CN204014259U - The HDI circuit board of adjustable blind hole position degree - Google Patents
The HDI circuit board of adjustable blind hole position degree Download PDFInfo
- Publication number
- CN204014259U CN204014259U CN201420378648.8U CN201420378648U CN204014259U CN 204014259 U CN204014259 U CN 204014259U CN 201420378648 U CN201420378648 U CN 201420378648U CN 204014259 U CN204014259 U CN 204014259U
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- China
- Prior art keywords
- conductive layer
- blind hole
- copper foil
- layer
- plate body
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Abstract
The HDI circuit board that the utility model discloses a kind of adjustable blind hole position degree, belongs to circuit board making technical field.It comprises plate body, described plate body comprises core layer, copper foil layer and conductive layer, described copper foil layer comprises the first copper foil layer and the second copper foil layer that is positioned at plate body upper and lower surface, described conductive layer comprises the first conductive layer, the second conductive layer, the 3rd conductive layer, the 4th conductive layer, the perforated zone of the plate face of described plate body is provided with calibration sign, described calibration sign comprises blind area and bore area, and described blind area is positioned at the periphery of described bore area.The utility model structural design is simple, easy to make, has the reference of calibration while making the machine drilling of HDI plate, has effectively improved the qualification rate of blind hole boring, greatly reduces the percent defective of HDI plate, has reduced production cost.
Description
Technical field
The utility model belongs to circuit board making technical field, more particularly, relates to the HDI circuit board of adjustable blind hole position degree.
Background technology
HDI wiring board, it is high-density interconnect circuit board, refer to and be designed with aperture below 6mil, the ring footpath of orifice ring is less than micro-guide hole of 0.25mm, contactor density is at 130 points/more than square inch, wiring density is in 117 points/more than square inch, the printed substrate of its live width spacing below 3mil/3mil.HDI wiring board has advantages of high-accuracy, has met the demand of modern electronic product to miniaturization, lightweight, slimming completely, becomes the main product in wiring board field.HDI wiring board is compared with the difference of common line plate maximum, and HDI wiring board is provided with blind hole.Blind hole is as a kind of micro-guide hole, refers to the outer and inferior skin (i.e. an internal layer adjacent with skin) of connection line plate and do not connect the via of whole wiring board.Be different from the mechanical hole that tradition adopts drill point to process, blind hole first adopts the outer field Copper Foil of chemical method etching conventionally, and the insulating barrier between the outer and inferior skin of recycling laser burn off, then realizes the conducting between outer and time skin by electroplating technology.In wiring board field, according to the difference of blind hole stacking fold, blind hole can be divided into single order blind hole, second-order blind holes and three rank blind holes etc.
At present in HDI board production, first do blind hole laser hole burning, do again through hole machine drilling, then electroplate and outer-layer circuit, at outer-layer circuit stage etching, go out blind hole with the ring ring of through hole, because blind hole is to be worked it out by two processing procedures with through hole, and processing procedure of outer-layer circuit will be made blind hole with the ring ring of through hole simultaneously, therefore when blind hole is excessive with the skew of through hole, outer-layer circuit is made and cannot be guaranteed to make qualified blind hole with the ring ring of through hole simultaneously, produces scrapping of causing because of Aligning degree.And traditional method of inspection is after the outer-layer circuit etching such as to be complete, then check blind hole with the skew of ring ring and through hole with the skew of ring ring, it is excessive that check it's time to be offset, because blind hole follows through hole all to complete, cannot adjust again, can only scrap processing.
Therefore, being necessary to arrange punching calibration sign on HDI circuit board detects blind hole and whether departs from prebored hole orientation.
Utility model content
For the above-mentioned problems in the prior art, the purpose of this utility model is to provide a kind of HDI circuit board of adjustable blind hole position degree, and it can detect the blind hole laser hole burning stage and whether depart from default orientation.
To achieve these goals, the technical scheme that the utility model adopts is as follows:
A kind of HDI circuit board of adjustable blind hole position degree, comprise plate body, described plate body comprises the core layer that is positioned at plate body centre, be positioned at the outer field copper foil layer of described plate body and conductive layer, described copper foil layer comprises the first copper foil layer and the second copper foil layer that is positioned at plate body upper and lower surface, described conductive layer comprises the first conductive layer, the second conductive layer, the 3rd conductive layer, the 4th conductive layer, described the first conductive layer and described the second conductive layer are between described the first copper foil layer and described core layer, described the 3rd conductive layer and described the 4th conductive layer are between described the second copper foil layer and described core layer, the perforated zone of the plate face of described plate body is provided with calibration sign, described calibration sign comprises blind area and bore area, described blind area is positioned at the periphery of described bore area.
Further, between described the first copper foil layer, described the first conductive layer and described the second conductive layer, be provided with blind hole.
Further, described blind area is annular shape, and described bore area is circular.
Further, the diameter of described bore area is greater than the diameter of blind hole.
Further, described blind area is engraved on the surface of plate body by laser hole burning mode.
Further, Wei Wutong district, described blind area.
Than prior art, the beneficial effect of the HDI circuit board of the utility model adjustable blind hole position degree is:
By the blind hole district of beating at HDI plate, in the mode of laser hole burning, annular blind area is set, before the punching of HDI plate, make the ring of a calibration through hole, when carrying out blind hole technique, first by the mode of laser hole burning, in the bore area of calibration sign, punched in advance, if can estimate out the very first time position deviation bore area of pre-punching, operating personnel can adjust machine in time, have avoided scrapping of follow-up machine drilling; Its structural design is simple, easy to make, has the reference of calibration while making the machine drilling of HDI plate, has effectively improved the qualification rate of blind hole boring, greatly reduces the percent defective of HDI plate, has reduced production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the HDI circuit board of the utility model adjustable blind hole position degree.
Fig. 2 is the endothecium structure schematic diagram of the HDI circuit board of the utility model adjustable blind hole position degree.
Fig. 3 is the structural representation that the calibration of the HDI circuit board of the utility model adjustable blind hole position degree identifies.
Fig. 4 is the schematic diagram that the boring of the HDI circuit board of the utility model adjustable blind hole position degree departs from.
Embodiment
Below in conjunction with specific embodiment, the utility model is further described.
As Fig. 1, Fig. 2, shown in Fig. 3, the HDI circuit board of a kind of adjustable blind hole of the utility model position degree, comprise plate body 1, plate body 1 comprises the core layer 104 that is positioned at plate body 1 centre, be positioned at the outer field copper foil layer of plate body 1 and conductive layer, copper foil layer comprises the first copper foil layer 101 and the second copper foil layer 107 that is positioned at plate body 1 upper and lower surface, conductive layer comprises the first conductive layer 102, the second conductive layer 103, the 3rd conductive layer 105, the 4th conductive layer 106, the first conductive layer 102 and the second conductive layer 103 are between the first copper foil layer 101 and core layer 104, the 3rd conductive layer 105 and the 4th conductive layer 106 are between the second copper foil layer 107 and core layer 104, the first copper foil layer 101, between the first conductive layer 102 and the second conductive layer 103, be provided with blind hole 108, the perforated zone of the plate face of plate body 1 is provided with calibration sign 2, and calibration sign 2 comprises 201He bore area, blind area 202, and blind area 201 is positioned at the periphery of bore area 202, blind area 201 is annular shape, and the width of blind area 201 is 0.1mm, and bore area 202 is circular, and the diameter of bore area 202 is 1.027mm, and 201Yu bore area 202, blind area is concentric, the diameter of bore area 202 is greater than the diameter of blind hole 108, and the diameter of blind hole 108 is 0.9mm, blind area 201 is engraved on the surface of plate body 1 by laser hole burning mode, 201Wei Wutong district, blind area.
The utility model arranges annular blind area 201 by the blind hole district of beating at HDI plate in the mode of laser hole burning, before the punching of HDI plate, make the ring of a calibration through hole, when carrying out blind hole technique, first by the mode of laser hole burning, in the bore area 202 of calibration sign 2, punched in advance, if the very first time can be estimated out (as shown in Figure 4) in the position deviation bore area of pre-punching, check the remaining size in bore area 202, whether the side-play amount that just can check out blind hole and through hole has the regulation of exceeding, if there is the time of exceeding, adjust in time the design of drilling program, drift rate is controlled in allowed limits, its structural design is simple, easy to make, has the reference of calibration while making the machine drilling of HDI plate, has effectively improved the qualification rate of blind hole boring, greatly reduces the percent defective of HDI plate, has reduced production cost.
Below schematically the utility model and execution mode thereof are described, this description does not have restricted, and shown in accompanying drawing is also one of execution mode of the present utility model, and actual structure is not limited to this.So, if those of ordinary skill in the art is enlightened by it, in the situation that not departing from the utility model creation aim, without the creationary frame mode similar to this technical scheme and the embodiment of designing, all should belong to protection range of the present utility model.
Claims (6)
1. the HDI circuit board of an adjustable blind hole position degree, comprise plate body, described plate body comprises the core layer that is positioned at plate body centre, be positioned at the outer field copper foil layer of described plate body and conductive layer, described copper foil layer comprises the first copper foil layer and the second copper foil layer that is positioned at plate body upper and lower surface, described conductive layer comprises the first conductive layer, the second conductive layer, the 3rd conductive layer, the 4th conductive layer, described the first conductive layer and described the second conductive layer are between described the first copper foil layer and described core layer, described the 3rd conductive layer and described the 4th conductive layer are between described the second copper foil layer and described core layer, it is characterized in that: the perforated zone of the plate face of described plate body is provided with calibration sign, described calibration sign comprises blind area and bore area, described blind area is positioned at the periphery of described bore area.
2. the HDI circuit board of adjustable blind hole position degree as claimed in claim 1, is characterized in that: between described the first copper foil layer, described the first conductive layer and described the second conductive layer, be provided with blind hole.
3. the HDI circuit board of adjustable blind hole position degree as claimed in claim 1, is characterized in that: described blind area is annular shape, and described bore area is circular.
4. the HDI circuit board of adjustable blind hole position degree as claimed in claim 3, is characterized in that: the diameter of described bore area is greater than the diameter of blind hole.
5. the HDI circuit board of adjustable blind hole position degree as claimed in claim 1, is characterized in that: described blind area is engraved on the surface of plate body by laser hole burning mode.
6. the HDI circuit board of adjustable blind hole position degree as claimed in claim 5, is characterized in that: Wei Wutong district, described blind area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420378648.8U CN204014259U (en) | 2014-07-10 | 2014-07-10 | The HDI circuit board of adjustable blind hole position degree |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420378648.8U CN204014259U (en) | 2014-07-10 | 2014-07-10 | The HDI circuit board of adjustable blind hole position degree |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204014259U true CN204014259U (en) | 2014-12-10 |
Family
ID=52054194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420378648.8U Expired - Fee Related CN204014259U (en) | 2014-07-10 | 2014-07-10 | The HDI circuit board of adjustable blind hole position degree |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204014259U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106771824A (en) * | 2017-02-15 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of pcb board and its method for being applied to radium-shine hole skew test point |
| CN110493961A (en) * | 2019-08-13 | 2019-11-22 | 沪士电子股份有限公司 | A kind of pcb board outer layer repeatedly drills Aligning degree monitoring method |
-
2014
- 2014-07-10 CN CN201420378648.8U patent/CN204014259U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106771824A (en) * | 2017-02-15 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of pcb board and its method for being applied to radium-shine hole skew test point |
| CN110493961A (en) * | 2019-08-13 | 2019-11-22 | 沪士电子股份有限公司 | A kind of pcb board outer layer repeatedly drills Aligning degree monitoring method |
| CN110493961B (en) * | 2019-08-13 | 2021-05-11 | 沪士电子股份有限公司 | Method for monitoring alignment degree of outer layer of PCB (printed circuit board) during multiple drilling |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20170710 |