CN203840542U - 侧面进声的硅麦克风封装结构 - Google Patents
侧面进声的硅麦克风封装结构 Download PDFInfo
- Publication number
- CN203840542U CN203840542U CN201420260426.6U CN201420260426U CN203840542U CN 203840542 U CN203840542 U CN 203840542U CN 201420260426 U CN201420260426 U CN 201420260426U CN 203840542 U CN203840542 U CN 203840542U
- Authority
- CN
- China
- Prior art keywords
- substrate
- sound hole
- silicon microphone
- microphone packaging
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 68
- 239000010703 silicon Substances 0.000 title claims abstract description 68
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 230000000630 rising effect Effects 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000007767 bonding agent Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
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- Pressure Sensors (AREA)
Abstract
Description
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420260426.6U CN203840542U (zh) | 2014-05-21 | 2014-05-21 | 侧面进声的硅麦克风封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420260426.6U CN203840542U (zh) | 2014-05-21 | 2014-05-21 | 侧面进声的硅麦克风封装结构 |
Publications (1)
Publication Number | Publication Date |
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CN203840542U true CN203840542U (zh) | 2014-09-17 |
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Family Applications (1)
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CN201420260426.6U Expired - Lifetime CN203840542U (zh) | 2014-05-21 | 2014-05-21 | 侧面进声的硅麦克风封装结构 |
Country Status (1)
Country | Link |
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CN (1) | CN203840542U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106358101A (zh) * | 2016-11-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | 一种麦克风导音设计结构及移动终端 |
GB2582386A (en) * | 2019-03-22 | 2020-09-23 | Cirrus Logic Int Semiconductor Ltd | Packaging for a MEMS transducer |
-
2014
- 2014-05-21 CN CN201420260426.6U patent/CN203840542U/zh not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106358101A (zh) * | 2016-11-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | 一种麦克风导音设计结构及移动终端 |
GB2582386A (en) * | 2019-03-22 | 2020-09-23 | Cirrus Logic Int Semiconductor Ltd | Packaging for a MEMS transducer |
US11172314B2 (en) | 2019-03-22 | 2021-11-09 | Cirrus Logic, Inc. | Packaging for a MEMS transducer |
GB2582386B (en) * | 2019-03-22 | 2022-03-16 | Cirrus Logic Int Semiconductor Ltd | Packaging for a MEMS transducer |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C35 | Partial or whole invalidation of patent or utility model | ||
IP01 | Partial invalidation of patent right |
Commission number: 5W107852 Conclusion of examination: Declaration of the rights of No. 201420260426.6 utility model 1, 5, 6, 16, invalid, on the basis of the claim 2-4, 7-12, 14-15 continue to maintain the patent valid. Decision date of declaring invalidation: 20150929 Decision number of declaring invalidation: 26963 Denomination of utility model: Side-sound-input silicon microphone packaging structure Granted publication date: 20140917 Patentee: MEMSENSING MICROSYSTEMS TECHNOLOGY CO.,LTD. |
|
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: 99 building NW-09 No. 215123 Jiangsu Jinji Lake in Suzhou Industrial Park Avenue, Room 102 Patentee after: MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) Co.,Ltd. Address before: 99 building NW-09 No. 215123 in Jiangsu Province, Suzhou City Industrial Park Jinji Lake Avenue, Room 501 Patentee before: MEMSENSING MICROSYSTEMS TECHNOLOGY CO.,LTD. |
|
CX01 | Expiry of patent term |
Granted publication date: 20140917 |