the other end contacts with enclosed globe shade such as LED modules with one end.In this case, as heat transfer film, can use multiple, also can be overlapping by heat transfer film.

2.LED module

(1)LED

In above-mentioned embodiment and variation, have employed LED element as light source, but also can adopt the LED of such as surface installing type or bullet cut.In this case, LED element is by resin seal, and LED module has installation base plate and LED.

In above-mentioned embodiment and variation, the glow color of LED is blue light, and fluorophor particle is particle blue light being converted to sodium yellow, is illustrated as example, but also can be other combination.As other combination, when sending white light, the glow color of LED being set to ultraviolet, as fluorophor particle, the particle being converted to red light, the particle being converted to green light can being utilized, be converted to these 3 kinds of particles of the particle of blue light.

In addition, also can utilize 3 kinds of LED element of emitting red light, green emitting, blue-light-emitting, the mixing of the glow color of LED is formed white light.In addition, what send from LED module is photochromicly not limited to white certainly, can adopt various LED (comprising element, surface installing type), fluorophor particle according to purposes.

(2) installation base plate

In above-mentioned embodiment and variation, be that the installation base plate of rectangle is illustrated for example with plan view shape, but the plan view shape of substrate is not particularly limited.As other shapes, plan view shape has discoideus, the polygon etc. such as ellipticity, triangle, pentagon.

In addition, in above-mentioned embodiment and variation, with thin plate (compared with the area of upper surface, the area of side is little) for example is illustrated, but also can adopt the plate of such as wall thickness, block parts.

In addition, the installation base plate in this description refers to and has nothing to do with shape, thickness, form, has and is installed and the parts of the pattern be connected with LED electrical by LED (comprising element, surperficial actual load type).Therefore, substrate also can be formed as above-mentioned bulk, also pedestal in embodiments can directly install LED (in this case, also can using pedestal as installation base plate, in addition, pedestal is installation base plate, is also support unit), the substrate that installation base plate and extension component become to be integrated also can as installation base plate (in this case, pedestal be also support unit).

In embodiments, installation base plate is made up of translucent material, but when without the need to rearward irradiating light, also can be made up of the material beyond translucent material.

(3) installation site

LED module in above-mentioned embodiment, variation, forms installation base plate by translucent material, rearward also irradiates light, but additive method also can be adopted rearward to irradiate light.

As additive method, also can form installation base plate by non-light transmittance material, on the table back of the body two sides of installation base plate, LED is installed.In addition, installation base plate is being formed by non-light transmittance material, installation base plate is configured to (such as 6 insulation boards three-dimensionally bonded and form cubic) such as spherical, cubics, on its surface, LED (comprising shell, SMD) actual load is installed.

(4) semiconductor light-emitting elements

In above-mentioned embodiment and variation, have employed LED as semiconductor light-emitting elements, but also can adopt the semiconductor light-emitting elements beyond LED.As other light-emitting components, such as, there is LD, EL light-emitting component (comprising organic and inorganic) etc., also can comprise LED and they are combinationally used.

3. framework

In the above-described embodiment, LED and heat transfer film is received in the container that enclosed globe shade is closed by stem stem, pedestal, if but LED and heat transfer film are configured in the framework that is made up of enclosed globe shade and housing, heat transfer film contacts with enclosed globe shade, by the heat trnasfer of the LED in lighting to enclosed globe shade, also there is no need necessarily to be received in container.

The following describes the variation 5 of having received LED and heat transfer film in the framework be made up of enclosed globe shade and housing.

Figure 16 is the sectional view of the lamp of variation 5.

Lamp 500 receives pedestal 509, LED module 511, circuit unit 513, circuit holder 515 and heat transfer film 517 in the framework 507 be made up of enclosed globe shade 503 and housing 505.In addition, the end being positioned at enclosed globe shade 503 opposition side in one end of framework 507, that is, on housing 505 is equipped with lamp holder 519.

Be equipped with pedestal 509 at the other end of the housing 505 of cylindrical shape, this pedestal 509 with the interarea of lamp holder 519 opposition side on be equipped with LED module 511.In addition, the assembling of pedestal 509 on housing 505 such as utilizes adhesive.Heat transfer film 517 is mounted on pedestal 509.At this, be fixed by screw 521.In addition, heat transfer film also can be sandwiched between LED module 511 and pedestal 509.

4. enclosed globe shade

(1) shape

In above-mentioned embodiment and variation, have employed A type enclosed globe shade, but also can adopt other types, such as B, G, R type, also can be the diverse shape of enclosed globe shade shape with bulb-shaped, the lamp-bulb type fluorescent lamp of incandescent lamp bulb.

(2) structure

In above-mentioned embodiment and variation, enclosed globe shade have employed the enclosed globe shade of integrative-structure, but such as also can be divided into multiple by enclosed globe shade and independently manufacture, and then they is engaged and forms 1 enclosed globe shade.Now, without the need to all forming by identical material, such as can by the part be made up of resin and the incorporating aspects be made up of glass.In addition, during enclosed globe shade employing combining structure, the LED module larger than the opening of enclosed globe shade can be utilized.

The enclosed globe shade of segmenting structure is described as variation 6 below.

Variation 6 enclosed globe shade 551 is formed as the shape close with the enclosed globe shade 503 of the lamp 500 of variation 5, is formed as the shape that total length is longer than enclosed globe shade 503.

Enclosed globe shade 551 is made up of framework 553 and multiple spherical sheets 555.At this, the quantity of spherical sheets 555 is 4, represents with symbol " 555a ", " 555b ", " 555c ", " 555d ".

Framework 553 is made up of translucent material, such as translucent resin.As shown in figure 17, framework 553 has 4 legs 553a, 553b, 553c, 553d.

Article 4, leg 553a, 553b, 553c, 553d utilize top 553e to combine.During from top viewing framework 553,4 legs 553a, 553b, 553c, 553d extend diametrically across the center at equal intervals from imaginary circles in a circumferential direction.The core of imaginary circles is equivalent to top 553e.

Each leg 553a, 553b, 553c, 553d have preset width in the mode of the inner peripheral surface along enclosed globe shade 551 and extend with bending.The width of leg 553a, 553b, 553c, 553d is, when being assembled on enclosed globe shade 551, making adjacent spherical sheets 555a, under state that 555b, 555c, 555d dock each other, the size on leg 553a, 553b, 553c, 553d can be placed on.

During from top viewing enclosed globe shade 551, each spherical sheets 555a, 555b, 555c, 555d are formed as the shape of having carried out 4 deciles in a circumferential direction.

The assembling of spherical sheets 555a, 555b, 555c, 555d and framework 553, be positioned at the mode on leg 553a, 553b, 553c, 553d of framework 553 with the butted part of each spherical sheets 555a, 555b, 555c, 555d, spherical sheets 555a, 555b, 555c, 555d are placed on leg 553a, 553b, 553c, 553d.

Spherical sheets 555a, 555b, 555c, 555d joint on framework 553 are undertaken by the adhesive (diagram is omitted) be configured on leg 553a, 553b, 553c, 553d of framework 553.In addition, on the enclosed globe shade 551 of segmenting structure, at least one party of leg 553a, 553b, 553c, 553d of heat transfer film and spherical sheets 555a, 555b, 555c, 555d and framework 553 contacts.

In addition, enclosed globe shade can be to see inner transparent sphere cover, also can be can't see inner translucent enclosed globe shade.Translucent such as by the diffusion layer that to be formed with calcium carbonate, silica, Chinese white etc. be on an internal surface main component, or inner surface is implemented frosted process (such as blasting treatment) and implements.

(2) size

In above-mentioned embodiment, variation etc., the ratio of enclosed globe shade and lamp total length is not described.At this enclosed globe shade than being the total length of enclosed globe shade and the ratio of lamp total length, the total length of enclosed globe shade is among enclosed globe shade, is exposed to the length of the lamp axis of the part of extraneous air.

The ratio of enclosed globe shade and lamp total length is preferably more than 0.54.When being less than 0.54, the area being exposed to the part of extraneous air on enclosed globe shade diminishes, and can not obtain enough heat dissipation characteristics.In addition, enclosed globe shade diminishes, and the distance between LED module and circuit unit diminishes, and in lighting, the impact of the heat that circuit unit is subject to from LED module increases.

5. housing

In above-mentioned embodiment and variation, housing is made up of resin material, but also can be made up of other materials.As other materials, when utilizing metal material, need to guarantee the insulating properties with lamp socket.With the insulating properties of lamp socket, such as can guarantee by being coated with layer of cloth or implementing insulation processing to minor diameter part on the minor diameter part of housing, also can be made up of metal material by the enclosed globe shade side of housing and the lamp base part of housing forms (combining 2 with upper-part) by resin material guarantees.

In above-mentioned embodiment and variation, the surface of housing is not illustrated, such as, can heat-dissipating fin be set, or also can carry out the process for improving radiance.

6. lamp holder

In above-mentioned embodiment and variation, make use of the lamp holder of Edison-type, but also can utilize other types, such as pin-type (is specially the G types such as GY, GX.)。

In addition, in above-mentioned embodiment and variation, lamp holder utilizes the internal thread in shell portion and the threaded portion of housing to screw togather, thus is assembled (joint) on housing, but additive method also can be adopted to engage with housing.As additive method, there is binding agent based joint, based on the joint of riveted joint, the joint etc. based on press-in, also two or more in these methods can be combined.

7. pedestal

In above-mentioned 2nd embodiment, variation 5, pedestal is engaged with housing by adhesive under the state being inserted into housing, but additive method also can be adopted to be fixed on housing.As additive method, the large-diameter portion of pedestal is set to slightly larger than the opening of housing and be pressed into housing method, pedestal is inserted in housing after method etc. that the open side of housing is riveted.

8. lamp

The lamp of the 1st and the 2nd embodiment, inside possesses circuit unit, and semiconductor light-emitting elements is lighted by circuit unit by the electric power accepted via lamp socket conversion, but lamp of the present utility model also can be the inner lamp not possessing the type of circuit unit.

Description of reference numerals

1 LED

3 enclosed globe shades

5 housings

7 lamp holders

9 bar-like members (support unit)

11 LED modules

13 heat transfer films

37 stem stems (pedestal).

Claims

1. a lamp, is provided with semiconductor light-emitting elements in the framework be made up of enclosed globe shade and housing, and the feature of described lamp is,

The opening of described enclosed globe shade is closed by pedestal,

The film that the conducting parts of more than 1, described semiconductor light-emitting elements and heat conductivity are good is accommodated with in the space be closed, described conducting parts and described semiconductor light-emitting elements thermal coupling and the heat in the luminescence of described semiconductor light-emitting elements is conducted to described pedestal

A part for described film contacts with the conductive area of the heat in the luminescence from described semiconductor light-emitting elements, and another part contacts with the inner surface of described enclosed globe shade,

Described conductive area is formed on the conducting parts of described more than 1.

2. lamp according to claim 1, is characterized in that,

The conducting parts of described more than 1 comprises: installation base plate, for installing described semiconductor light-emitting elements; And support unit, extend to the central portion in described enclosed globe shade from described pedestal, support described installation base plate.

3. lamp according to claim 2, is characterized in that,

Described conductive area is formed on described installation base plate.

4. the lamp according to any one of claims 1 to 3, is characterized in that,

Described film is banded, to arrange around state in described space.

5. lamp according to claim 1, is characterized in that,

Described film is formed by pressing from both sides copper wire hyaline membrane material.

6. a lighting device, possesses lamp and assembles described lamp and the ligthing paraphernalia lighted, it is characterized in that,

Described lamp is lamp according to claim 1.