CN203940252U - A kind of chip directly pastes the LED light source module of heat pipe - Google Patents
A kind of chip directly pastes the LED light source module of heat pipe Download PDFInfo
- Publication number
- CN203940252U CN203940252U CN201420038709.6U CN201420038709U CN203940252U CN 203940252 U CN203940252 U CN 203940252U CN 201420038709 U CN201420038709 U CN 201420038709U CN 203940252 U CN203940252 U CN 203940252U
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- groove
- flat part
- light source
- source module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses the LED light source module that a kind of chip directly pastes heat pipe, comprise heat pipe, LED chip array; Heat pipe is divided into cylindrical section and the reeded flat part of tool, and LED chip array is directly mounted on the installed surface of flat part bottom portion of groove.Circular heat pipe is heated and exerted pressure by punch, make one side pressure become the reeded flat part of two sides tool, then reflecting layer on its plated surface; In groove, lay electrode and catch, then by die bond material, LED chip array is solidified on the installed surface of bottom portion of groove; Then carry out wire bonding, and in groove, fill fluorescent colloid encapsulation.LED chip array is directly mounted on heat pipe surface, can reduce the thermal resistance of thermal source to external heat sink, is more conducive to the derivation of heat.Fluorescent colloid direct forming is in heat pipe flat part groove, and technique is simple, with low cost.
Description
Technical field
The utility model relates to LED light source module, relates in particular to a kind of chip and directly paste the LED light source module of heat pipe.
Background technology
LED(Light Emitting Diode), light emitting diode, is the luminous semi-conductor electricity sub-element of energy after a kind of energising.LED has energy-saving and environmental protection and long-life three advantages, with conventional incandescent comparison, can save 60%～90% electric energy, is acknowledged as green light source of future generation, just progressively replaces at present conventional light source, is penetrated in the middle of daily life.
At present, LED packaging is towards multi-chip integrated form encapsulation future development, but multi-chip package device module can produce more heats, causes that LED junction temperature rises, thereby causes LED luminous efficiency degradation, affects its working life.Heat pipe, as the efficient heat conducting element of one, is widely used in the heat radiation of electronic devices and components, by heat pipe, the heat of thermal objects is delivered to rapidly outside thermal source, and its capacity of heat transmission exceedes the capacity of heat transmission of any known metal.
Common heat-pipe radiator is that LED packaging is mounted on to metal base, and heat pipe is connected with metal base again, and heat is exported to external heat sink, dispels the heat.But this kind of method exists the heat transfer circuit path length of LED packaging to external heat sink, thermal resistance is large, has been difficult to meet the radiating requirements of high-power high integration LED light source module.
Summary of the invention
The purpose of this utility model is to overcome the shortcoming and defect of prior art, the LED light source module that provides a kind of chip directly to paste heat pipe, and its thermal contact resistance is little, heat transfer efficiency is high, reliability is high, process structure is simple.
The utility model is achieved through the following technical solutions:
Chip directly pastes a LED light source module for heat pipe, and it comprises heat pipe, LED chip array 3; Described heat pipe 1 is divided into cylindrical section and the reeded flat part of tool, and described LED chip array 3 is directly mounted on the installed surface of flat part bottom portion of groove.
The installed surface of described bottom portion of groove is plane; The two ends of described groove are also respectively arranged with electrode 2 and catch 4; Described electrode 2 is connected with LED chip array 3 by wire 6; Described LED chip array 3, electrode 2, catch 4 are encapsulated in groove by fluorescent colloid 8.
Between the cylindrical section of described heat pipe 1 and flat part, be connected by the mild transition of circular arc.
The inner surface of described groove is coated with silver-plated reflecting layer.
The inner copper ball 7 that adopts of described heat pipe 1 flat part is as supporting construction.
Described heat pipe 1 is built-in with metal dust liquid-sucking core.
Said chip is directly pasted the manufacture method of the LED light source module of heat pipe, comprises the following steps:
(1) prepared by heat pipe 1
Circular heat pipe is heated to 150 DEG C～250 DEG C, exerts pressure by punch 5, circular heat pipe one end is pressed into the reeded flat part of two sides tool, then reflecting layer on its plated surface;
(2) electrode 2, LED chip array 3 are laid
Lay respectively electrode 2 and catch 4 at groove two ends, then by die bond material, LED chip array 3 is solidified on the installed surface of bottom portion of groove;
(3) wire 6 connects and fluorescent colloid 8 is filled
LED chip array 3, by after being connected between wire 6 and electrode, is filled in fluorescent colloid 8 in groove, and LED chip array 3, electrode 2, block 4 are fixed to encapsulation.
The surface of described step (1) convex mould 5 has circular arc transition, and the transition that this circular arc transition is used to form between cylindrical section and the reeded flat part of tool of heat pipe 1 connects.
At the cylindrical section installation of heat radiator 9 of heat pipe 1, the mild transition position of circular arc between cylindrical section and flat part is installed reflector 10.
The utility model has the following advantages compared with prior art:
This chip directly pastes the LED light source module of heat pipe, and the heat pipe one end adopting is the reeded flat part of tool, and LED chip array is arranged on bottom portion of groove, is directly mounted on heat pipe surface, can reduce the thermal resistance of thermal source to external heat sink, is more conducive to the derivation of heat.
This chip directly pastes the LED light source module of heat pipe, can two-sided installation LED chip array, and integrated level is high, and rising angle is large.
Fluorescent colloid direct forming is in heat pipe surface, and technique is simple.
Brief description of the drawings
Fig. 1 is the utility model structural representation.
Fig. 2 is the structural representation before heat pipe flattens.
Fig. 3 is that heat pipe pressurizes after pressure by punch, the reeded flat part schematic diagram of tool of formation.
Fig. 4 is the utility model internal cross section structural representation.
Fig. 5 is the structural representation that the utility model is applied to light fixture.
Detailed description of the invention
Below in conjunction with specific embodiment, the utility model is more specifically described in detail.
Embodiment
As shown in Figures 1 to 5.The utility model chip directly pastes the LED light source module of heat pipe, and it comprises heat pipe 1, LED chip array 3; Described heat pipe 1 is divided into cylindrical section and the reeded flat part of tool, and described LED chip array 3 is directly mounted on the installed surface of flat part bottom portion of groove.
The installed surface of described bottom portion of groove is plane; The two ends of described groove are respectively arranged with electrode 2 and catch 4; Described electrode 2 is connected with LED chip array 3 by wire 6; Described LED chip array 3, electrode 2, catch 4 are encapsulated in groove by fluorescent colloid 8.
Between the cylindrical section of described heat pipe 1 and flat part, be connected by the mild transition of circular arc.
The inner surface of described groove is coated with silver-plated reflecting layer.
The inner copper ball 7 that adopts of described heat pipe 1 flat part is as supporting construction.
Described heat pipe 1 is built-in with metal dust liquid-sucking core.
Said chip is directly pasted the manufacture method of the LED light source module of heat pipe, comprises the following steps:
(1) prepared by heat pipe 1
Circular heat pipe is heated to 150 DEG C～250 DEG C, exerts pressure by punch 5, circular heat pipe one end is pressed into the reeded flat part of two sides tool, then reflecting layer on its plated surface;
(2) electrode 2, LED chip array 3 are laid
In groove, discharge electrode 2 and catch 4 are also pressed respectively in two ends, then by die bond material, LED chip array 3 are solidified on the installed surface of bottom portion of groove;
(3) wire 6 connects and fluorescent colloid 8 is filled
LED chip array 3, by after being connected between wire 6 and electrode, is filled in fluorescent colloid 8 in groove, and LED chip array 3, electrode 2, block 4 are fixed to encapsulation.
The surface of described step (1) convex mould 5 has circular arc transition, and the transition that this circular arc transition is used to form between cylindrical section and the reeded flat part of tool of heat pipe 1 connects.
At the cylindrical section installation of heat radiator 9 of heat pipe 1, the mild transition position of circular arc between cylindrical section and flat part is installed reflector 10.
The lighting application that as mentioned above, can realize chip and directly paste the LED light source module of heat pipe.
Embodiment of the present utility model is not restricted to the described embodiments; other are any does not deviate from change, the modification done under Spirit Essence of the present utility model and principle, substitute, combination, simplify; all should be equivalent substitute mode, within being included in protection domain of the present utility model.
Claims (5)
1. chip directly pastes a LED light source module for heat pipe, it is characterized in that: comprise heat pipe, LED chip array; Described heat pipe is divided into cylindrical section and the reeded flat part of tool, and described LED chip array is directly mounted on the installed surface of flat part bottom portion of groove; The installed surface of described bottom portion of groove is plane; The two ends of described groove are also respectively arranged with electrode and catch; Described electrode is connected with LED chip array by wire; Described LED chip array, electrode, catch are encapsulated in groove by fluorescent colloid.
2. chip according to claim 1 directly pastes the LED light source module of heat pipe, it is characterized in that: between the cylindrical section of described heat pipe and flat part, be connected by the mild transition of circular arc.
3. the LED light source module that directly pastes heat pipe according to the chip described in claim 1 or 2 any one, is characterized in that: the inner surface of described groove is coated with silver-plated reflecting layer.
4. chip according to claim 3 directly pastes the LED light source module of heat pipe, it is characterized in that: the inner copper ball that adopts of described heat pipe flat part is as supporting construction.
5. chip according to claim 4 directly pastes the LED light source module of heat pipe, it is characterized in that: described heat pipe is built-in with metal dust liquid-sucking core.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420038709.6U CN203940252U (en) | 2014-01-21 | 2014-01-21 | A kind of chip directly pastes the LED light source module of heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420038709.6U CN203940252U (en) | 2014-01-21 | 2014-01-21 | A kind of chip directly pastes the LED light source module of heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203940252U true CN203940252U (en) | 2014-11-12 |
Family
ID=51859566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420038709.6U Expired - Fee Related CN203940252U (en) | 2014-01-21 | 2014-01-21 | A kind of chip directly pastes the LED light source module of heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203940252U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103759152A (en) * | 2014-01-21 | 2014-04-30 | 华南理工大学 | LED light source module of chip direct-pasting heat pipe and manufacturing method of LED light source module |
-
2014
- 2014-01-21 CN CN201420038709.6U patent/CN203940252U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103759152A (en) * | 2014-01-21 | 2014-04-30 | 华南理工大学 | LED light source module of chip direct-pasting heat pipe and manufacturing method of LED light source module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201868429U (en) | Embedded-type encapsulating structure of luminous diode | |
| JP2011009682A (en) | Light emitting diode mounting structure having multiple spare solder pads for increasing wire-bonding yield, and method of manufacturing the same | |
| CN102064247A (en) | Packaging method and packaging structure for embedded light emitting diode | |
| CN105932019A (en) | Large power LED structure adopting COB packaging | |
| CN101984510A (en) | Flexibly connected light-emitting diode (LED) device based on liquid metal base | |
| CN203260639U (en) | High-luminous-efficiency and good-heat-dissipation COB light source | |
| CN103296184A (en) | Manufacturing method for light-emitting diode (LED) lamp strip using sapphire as chip support | |
| CN103824926A (en) | Method for producing multi-chip LED (light-emitting diode) package | |
| CN202839589U (en) | Soaking plate, LED chip packaging structure based on soaking plate and chip support thereof | |
| CN203940252U (en) | A kind of chip directly pastes the LED light source module of heat pipe | |
| CN204243034U (en) | A kind of LED module | |
| EP2484969A1 (en) | Led energy-saving lamp | |
| CN102856476A (en) | LED chip packaging structure on basis of vapor chamber and chip support of LED chip packaging structure | |
| CN203377261U (en) | Light emitting diode (LED) packaging support and LED packaging structure | |
| CN102364684A (en) | LED (Light-Emitting Diode) module and manufacturing process thereof | |
| CN105070813A (en) | Large-power LED support and packaging method thereof | |
| CN202120908U (en) | Single-lead light-emitting diode (LED) module | |
| CN202120909U (en) | LED module group | |
| CN204011481U (en) | The separated also high reflectance circuit board of integrated LED chip of electric heating | |
| CN203950803U (en) | Luminescent device | |
| CN203746850U (en) | High-efficiency LED module group device capable of omnibearing light emission | |
| CN210928141U (en) | High-efficient radiating circuit board | |
| CN203836739U (en) | Silicon-substrate LED road lamp light source module | |
| CN201655842U (en) | Surface mounted devices light-emitting diode encapsulating structure | |
| CN103759152A (en) | LED light source module of chip direct-pasting heat pipe and manufacturing method of LED light source module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141112 Termination date: 20170121 |