CN103455179A - High-resolution laser etching method for transparent conducting layer of touch panel - Google Patents

High-resolution laser etching method for transparent conducting layer of touch panel Download PDF

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Publication number
CN103455179A
CN103455179A CN2012101683158A CN201210168315A CN103455179A CN 103455179 A CN103455179 A CN 103455179A CN 2012101683158 A CN2012101683158 A CN 2012101683158A CN 201210168315 A CN201210168315 A CN 201210168315A CN 103455179 A CN103455179 A CN 103455179A
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CN
China
Prior art keywords
laser
conducting layer
transparent
induced thermal
transparency conducting
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Pending
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CN2012101683158A
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Chinese (zh)
Inventor
陈耀宗
张裕洋
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Teco Nanotech Co Ltd
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Teco Nanotech Co Ltd
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Priority to CN2012101683158A priority Critical patent/CN103455179A/en
Publication of CN103455179A publication Critical patent/CN103455179A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a high-resolution laser etching method for a transparent conducting layer of a touch panel. The high-resolution laser etching method comprises the steps of preparing a transparent conducting material, enabling a carbon material to be mixed into the transparent conducting material so to form transparent conductive ink; then preparing a transparent film, enabling the transparent conductive ink to be arranged on the transparent film in a spraying, screen printing, ink jet printing or reel-to-reel ink coating mode so as to form the transparent conducting layer; finally enabling laser beam to be projected on the transparent conducting layer of the transparent film, and enabling the light gathering effect of the laser beam to be good due to the fact that the transparent conducting layer comprises the carbon material; when laser beam etching is performed, enabling the transparent conducting layer etching line width to be below 50 mu m, and enabling the invalid area width of an adjacent etching margin after the transparent conducting layer etching to be below 10 mu m so as to achieve the high-resolution laser etching method.

Description

The high-res laser-induced thermal etching method of the transparency conducting layer of contact panel
Technical field
The present invention is relevant a kind of touch control panel, and espespecially a kind of laser machine that utilizes carries out the laser-induced thermal etching method of transparency conducting layer totem to the transparency conducting layer of touch control panel.
Background technology
Along with scientific and technological development, various electronic installation is constantly weeded out the old and bring forth the new.Wherein many electronic installations are all carrying contact panel, to facilitate the user, input instruction and word.The user utilizes pointer or finger directly to click the specific region on contact panel, can send instruction.Perhaps, the user also can be on contact panel writing words.When contact panel collocation display screen, the user also can pull icon on contact panel.Because contact panel has quite various input mode, make contact panel more and more be widely used in electronic installation.The user is when the contact contact panel, and the electrically reaction by contact panel produced, induce the coordinate position that the user contacts, to carry out the action of correspondence.Therefore, the coordinate position contacted in order to induce the user accurately, industry is devoted to research invariably electrically instead would not be subject to the impact of other factors while how to make contact panel be touched.
So-called contact panel be take capacitive touch control plate as example, is the moment that finger by the user or conductor touch on panel to produce a capacity effect, then can determine by the variation of capacitance the position of finger or conductor, reach accordingly the purpose of signal input.The base material of traditional capacitance touch screen is provided with transparency conducting layer and the conducting wire of both positive and negative polarity, its principle of work is to touch two while being separated by the transparency conducting layers induction positive and negative as the user, finger provides the path of two induction electrode conductings, and utilize the electric energy mode to stimulate nerve or the musculature of finger, reach the purpose of electro photoluminescence haptic feedback, the change amount of the transparency conducting layer contact capacitance value by detecting both positive and negative polarity, can determine respectively the position that hand touches after processing via touch-control IC, and then point the coordinate of touch point on definite touch-screen.
The known transparency conducting layer for Trackpad can multiple totem mode as the TaiWan, China patent disclose No. 201029022 disclosed, can utilize the laser-induced thermal etching mode to carry out the transparent induction region that patterning is made the both positive and negative polarity of transparency conducting layer, so the usage operation complexity along with contact panel improves, and for the etching fineness of the transparent induction region of the both positive and negative polarity of transparency conducting layer, requires also to improve gradually.
Because the transparent feel of Trackpad answers the conductive layer penetrability high nearly more than 85%, and the conductive material in structure mainly with inorganic metal oxide as ITO etc., this material tool metallic luster, therefore when carrying out laser-induced thermal etching, after this laser beam is projeced into this inorganic, metal oxide, this laser beam spot can't be assembled easy diffusion, make the photoetch scope at least more than 70um, more than the inactive area (because laser light scattering is partially sintered oxide regions) further produced for the non-etching area of conductive layer but because of laser-induced thermal etching reaches 50um, therefore more than in product design, etching region at least needs 70um, and it is inactive area that the pattern periphery of the transparency conducting layer after etching has 50um at least.
Summary of the invention
Therefore, fundamental purpose of the present invention, be to solve the prior art defect, add material with carbon element in the transparent conductive material that the present invention uses in the making contact panel, this material with carbon element mostly is the black material, for the spotlight effect that has of laser beam sources, when laser beam condensation carries out etching, can reach below 50um the etched live width width of this transparency conducting layer, to can be below 10um in abutting connection with etching limit inactive area width after this transparency conducting layer etching.Can make the transparency conducting layer of the both positive and negative polarity induction of high-res with this technology.
In order to achieve the above object, the invention provides a kind of high-res laser-induced thermal etching method of transparency conducting layer of contact panel, with laser machine, contact panel carried out to etching, comprise:
Have a transparent conductive material;
Transparent conductive material is mixed with to material with carbon element, to form electrically conducting transparent printing ink;
Have a transparent film;
By electrically conducting transparent printing ink film forming on this transparent film, to form transparency conducting layer;
Laser beam is projeced on this transparency conducting layer of this transparent film, this transparency conducting layer contains material with carbon element, and this material with carbon element makes laser beam condensation, when carrying out laser-induced thermal etching, makes this transparency conducting layer form the electrically conducting transparent circuit.
Wherein, the organic conductive glue that this transparent conductive material is transparent conductive resin.
Wherein, this material with carbon element is carbon dust, graphite, acticarbon, carbon fiber, Graphene or CNT.
Wherein, this transparent film is polyethylene terephthalate.
Wherein, this transparency conducting layer with spraying, screen painting, ink jet printing or volume to volume printing ink coating method film forming on this transparent film.
Wherein, the content of the material with carbon element of this transparency conducting layer is 0.001% ~ 0.1%.
Wherein, this transparency conducting layer contained 0.001% ~ 0.1% between material with carbon element, with the number of times that comes and goes spraying, screen painting, ink jet printing or the coating of volume to volume printing ink, control.
Wherein, this material with carbon element consumption is 0.05%.
Wherein, the optical maser wavelength of this laser machine is at 1064nm energy 3 ± 1W, and pulsed frequency is 80KH z.
Wherein, the etched width of the electrically conducting transparent circuit after this transparency conducting layer etching is below 50um.
Wherein, after this transparency conducting layer etching in abutting connection with etching limit inactive area width below 10um.
The accompanying drawing explanation
Fig. 1 is that contact panel of the present invention is made schematic flow sheet.
The schematic side view that Fig. 2 is contact panel of the present invention.
Fig. 3 looks schematic diagram on contact panel of the present invention.
The local enlarged diagram that Fig. 4 is A place in Fig. 3.
The main element symbol description:
Transparent film 1 inactive area 11
Transparency conducting layer 2 electrically conducting transparent circuits 21
Laser machine 3; Laser head 31
Laser beam 32.
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described, so that those skilled in the art can better understand the present invention also, can be implemented, but illustrated embodiment is not as a limitation of the invention.
Referring to Fig. 1, Fig. 2 and Fig. 3, is side-looking and the schematic top plan view of contact panel making flow process of the present invention and contact panel.As shown in the figure: at first the high-res laser-induced thermal etching method of the conducting film of contact panel of the present invention, as step 100, has a transparent conductive material.In the present embodiment, the organic conductive glue that this conductive material is transparent conductive resin.
Step 102, be mixed with material with carbon element by this transparent conductive material, to form electrically conducting transparent printing ink.In the present embodiment, this material with carbon element is carbon dust, graphite, acticarbon, carbon fiber, Graphene or CNT.
Step 104, have a transparent film 1, and this transparent film 1 is PET film (Polyethylene terephthalate, polyethylene terephthalate).
Step 106, utilize spraying, screen painting, ink jet printing or volume to volume printing ink coating method by electrically conducting transparent printing ink film forming on this transparent film 1, after forming transparency conducting layer 2, the content of the material with carbon element of this transparency conducting layer 2 is 0.001% ~ 0.1% (take the powder consumption as 0.05% as best).
Step 108, have a laser machine 3, and laser machine 3 is adjusted to optical maser wavelength at 1064nm energy 3 ± 1W, and pulsed frequency is 80KH z.
Step 110, after laser machine 3 is adjusted, laser head 31 is projeced into laser beam 32 on the transparency conducting layer 2 of this transparent film 1, the composition that contains material with carbon element due to this transparency conducting layer 2, therefore when laser beam 32 is projeced on this transparency conducting layer 2, because this material with carbon element is the black material, the spotlight effect that this laser beam 32 is incident upon on transparency conducting layer 2 is good, when this laser beam 32 is carried out etching, the live width width of the electrically conducting transparent circuit 21 that this transparency conducting layer 2 can be etched into is below 50um, inactive area 11 width in abutting connection with the etching limit after these transparency conducting layer 2 etchings can be below 10um (as shown in Figures 3 and 4).
The present invention after this printing opacity conductive material adds with the material with carbon element of CNT powder with tradition without adding material with carbon element, utilizing laser beam to carry out etching, make both Discrepancy Descriptions of live width width of electrically conducting transparent circuit of this transparency conducting layer as follows:
The tradition aspect:
Material with carbon element 0
Transparent conductive material ITO
Transparent film PET
Spraying number of times 0 time
Penetrability 85%
Surface resistance 450 Ω
The laser-induced thermal etching minimum feature > 70um
Inactive area > 50um.
The transparent conductive material of traditional contact panel at sputter after transparent film PET, can keep penetrability more than 85%, the surface resistance that surface is measured is 450 Ω, but transparent conductive material does not add material with carbon element, therefore when carrying out laser-induced thermal etching, laser beam spot is easily spread, cause the cumulative weak effect, so the laser-induced thermal etching minimum feature is all more than 70um, and inactive area is more than 50um.
 
Aspect of the present invention:
Embodiment mono-:
Material with carbon element 0.001% ~ 0.01% CNT
Transparent conductive material organic conductive glue
Transparent film PET
Spraying number of times 10 times
Penetrability is more than 90%
Surface resistance 800 Ω
Laser-induced thermal etching minimum feature<45um
Inactive area<10um.
When the transparent conductive material of the contact panel in embodiments of the invention one is organic conductive glue, in this organic conductive glue, be added with after 0.001% ~ 0.01% CNT forms electrically conducting transparent printing ink, mode with spraying is sprayed at the upper transparency conducting layer that forms of transparent film PET, the penetrability of this transparency conducting layer can be more than 90%, the surface resistance that surface is measured is 800 Ω, when carrying out laser-induced thermal etching, make laser beam spot cumulative effect good, therefore the minimum feature of the electrically conducting transparent circuit after laser-induced thermal etching is all below 45um, and inactive area is below 10um.
 
Embodiment bis-:
Material with carbon element 0.001% ~ 0.01% CNT
Transparent conductive material organic conductive glue
Transparent film PET
Spraying number of times 20 times
Penetrability is more than 88%
Surface resistance 400 Ω
Laser-induced thermal etching minimum feature<40um
Inactive area<10um.
The transparent conductive material of the contact panel in embodiments of the invention two is organic conductive glue, in this organic conductive glue, be added with after 0.001% ~ 0.01% CNT forms electrically conducting transparent printing ink, mode with spraying is sprayed at the upper transparency conducting layer that forms of transparent film PET, the penetrability of this transparency conducting layer can be more than 88%, the surface resistance that surface is measured is 400 Ω, when carrying out laser-induced thermal etching, make laser beam spot cumulative effect good, therefore after laser-induced thermal etching, the minimum feature of electrically conducting transparent circuit is all below 40um, and inactive area is below 10um.
 
Embodiment tri-:
0.001% ~ 0.01% anti-meter carbon pipe of material with carbon element
Transparent conductive material organic conductive glue
Transparent film PET
Spraying number of times 40 times
Penetrability is more than 85%
Surface resistance 200 Ω
Laser-induced thermal etching minimum feature<35um
Inactive area<10um.
The transparent conductive material of the contact panel in embodiments of the invention three is organic conductive glue, after this organic conductive glue is added with 0.001% ~ 0.01% CNT formation electrically conducting transparent printing ink, mode with spraying is sprayed at the upper transparency conducting layer that forms of transparent film PET, the penetrability of this transparency conducting layer can be more than 85%, the surface resistance that surface is measured is 200 Ω, when carrying out laser-induced thermal etching, make laser beam spot cumulative effect good, therefore after laser-induced thermal etching, the minimum feature of electrically conducting transparent circuit is all below 35um, and inactive area is below 10um.
 
Embodiment tetra-:
Material with carbon element 0.001% ~ 0.01% carbon dust
Transparent conductive material organic conductive glue
Transparent film PET
Spraying number of times 50 times
Penetrability is more than 85%
Surface resistance 700 Ω
Laser-induced thermal etching minimum feature<50um
Inactive area<10um.
The transparent conductive material of the contact panel in embodiments of the invention four is organic conductive glue, after this organic conductive glue is added with 0.001% ~ 0.01% carbon dust formation electrically conducting transparent printing ink, mode with spraying is sprayed at the upper transparency conducting layer that forms of transparent film PET, the penetrability of this transparency conducting layer can be more than 85%, the surface resistance that surface is measured is 700 Ω, when carrying out laser-induced thermal etching, make laser beam spot cumulative effect good, therefore after laser-induced thermal etching, the minimum feature of electrically conducting transparent circuit is all below 50um, and inactive area is also again below 10um.
By the above embodiments one to four with respect to tradition relatively after, carry out etching under the regularization condition that can obviously find out the electrically conducting transparent layer material of selecting carbonaceous material and coordinate laser beam of the present invention to export, there is excellent etching live width can make the live width of electrically conducting transparent circuit be less than below 50um, in addition the etching inactive area of embodiment mono-to four face etching region can be lower than below 10um, traditional at least be greater than 50um more than.Embodiment mono-to three announcement is along with the carbon content of transparency conducting layer increases, and makes the cumulative effect of laser beam of laser machine better, and the etching live width can increase and relatively diminish along with the consumption of material with carbon element.Separately, the present embodiment four discloses and is applied to, containing the carbon dope powder, identical effect is also arranged.
Further, be spraying of the present invention or the sputter transparency conducting layer on transparent film contained 0.001% ~ 0.1% between material with carbon element content, can utilize round spraying, screen painting, ink jet printing or the formed electrically conducting transparent layer thickness of volume to volume printing ink coating number of times to control.
The above embodiment is only the preferred embodiment for absolutely proving that the present invention lifts, and protection scope of the present invention is not limited to this.Being equal to that those skilled in the art do on basis of the present invention substitutes or conversion, all within protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.

Claims (11)

1. the high-res laser-induced thermal etching method of the transparency conducting layer of a contact panel, carry out etching with laser machine to contact panel, comprises:
A), have a transparent conductive material;
B), this transparent conductive material is mixed with to material with carbon element, to form electrically conducting transparent printing ink;
C), have a transparent film;
D), by electrically conducting transparent printing ink film forming on this transparent film, to form transparency conducting layer;
E), laser beam is projeced on the transparency conducting layer of this transparent film, this transparency conducting layer contains material with carbon element, this material with carbon element makes laser beam condensation, when carrying out laser-induced thermal etching, makes transparency conducting layer form the electrically conducting transparent circuit.
2. high-res laser-induced thermal etching method as claimed in claim 1, wherein, the organic conductive glue that the transparent conductive material of this step is transparent conductive resin.
3. high-res laser-induced thermal etching method as claimed in claim 2, wherein, the material with carbon element of this b step is carbon dust, graphite, acticarbon, carbon fiber, Graphene or CNT.
4. high-res laser-induced thermal etching method as claimed in claim 3, wherein, the transparent film of this c step is polyethylene terephthalate.
5. high-res laser-induced thermal etching method as claimed in claim 4, wherein, the transparency conducting layer of this d step with spraying, screen painting, ink jet printing or volume to volume printing ink coating method film forming on this transparent film.
6. high-res laser-induced thermal etching method as claimed in claim 5, wherein, the content of the material with carbon element of this transparency conducting layer of this d step is 0.001% ~ 0.1%.
7. high-res laser-induced thermal etching method as claimed in claim 6, wherein, this transparency conducting layer contained 0.001% ~ 0.1% between material with carbon element, to come and go spraying, screen painting, ink jet printing or volume to volume printing ink coating number of times, control.
8. high-res laser-induced thermal etching method as claimed in claim 7, wherein, this material with carbon element consumption is 0.05%.
9. high-res laser-induced thermal etching method as claimed in claim 8, wherein, the optical maser wavelength of the laser machine of this e step is at 1064nm, energy 3 ± 1W, pulsed frequency is 80KHZ.
10. high-res laser-induced thermal etching method as claimed in claim 9, wherein, the live width width of the electrically conducting transparent circuit after this transparency conducting layer etching is below 50um.
11. high-res laser-induced thermal etching method as claimed in claim 10, wherein, after this transparency conducting layer etching in abutting connection with etching limit inactive area width below 10um.
CN2012101683158A 2012-05-28 2012-05-28 High-resolution laser etching method for transparent conducting layer of touch panel Pending CN103455179A (en)

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Cited By (5)

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Publication number Priority date Publication date Assignee Title
CN105855711A (en) * 2015-01-09 2016-08-17 位元奈米科技股份有限公司 Laser etching method for transparent conductive plate and transparent conductive plate prepared thereby
CN107378231A (en) * 2017-08-21 2017-11-24 英诺激光科技股份有限公司 The method for preparing metal structure in transparent material surface using metal nano prepared Chinese ink
CN108834337A (en) * 2018-08-31 2018-11-16 生益电子股份有限公司 A kind of production method and PCB of PCB
CN108882569A (en) * 2018-08-31 2018-11-23 生益电子股份有限公司 A kind of production method and PCB of PCB
CN109219236A (en) * 2017-06-30 2019-01-15 宏启胜精密电子(秦皇岛)有限公司 Transparent flexible circuit board and preparation method thereof

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US20080006534A1 (en) * 2001-11-30 2008-01-10 The University Of North Carolina At Chapel Hill Deposition method for nanostructure materials
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105855711A (en) * 2015-01-09 2016-08-17 位元奈米科技股份有限公司 Laser etching method for transparent conductive plate and transparent conductive plate prepared thereby
CN109219236A (en) * 2017-06-30 2019-01-15 宏启胜精密电子(秦皇岛)有限公司 Transparent flexible circuit board and preparation method thereof
CN107378231A (en) * 2017-08-21 2017-11-24 英诺激光科技股份有限公司 The method for preparing metal structure in transparent material surface using metal nano prepared Chinese ink
CN107378231B (en) * 2017-08-21 2019-06-07 英诺激光科技股份有限公司 The method for preparing metal structure in transparent material surface using metal nano prepared Chinese ink
CN108834337A (en) * 2018-08-31 2018-11-16 生益电子股份有限公司 A kind of production method and PCB of PCB
CN108882569A (en) * 2018-08-31 2018-11-23 生益电子股份有限公司 A kind of production method and PCB of PCB
CN108834337B (en) * 2018-08-31 2021-01-19 生益电子股份有限公司 PCB manufacturing method and PCB

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Application publication date: 20131218