CN203859982U - High-transmission thin electromagnetic interference shielding film and printed circuit board having same - Google Patents
High-transmission thin electromagnetic interference shielding film and printed circuit board having same Download PDFInfo
- Publication number
- CN203859982U CN203859982U CN201420226460.1U CN201420226460U CN203859982U CN 203859982 U CN203859982 U CN 203859982U CN 201420226460 U CN201420226460 U CN 201420226460U CN 203859982 U CN203859982 U CN 203859982U
- Authority
- CN
- China
- Prior art keywords
- layer
- metal screen
- transmission
- screen layer
- shielding film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 64
- 239000002184 metal Substances 0.000 claims abstract description 64
- 230000003746 surface roughness Effects 0.000 claims abstract description 13
- 238000004026 adhesive bonding Methods 0.000 claims description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000005030 aluminium foil Substances 0.000 claims description 4
- 239000003963 antioxidant agent Substances 0.000 claims description 4
- 230000003078 antioxidant effect Effects 0.000 claims description 4
- 235000006708 antioxidants Nutrition 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 11
- 239000000126 substance Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000007731 hot pressing Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 abstract 7
- 239000012790 adhesive layer Substances 0.000 abstract 5
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 54
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000000047 product Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- -1 acryl Chemical group 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 208000019901 Anxiety disease Diseases 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 230000036506 anxiety Effects 0.000 description 1
- 230000010267 cellular communication Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001997 phenyl group Chemical class [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a high-transmission thin electromagnetic interference shielding film and application thereof. The high-transmission thin electromagnetic interference shielding film includes a metal shielding layer and an adhesive layer; the metal shielding layer is provided with two opposite surfaces which are respectively a first surface and a second surface; the adhesive layer is arranged at the second surface of the metal shielding layer; the second surface of the metal shielding layer is a rough surface of which the average surface roughness (Rz) is in a range of 0.5 to 12 microns; the thickness of the metal shielding layer is in a range of 1 to 35 microns; and the thickness of the adhesive layer is in a range of 1 to 16 microns. According to the high-transmission thin electromagnetic interference shielding film, the adhesive layer becomes thinner in hot pressing, and the metal shielding layer can pierce the adhesive layer by means of the surface roughness, so that the metal shielding layer and a grounding wire on a circuit board can form a conduction circuit, and therefore, the grounding impedance value of the circuit board can be decreased, and electromagnetic wave interference can be reduced. The high-transmission thin electromagnetic interference shielding film has the advantages of small transmission loss, high transmission quality, excellent shielding effect, high flexibility, favorable electrical properties, excellent chemical resistance, excellent softness, high shielding performance and the like.
Description
Technical field
The utility model relates to the emi shielding film that a kind of gluing layer covers without slimming, high-transmission, the height of conducting particles, particularly a kind of slim have excellent chemical resistance, electrical characteristic, for the high-transmission thin electromagnetic interference shielding film of the printed circuit board (PCB) of high flexible.
Background technology
Under electronics and the multi-functional complicated market demand of communication product trend, the structure dress of circuit substrate needs lighter, thin, short, little; And in function, need powerful and high speed signal transmission.Therefore, line density certainly will improve, distance to each other between support plate circuit is more and more nearer, and operating frequency is broadband towards height, if add configuration, the unreasonable lower electromagnetic interference that connects up (Electromagnetic Interference, EMI) situation is more and more serious, therefore must effectively manage electromagnetic compatibility (Electromagnetic Compatibility, EMC), thus maintain the normal signal transmission of electronic product and improve reliability.Frivolous and can be arbitrarily crooked characteristic, make soft board occupy very important status in the development of moving towards demand portable information and communication electronic industry.
Because telecommunications product is more attained little trend, order about soft board and must carry more strong large function, on the other hand because portable electronic product moves towards microminiature, also and then drive the high demand of high density soft board technology, in function, require under the situation of powerful and high frequency, high density, graph thinning, released in the market the screen for film-type flexible printed wiring board (FPC), in the small-sized electronic products such as mobile phone, numerical digit camera, digit camera, be widely adopted.
In view of this, urgently develop a kind of material of shield electromagnetic interference of novelty.
Utility model content
In order to address the above problem, the utility model provides a kind of high-transmission slimming emi shielding film and application thereof, this high-transmission slimming emi shielding film utilizes metal screen layer surface roughness to puncture gluing layer and printed circuit board ground cabling to carry out conducting and realize electro-magnetic screen function, have the advantages such as transmission loss is little, transmission quality is high, shielding is good, pliability is good, electrical characteristic is good, chemical resistance is good, flexibility is good, height covers.
The utility model for the technical scheme that solves its technical problem and adopt is:
The utility model provides a kind of high-transmission slimming emi shielding film, comprise metal screen layer and gluing layer, described metal screen layer has two relative surfaces and is respectively first surface and second surface, described gluing layer is positioned on the second surface of described metal screen layer, the second surface of described metal screen layer is that rough surface and average surface roughness (Rz) are 0.5-12 micron, the thickness of described metal screen layer is 1-35 micron, and the thickness of described gluing layer is 1-16 micron.
In a preferred embodiment of the present utility model, above-mentioned high-transmission slimming emi shielding film is also provided with the first release film, ink layer and the second release film, described ink layer is formed on the first surface of described metal screen layer, and described ink layer is folded between described the first release film and described metal screen layer, described gluing layer is folded between described metal screen layer and described the second release film, the structure that finally remaines in circuit board surface is by described ink layer, metal screen layer and gluing layer be superimposed formation successively, described ink layer, the gross thickness of metal screen layer and gluing layer is 5-50 micron, the thickness of described ink layer is 1-7 micron.
Say further, described metal screen layer is through anti-oxidant resistance to heat treated metal screen layer.
Say further, described metal screen layer is Copper Foil, aluminium foil, goldleaf or silver foil.
Say further, described the first release film and the second release film PET fluorine of respectively doing for oneself is moulded a kind of in the sub-light release film of release film, PET silicate-containing oil release film, PET and PE release film, and thickness is respectively done for oneself 25 to 100 microns.
The utility model also provides a kind of printed circuit board (PCB) with above-mentioned high-transmission slimming emi shielding film, described high-transmission slimming emi shielding film adheres to printed circuit board surface by described gluing layer, and the second surface of described metal screen layer utilizes its surface roughness to pierce through described gluing layer and contacts conducting with the ground connection cabling of printed circuit board (PCB).
The beneficial effects of the utility model are: the utility model high-transmission slimming emi shielding film is to be coated with ink layer on the first release film, hot pressing laminating metal screen layer on ink layer, on the second release film, be coated with gluing layer, again by metal screen layer and gluing layer to pressing, this high-transmission slimming emi shielding film has ultrathin type, flexibility is good, color masking, chemical resistance is good, electrical characteristic is good, pliability is good, transmission quality height and speed advantages of higher, be better than traditional PI diaphragm (the thin PI of thin glue), photosensitive type PI (or acryl system) diaphragm, non-photosensitive type PI diaphragm (photoresistance on need) and general screened film, be applicable to mobile phone, panel computers etc. have comprised a lot of antenna (bluetooths, Wi-Fi, cellular communication and GPS etc.) the application of handheld device, interference-free between making it in very little space mutually, thereby replace general barrier film material.
Accompanying drawing explanation
Fig. 1 is the structural representation of high-transmission slimming emi shielding film of the present utility model;
Fig. 2 is the structural representation of the high-transmission slimming emi shielding film of the utility model embodiment;
Fig. 3 is that the utility model metal screen layer utilizes its surface roughness to pierce through described gluing layer and forms turning circuit schematic diagram with the ground connection cabling of printed circuit board (PCB);
Fig. 4 is the printed circuit board arrangement schematic diagram with the utility model screened film.
Embodiment
By specific instantiation, embodiment of the present utility model is described below, those skilled in the art can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can other different mode be implemented, and, under the category not disclosing departing from the utility model, can give different modifications and change that is.
A kind of high-transmission slimming emi shielding film, as shown in Figure 1, comprise metal screen layer 1 and gluing layer 2, described metal screen layer 1 has two relative surfaces and is respectively first surface 11 and second surface 12, described gluing layer is positioned on the second surface of described metal screen layer, the second surface 12 of described metal screen layer is that rough surface and average surface roughness (Rz) are 0.5-12 micron, the thickness of described metal screen layer 1 is 1-35 micron, and the thickness of described gluing layer 2 is 1-16 micron.
Described gluing layer has low-k, low-dielectric loss because of sub-feature under the transmission of 1GHz～20GHz high-frequency signals.The dielectric constant of described gluing layer is 2.0-3.5.The dielectric loss factor of described gluing layer is 0.001-0.010.
Described metal screen layer is through anti-oxidant resistance to heat treated metal screen layer.Described metal screen layer is Copper Foil, aluminium foil, goldleaf or silver foil.
Embodiment: a kind of high-transmission slimming emi shielding film, as shown in Figure 2, comprise metal screen layer 1 and gluing layer 2, described metal screen layer has two relative surfaces and is respectively first surface 11 and second surface 12, described gluing layer is positioned on the second surface of described metal screen layer, the second surface 12 of described metal screen layer is that rough surface and average surface roughness (Rz) are 0.5-12 micron, the thickness of described metal screen layer 1 is 1-35 micron, the thickness of described gluing layer 2 is 1-16 micron, also be provided with the first release film 4, ink layer 3 and the second release film 5, described ink layer is formed on the first surface of described metal screen layer, and described ink layer is folded between described the first release film and described metal screen layer, described gluing layer is folded between described metal screen layer and described the second release film, the structure that finally remaines in circuit board surface is by described ink layer 3, metal screen layer 1 and gluing layer 2 be superimposed formation successively, described ink layer, the gross thickness of metal screen layer and gluing layer is 5-50 micron, the thickness of described ink layer is 1-7 micron.
Described gluing layer has low-k, low-dielectric loss because of sub-feature under the transmission of 1GHz～20GHz high-frequency signals.The dielectric constant of described gluing layer is 2.0-3.5.The dielectric loss factor of described gluing layer is 0.001-0.010.
Described metal screen layer is through anti-oxidant resistance to heat treated metal screen layer.Described metal screen layer is Copper Foil, aluminium foil, goldleaf or silver foil.
Described the first release film and the second release film PET fluorine of respectively doing for oneself is moulded a kind of in the sub-light release film of release film, PET silicate-containing oil release film, PET and PE release film, and thickness is respectively done for oneself 25 to 100 microns.
Described ink layer is the resin bed containing coloured female additive, and the resin material of described ink layer be epoxy resin, acrylic resin, amido formate be resin, silicon rubber be resin, poly-to ring diformazan benzene series resin, bismaleimides, be at least one in resin and polyimide resin, the look female additive of described ink layer comprises at least one in material with carbon element, titanium dioxide, pigment, dyestuff and toner.Pigment can comprise organic material and inorganic material prepared.Ink layer can be black, redness, the shades of colour such as orange, yellow, blue.
The manufacture method of above-mentioned high-transmission slimming emi shielding film is as follows:
Step 1: be coated with ink layer on described the first release film, by selecting the first release film of different surface roughness to make the reflective degree on ink layer surface different, reach different glossiness;
Step 2: the hot pressing described metal screen layer of fitting on described ink layer;
Step 3: get described the second release film, be coated with described gluing layer on described the second release film, the second release film is for keeping the stickiness of described gluing layer, is beneficial to follow-uply be bonding on circuit board or use is made in other pressing;
Step 4: the semi-finished product that step 2 and step 3 are made are pressed into described high-transmission slimming emi shielding film.
When above-mentioned high-transmission slimming emi shielding film is applied to flexible printed wiring board, first the second release film is removed, carry out again pressing, gluing layer 2 is because of the attenuation of hot pressing thickness, its surface roughness of utilizing the second surface 12 of described metal screen layer 1 pierces through described gluing layer 2, and then form turning circuit with the ground connection cabling 61 on flexible printed wiring board 6, via making resin reach complete crosslinking curing to maintain electrically good and mechanical properties under a period of time, flexible printed wiring board impedance ground value is lowered and reach the object that reduces Electromagnetic Interference, there is high-speed and high-efficiency transmission simultaneously, principle as shown in Figure 3.Be coated with the printed circuit board arrangement of the utility model high-transmission slimming emi shielding film as shown in Figure 4, described ink layer 3, metal screen layer 1 and gluing layer 2 in described high-transmission slimming emi shielding film are finally covered in flexible printed wiring board 6 surfaces, and the second surface of described metal screen layer 1 utilizes its surface roughness to pierce through described gluing layer 2 and contacts conducting with the ground connection cabling 61 of printed circuit board (PCB).
Following table is several embodiment of the present utility model and resistance value, peel strength and shielding test result:
The high-transmission slimming emi shielding film that the utility model is used has the characteristics such as flexibility is high, electrical characteristic good, chemical resistance is good, transmission loss is few, transmission quality is high, height covers, than the polyimides coverlay that insulating barrier was used in the past, have more ultra-flexible, there is the advantages such as manufacture method is simple, with low cost, compare general electromagnetic shielding film and there is higher transmission quality.And the utility model emi shielding film has better extinction effect, to meet client's various different demands.Use traditionally the black polyamide thin film that is added with carbon dust; though the polyimides diaphragm of this manufacture has good extinction effect; but high cost; during actual volume production, do not meet demand, and the polyimides diaphragm that contains additive also has the anxiety worry of the character variation such as tensile strength, dimensional stability.Therefore, the utility model can better be applied to the enterprise to signal transmission quality You Yao, circuit is had to the printed circuit board (PCB) of mask requirement.
Claims (6)
1. a high-transmission slimming emi shielding film, it is characterized in that: comprise metal screen layer and gluing layer, described metal screen layer has two relative surfaces and is respectively first surface and second surface, described gluing layer is positioned on the second surface of described metal screen layer, the second surface of described metal screen layer is that rough surface and average surface roughness are 0.5-12 micron, the thickness of described metal screen layer is 1-35 micron, and the thickness of described gluing layer is 1-16 micron.
2. high-transmission slimming emi shielding film as claimed in claim 1, it is characterized in that: be also provided with the first release film, ink layer and the second release film, described ink layer is formed on the first surface of described metal screen layer, and described ink layer is folded between described the first release film and described metal screen layer, described gluing layer is folded between described metal screen layer and described the second release film, the structure that finally remaines in circuit board surface is by described ink layer, metal screen layer and gluing layer be superimposed formation successively, described ink layer, the gross thickness of metal screen layer and gluing layer is 5-50 micron, the thickness of described ink layer is 1-7 micron.
3. high-transmission slimming emi shielding film as claimed in claim 1, is characterized in that: described metal screen layer is through anti-oxidant resistance to heat treated metal screen layer.
4. high-transmission slimming emi shielding film as claimed in claim 1, is characterized in that: described metal screen layer is Copper Foil, aluminium foil, goldleaf or silver foil.
5. high-transmission slimming emi shielding film as claimed in claim 2, it is characterized in that: described the first release film and the second release film PET fluorine of respectively doing for oneself is moulded a kind of in the sub-light release film of release film, PET silicate-containing oil release film, PET and PE release film, and thickness is respectively done for oneself 25 to 100 microns.
6. a printed circuit board (PCB) with the high-transmission slimming emi shielding film as described in any one in claim 1 to 5, it is characterized in that: described high-transmission slimming emi shielding film adheres to printed circuit board surface by described gluing layer, and the second surface of described metal screen layer utilizes its surface roughness to pierce through described gluing layer and contacts conducting with the ground connection cabling of printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420226460.1U CN203859982U (en) | 2014-05-06 | 2014-05-06 | High-transmission thin electromagnetic interference shielding film and printed circuit board having same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420226460.1U CN203859982U (en) | 2014-05-06 | 2014-05-06 | High-transmission thin electromagnetic interference shielding film and printed circuit board having same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203859982U true CN203859982U (en) | 2014-10-01 |
Family
ID=51609824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420226460.1U Expired - Lifetime CN203859982U (en) | 2014-05-06 | 2014-05-06 | High-transmission thin electromagnetic interference shielding film and printed circuit board having same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203859982U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104332217A (en) * | 2014-10-08 | 2015-02-04 | 广州方邦电子有限公司 | Free ground film and manufacturing method thereof, and shielding circuit board including free ground film and ground method thereof |
| CN107079611A (en) * | 2014-12-05 | 2017-08-18 | 拓自达电线株式会社 | Electromagnetic shielding film |
| WO2019174065A1 (en) * | 2018-03-14 | 2019-09-19 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and electromagnetic shielding film preparation method |
| CN110769666A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN113243145A (en) * | 2018-12-13 | 2021-08-10 | Lg伊诺特有限公司 | Printed circuit board |
-
2014
- 2014-05-06 CN CN201420226460.1U patent/CN203859982U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104332217A (en) * | 2014-10-08 | 2015-02-04 | 广州方邦电子有限公司 | Free ground film and manufacturing method thereof, and shielding circuit board including free ground film and ground method thereof |
| US10159141B2 (en) | 2014-10-08 | 2018-12-18 | Guangzhou Fang Bang Electronics Co., Ltd. | Free grounding film and manufacturing method therefor, and shielding circuit board including free grounding film and grounding method |
| CN107079611A (en) * | 2014-12-05 | 2017-08-18 | 拓自达电线株式会社 | Electromagnetic shielding film |
| WO2019174065A1 (en) * | 2018-03-14 | 2019-09-19 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and electromagnetic shielding film preparation method |
| US10881039B1 (en) | 2018-03-14 | 2020-12-29 | Guangzhou Fang Bang Electronic Co., Ltd. | Electromagnetic interference shielding film, circuit board, and preparation method for electromagnetic interference shielding film |
| CN110769666A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN113243145A (en) * | 2018-12-13 | 2021-08-10 | Lg伊诺特有限公司 | Printed circuit board |
| CN113243145B (en) * | 2018-12-13 | 2023-12-15 | Lg伊诺特有限公司 | Printed circuit board with improved heat dissipation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105101761A (en) | High-transmission thin electromagnetic interference shielding film, and manufacturing method and applications thereof | |
| CN204104291U (en) | Slimming high-transmission electromagnetic absorption screened film | |
| CN203859982U (en) | High-transmission thin electromagnetic interference shielding film and printed circuit board having same | |
| CN205864954U (en) | The emi shielding film of high-transmission height shield effectiveness | |
| CN206650912U (en) | High shielding EMI screened films | |
| CN101448362B (en) | Ultra-thin shielding film and circuit board capable of changing circuit impedance, and method for preparing same | |
| CN105101762B (en) | It is thinned high-transmission emi shielding film and its manufacturing method and application | |
| US9092096B2 (en) | Low-cost mass-produced touch sensors | |
| CN107660113A (en) | Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof | |
| CN107791641B (en) | High-shielding electromagnetic interference shielding film with double metal layers and preparation method thereof | |
| CN105578851A (en) | Thin-type high-transmission electromagnetic-absorbing screened film and manufacturing method thereof | |
| CN104332217A (en) | Free ground film and manufacturing method thereof, and shielding circuit board including free ground film and ground method thereof | |
| CN203859981U (en) | Thin high-transmission electromagnetic interference shielding film and printed circuit board having same | |
| JP2015133474A (en) | Electromagnetic shield film and method of manufacturing circuit board including shield film | |
| WO2018006440A1 (en) | Electromagnetic shielding protection film and fpc | |
| KR20070113770A (en) | Antenna structure composed with double-side circuit and magnetic member for rfid tag and manufacturing method thereof | |
| CN204596965U (en) | A kind of multi-functional NFC antenna | |
| CN203194086U (en) | Thin-type colorful electromagnetic interference shielding film | |
| CN103717050A (en) | Thin-type flexible thermally-cured electromagnetic shielding glue film | |
| CN104105386A (en) | Thin-type colorful electromagnetic interference shielding film and manufacturing method thereof | |
| CN108668425A (en) | Signal transmssion line ontology and preparation method thereof, USBTypeC connectors | |
| CN105407631A (en) | Flexible circuit board laminated structure and mobile terminal | |
| CN208095043U (en) | Electromagnetic shielding film and wiring board | |
| CN112437598B (en) | High-shielding electromagnetic interference shielding film of multi-aperture copper foil and preparation method thereof | |
| CN111642065A (en) | Novel multilayer structure high-shielding electromagnetic shielding film for flexible circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141001 |
|
| CX01 | Expiry of patent term |