CN103438409A - Aluminum heat radiating module of LED (Light Emitting Diode) - Google Patents
Aluminum heat radiating module of LED (Light Emitting Diode) Download PDFInfo
- Publication number
- CN103438409A CN103438409A CN2013103228871A CN201310322887A CN103438409A CN 103438409 A CN103438409 A CN 103438409A CN 2013103228871 A CN2013103228871 A CN 2013103228871A CN 201310322887 A CN201310322887 A CN 201310322887A CN 103438409 A CN103438409 A CN 103438409A
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- CN
- China
- Prior art keywords
- led
- led chip
- common pcb
- radiator
- aluminum heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
The invention provides an aluminum heat radiating module of an LED (Light Emitting Diode). The aluminum heat radiating module of the LED comprises an aluminum heat radiator, an LED chip and a common PCB (Printed circuit board), wherein circuit bonding pads which correspond to two electrodes of the LED chip are arranged on an electricity conducting layer of the common PCB; a heat conducting face is arranged on the aluminum heat radiator; a concave camber for the arrangement of the common PCB is arranged in a position near the heat conducting face; the common PCB board is arranged inside the concave camber of the heat radiator; the insulating face of the LED chip is adhered onto a corresponding part of the heat conducting face of the aluminum heat radiator by adopting bonding glue; the two electrodes of the LED chip and the two circuit bonding pads on the common PCB are correspondingly connected by electricity conducting wires. The aluminum heat radiating module of the LED provided by the invention is convenient to manufacture and has a good heat radiation effect.
Description
[technical field]
The invention belongs to the LED technical field, be specifically related to the aluminium radiating module of a kind of LED.
[background technology]
The LED industry division of labor: LED epitaxial wafer wafer generation-LED chip preparation-LED bead seal dress-LED lamp assembled.
It is high that LED has luminous efficiency, but, because the LED chip volume is very little, during work, can produce very high heat, must conduct with the thermal convection current mode heat of LED chip is derived efficiently and reached the junction temperature that reduces chip by heat.
The heat dissipation technology of LED chip adopts three kinds of methods at present: 1, LED chip is fixed on support and forms the LED pearl, the LED bead weld is connected on the PCB aluminium base, and the PCB aluminium base is fixed on radiator; 2, COB method, be arranged on the PCB aluminium base a plurality of LED chips are intensive, and the PCB aluminium base is fixed on radiator; 3, the direct nation of LED chip being fixed on to a circuit directly is made in the ceramic heat sink surface or circuit directly is made on the metal heat sink surface.Method 1 is owing to being provided with support, PCB aluminium base between LED chip and radiator, therefore, the heat radiation process has increased thermal resistance, and radiating effect is bad; Method 2 is owing to being provided with the PCB aluminium base between LED chip and radiator, and the intensive setting of LED chip, so radiating effect is also bad.Although method 3 has radiating effect preferably, the manufacturing process complexity, production efficiency is low, and cost is high.The in-problem basic reason of above method is: prior art, the conduction of LED chip, heat conduction functional requirement, is made of one structure and meets simultaneously.
Chinese utility model patent 201020189425.9 discloses a kind of LED ceramic heat sink, Chinese utility model patent 201210044889.4 discloses a kind of high power LED lamp that uses ceramic heat-dissipating, Chinese utility model patent 201120028108.3 discloses a kind of ceramic heat-dissipating body of the LED of raising radiating efficiency, it has all used ceramic material, the manufacturing process complexity, production efficiency is low, and cost is high.
Chinese invention patent 201210174071.4 discloses and a kind of LED chip has been encapsulated in to LED light fixture module and the method on heat radiation prop carrier circuit, because circuit comprises metallic circuit layer and the insulating barrier be bonded together, and sticking with glue agent is bonded in the insulation aspect of circuit above three-dimensional heat radiation support light fixture carrier, therefore, lead between radiator (i.e. the light fixture carrier is supported in three-dimensional heat radiation) and have equally insulating barrier and the adhesive that the thermal conductivity factor low thermal resistance is large at the LED chip heat, so heat-conducting effect is also very poor.
In view of this, the inventor, for the defect further investigation of prior art, has this case to produce then.
[summary of the invention]
Technical problem to be solved by this invention is to provide the aluminium radiating module of a kind of LED of easily manufactured, good heat dissipation effect.
The present invention solves the problems of the technologies described above by the following technical solutions:
The aluminium radiating module of a kind of LED, comprise aluminium radiator, LED chip, common pcb board;
The circuit pad of answering with two electrode pairs of LED chip is set on described common pcb board conductive layer;
One thermal conductive surface is set on described aluminium radiator, the concave surface of the described common pcb board of an arrangement is set in this thermal conductive surface adjacent position;
Described common pcb board is placed in the concave surface of described radiator; The insulating surfaces of described LED chip adopts bonded adhesives to be bonded on the correspondence position of thermal conductive surface of aluminium radiator; Adopt the corresponding connection of conductor wire between two electrodes of described LED chip and two circuit pads on described common pcb board.
The invention has the advantages that: the aluminium radiating module of a kind of LED of the present invention, because LED chip directly is bonded on the thermal conductive surface of radiator, the electrode of LED is directly connected on common pcb board, the heat conduction of LED chip, the separation of conduction have been realized, there is no support, PCB aluminium base, not be used on radiator and directly do circuit, on the one hand, thermal resistance between LED chip and radiator is very little, and radiating effect is fine, has improved the quality of product, on the other hand, simplify the complicated production flow process of prior art, improved production efficiency, reduced production cost; Because radiator can directly be made the housing of light fixture, LED chip can be separately positioned on according to the light distribution requirements of light fixture each position of lamp casing, can realize the progress of LED tool from the plane luminous intensity distribution to three-dimensional luminous intensity distribution on the one hand, there is no on the other hand the concentrated problem of COB heat, greatly improved the heat dissipation problem of LED chip.Because the material of aluminium radiator is the universal industrial material, simpler than processing technology with ceramic material, production efficiency is high, cost is low; Because the present invention merges the encapsulation of current specialization and light fixture, the division of labor of having broken current LED industry, improved product quality on the one hand, shortened on the other hand production life cycle, improved production efficiency.
[accompanying drawing explanation]
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is structural representation of the present invention.
[specific embodiment]
As shown in Figure 1, the aluminium radiating module of a kind of LED, comprise aluminium radiator 1, LED chip 2, common pcb board 3;
There is the circuit pad 31 corresponding with 2 two electrodes 21 of LED chip on common pcb board 3;
One thermal conductive surface 11 is set on aluminium radiator 1, the concave surface of the common pcb board 3 of an arrangement is set in these thermal conductive surface 11 adjacent positions; Common pcb board 3 is placed in the concave surface of aluminium radiator 1; The insulating surfaces of LED chip 2 adopts bonded adhesives 4 to be bonded on the correspondence position of thermal conductive surface 11 of aluminium radiator 1; Adopt between two electrodes 21 of LED chip 2 and two circuit pads 31 on common pcb board 3 that conductor wire 5 is corresponding to be connected.
The aluminium radiating module of a kind of LED of the present invention, because LED chip has directly been cancelled support, PCB aluminium base, LED chip is set directly on radiator, there is no the thermal resistance of support, PCB aluminium base, thermal resistance between LED chip and radiator is very little, and radiating effect is fine; Because radiator can directly be made the housing of light fixture, LED chip can not have the concentrated problem of COB heat according to the light distribution requirements scattering device of light fixture in each position of lamp casing, has greatly improved the heat dissipation problem of LED chip.Because the material of aluminium radiator is the universal industrial material, simpler than processing technology with ceramic material, production efficiency is high, cost is low; Because the present invention merges the encapsulation of current specialization and light fixture, the division of labor of having broken current LED industry, improved product quality on the one hand, shortened on the other hand production life cycle, improved production efficiency.
Claims (1)
1. the aluminium radiating module of a LED is characterized in that:
Comprise aluminium radiator, LED chip, common pcb board;
The circuit pad of answering with two electrode pairs of LED chip is set on described common pcb board conductive layer;
One thermal conductive surface is set on described aluminium radiator, the concave surface of the described common pcb board of an arrangement is set in this thermal conductive surface adjacent position;
Described common pcb board is placed in the concave surface of described radiator; The insulating surfaces of described LED chip adopts bonded adhesives to be bonded on the correspondence position of thermal conductive surface of aluminium radiator; Adopt the corresponding connection of conductor wire between two electrodes of described LED chip and two circuit pads on described common pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103228871A CN103438409A (en) | 2013-07-30 | 2013-07-30 | Aluminum heat radiating module of LED (Light Emitting Diode) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103228871A CN103438409A (en) | 2013-07-30 | 2013-07-30 | Aluminum heat radiating module of LED (Light Emitting Diode) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103438409A true CN103438409A (en) | 2013-12-11 |
Family
ID=49692109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103228871A Pending CN103438409A (en) | 2013-07-30 | 2013-07-30 | Aluminum heat radiating module of LED (Light Emitting Diode) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103438409A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108692261A (en) * | 2017-09-28 | 2018-10-23 | 常州星宇车灯股份有限公司 | A kind of mounting structure of car light LED chip |
| US10681801B2 (en) | 2016-10-14 | 2020-06-09 | Cpt Group Gmbh | Mounting assembly with a heatsink |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201265820Y (en) * | 2008-09-18 | 2009-07-01 | 苏州久腾光电科技有限公司 | LED light source module packaging structure |
| CN101500373A (en) * | 2008-01-29 | 2009-08-05 | 三星电子株式会社 | Printed circuit board, backlight unit and liquid crystal display device |
-
2013
- 2013-07-30 CN CN2013103228871A patent/CN103438409A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101500373A (en) * | 2008-01-29 | 2009-08-05 | 三星电子株式会社 | Printed circuit board, backlight unit and liquid crystal display device |
| CN201265820Y (en) * | 2008-09-18 | 2009-07-01 | 苏州久腾光电科技有限公司 | LED light source module packaging structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10681801B2 (en) | 2016-10-14 | 2020-06-09 | Cpt Group Gmbh | Mounting assembly with a heatsink |
| CN108692261A (en) * | 2017-09-28 | 2018-10-23 | 常州星宇车灯股份有限公司 | A kind of mounting structure of car light LED chip |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131211 |