CN204029801U - Adopt the integrated module LED light source of Flip-Chip Using - Google Patents

Abstract

The utility model discloses a kind of integrated module LED light source that adopts Flip-Chip Using, be respectively equipped with positive pole (6) and negative pole (3) at the two ends up and down of ceramic substrate (1); Front one side of ceramic substrate is provided with the lamp bowl of depression; The bottom of lamp bowl is provided with the LED light emitting array of 20 row × 10 row that are made up of 200 LED chips (2); In ceramic substrate, be equidistantly embedded with 19 U-shaped connectors (4) for conducting electricity; Between every 2 adjacent row LED chips, dispose the U-shaped connector described in; The openend of U-shaped connector stretches out the solder joint as LED chip from the bottom of lamp bowl; LED chip is welded between electrode and U-shaped connector or between 2 adjacent U-shaped connectors; Described electrode comprises described positive pole and negative pole; The recessed cavity place of lamp bowl is filled by glue layer (5).The integrated module LED configurations of light sources novelty of this employing Flip-Chip Using, reliability is high, is easy to promotion and implementation.

Description

Adopt the integrated module LED light source of Flip-Chip Using

Technical field

The utility model relates to a kind of integrated module LED light source that adopts Flip-Chip Using.

Background technology

The integrated die set light source of existing LED, all adopts forward cartridge chip, adopts aluminium oxide as substrate, processes, then at its surface etching electrode on substrate; Adopt gold thread, the both positive and negative polarity of electrode and support is coupled together and conducted electricity; But because gold thread is to belong to noble metal, its diameter is generally no more than 1.2mil, i.e. 30um, ability to bear is relatively fragile; Therefore, in use and easily rupture; Owing to being subject to the problems affect of gold thread fragility, two aspects of expansion of metal; Determine to adopt that the light source product power of the integrated module of existing LED mechanism encapsulation is the highest can only accomplish 150W.Therefore, be necessary to design a kind of reliability higher and support more high-power LED light source.

Utility model content

Technical problem to be solved in the utility model is to provide a kind of integrated module LED light source that adopts Flip-Chip Using, the integrated module LED configurations of light sources novelty of this employing Flip-Chip Using, and reliability is high, is easy to promotion and implementation.

The technical solution of utility model is as follows:

Adopt an integrated module LED light source for Flip-Chip Using, be respectively equipped with positive pole (6) and negative pole (3) at the two ends up and down of ceramic substrate (1); Front one side of ceramic substrate is provided with the lamp bowl of depression; The bottom of lamp bowl is provided with the LED light emitting array of 20 row × 10 row that are made up of 200 LED chips;

In ceramic substrate, be equidistantly embedded with 19 U-shaped connectors (4) for conducting electricity; Between every 2 adjacent row LED chips, dispose the U-shaped connector described in; The openend of U-shaped connector stretches out the solder joint as LED chip from the bottom of lamp bowl; LED chip is welded between electrode and U-shaped connector or between 2 adjacent U-shaped connectors; Described electrode comprises described positive pole and negative pole; The recessed cavity place of lamp bowl is filled by glue layer (5).

Thickness, height and the width of described ceramic substrate are respectively 1.7mm, 33.22mm and 17.22mm.

Beneficial effect:

The integrated module LED light source of employing Flip-Chip Using of the present utility model, adopts flip-chip, and its electrode structure is made in frame bottom, and top layer is light-emitting area; Employing tin cream is fixed, the both positive and negative polarity contact that electrode is direct corresponding with substrate; This technique encapsulation, does not need to adopt gold thread welding, and fundamentally face has been stopped the problem of gold thread fracture;

Adopt this LED light source, product power is the highest can accomplish 300W; Solve some requirements for light fixture super brightness of industry.

In addition, ceramic substrate has good heat conductivity, reliably electrical insulating property, low dielectric constant and dielectric loss, is the desirable cooling encapsulation material of large scale integrated circuit of new generation, semiconductor module circuit and high power device.Circuit adopts copper sheet (U-shaped connector, positive pole and negative pole etc.) to be connected, and not only conduct electricity very well, and cost is low, is conducive to promotion and implementation.

Brief description of the drawings

Fig. 1 is the front schematic view of the integrated module LED light source module of employing Flip-Chip Using of the present utility model.

Fig. 2 is the side cutaway view that adopts the integrated module LED light source module of Flip-Chip Using;

Fig. 3 is the enlarged drawing of A part in Fig. 2.

Label declaration: 1-ceramic substrate, 2-LED chip, 3-negative pole, 4-U type connector, 5-glue layer; 6-positive pole.

Embodiment

Below with reference to the drawings and specific embodiments, the utility model is described in further details:

Embodiment 1:

As Figure 1-3, a kind of integrated module LED light source that adopts Flip-Chip Using, is respectively equipped with positive pole 6 and negative pole 3 at the two ends up and down of ceramic substrate 1; Front one side of ceramic substrate is provided with the lamp bowl of depression; The bottom of lamp bowl is provided with the LED light emitting array of 20 row × 10 row that are made up of 200 LED chips 2;

In ceramic substrate, be equidistantly embedded with 19 U-shaped connectors 4 for conducting electricity; Between every 2 adjacent row LED chips, dispose the U-shaped connector described in; The openend of U-shaped connector stretches out the solder joint as LED chip from the bottom of lamp bowl; LED chip is welded between electrode and U-shaped connector or between 2 adjacent U-shaped connectors; Described electrode comprises described positive pole and negative pole; The recessed cavity place of lamp bowl is filled by glue layer 5.

Thickness, height and the width of described ceramic substrate are respectively 1.7mm, 33.22mm and 17.22mm.

In Fig. 1, adopting the outside of the integrated module LED light source of Flip-Chip Using to be also provided with the housing with installing hole, is common features, therefore do not repeat.

Claims (2)

1. an integrated module LED light source that adopts Flip-Chip Using, is characterized in that, is respectively equipped with positive pole (6) and negative pole (3) at the two ends up and down of ceramic substrate (1); Front one side of ceramic substrate is provided with the lamp bowl of depression; The bottom of lamp bowl is provided with the LED light emitting array of 20 row × 10 row that are made up of 200 LED chips (2);

In ceramic substrate, be equidistantly embedded with 19 U-shaped connectors (4) for conducting electricity; Between every 2 adjacent row LED chips, dispose the U-shaped connector described in; The openend of U-shaped connector stretches out the solder joint as LED chip from the bottom of lamp bowl; LED chip is welded between electrode and U-shaped connector or between 2 adjacent U-shaped connectors; Described electrode comprises described positive pole and negative pole; The recessed cavity place of lamp bowl is filled by glue layer (5).

2. the integrated module LED light source of employing Flip-Chip Using according to claim 1, is characterized in that, thickness, height and the width of described ceramic substrate are respectively 1.7mm, 33.22mm and 17.22mm.