CN203840542U - Silicon microphone packaging structure for realizing sound incoming laterally - Google Patents
Silicon microphone packaging structure for realizing sound incoming laterally Download PDFInfo
- Publication number
- CN203840542U CN203840542U CN201420260426.6U CN201420260426U CN203840542U CN 203840542 U CN203840542 U CN 203840542U CN 201420260426 U CN201420260426 U CN 201420260426U CN 203840542 U CN203840542 U CN 203840542U
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- substrate
- sound hole
- silicon microphone
- microphone packaging
- packaging structure
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 68
- 239000010703 silicon Substances 0.000 title claims abstract description 68
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 230000000630 rising effect Effects 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000007767 bonding agent Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
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Abstract
The utility model relates to a silicon microphone packaging structure for realizing sound incoming laterally, which comprises a first substrate, an MEMS sensor, an ASIC chip, leads connecting the MEMS sensor and the ASIC chip and a shell fixed on the first substrate, wherein the first substrate and the shell form an inner cavity body; the MEMS sensor and the ASIC chip are arranged on the first substrate and are exposed inside the inner cavity body; the silicon microphone packaging structure is provided with a lateral wall located on the first lateral face, the lateral wall is provided with a sound hole outwardly passing through the first lateral face, the sound hole is communicated with the inner cavity body, and thus sound incoming laterally can be realized.
Description
Technical field
The utility model relates to a kind of silicon microphone packaging structure, can make microphone realize side enter sound by this structure.
Background technology
Silicon microphone has been widely used in communication and consumption electronic product.Common silicon microphone packaging structure provides two kinds to enter sound mode, and sound is entered and sound is entered in bottom in top.Yet, change along with consumption electronic product outward appearance and application mode, this series products moves to Mike's sound of the wind hole the side of equipment gradually, and existing microphone does not directly provide side to enter sound, therefore need to form the side that a series of bending sound channel realizes equipment by device housings and gum cover, enter sound, this has brought inconvenience to use of microphone.
Therefore, be necessary existing technology to improve, to overcome above technical problem.
Utility model content
The purpose of this utility model is to provide a kind of can realize the silicon microphone packaging structure that sound is entered in side.
For solving, realize above-mentioned purpose, the utility model adopts following technical scheme: the silicon microphone packaging structure of sound is entered in a kind of side, described silicon microphone packaging structure comprises first substrate, MEMS transducer, asic chip, connect the lead-in wire of described MEMS transducer and described asic chip and be fixed on the shell on described first substrate, between described first substrate and described shell, form an internal cavity, described MEMS transducer and described asic chip are installed on described first substrate and are all exposed in described internal cavity, described silicon microphone packaging structure is provided with the sidewall that is positioned at the first side, described sidewall is provided with the sound hole of outwards running through described the first side, described sound hole is connected with described internal cavity.
As the further improved technical scheme of the utility model, described silicon microphone packaging structure is provided with the dielectric layer between described first substrate and described shell in short transverse, described shell is fixed on described first substrate by described dielectric layer, and described sound hole side direction runs through described dielectric layer.
As the further improved technical scheme of the utility model, described dielectric layer is coating, or solder resist, or bonding agent.
As the further improved technical scheme of the utility model, described sound hole is formed by the inc vacancy of described dielectric layer.
As the further improved technical scheme of the utility model, described first substrate comprises described the first side and is exposed to the upper surface in described internal cavity, described MEMS transducer and described asic chip are positioned at described upper surface, and described sound hole is formed on described upper surface and side direction runs through described the first side.
As the further improved technical scheme of the utility model, described sound hole is rectangular and be positioned at the middle part of described the first side.
As the further improved technical scheme of the utility model, described first substrate comprises the lower surface being oppositely arranged with described upper surface, and described lower surface is further run through in described sound hole downwards.
As the further improved technical scheme of the utility model, the lower surface that described first substrate comprises described the first side, is exposed to the upper surface in described internal cavity and is oppositely arranged with described upper surface, described MEMS transducer and described asic chip are positioned at described upper surface; Described sound hole comprises first sound hole and the rising tone hole being interconnected, and wherein said first sound hole side direction runs through described the first side and runs through described lower surface downwards, and described upper surface is not upwards run through in described first sound hole; Described upper surface is upwards run through in described rising tone hole.
As the further improved technical scheme of the utility model, described silicon microphone packaging structure comprises the second substrate that is positioned at described first substrate below and fits with described first substrate, described second substrate is provided with described the first side and is positioned at second side of the same side and the operatic tunes that side direction runs through described the second side, the described operatic tunes is positioned at the below in described sound hole and is communicated with described sound hole, a sound channel of the common formation in the described operatic tunes and described sound hole.
As the further improved technical scheme of the utility model, the described operatic tunes is being located consistency from top to bottom with described first sound hole near described the first side near described the second place, side, and the described operatic tunes is being provided with an arc surface away from described the second place, side.
As the further improved technical scheme of the utility model, described silicon microphone packaging structure comprises between described first substrate and described second substrate and in order to the coating of acoustic seal, described first substrate and/or described second substrate are provided with the conductive through hole that the signal of telecommunication is drawn.
As the further improved technical scheme of the utility model, described silicon microphone packaging structure comprises the second substrate that is positioned at described first substrate below and fits with described first substrate, and described sound hole is positioned at the top of described second substrate and does not run through described second substrate downwards.
As the further improved technical scheme of the utility model, described shell comprises side plate and separates with described side plate the cover plate of making, described side plate is between described first substrate and described cover plate, the lower end of described side plate is fixed on described first substrate, the upper end of described side plate is fixed on described cover plate, described side plate comprises described the first side and described sound hole, and described sound hole is compared to the more close described cover plate of described first substrate.
As the further improved technical scheme of the utility model, described shell comprises roof, described silicon microphone packaging structure comprises the cover plate being fixed on described roof, described cover plate comprises described the first side, described sound hole comprises first sound hole and the rising tone hole being interconnected, wherein said first sound hole side direction runs through described the first side, and described roof is run through in described rising tone hole.
As the further improved technical scheme of the utility model, described shell comprises side plate and separates with described side plate the first cover plate of making, described side plate is between described first substrate and described the first cover plate, the lower end of described side plate is fixed on described first substrate, the upper end of described side plate is fixed on described the first cover plate, described silicon microphone packaging structure comprises the second cover plate being fixed on described the first cover plate, described the second cover plate comprises described the first side, described sound hole comprises first sound hole and the rising tone hole being interconnected, wherein said first sound hole side direction runs through described the first side, described the first cover plate is run through in described rising tone hole.
As the further improved technical scheme of the utility model, described shell comprises some lateral walls, and described in one of them, lateral wall is provided with described the first side, and described sound hole is for several and run through described the first side.
Compared with prior art, the utility model by sidewall, be provided with outwards run through described the first side sound hole to be connected with described internal cavity, thereby realized side, enter sound.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of silicon microphone packaging structure in the first execution mode that sound is entered in the utility model side.
Fig. 2 is the generalized section of Fig. 1, and indicated with arrow the path that sound enters internal cavity from the side.
Fig. 3 is the schematic perspective view of silicon microphone packaging structure in the second execution mode that sound is entered in the utility model side.
Fig. 4 is the generalized section of Fig. 3, and indicated with arrow the path that sound enters internal cavity from the side.
Fig. 5 is the schematic perspective view of silicon microphone packaging structure in the 3rd execution mode that sound is entered in the utility model side.
Fig. 6 is the generalized section of Fig. 5, and indicated with arrow the path that sound enters internal cavity from the side.
Fig. 7 is the schematic perspective view of silicon microphone packaging structure in the 4th execution mode that sound is entered in the utility model side.
Fig. 8 is the generalized section of Fig. 7, and indicated with arrow the path that sound enters internal cavity from the side.
Fig. 9 is the schematic perspective view of silicon microphone packaging structure in the 5th execution mode that sound is entered in the utility model side.
Figure 10 is the generalized section of Fig. 9, and indicated with arrow the path that sound enters internal cavity from the side.
Figure 11 is the schematic perspective view of silicon microphone packaging structure in the 6th execution mode that sound is entered in the utility model side.
Figure 12 is the three-dimensional exploded view of Figure 11.
Figure 13 is the generalized section of Figure 11, and indicated with arrow the path that sound enters internal cavity from the side.
Figure 14 is the schematic perspective view of silicon microphone packaging structure in the 7th execution mode that sound is entered in the utility model side.
Figure 15 is the three-dimensional exploded view of Figure 14.
Figure 16 is the generalized section of Figure 14, and indicated with arrow the path that sound enters internal cavity from the side.
Figure 17 is the schematic perspective view of silicon microphone packaging structure in the 8th execution mode that sound is entered in the utility model side.
Figure 18 is the generalized section of Figure 17, and indicated with arrow the path that sound enters internal cavity from the side.
Figure 19 is the schematic perspective view of silicon microphone packaging structure in the 9th execution mode that sound is entered in the utility model side.
Figure 20 is the generalized section of Figure 19, and indicated with arrow the path that sound enters internal cavity from the side.
Figure 21 is the schematic perspective view of silicon microphone packaging structure in the tenth execution mode that sound is entered in the utility model side.
Figure 22 is the generalized section of Figure 21, and indicated with arrow the path that sound enters internal cavity from the side.
Figure 23 is the schematic perspective view of silicon microphone packaging structure in the 11 execution mode that sound is entered in the utility model side.
Figure 24 is the generalized section of Figure 23, and indicated with arrow the path that sound enters internal cavity from the side.
Embodiment
Shown in please refer to the drawing 1 and Fig. 2, the first execution mode of the present utility model has disclosed the silicon microphone packaging structure 100 that sound is entered in a kind of side.Described silicon microphone packaging structure 100 comprises first substrate 1, MEMS transducer 2, asic chip 3, connects the lead-in wire 4 of described MEMS transducer 2 and described asic chip 3 and be fixed on the shell 5 on described first substrate 1.Between described first substrate 1 and described shell 5, form an internal cavity 10, described MEMS transducer 2 is installed on described first substrate 1 and is all exposed in described internal cavity 10 with described asic chip 3.
Described silicon microphone packaging structure 100 is provided with the dielectric layer 6 between described first substrate 1 and described shell 5 in short transverse, and described shell 5 is fixed on described first substrate 1 by described dielectric layer 6.
Described silicon microphone packaging structure 100 is provided with the sidewall 18 that is positioned at the first side 17, and described sidewall 18 is provided with the sound hole 7 of outwards running through described the first side 17, and described sound hole 7 is connected with described internal cavity 10.So arrange, utilize the difference in height of described dielectric layer 6 and described first substrate 1, form the sound hole 7 described in one or more.Shown in please refer to the drawing 2, sound can enter in described internal cavity 10 from 7 sides, described sound hole along arrow.
In illustrated the first execution mode, described dielectric layer is coating or solder resist, and described sound hole 7 side direction run through described dielectric layer 6.Particularly, described sound hole 7 is formed by the inc vacancy 61 of described dielectric layer 6.The similar gap of shape in described sound hole 7.
Shown in please refer to the drawing 3 and Fig. 4, the silicon microphone packaging structure 100 and the first execution mode that in the utility model the second execution mode, disclose are similar, difference is: in the second execution mode of the present utility model, described dielectric layer 6 is bonding agent, and described sound hole 7 is formed by the inc vacancy 61 of described bonding agent.The similar gap of shape in described sound hole 7.
Shown in please refer to the drawing 5 and Fig. 6, in the 3rd execution mode of the present utility model, described first substrate 1 comprises described the first side 17, is exposed to the upper surface 11 of described internal cavity interior 10 and the lower surface 12 being oppositely arranged with described upper surface 11.Described MEMS transducer 2 is positioned at described upper surface 11 with described asic chip 3.Described sound hole 7 is formed on described upper surface 11 and side direction runs through described the first side 17.Described sound hole 7 is rectangular and be positioned at the middle part of described the first side 17.But in described the 3rd execution mode, described sound hole 7 is only formed on described upper surface 11, it does not run through described lower surface 12 downwards.Now, described sound hole 7 is equivalent to be positioned at a shallow slot on upper surface 11.
Certainly, can understand, described sound hole 7 also can combine by above-mentioned first, second and third execution mode.
Shown in please refer to the drawing 7 and Fig. 8, in the 4th execution mode of the present utility model, described silicon microphone packaging structure 100 is mounted on a circuit board 200.Wherein, described lower surface 12 is further run through in described sound hole 7 downwards.Now, described sound hole 7 is equivalent to be positioned at a breach on the first side 17.Described breach and sound channel of circuit board 200 self-assembling formation.
Shown in please refer to the drawing 9 and Figure 10, in the 5th execution mode of the present utility model, described silicon microphone packaging structure 100 is mounted on a circuit board 200.Described sound hole 7 comprises and being interconnected and orthogonal first sound hole 71 and rising tone hole 72, and wherein said first sound hole 71 side direction run through described the first side 17 and run through described lower surface 12 downwards, and described upper surface 11 is not upwards run through in described first sound hole 71; Described upper surface 11 is upwards run through in described rising tone hole 72.Now, described sound hole 7 and sound channel of described circuit board 200 self-assembling formation.
Shown in please refer to the drawing 11 to Figure 13, the silicon microphone packaging structure 100 and the 5th execution mode that in the utility model the 6th execution mode, disclose are similar, and difference is: the silicon microphone packaging structure 100 in described the 6th execution mode is also provided with the second substrate 8 that is positioned at described first substrate 1 below and fits with described first substrate 1.Described second substrate 8 is provided with described the first side 17 and is positioned at second side 80 of the same side and the operatic tunes 81 that side direction runs through described the second side 80.The described operatic tunes 81 is positioned at the below in described sound hole 7 and is communicated with described sound hole 7, a sound channel of the described operatic tunes 81 and the 7 common formation of described sound hole.Shown in please refer to the drawing 11, the described operatic tunes 81 near 80 places, described the second side and described first sound hole 71 near described first side 17 place's consistencies from top to bottom.Shown in please refer to the drawing 12, the described operatic tunes 81 is being provided with an arc surface 82 away from 80 places, described the second side.Described silicon microphone packaging structure 100 also comprises between described first substrate 1 and described second substrate 8 and in order to the coating 84 of acoustic seal.Described first substrate 1 and/or described second substrate 8 are provided with the conductive through hole 83 that the signal of telecommunication is drawn.
Shown in please refer to the drawing 14 to Figure 16, the silicon microphone packaging structure 100 and the 4th execution mode that in the utility model the 7th execution mode, disclose are similar, and difference is: the silicon microphone packaging structure 100 in described the 7th execution mode is also provided with the second substrate 8 that is positioned at described first substrate 1 below and fits with described first substrate 1.Described sound hole 7 is positioned at the top of described second substrate 8 and does not run through described second substrate 8 downwards.Now, described sound hole 7 and sound channel of described second substrate 8 self-assembling formation.Described silicon microphone packaging structure 100 also comprises between described first substrate 1 and described second substrate 8 and in order to the coating 84 of acoustic seal.Described first substrate 1 and/or described second substrate 8 are provided with the conductive through hole 83 that the signal of telecommunication is drawn.Certainly, also can increase shallow slot to expand the cross section of described sound channel on described second substrate 8, shallow slot can be realized by the difference in height of bonding agent between grooving, coating or substrate.
In the first execution mode to the seven execution modes, roof and the sidewall of described shell 5 are integrally formed.Yet shown in please refer to the drawing 17 and Figure 18, in the utility model the 8th execution mode, described shell 5 comprises side plate 51 and separates with described side plate 51 cover plate 52 of making.Described side plate 51 is between described first substrate 1 and described cover plate 52, and the lower end of described side plate 51 is fixed on described first substrate 1, and the upper end of described side plate 51 is fixed on described cover plate 52.Described side plate 51 comprises described the first side 17 and described sound hole 7, and described sound hole 7 is compared to the more close described cover plate 52 of described first substrate 1.
Shown in please refer to the drawing 19 and Figure 20, in the 9th execution mode of the present utility model, described shell 5 comprises roof 53, and described silicon microphone packaging structure 100 comprises the cover plate 9 being fixed on described roof 53, and described cover plate 9 comprises described the first side 17.Described sound hole 7 comprises first sound hole 71 and the rising tone hole 72 being interconnected, and wherein said first sound hole 71 side direction run through described the first side 17, and described roof 53 is run through in described rising tone hole 72.
Shown in please refer to the drawing 21 and Figure 22, in the tenth execution mode of the present utility model, described shell 5 comprises side plate 51 and separates with described side plate 51 the first cover plate 54 of making.Described side plate 51 is between described first substrate 1 and described the first cover plate 54, and the lower end of described side plate 51 is fixed on described first substrate 1, and the upper end of described side plate 51 is fixed on described the first cover plate 54.Described silicon microphone packaging structure 100 comprises the second cover plate 55 being fixed on described the first cover plate 54, and described the second cover plate 55 comprises described the first side 17.Described sound hole 7 comprises first sound hole 71 and the rising tone hole 72 being interconnected, and wherein said first sound hole 71 side direction run through described the first side 17, and described the first cover plate 54 is run through in described rising tone hole 72.Described rising tone hole 72 is connected to the back of the body chamber (not label) of MEMS transducer 2.
Shown in please refer to the drawing 23 and Figure 24, in the 11 execution mode of the present utility model, described shell 5 comprises some lateral walls 56, and described in one of them, lateral wall 56 is provided with described the first side 17, and described sound hole 7 is for several and run through the middle part of described the first side 17.
Compared to prior art, the utility model by sidewall 18, be provided with outwards run through described the first side 17 sound hole 7 to be connected with described internal cavity 10, thereby realized side, enter sound.In addition, the utility model silicon microphone packaging structure 100 mainly utilizes substrate surface difference in height and multilager base plate to enter sound in conjunction with realizing side, and making is simple, cost is low, rate of finished products is higher.
It should be noted that: above embodiment is only for illustrating the utility model and the described technical scheme of unrestricted the utility model, although this specification has been described in detail the utility model with reference to the above embodiments, but, those of ordinary skill in the art is to be understood that, person of ordinary skill in the field still can modify or be equal to replacement the utility model, and all do not depart from technical scheme and the improvement thereof of spirit and scope of the present utility model, all should be encompassed within the scope of claim of the present utility model.
Claims (16)
1. the silicon microphone packaging structure of sound is entered in a side, described silicon microphone packaging structure comprises first substrate, MEMS transducer, asic chip, connect the lead-in wire of described MEMS transducer and described asic chip and be fixed on the shell on described first substrate, between described first substrate and described shell, form an internal cavity, described MEMS transducer and described asic chip are installed on described first substrate and are all exposed in described internal cavity, it is characterized in that: described silicon microphone packaging structure is provided with the sidewall that is positioned at the first side, described sidewall is provided with the sound hole of outwards running through described the first side, described sound hole is connected with described internal cavity.
2. silicon microphone packaging structure as claimed in claim 1, it is characterized in that: described silicon microphone packaging structure is provided with the dielectric layer between described first substrate and described shell in short transverse, described shell is fixed on described first substrate by described dielectric layer, and described sound hole side direction runs through described dielectric layer.
3. silicon microphone packaging structure as claimed in claim 2, is characterized in that: described dielectric layer is coating, or solder resist, or bonding agent.
4. silicon microphone packaging structure as claimed in claim 3, is characterized in that: described sound hole is formed by the inc vacancy of described dielectric layer.
5. silicon microphone packaging structure as claimed in claim 1, it is characterized in that: described first substrate comprises described the first side and is exposed to the upper surface in described internal cavity, described MEMS transducer and described asic chip are positioned at described upper surface, and described sound hole is formed on described upper surface and side direction runs through described the first side.
6. silicon microphone packaging structure as claimed in claim 5, is characterized in that: described sound hole is rectangular and be positioned at the middle part of described the first side.
7. silicon microphone packaging structure as claimed in claim 5, is characterized in that: described first substrate comprises the lower surface being oppositely arranged with described upper surface, and described lower surface is further run through in described sound hole downwards.
8. silicon microphone packaging structure as claimed in claim 1, it is characterized in that: the lower surface that described first substrate comprises described the first side, is exposed to the upper surface in described internal cavity and is oppositely arranged with described upper surface, described MEMS transducer and described asic chip are positioned at described upper surface; Described sound hole comprises first sound hole and the rising tone hole being interconnected, and wherein said first sound hole side direction runs through described the first side and runs through described lower surface downwards, and described upper surface is not upwards run through in described first sound hole; Described upper surface is upwards run through in described rising tone hole.
9. silicon microphone packaging structure as claimed in claim 8, it is characterized in that: described silicon microphone packaging structure comprises the second substrate that is positioned at described first substrate below and fits with described first substrate, described second substrate is provided with described the first side and is positioned at second side of the same side and the operatic tunes that side direction runs through described the second side, the described operatic tunes is positioned at the below in described sound hole and is communicated with described sound hole, a sound channel of the common formation in the described operatic tunes and described sound hole.
10. silicon microphone packaging structure as claimed in claim 9, it is characterized in that: the described operatic tunes is being located consistency from top to bottom with described first sound hole near described the first side near described the second place, side, the described operatic tunes is being provided with an arc surface away from described the second place, side.
11. silicon microphone packaging structures as claimed in claim 9, it is characterized in that: described silicon microphone packaging structure comprises between described first substrate and described second substrate and in order to the coating of acoustic seal, described first substrate and/or described second substrate are provided with the conductive through hole that the signal of telecommunication is drawn.
12. silicon microphone packaging structures as claimed in claim 7, it is characterized in that: described silicon microphone packaging structure comprises the second substrate that is positioned at described first substrate below and fits with described first substrate, and described sound hole is positioned at the top of described second substrate and does not run through described second substrate downwards.
13. silicon microphone packaging structures as claimed in claim 1, it is characterized in that: described shell comprises side plate and separates with described side plate the cover plate of making, described side plate is between described first substrate and described cover plate, the lower end of described side plate is fixed on described first substrate, the upper end of described side plate is fixed on described cover plate, described side plate comprises described the first side and described sound hole, and described sound hole is compared to the more close described cover plate of described first substrate.
14. silicon microphone packaging structures as claimed in claim 1, it is characterized in that: described shell comprises roof, described silicon microphone packaging structure comprises the cover plate being fixed on described roof, described cover plate comprises described the first side, described sound hole comprises first sound hole and the rising tone hole being interconnected, wherein said first sound hole side direction runs through described the first side, and described roof is run through in described rising tone hole.
15. silicon microphone packaging structures as claimed in claim 1, it is characterized in that: described shell comprises side plate and separates with described side plate the first cover plate of making, described side plate is between described first substrate and described the first cover plate, the lower end of described side plate is fixed on described first substrate, the upper end of described side plate is fixed on described the first cover plate, described silicon microphone packaging structure comprises the second cover plate being fixed on described the first cover plate, described the second cover plate comprises described the first side, described sound hole comprises first sound hole and the rising tone hole being interconnected, wherein said first sound hole side direction runs through described the first side, described the first cover plate is run through in described rising tone hole.
16. silicon microphone packaging structures as claimed in claim 1, is characterized in that: described shell comprises some lateral walls, described in one of them, lateral wall is provided with described the first side, and described sound hole is for several and run through described the first side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420260426.6U CN203840542U (en) | 2014-05-21 | 2014-05-21 | Silicon microphone packaging structure for realizing sound incoming laterally |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420260426.6U CN203840542U (en) | 2014-05-21 | 2014-05-21 | Silicon microphone packaging structure for realizing sound incoming laterally |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203840542U true CN203840542U (en) | 2014-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420260426.6U Expired - Lifetime CN203840542U (en) | 2014-05-21 | 2014-05-21 | Silicon microphone packaging structure for realizing sound incoming laterally |
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| Country | Link |
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| CN (1) | CN203840542U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358101A (en) * | 2016-11-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | Microphone leading-note design structure and mobile terminal |
| GB2582386A (en) * | 2019-03-22 | 2020-09-23 | Cirrus Logic Int Semiconductor Ltd | Packaging for a MEMS transducer |
-
2014
- 2014-05-21 CN CN201420260426.6U patent/CN203840542U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358101A (en) * | 2016-11-30 | 2017-01-25 | 宇龙计算机通信科技(深圳)有限公司 | Microphone leading-note design structure and mobile terminal |
| GB2582386A (en) * | 2019-03-22 | 2020-09-23 | Cirrus Logic Int Semiconductor Ltd | Packaging for a MEMS transducer |
| US11172314B2 (en) | 2019-03-22 | 2021-11-09 | Cirrus Logic, Inc. | Packaging for a MEMS transducer |
| GB2582386B (en) * | 2019-03-22 | 2022-03-16 | Cirrus Logic Int Semiconductor Ltd | Packaging for a MEMS transducer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C35 | Partial or whole invalidation of patent or utility model | ||
| IP01 | Partial invalidation of patent right |
Commission number: 5W107852 Conclusion of examination: Declaration of the rights of No. 201420260426.6 utility model 1, 5, 6, 16, invalid, on the basis of the claim 2-4, 7-12, 14-15 continue to maintain the patent valid. Decision date of declaring invalidation: 20150929 Decision number of declaring invalidation: 26963 Denomination of utility model: Side-sound-input silicon microphone packaging structure Granted publication date: 20140917 Patentee: MEMSENSING MICROSYSTEMS TECHNOLOGY CO.,LTD. |
|
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 99 building NW-09 No. 215123 Jiangsu Jinji Lake in Suzhou Industrial Park Avenue, Room 102 Patentee after: MEMSENSING MICROSYSTEMS (SUZHOU, CHINA) Co.,Ltd. Address before: 99 building NW-09 No. 215123 in Jiangsu Province, Suzhou City Industrial Park Jinji Lake Avenue, Room 501 Patentee before: MEMSENSING MICROSYSTEMS TECHNOLOGY CO.,LTD. |
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| CX01 | Expiry of patent term |
Granted publication date: 20140917 |