CN203849707U - Touch panel - Google Patents
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- CN203849707U CN203849707U CN201420276750.7U CN201420276750U CN203849707U CN 203849707 U CN203849707 U CN 203849707U CN 201420276750 U CN201420276750 U CN 201420276750U CN 203849707 U CN203849707 U CN 203849707U
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Abstract
The utility model discloses a touch panel which comprises a base material and a conductive grid pattern which is located on the base material. The conductive grid pattern has conductivity and is provided with a circuit region. The circuit region is provided with a plurality of wires. The wires are staggered in the first direction and the second direction to form a plurality of staggered portions. Each staggered portion is provided with a protruding portion extending from the staggered portion, and each staggered portion and the corresponding protruding portion form a conductive connecting region. According to the touch panel, the conductive grid pattern with conductivity is arranged on the base material, the wires in the circuit region of the conductive grid pattern are staggered with one another in the first direction and the second direction to form the staggered portions, each staggered portion is provided with the corresponding protruding portion extending from the staggered portion, each staggered portion and the corresponding protruding portion form the corresponding conductive connecting region, and therefore the aims of reducing attenuation produced during signal transmission and then accurately and rapidly responding to the touch input position are achieved.
Description
Technical field
The utility model is about a kind of contact panel.
Background technology
All types of touch-control input technologies have been widely used in electronic product, for example mobile phone and panel computer adopt contact panel as suitable general of input interface, this kind of input interface provides user a kind of intuitive operation, that is, instruction is assigned on the surface that user can directly contact input panel by finger or writing pencil, or on the surface of contact panel, vacillates to choose or operate object or the input of carrying out handwriting.
Existing contact panel comprises at least one base material and formed conductive pattern, line layer, insulation course and flexible printed wiring board pattern etc. on base material.One, the material of conductive pattern is to use the tin indium oxide (Indium tin oxide, ITO) of electrically conducting transparent.Yet when the size of contact panel is increasing, the area of the tin indium oxide of laying on base material also will be larger, now, the resistance of the surface resistance of the conductive pattern that tin indium oxide forms will improve significantly, and when signal is transmitted on conductive pattern, form decay largely.So, cannot be precisely and reflect rapidly the position of touch-control input by the signal processor that causes rear end, and the correctness that causes follow-up signal to process and use.
Therefore someone proposes to replace with the design of metal grill (Metal Mesh) contact panel of the existing ITO of utilization material gradually at present, by the conductive characteristic of metal material own, can reduce the problem of signal attenuation of existing ITO when large area designs, metal material has better flexural property compared to ITO simultaneously, therefore can utilize on deflection formula contact panel.Yet, due to the light tight characteristic of metal material, tend to cause aperture opening ratio to decline, therefore for fear of reducing aperture opening ratio, so the circuit of metal grill is also done thinner and thinner.But existing with chemical wet etching metal level to manufacture in the process of metal grill pattern, metal grill often can be because etching excessively have the problem of broken string in circuit confluce.
Therefore, how to provide a kind of metal grill contact panel, can reduce the decay producing when signal transmits, thereby more accurately and promptly react the position of touch-control input, do not have again broken string problem, become one of important topic.
Utility model content
Because above-mentioned problem, the purpose of this utility model can reduce for providing a kind of the decay producing when signal transmits, thereby more accurately and promptly reacts the contact panel of the position of touch-control input.
For reaching above-mentioned purpose, according to a kind of contact panel of the present utility model, comprise a base material and a conductive grid pattern.Conductive grid pattern is positioned on base material, and conductive grid pattern tool electric conductivity also comprises a line areas.Line areas has a plurality of wires.Those wires are crisscross arranged to form a plurality of staggered portions along a first direction and a second direction.Each staggered portion has the protuberance extending from staggered portion one side, and staggered portion and protuberance formation one conduction bonding pad.Wherein, in unidirectional section, respectively the line width of this conduction bonding pad is greater than the respectively line width of this wire, and the normal vector of this section is parallel to respectively this wire bearing of trend.
Further, in unidirectional section, 2.5 to 6 times of the line width that the line width of bonding pad of conducting electricity described in each is wire described in each.
Further, described conduction bonding pad has a lower surface near described base material, a upper surface corresponding with described lower surface, and the side surface being connected with described lower surface with described upper surface, described upper surface has one first roughness and described side surface has one second roughness, described the first roughness is greater than described the second roughness, described the first roughness intercepts the interior peak of unit length of described upper surface and the difference in height of minimum point, and described the second roughness intercepts the interior peak of unit length of described side surface and the difference in height of minimum point.
Further, described the first roughness is to be less than or equal to 500 nanometers.
Further, more comprise an anti-reflecting layer, and described anti-reflecting layer is to be positioned on described conductive grid pattern.
Further, described conduction bonding pad has near a lower surface of described base material and the upper surface being oppositely arranged with described lower surface, in described section, the live width of described upper surface is one first live width, the live width of described lower surface is one second live width, and described conduction bonding pad also has one the 3rd live width between described upper surface and described lower surface in described section, and described the 3rd live width is to be less than described the first live width and described the second live width.
Further, described the 3rd live width is to be less than the first live width and described the second live width more than 0.1 micron.
For reaching above-mentioned purpose, according to a kind of contact panel of the present utility model, comprise a base material and a conductive grid pattern.Conductive grid pattern is positioned on base material, and conductive grid pattern tool electric conductivity also comprises a line areas.Line areas has a plurality of wires.Those wires are crisscross arranged to form a plurality of staggered portions along a first direction and a second direction.Each staggered portion has the protuberance extending from staggered portion, and staggered portion and protuberance formation one conduction bonding pad.Conduction bonding pad has a lower surface, and the upper surface that is oppositely arranged of lower surface of close base material, and the side surface being connected with lower surface with upper surface.The upper surface of a section of bonding pad of wherein conducting electricity has one first roughness, one side surface of the section of conduction bonding pad has one second roughness, and the first roughness is greater than the second roughness, the normal vector of section is to be parallel to first direction or second direction, the difference in height of peak and minimum point in the unit length of the first roughness intercepting upper surface, the difference in height of peak and minimum point in the unit length of the second roughness intercepting side surface.
Further, described the first roughness is to be less than or equal to 500 nanometers.
Further, in unidirectional section, the line width of bonding pad of conducting electricity described in each is greater than the line width of described wire, and the normal vector of described section is parallel to wire bearing of trend described in each.
Further, in unidirectional section, the line width of described conduction bonding pad is 2.5 to 6 times of line width of wire described in each.
Further, more comprise an anti-reflecting layer, described anti-reflecting layer is to be positioned on described conductive grid pattern.
Further, described conduction bonding pad is in a section, the live width of described upper surface is one first live width, the live width of described lower surface is one second live width, and described conduction bonding pad also has one the 3rd live width between described upper surface and described lower surface, and described the 3rd live width is to be less than described the first live width and described the second live width.
For reaching above-mentioned purpose, according to a kind of contact panel of the present utility model, comprise a base material and a conductive grid pattern.Conductive grid pattern is positioned on base material, and conductive grid pattern tool electric conductivity also comprises a line areas.Line areas has a plurality of wires.Those wires are crisscross arranged to form a plurality of staggered portions along a first direction and a second direction.Each staggered portion has the protuberance extending from staggered portion, and staggered portion and protuberance formation one conduction bonding pad.The section of bonding pad of wherein conducting electricity has a lower surface engaging with base material and the upper surface being oppositely arranged with lower surface, the section live width of upper surface is one first live width, the section live width of lower surface is one second live width, and conduction bonding pad also has one the 3rd live width between upper surface and lower surface in section, and the 3rd live width is to be less than the first live width and the second live width, and the normal vector of section is to be parallel to first direction or second direction.
Further, described the 3rd live width is to be less than the first live width and described the second live width more than 0.1 micron.
Further, in same section direction, the line width of bonding pad of conducting electricity described in each is greater than the line width of described wire, and the normal vector of described section is parallel to wire bearing of trend described in each.
Further, in same section direction, the line width of described conduction bonding pad is 2.5 to 6 times of line width of wire described in each.
Further, described upper surface has one first roughness, described side surface has one second roughness, described the first roughness is greater than described the second roughness, described the first roughness intercepts the interior peak of unit length of described upper surface and the difference in height of minimum point, and described the second roughness intercepts the interior peak of unit length of described side surface and the difference in height of minimum point.
Further, more comprise an anti-reflecting layer, described anti-reflecting layer is to be positioned on described conductive grid pattern.
From the above, because of foundation a kind of contact panel of the present utility model, its be by by the conductive grid pattern setting with electric conductivity on base material, and the wire of the line areas of conductive grid pattern is interlaced and form staggered portion along first direction and second direction, and each staggered portion has the protuberance extending from staggered portion, and make staggered portion and protuberance form a conduction bonding pad, thereby reach, can reduce the decay producing when signal transmits, thereby more accurately and promptly react the object of the position of touch-control input.
Accompanying drawing explanation
Figure 1A and Figure 1B are the schematic diagram of a kind of contact panel of the utility model preferred embodiment.
The cross sectional view of Fig. 2 A for forming along the face line A-A ' shown in Figure 1B.
The cross sectional view of Fig. 2 B for forming along the face line B-B ' shown in Figure 1B.
Fig. 3 A to Fig. 3 H is the schematic diagram according to the multiple variation aspect of the conduction bonding pad of the utility model preferred embodiment.
Fig. 4 is the schematic diagram according to the contact panel of the another kind of preferred embodiment of the utility model.
Fig. 5 is the schematic diagram according to the contact panel of another preferred embodiment of the utility model.
Fig. 6 is the schematic diagram according to the contact panel of the utility model preferred embodiment.
Drawing reference numeral explanation:
1,2,3,4: contact panel
11: base material
12,41: conductive grid pattern
121: line areas
122: the first wires
123: the second wires
124: staggered portion
125: protuberance
126: conduction bonding pad
21,31: anti-reflecting layer
42: carry electrode
43: sensing electrode
44: transmission line
45: ground-electrode
5: control module
A-A ', B-B ': face line
D1: first direction
D2: second direction
R1: the first roughness
R2: the second roughness
S1: upper surface
S2: side surface
S3: lower surface
W11, W21: the first live width
W22: the second live width
W23: the 3rd live width
Wa: line width
Embodiment
Hereinafter with reference to correlative type, the contact panel according to the utility model preferred embodiment is described, wherein identical element is illustrated the reference marks with identical.
First, please refer to shown in Figure 1A and Figure 1B, it is a kind of contact panel 1 of the utility model preferred embodiment.Contact panel 1 comprises base material 11 and conductive grid pattern 12.In the present embodiment, base material 11 is a transparent base, for example glass baseplate or transparent membranaceous base material, preferably can select material is pi (Polyimide, PI) or polyethylene terephthalate (Polyethylene terephthalate, PET) membranaceous base material, and have the characteristic of transparent, frivolous and deflection concurrently simultaneously.
Conductive grid pattern 12 is positioned on base material 11, and conductive grid pattern 12 has electric conductivity.In the present embodiment, the material of conductive grid pattern 12 is metal, for example, be copper, and it is by sputter, evaporation and form a bronze medal film on the surface of base material 11, then, then by being coated with the flow process of photoresist, exposure, development and etching form conductive grid pattern 12.Need special instruction, in other enforcement aspect, the material of conductive grid pattern 12 also can be selected other metal or Graphene, and is formed at base material 11 by other technique.In the present embodiment, conductive grid pattern 12 is for simple layer metal is through the formed simple layer conductive pattern of chemical wet etching structure, and its thickness is between 0.01 to 20 micron, wherein, considering demand and the design of actual product, and under the difference of the technology mode adopting, the thickness of conductive grid pattern 12 is preferably between 0.1 to 10 micron or 0.2 to 10 micron.
Conductive grid pattern 12 comprises a line areas 121, and it has a plurality of the first wires 122 and a plurality of the second wires 123.Each first wire 122 is for each other side by side and be arranged at the surface of base material 11 along a first direction D1, and wherein each first wire 122 extends along a second direction D2 direction.Each other side by side and along second direction D2, be arranged at the surface of base material 11, wherein each second wire 123 extends along first direction D1 direction for each second wire 123.On the implementation, each first wire 122 can be to extend and arrange along Y direction, and each second wire 123 is to extend and arrange with X-direction.Certainly, in other enforcement aspect, also can adopt each first wire 122 is to extend with X-direction, and the mode that each second wire 123 extends with Y direction is implemented, or respectively first wire 122 is with the direction extension setting at 45 ° with X-axis shape, and each second wire 123 is to form the direction extension setting of 135 ° with X-axis.The first wire 122 and the second wire 123 are interlaced and form a plurality of staggered portions 124, and each staggered portion 124 1 sides are extended a protuberance 125.Wherein, staggered portion 124 forms a conduction bonding pad 126 with its protuberance extending 125.
Then, please refer to Fig. 2 A, its cross sectional view for forming along the face line A-A ' shown in Figure 1B.In the present embodiment, the section forming along face line A-A ' is the first section, and the section line width of the upper surface S1 of the first section of conduction bonding pad 126 is one first live width W11, and the first live width W11 is in fact the line width Wa that is greater than the first section of the first wire 122, particularly, the line width of the first section of conduction bonding pad 126 is 2.5 to 6 times of line width of the first section of the first wire 122.Wherein, face line A-A ' is parallel in fact second direction D2, and in other words, the normal vector of the first section is to be parallel in fact first direction D1.In addition, please refer to Fig. 2 B, its cross sectional view for forming along the face line B-B ' shown in Figure 1B.In the present embodiment, the section forming along face line B-B ' is the second section, and the line width of the second section of conduction bonding pad 126 is the line widths that are greater than the second section of the second wire 123, particularly, the line width of the second section of conduction bonding pad 126 is 2.5 to 6 times of line width of the first section of the second wire 123.Wherein, face line B-B ' is parallel in fact first direction D1, and in other words, the normal vector of the first section is to be parallel in fact second direction D2.Comprehensive foregoing, in unidirectional section, each line width that conducts electricity bonding pad is greater than the line width of each wire, and the normal vector of section is parallel in fact each wire bearing of trend.
In addition, in different enforcement aspects, the width of the first section of conduction bonding pad 126 can be 2.5 to 5 times of width of first section of each first wire 122, or the width of the second section of conduction bonding pad 126 is 2.5 to 5 times of width of the second section of each the second wire 123, or the width of the first section of conduction bonding pad 126 be 3 to 4 times of width of the first section of each the first wire 122, or to conduct electricity the width of the second section of bonding pad 126 be 3 to 4 times of width of the second section of each the second wire 123.
In the present embodiment, by the first wire 122, the second wire 123 and staggered portion 124, form with the structure that its protuberance extending 125 forms conduction bonding pad 126, the conductive grid pattern 12 being become by conductive material not only can reduce whole impedance effectively, and can reduce the decay producing when signal transmits, simultaneously, also can effectively replace tin indium oxide, and the cost of reduce manufacturing, and overcome tin indium oxide and do not there is flexual shortcoming.Meanwhile, can avoid producing staggered portion 124 etchings excessively in the process of manufacturing and the problem of broken string also can provide the signal of the higher current value of the first wire 122 and the second wire 123 transmission, and have the effect of improving impedance matching concurrently.
Need special instruction, as shown in Figure 1A and Figure 1B, in this be the portion's of interlocking extended protuberance 125 of 124 1 side be to be example around staggered portion 124, yet, be not as limit.Please refer to Fig. 3 A to Fig. 3 H, so that the multiple different aspects of implementing of conduction bonding pad 126 to be described.As shown in Figure 3A, protuberance 125 is to form around staggered portion 124 the conduction bonding pad 126 that outward appearance presents rhombus or rectangle, and as shown in Figure 3 B, protuberance 125 is to have an arc limit, and be adjacent to staggered portion 124 and form outward appearance and present circular or oval-shaped conduction bonding pad 126, as shown in Figure 3 C, protuberance 125 is the arc limits with indent, again as shown in Figure 3 D, protuberance 125 is surrounded on staggered portion 124 and forms outward appearance and present polygonal conduction bonding pad 126.Please please refer to Fig. 3 E to Fig. 3 H, the protuberance 125 of conduction bonding pad 126, with respect to the position of staggered portion 124, also can have multiple different variation again.
In addition, formed conductive grid pattern 12 on same contact panel, a plurality of conductions bonding pad 126 that it has can be according to the layout of integrated circuit, the mode of the demand of actual product or the technique used, and make above-mentioned a plurality of conductions bonding pad 126 there is different enforcement aspects, be for example, the partially conductive bonding pad 126 of conductive grid pattern 12 is as shown in Fig. 3 E or Fig. 3 F, and remaining conduction bonding pad 126 is as shown in Fig. 3 C or Fig. 3 D.
Then, referring again to the cross sectional view shown in Fig. 2 A.In the present embodiment, a upper surface S1 who there is a lower surface S3 near this base material 11 in the first section of forming along face line A-A ' of conduction bonding pad 126, is oppositely arranged with lower surface S3, and a side surface S2 who is connected with lower surface S3 with upper surface S1.Wherein upper surface S1 has one first roughness R1, and a side surface S2 of the first section has one second roughness R2, and the first roughness R1 is greater than the second roughness R2.Wherein, the upper surface S1 of conduction bonding pad 126 has rule or the irregular uneven structure of indent or projection, and aforesaid the first roughness R1 is formed at the peak of uneven structure of upper surface S1 to the distance between minimum point (difference in height) in unit length.In the present embodiment, the side surface S2 of conduction bonding pad 126 is the curved surface of an indent, and the second roughness R2 be not the peak of this curved surface to the distance (difference in height) of minimum point, but be formed at the rule of indent in side surface S2 unit length or projection or the peak of irregular uneven structure to the distance between minimum point (difference in height).
In the present embodiment, being is the first roughness R1 of upper surface S1 and the second roughness R2 of side surface S2 that conduction bonding pad 126 was observed and measured to the focusing ion microscope (Focus ion beam, FIB) of 5000 to 50000 times by having multiplying power.The result of observing under this condition is, the first roughness R1 is less than or equal to 500 nanometers, and the second roughness R2 is less than or equal to 100 nanometers.In addition,, in other enforcement aspect, also observe the first roughness R1 and be less than or equal to 300 nanometers, or the first roughness R1 is less than or equal to 200 nanometers.In addition, cross sectional view as shown in Figure 2 B, the first roughness R1 of the upper surface S1 of the second section of forming along face line B-B ' of conduction bonding pad 126 is also greater than the second roughness R2 of a side surface S2 of the second section, and the first roughness R1 of the upper surface S1 of the second section has the technical characterictic identical with the first roughness of the upper surface S1 of the first section.Thereby repeat no more in this.
It is worth mentioning that; in the present embodiment; due to the upper surface S1 of a conduction bonding pad 126 complete smooth surface not; thereby be not only conducive in subsequent technique; promote anti-reflecting layer (for example: blackening layer) or protective seam be attached to the ability of conduction bonding pad 126; also can avoid upper surface S1 too smooth, and produce unnecessary light reflection.
Except using above-mentioned focusing ion microscope, in other enforcement aspect, also can use multiplying power is sweep electron microscope (the Scanning electron microscopy of 5000 to 50000 times, SEM), or multiplying power is transmission electron microscope (the Transmission electron micoscopy of 5000 to 50000 times, TEM), or to measure yardstick be that the atomic force microscope (Atomic force microscopy, AFM) of 10 microns to 100 microns conducts electricity the first roughness R1 of bonding pad 126 and the measurement of the second roughness R2.
Then, please refer to the cross sectional view shown in Fig. 2 B, wherein, the section line width of upper surface S1 is one first live width W21, and the section line width of lower surface S3 is one second live width W22.In addition, conduction bonding pad 126 also has one the 3rd live width W23 between upper surface S1 and lower surface S3, and the length of the 3rd live width W23 (width) is the length (width) that is less than the first live width W21 and the length (width) of the second live width W22.In other words, the side surface S2 of conduction bonding pad 126 is cambered surface or the curved surface of a central indent, and it is to concave towards the first wire 122, the central shaft position of the second wire 123 or the center of staggered portion 124.In the present embodiment, the length of the 3rd live width W23 (width) is the length (width) more than 0.1 micron that is less than the first live width W21, and the length of the 3rd live width W23 (width) is the length (width) more than 0.1 micron that is less than the second live width W22.In addition, also to have as the length (width) of the 3rd live width W23 of the second section be the technical characterictic of the length (width) of the length (width) that is less than the first live width W21 and the second live width W22 to the first section of forming along face line A-A ' of conduction bonding pad 126.
In the present embodiment, because the side surface S2 of conduction bonding pad 126 has the profile of central indent, thereby be perpendicular to lower surface S3 or side surface S2 is outward extending hillside shape compared to side surface S2, the present embodiment will be difficult for producing the reflection of light.Secondly, with side surface S2 be that the aspect inside contracting is downwards compared and the bonding area of lower surface S3 and base material 11 is dwindled, the present embodiment has larger composition surface (lower surface S3), thereby can avoid the too small problem that conductive grid pattern 12 is easily peeled off from base material 11 of area because of composition surface.
Then, please refer to Fig. 4, it is the schematic diagram of the contact panel 2 of the another kind of preferred embodiment of the utility model.Contact panel 2 is with the Main Differences of contact panel 1, and contact panel 2 more comprises an anti-reflecting layer 21, and anti-reflecting layer 21 is to be positioned on conductive grid pattern 12.In the present embodiment, the pattern that anti-reflecting layer 21 is identical with conductive grid pattern 12, in other words, anti-reflecting layer 21 is to be only arranged on conductive grid pattern 12.In addition, please refer to Fig. 5, it is the contact panel 3 of another preferred embodiment of the utility model.Contact panel 3 is with the key distinction of contact panel 2, and the anti-reflecting layer 31 of contact panel 3 is to be arranged on base material 11, to cover conductive grid pattern 12.
Please then refer to Fig. 6, it is the schematic diagram of the conductive grid pattern 41 in the unit period of contact panel 4 of a kind of preferred embodiment of the utility model.In the present embodiment, a plurality of conductor sections in conductive grid pattern 41 and a plurality of conductions bonding pad form a plurality of carry electrodes 42 and a plurality of sensing electrodes 43 and plurality of transmission lines 44.Wherein, a plurality of conductor sections and a plurality of conductions bonding pad form and have more formed a plurality of ground-electrodes 45, and described ground-electrode 45 is between carry electrode 42 and sensing electrode 43.Therefore, carry electrode 42 and sensing electrode 43 have the technical characterictic of lattice 12 described above.
Carry electrode 42 is respectively one dimension with sensing electrode 43 to be arranged, and adjacent one another are and insulation gap, carry electrode 42 is electrically connected to the control module 5 that is arranged at a side of lattice 41 respectively with sensing electrode 43.When user's touching or click touch-control contact panel 4, the capacitance variations signal that carry electrode 42 produces is to receive by sensing electrode 43, and be sent to the signal processing module in the control module 5 being electrically connected to sensing electrode 43, through computing and processing, produce a coordinate signal that represents touch-control input.In addition, the driving sensing mode of carry electrode 42 and sensing electrode 43, can be mutual capacitance type.In other application, the driving sensing mode of carry electrode 42 and sensing electrode 43, also can be self-capacitance formula, that is carry electrode 42 and sensing electrode 43 sensing touch-control and pass touching signals back all voluntarily.
The structure of above-mentioned different contact panels all can be combined into a touch control display apparatus with a display device.Wherein the mode of combination can be that contact panel is hung on outward on the display surface of display device.The mode of combination can be also that the display surface of display device is used as to base material, directly by conductive grid design producing on the display surface of display device.Combination mode or with certain one deck material in display device, be used as base material, conductive grid pattern is embedded in display device and is made on this base material.
In sum, because of foundation a kind of contact panel of the present utility model, its be by by the conductive grid pattern setting with electric conductivity on base material, and the circuit of the line areas of conductive grid pattern is interlaced and form staggered portion, and each staggered portion one side is extended a protuberance, and make staggered portion and protuberance form a conduction bonding pad, thereby reach, can reduce the decay producing when signal transmits, thereby more accurately and promptly react the object of the position of touch-control input.
The foregoing is only illustrative, but not be restricted person.Anyly do not depart from spirit of the present utility model and category, and the equivalent modifications that it is carried out or change all should be contained in claim scope.
Claims (19)
1. a contact panel, is characterized in that, comprises:
One base material; And
One conductive grid pattern, is positioned on described base material, and it comprises:
One line areas, has a plurality of wires, and described wire is crisscross arranged to form a plurality of staggered portions along a first direction and a second direction respectively, and each staggered portion one side extends a protuberance, and described staggered portion and described protuberance form a conduction bonding pad,
Wherein in unidirectional section, the line width of bonding pad of conducting electricity described in each is greater than the line width of wire described in each, and the normal vector of described section is parallel to wire bearing of trend described in each.
2. contact panel as claimed in claim 1, is characterized in that, in unidirectional section, and 2.5 to 6 times of the line width that the line width of bonding pad of conducting electricity described in each is wire described in each.
3. contact panel as claimed in claim 1, it is characterized in that, described conduction bonding pad has a lower surface near described base material, a upper surface corresponding with described lower surface, and the side surface being connected with described lower surface with described upper surface, described upper surface has one first roughness and described side surface has one second roughness, described the first roughness is greater than described the second roughness, described the first roughness intercepts the interior peak of unit length of described upper surface and the difference in height of minimum point, described the second roughness intercepts the interior peak of unit length of described side surface and the difference in height of minimum point.
4. contact panel as claimed in claim 3, is characterized in that, described the first roughness is to be less than or equal to 500 nanometers.
5. contact panel as claimed in claim 1, is characterized in that, more comprises an anti-reflecting layer, and described anti-reflecting layer is to be positioned on described conductive grid pattern.
6. contact panel as claimed in claim 1, it is characterized in that, described conduction bonding pad has near a lower surface of described base material and the upper surface being oppositely arranged with described lower surface, in described section, the live width of described upper surface is one first live width, the live width of described lower surface is one second live width, and described conduction bonding pad also has one the 3rd live width between described upper surface and described lower surface in described section, and described the 3rd live width is to be less than described the first live width and described the second live width.
7. contact panel as claimed in claim 6, is characterized in that, described the 3rd live width is to be less than the first live width and described the second live width more than 0.1 micron.
8. a contact panel, is characterized in that, comprises:
One base material; And
One conductive grid pattern, is positioned on described base material, and it comprises:
One line areas, has a plurality of wires, and described wire is crisscross arranged to form a plurality of staggered portions along a first direction and a second direction respectively, and each staggered portion one side is extended a protuberance, described staggered portion and described protuberance formation one conduction bonding pad;
Wherein said conduction bonding pad has a lower surface near described base material, a upper surface corresponding with described lower surface, and the side surface being connected with lower surface with described upper surface, described upper surface has one first roughness and described side surface has one second roughness, and described the first roughness is greater than described the second roughness, described the first roughness intercepts the interior peak of unit length of described upper surface and the difference in height of minimum point, and described the second roughness intercepts the interior peak of unit length of described side surface and the difference in height of minimum point.
9. contact panel as claimed in claim 8, is characterized in that, described the first roughness is to be less than or equal to 500 nanometers.
10. contact panel as claimed in claim 8, is characterized in that, in unidirectional section, the line width of bonding pad of conducting electricity described in each is greater than the line width of described wire, and the normal vector of described section is parallel to wire bearing of trend described in each.
11. contact panels as claimed in claim 10, is characterized in that, in unidirectional section, the line width of described conduction bonding pad is 2.5 to 6 times of line width of wire described in each.
12. contact panels as claimed in claim 8, is characterized in that, more comprise an anti-reflecting layer, and described anti-reflecting layer is to be positioned on described conductive grid pattern.
13. contact panels as claimed in claim 8, it is characterized in that, described conduction bonding pad is in a section, the live width of described upper surface is one first live width, the live width of described lower surface is one second live width, and described conduction bonding pad also has one the 3rd live width between described upper surface and described lower surface, and described the 3rd live width is to be less than described the first live width and described the second live width.
14. 1 kinds of contact panels, is characterized in that, comprise:
One base material; And
One conductive grid pattern, is positioned on described base material, and it comprises:
One line areas, has a plurality of wires, and described wire is crisscross arranged to form a plurality of staggered portions along a first direction and a second direction respectively, and each staggered portion one side is extended a protuberance, described staggered portion and described protuberance formation one conduction bonding pad;
Wherein said conduction bonding pad has a lower surface near described base material, a upper surface corresponding with described lower surface, and the side surface being connected with lower surface with described upper surface, described conduction bonding pad is in a section, the live width of described upper surface is one first live width, the live width of described lower surface is one second live width, and described conduction bonding pad also has one the 3rd live width between described upper surface and described lower surface, and described the 3rd live width is to be less than described the first live width and described the second live width.
15. contact panels as claimed in claim 14, is characterized in that, described the 3rd live width is to be less than the first live width and described the second live width more than 0.1 micron.
16. contact panels as claimed in claim 14, is characterized in that, in same section direction, the line width of bonding pad of conducting electricity described in each is greater than the line width of described wire, and the normal vector of described section is parallel to wire bearing of trend described in each.
17. contact panels as claimed in claim 16, is characterized in that, in same section direction, the line width of described conduction bonding pad is 2.5 to 6 times of line width of wire described in each.
18. contact panels as claimed in claim 14, it is characterized in that, described upper surface has one first roughness, described side surface has one second roughness, described the first roughness is greater than described the second roughness, described the first roughness intercepts the interior peak of unit length of described upper surface and the difference in height of minimum point, and described the second roughness intercepts the interior peak of unit length of described side surface and the difference in height of minimum point.
19. contact panels as claimed in claim 14, is characterized in that, more comprise an anti-reflecting layer, and described anti-reflecting layer is to be positioned on described conductive grid pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420276750.7U CN203849707U (en) | 2014-05-28 | 2014-05-28 | Touch panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420276750.7U CN203849707U (en) | 2014-05-28 | 2014-05-28 | Touch panel |
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| CN203849707U true CN203849707U (en) | 2014-09-24 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104777939A (en) * | 2015-04-24 | 2015-07-15 | 昆山龙腾光电有限公司 | Touch panel |
| CN105320313A (en) * | 2014-05-28 | 2016-02-10 | 群创光电股份有限公司 | Touch panel |
| TWI559641B (en) * | 2015-01-20 | 2016-11-21 | 群創光電股份有限公司 | Display device |
-
2014
- 2014-05-28 CN CN201420276750.7U patent/CN203849707U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105320313A (en) * | 2014-05-28 | 2016-02-10 | 群创光电股份有限公司 | Touch panel |
| CN105320313B (en) * | 2014-05-28 | 2020-07-21 | 群创光电股份有限公司 | Touch panel |
| TWI559641B (en) * | 2015-01-20 | 2016-11-21 | 群創光電股份有限公司 | Display device |
| CN104777939A (en) * | 2015-04-24 | 2015-07-15 | 昆山龙腾光电有限公司 | Touch panel |
| CN104777939B (en) * | 2015-04-24 | 2018-01-16 | 昆山龙腾光电有限公司 | Contact panel |
| US9927935B2 (en) | 2015-04-24 | 2018-03-27 | Infovision Optoelectronics (Kunshan) Co., Ltd. | Touch panel and display device |
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