CN204090283U - There is the printed circuit board (PCB) of target patterns - Google Patents
There is the printed circuit board (PCB) of target patterns Download PDFInfo
- Publication number
- CN204090283U CN204090283U CN201420459266.8U CN201420459266U CN204090283U CN 204090283 U CN204090283 U CN 204090283U CN 201420459266 U CN201420459266 U CN 201420459266U CN 204090283 U CN204090283 U CN 204090283U
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- target patterns
- pcb
- annulus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a kind of printed circuit board (PCB) with target patterns, the described printed circuit board (PCB) with target patterns, comprise substrate and the target patterns being arranged on described substrate surface, wherein said target patterns comprises alignment mark and to be arranged between the ground floor of described alignment mark periphery offset detection annulus between offset detection annulus and the second layer, and the spacing between wherein said ground floor between offset detection annulus and the second layer between offset detection annulus is default bias threshold value.
Description
Technical field
The utility model relates to printed circuit board (PCB) (Printed Circuit Board, PCB) technology, especially, relates to a kind of printed circuit board (PCB) with target patterns.
Background technology
Along with the development of electronic technology, printed circuit board (PCB) is widely used in electronic product, for carrying the functional circuit of electronic product inside and the electric connection realized between difference in functionality circuit.In multilayer board manufacturing process, target patterns is a kind of very important Computer Aided Design; Target patterns can be formed in printed circuit board surface, the machine drilling location, the figure that are mainly used in printed circuit board (PCB) turn the operations such as contraposition, particularly, after multilayer board pressing, after X ray (X-RAY) automatic target drilling machine can be used directly to read target, wad cutter is got out, wherein, target precision quality is directly connected to machine drilling and figure and changes a job the product quality of sequence.
In the bonding processes of multilayer board, Aligning degree between each layer printed circuit board requires extremely important, but the drone design of traditional printed circuit board (PCB) is only as basic roles such as the location in multilayer board bonding processes and contrapositions, cannot be used for identifying whether multilayer board has occurred interlayer skew.
Utility model content
One of them object of the present utility model is above-mentioned defect in order to improve prior art and provides a kind of printed circuit board (PCB) with target patterns.
The printed circuit board (PCB) of what the utility model provided have target patterns, comprise substrate and the target patterns being arranged on described substrate surface, wherein said target patterns comprises alignment mark and to be arranged between the ground floor of described alignment mark periphery offset detection annulus between offset detection annulus and the second layer, and the spacing between wherein said ground floor between offset detection annulus and the second layer between offset detection annulus is default bias threshold value.
What the utility model provided has in a kind of preferred embodiment of the printed circuit board (PCB) of target patterns, and described target patterns is arranged on the jigsaw edges of boards region of described printed circuit board (PCB).
What the utility model provided has in a kind of preferred embodiment of the printed circuit board (PCB) of target patterns, and described default bias threshold value is 75 microns.
What the utility model provided has in a kind of preferred embodiment of the printed circuit board (PCB) of target patterns, and described alignment mark comprises center circle and contraposition annulus, and wherein said contraposition annulus is arranged on the periphery of described center circle.
What the utility model provided has in a kind of preferred embodiment of the printed circuit board (PCB) of target patterns, and described center diameter of a circle is 2.5 millimeters.
What the utility model provided has in a kind of preferred embodiment of the printed circuit board (PCB) of target patterns, and the internal diameter of described contraposition annulus is 3.275 millimeters, and its external diameter is 4.275 millimeters.
What the utility model provided has in a kind of preferred embodiment of the printed circuit board (PCB) of target patterns, and between described ground floor, the internal diameter of offset detection annulus is 5.275 millimeters, and its external diameter is 5.475 millimeters.
What the utility model provided has in a kind of preferred embodiment of the printed circuit board (PCB) of target patterns, and the internal diameter of described two interlayer offset detection annulus is 5.550 millimeters, and its external diameter is 5.750 millimeters.
Compared to prior art, adopt the printed circuit board (PCB) with above-mentioned target patterns 200 that the utility model provides, when carrying out the pressing of multilayer board, can by between described ground floor between offset detection annulus and the described second layer offset detection annulus detect whether occur that serious interlayer offsets between each layer printed circuit board, thus can directly filter bad product, eliminate the program of ad hoc carrying out interlayer alignment, greatly save the production time, improve the production efficiency of multilayer board.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing used in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of a kind of embodiment of the printed circuit board (PCB) with target patterns that the utility model provides.
Fig. 2 is the floor map of the target patterns of the printed circuit board (PCB) shown in Fig. 1.
Embodiment
Be clearly and completely described to the technical scheme in the utility model embodiment below, obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making other embodiments all obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Refer to Fig. 1, it is the structural representation of a kind of embodiment of the printed circuit board (PCB) with target patterns that the utility model provides.Described printed circuit board (PCB) 100 can comprise substrate 110 and be positioned at the metal level 120 on described substrate 110 surface, and wherein said conductive layer 120 can be arranged on one of them surface of described substrate 110, also can be arranged on two surfaces of described substrate 110.
Described metal level 120 comprises conducting wire and target patterns, in one embodiment, described conducting wire can be arranged on the surface, central area of described substrate 110, and described target patterns can be arranged on fringe region or the corner regions surface of described substrate 110, such as, described target patterns can be distributed in the edges of boards region of the jigsaw of described printed circuit board (PCB) 110 according to predeterminable range.In a particular embodiment, the number of described target patterns can be decided according to the actual requirements, and the position of described target patterns is also not limited in above-mentioned corner regions, and it can design according to product needed, and the utility model does not limit this.
In the printed circuit board (PCB) 100 that the utility model provides, described target patterns carries out, as except location and alignment mark, can also being used for the interlayer offset detection of carrying out in multilayer board bonding processes except being used for.Particularly, refer to Fig. 2, the planar structure schematic diagram of the target patterns of the printed circuit board (PCB) 100 that the utility model provides.Described target patterns 200 to comprise between center circle 210, contraposition annulus 220, ground floor offset detection annulus 240 between offset detection annulus 230 and the second layer.Wherein, between described center circle 210, contraposition annulus 220, ground floor, between offset detection annulus 230 and the second layer, offset detection annulus 240 is concentric design; Described contraposition annulus 220 is arranged on the periphery of described center circle 210, and it coordinates the alignment mark as described printed circuit board (PCB) 100 with described center circle 210.Between described ground floor, between offset detection annulus 230 and the described second layer, offset detection annulus 240 is successively set on the periphery of described alignment mark from the inside to the outside.
Wherein, the spacing between described ground floor between offset detection annulus 230 and the described second layer between offset detection annulus 240 can be the default bias threshold value of the serious interlayer skew of appearance, such as 75 microns, and the width of the two can be 200 microns.Such as, in the present embodiment, the diameter of described center circle 210 can be 2.5 millimeters; The internal diameter of described contraposition annulus 220 can be 3.275 millimeters, and its external diameter can be 4.275 millimeters; Between described ground floor, the internal diameter of offset detection annulus 230 can be 5.275 millimeters, and its external diameter can be 5.475 millimeters; Between the described second layer, the internal diameter of offset detection annulus 240 can be 5.550 millimeters, and its external diameter can be 5.750 millimeters.
Adopt the printed circuit board (PCB) 100 with above-mentioned target patterns 200 that the utility model provides, when carrying out the pressing of multilayer board, can by between described ground floor between offset detection annulus 230 and the described second layer offset detection annulus 240 detect whether occur that serious interlayer offsets between each layer printed circuit board, thus can directly filter bad product, eliminate the program of ad hoc carrying out interlayer alignment, greatly save the production time, improve the production efficiency of multilayer board.
Particularly, observe that two interlayer offset detection annulus 230 and 240 of the target patterns of a certain layer printed circuit board cover two interlayer offset detection annulus 230 and 240 of another layer printed circuit board just when boring target drone by X ray, then can judge that above-mentioned two layer printed circuit boards do not occur that interlayer offsets.When between the second layer being observed the target patterns of a certain layer printed circuit board by X ray brill target drone, offset detection annulus 240 covers the white space between two interlayer offset detection annulus 230 and 240 of another layer printed circuit board or just covers offset detection annulus 230 between the ground floor of another printed circuit board (PCB), then can judge that the interlayer skew of above-mentioned two layer printed circuit boards is no more than described offset gate limit value 75 microns, namely only there is the slight interlayer skew not affecting product yield in the two.Otherwise, then can think that serious interlayer skew (side-play amount exceedes described offset gate limit value 75 microns) appears in above-mentioned two layer printed circuit boards.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model description to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included within scope of patent protection of the present utility model.
Claims (8)
1. one kind has the printed circuit board (PCB) of target patterns, it is characterized in that, comprise substrate and the target patterns being arranged on described substrate surface, wherein said target patterns comprises alignment mark and to be arranged between the ground floor of described alignment mark periphery offset detection annulus between offset detection annulus and the second layer, and the spacing between wherein said ground floor between offset detection annulus and the second layer between offset detection annulus is default bias threshold value.
2. have the printed circuit board (PCB) of target patterns as claimed in claim 1, it is characterized in that, described target patterns is arranged on the jigsaw edges of boards region of described printed circuit board (PCB).
3. have the printed circuit board (PCB) of target patterns as claimed in claim 1, it is characterized in that, described default bias threshold value is 75 microns.
4. have the printed circuit board (PCB) of target patterns as claimed in claim 3, it is characterized in that, described alignment mark comprises center circle and contraposition annulus, and wherein said contraposition annulus is arranged on the periphery of described center circle.
5. have the printed circuit board (PCB) of target patterns as claimed in claim 4, it is characterized in that, described center diameter of a circle is 2.5 millimeters.
6. have the printed circuit board (PCB) of target patterns as claimed in claim 5, it is characterized in that, the internal diameter of described contraposition annulus is 3.275 millimeters, and its external diameter is 4.275 millimeters.
7. have the printed circuit board (PCB) of target patterns as claimed in claim 6, it is characterized in that, between described ground floor, the internal diameter of offset detection annulus is 5.275 millimeters, and its external diameter is 5.475 millimeters.
8. have the printed circuit board (PCB) of target patterns as claimed in claim 7, it is characterized in that, the internal diameter of described two interlayer offset detection annulus is 5.550 millimeters, and its external diameter is 5.750 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420459266.8U CN204090283U (en) | 2014-08-14 | 2014-08-14 | There is the printed circuit board (PCB) of target patterns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420459266.8U CN204090283U (en) | 2014-08-14 | 2014-08-14 | There is the printed circuit board (PCB) of target patterns |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204090283U true CN204090283U (en) | 2015-01-07 |
Family
ID=52182947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420459266.8U Active CN204090283U (en) | 2014-08-14 | 2014-08-14 | There is the printed circuit board (PCB) of target patterns |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204090283U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050339A (en) * | 2015-07-10 | 2015-11-11 | 东莞市科佳电路有限公司 | Method for detecting interlayer position deviation of multilayer printed circuit board |
| CN107708285A (en) * | 2016-08-09 | 2018-02-16 | 北大方正集团有限公司 | The preparation method of multilayer circuit board and multilayer circuit board |
| CN109539940A (en) * | 2018-11-23 | 2019-03-29 | 梅州市志浩电子科技有限公司 | The inclined distance measurement method in the hole of laser drilling |
-
2014
- 2014-08-14 CN CN201420459266.8U patent/CN204090283U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050339A (en) * | 2015-07-10 | 2015-11-11 | 东莞市科佳电路有限公司 | Method for detecting interlayer position deviation of multilayer printed circuit board |
| CN107708285A (en) * | 2016-08-09 | 2018-02-16 | 北大方正集团有限公司 | The preparation method of multilayer circuit board and multilayer circuit board |
| CN107708285B (en) * | 2016-08-09 | 2020-10-16 | 北大方正集团有限公司 | Multilayer circuit board and method for producing multilayer circuit board |
| CN109539940A (en) * | 2018-11-23 | 2019-03-29 | 梅州市志浩电子科技有限公司 | The inclined distance measurement method in the hole of laser drilling |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205071431U (en) | PCB board is with preventing partially to bit architecture | |
| CN204090283U (en) | There is the printed circuit board (PCB) of target patterns | |
| CN104244584A (en) | Laser drilling alignment method | |
| CN103056411A (en) | Method for designing positioning hole drilling target after multi-layer printed circuit board (PCB) pressing | |
| CN102917540B (en) | Printed wiring board selectivity hole copper minimizing technology | |
| CN103687315A (en) | Designing method of punching alignment target | |
| CN205946329U (en) | Printed circuit board | |
| CN105764270A (en) | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing | |
| CN207070445U (en) | A kind of compound alignment target of figure | |
| CN104476616A (en) | Manufacturing method of slot of printed-circuit board | |
| CN107820365A (en) | A kind of PCB processing method and PCB | |
| CN103020387A (en) | Method for detecting inner layer circuit of PCB (Printed Circuit Board) by utilizing GENESIS software | |
| TWI439916B (en) | Capacitive touch panel structure and method producing the same | |
| CN204575095U (en) | A kind of capacitive transducer with shield assembly | |
| CN201986253U (en) | Novel circuit board positioning structure | |
| US20140144691A1 (en) | Method for shortening via stub and printed circuit board designed based on the method | |
| CN103025064B (en) | A kind of alignment method of wiring board | |
| CN204014258U (en) | With V, carve the pcb board of fool proof test point | |
| CN204014259U (en) | The HDI circuit board of adjustable blind hole position degree | |
| CN112504183B (en) | Hole deviation detection method | |
| CN201839506U (en) | Multilayer circuit board with precise outer layer counterpointing | |
| CN204545651U (en) | A kind of wiring board welding localization tool | |
| CN204721711U (en) | A kind of multilayer circuit board | |
| CN206136443U (en) | PCB makeup on no technology limit | |
| CN103228099A (en) | BGA (ball grid array) bonding pad and buried hole alignment inspection structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |