CN203857313U - 一种高光效的led球泡灯 - Google Patents
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Abstract
本实用新型公开了一种高光效的LED球泡灯，包括多个LED灯丝、芯柱、LED驱动器、标准接口和灯罩；所述多个LED灯丝和芯柱由灯罩密封，且灯罩中填充散热材料；每个LED灯丝的两端均通过LED灯丝的两个灯丝电极与芯柱上的两个芯柱电极点焊连接，多个LED灯丝在球泡灯内部围绕芯柱排布；所述芯柱下部连接排气管；芯柱的下端电极通过电连接线与LED驱动器相连，LED驱动器通过引线与标准接口连接，标准接口与外部AC或DC电源相连通；本实用新型可以使LED灯丝在较低温度下工作发挥其高光效。
Description
技术领域
本实用新型涉及一种LED球泡灯，尤其涉及一种由灯丝直接组装的高光效LED球泡灯。
背景技术
半导体发光二极管(LED)照明被认为是21世纪最具发展前景的领域之一，随着各国禁用白炽灯法令的出台，LED在照明领域应用越来越广泛，其中在透明基板上进行封装的LED灯丝由于光效高且外观类似传统的钨丝灯备受终端客户喜爱。该灯丝主要是由于LED芯片的P-N结是4Л角度发光，采用支架或者陶瓷封装会由于向下的蓝光反射回来经过P-N结而损失一半，最终导致蓝光损失25％；采用透明基板可以将这一部分的蓝光利用起来，提高LED光源的光效，但是目前采用这种透明基板的灯丝基本不具有散热能力，组装的球泡灯由于温度过高而导致光效高的特点并不突出，尤其是采用该灯丝做成高光通量的球泡灯，所以灯丝球泡灯的散热是急需解决的问题。
发明内容
本实用新型的目的在于针对现有技术的不足，提供一种高光效的LED球泡灯。
本实用新型的目的是通过以下技术方案实现的：一种高光效的LED球泡灯，包括：多个LED灯丝、芯柱、LED驱动器、标准接口、灯罩；所述多个LED灯丝和芯柱由灯罩密封，且灯罩中填充散热材料；每个LED灯丝的两端均通过LED灯丝的两个灯丝电极与芯柱上的两个芯柱电极点焊连接，多个LED灯丝在球泡灯内部围绕芯柱排布；所述芯柱下部连接排气管；芯柱的芯柱电极通过电连接线与LED驱动器相连，LED驱动器通过引线与标准接口连接，标准接口与外部AC或DC电源相连通。
所述多个LED灯丝在球泡灯内部围绕芯柱排布具体为：LED灯丝围绕芯柱呈锥状线性排布、LED灯丝围绕芯柱呈线***叉排布、LED灯丝围绕芯柱呈正多边形排布或LED灯丝围绕芯柱呈M型排布。
所述LED灯丝包括：灯丝电极、透明基板、多个LED芯片、键合线和荧光胶，多个LED芯片固定在两端含有灯丝电极的透明基板上，LED芯片之间、LED芯片与灯丝电极之间通过键合线相连接，LED芯片、键合线和透明基板上包裹荧光胶。
所述LED灯丝包括：灯丝电极、透明基板、多个LED芯片、线路和荧光胶，多个LED芯片固定在具有线路的透明基板上，通过LED芯片将透明基板上的线路与透明基板两端的灯丝电极连接起来，LED芯片和透明基板上包裹荧光胶。
所述LED灯丝包括：灯丝电极、导电基板、多个LED芯片、键合线，多个LED芯片固定在具有微孔的导电基板上，导电基板的一端作为一个灯丝电极，导电基板的另一端通过粘结材料与另一个灯丝电极相连，LED芯片之间、LED芯片与灯丝电极之间通过键合线连接起来，LED芯片、键合线、微孔、粘结材料和导电基板上包裹荧光胶。
本实用新型的有益效果是，使高光效LED灯丝在较低温度下工作发挥其高光效的优点。
附图说明
图1(a)～(d)是本实用新型球泡灯不同实施案例的结构示意图；
图2(a)～(e)是本实用新型球泡灯芯柱不同实施案例的结构示意图；
图3(a)～(e)是本实用新型球泡灯LED灯丝不同实施案例的截面图；
图中，LED灯丝1、灯丝电极2、芯柱3、芯柱电极4、排气管5、电连接线6、LED驱动器7、引线8、标准接口9、灯罩10、散热材料11；绝缘层3-1、第一夹层3-2、第二夹层3-3、第一镀层3-4、第三夹层3-5、第二镀层3-6；透明基板12、导电基板17、LED芯片13、键合线14、荧光胶15、线路16、微孔18、粘结材料19。
具体实施方式
以下参照附图，对本实用新型做作进一步详细说明。
如图1所示，本实用新型一种高光效的LED球泡灯，包括：多个LED灯丝1、芯柱3、LED驱动器7、标准接口9、灯罩10；所述多个LED灯丝1和芯柱3由灯罩10密封，且灯罩10中填充散热材料11；每个LED灯丝1的两端均通过LED灯丝1的两个灯丝电极2与芯柱3上的两个芯柱电极4点焊连接，多个LED灯丝1在球泡灯内部围绕芯柱3呈不同形状排布；所述芯柱3下部连接排气管5；芯柱3的芯柱电极4通过电连接线6与LED驱动器7相连，LED驱动器7通过引线8与标准接口9连接，标准接口9与外部AC或DC电源相连通；
图1(a)是球泡灯的第一实施案例，其中LED灯丝1呈锥状线性排布；
图1(b)是球泡灯的第二实施案例，其中LED灯丝1呈线***叉排布；
图1(c)是球泡灯的第三实施案例，其中LED灯丝1呈正多边形排布；
图1(d)是球泡灯的第四实施案例，其中LED灯丝1呈M型排布；
如图2所示：
图2(a)是芯柱3的第一实施案例：芯柱3是由绝缘层3-1包裹第一夹层3-2(具有高反射率的金属如银、铝或钛)构成；
图2(b)是芯柱3的第二实施案例：芯柱3是由绝缘层3-1包裹第一夹层3-2(具有高反射率的金属如银、铝或钛)构成，而第一夹层3-2内部含有第二夹层3-3(热相变材料如石蜡或金属盐)；
图2(c)是芯柱3的第三实施案例：芯柱3是由绝缘层3-1包裹第三夹层3-5(铜或其合金材料)构成，而第三夹层3-5表面镀有第一镀层3-4(反射材料材料为银、铝、钛或铂)；
图2(d)是芯柱3的第四实施案例：芯柱3是由绝缘层3-1包裹第三夹层3-5(铜或其合金材料)构成，而第三夹层3-5内部含有第二夹层3-3(热相变材料如石蜡或金属盐)、表面镀有第一镀层3-4(反射材料材料为银、铝、钛或铂)；
图2(e)是芯柱3的第五实施案例：芯柱3是由第三夹层3-5(铜或其合金材料)和镀在第三夹层3-5表面的第二镀层3-6(反射材料材料为氧化铝、二氧化硅、二氧化钛)构成。
如图3所示：
图3(a)是LED灯丝1的第一实施案例，LED灯丝1包括灯丝电极2、透明基板12、多个LED芯片13、键合线14和荧光胶15，LED芯片13(主要是针对正装芯片)通过固晶材料(如硅胶、环氧树脂、Hybrid、PMMA、PU)固定在两端含有灯丝电极2的透明基板12(如透明玻璃、透明陶瓷、钇铝石榴石、蓝宝石、透明耐热PC/PS/PMMA)上，接着通过键合线将LED芯片13、以及芯片13与电极2连接起来，再通过荧光胶15将LED芯片13、键合线14以及基板12包裹起来形成360度出光的LED灯丝1。
图3(b)是LED灯丝1的第二实施案例，LED灯丝1包括灯丝电极2、透明基板12、多个LED芯片13、线路16、荧光胶15，LED芯片13(主要是正对倒装芯片)通过固晶材料(如金、金锡合金、锡膏)固定在具有线路16的透明基板12(如透明玻璃、透明陶瓷、钇铝石榴石、蓝宝石、透明耐热PC/PS/PMMA)上，通过LED芯片13将基板12上的线路16与基板两端的灯丝电极2连接起来；再通过荧光胶15将LED芯片13和基板12包裹起来形成360度出光的LED灯丝1。
图3(c)～(e)是LED灯丝1的第三实施案例，图3(c)是LED灯丝1的透视图，图3(d)是LED灯丝1的半成品图，图3(e)是LED灯丝1的成品外观图。
LED灯丝1包括灯丝电极2、导电基板17、多个LED芯片13、键合线14，多个LED芯片13通过固晶材料(如硅胶、环氧树脂、Hybrid、PMMA、PU)固定在具有微孔18(空气组成的微小空洞，尺寸10nm～100um)的导电基板17(如铜、银、铁或其合金材料)上，导电基板17的一端作为一个灯丝电极2，导电基板17的另一端通过粘结材料19(高分子材料如PPA、PCT、EMC、SMC、LCP)与另一个灯丝电极2相连，LED芯片13之间、LED芯片13与灯丝电极2之间通过键合线14连接起来，然后通过Molding的方式由荧光胶15将LED芯片13、键合线14、微孔18、粘结材料19、导电基板17包裹起来，只留出灯丝电极2，如图3(e)所示。
本实用新型不限于以上实施方式，在本实用新型的精神和权利要求的保护范围内，对本实用新型作出的任何修改和改变，均应认为是本实用新型的保护范围。
Claims (5)
1.一种高光效的LED球泡灯，其特征在于，包括：多个LED灯丝(1)、芯柱(3)、LED驱动器(7)、标准接口(9)、灯罩(10)；所述多个LED灯丝(1)和芯柱(3)由灯罩(10)密封，且灯罩(10)中填充散热材料(11)；每个LED灯丝(1)的两端均通过LED灯丝(1)的两个灯丝电极(2)与芯柱(3)上的两个芯柱电极(4)点焊连接，多个LED灯丝(1)在球泡灯内部围绕芯柱(3)排布；所述芯柱(3)下部连接排气管(5)；芯柱(3)的芯柱电极(4)通过电连接线(6)与LED驱动器(7)相连，LED驱动器(7)通过引线(8)与标准接口(9)连接，标准接口(9)与外部AC或DC电源相连通。
2.根据权利要求1所述高光效的LED球泡灯，其特征在于，所述多个LED灯丝(1)在球泡灯内部围绕芯柱(3)排布具体为：LED灯丝(1)围绕芯柱(3)呈锥状线性排布、LED灯丝(1)围绕芯柱(3)呈线***叉排布、LED灯丝(1)围绕芯柱(3)呈正多边形排布或LED灯丝(1)围绕芯柱(3)呈M型排布。
3.根据权利要求1所述高光效的LED球泡灯，其特征在于，所述LED灯丝(1)包括：灯丝电极(2)、透明基板(12)、多个LED芯片(13)、键合线(14)和荧光胶(15)，多个LED芯片(13)固定在两端含有灯丝电极(2)的透明基板(12)上，LED芯片(13)之间、LED芯片(13)与灯丝电极(2)之间通过键合线(14)相连接，LED芯片(13)、键合线(14)和透明基板(12)上包裹荧光胶(15)。
4.根据权利要求1所述高光效的LED球泡灯，其特征在于，所述LED灯丝(1)包括：灯丝电极(2)、透明基板(12)、多个LED芯片(13)、线路(16)和荧光胶(15)，多个LED芯片(13)固定在具有线路(16)的透明基板(12)上，通过LED芯片(13)将透明基板(12)上的线路(16)与透明基板(12)两端的灯丝电极(2)连接起来，LED芯片(13)和透明基板(12)上包裹荧光胶(15)。
5.根据权利要求1所述高光效的LED球泡灯，其特征在于，所述LED灯丝(1)包括：灯丝电极(2)、导电基板(17)、多个LED芯片(13)、键合线(14)，多个LED芯片(13)固定在具有微孔(18)的导电基板(17)上，导电基板(17)的一端作为一个灯丝电极(2)，导电基板(17)的另一端通过粘结材料(19)与另一个灯丝电极(2)相连，LED芯片(13)之间、LED芯片(13)与灯丝电极(2)之间通过键合线(14)连接起来，LED芯片(13)、键合线(14)、微孔(18)、粘结材料(19)和导电基板(17)上包裹荧光胶(15)。
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Cited By (32)
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