CN203775411U - MEMS microphone - Google Patents
MEMS microphone Download PDFInfo
- Publication number
- CN203775411U CN203775411U CN201420151563.6U CN201420151563U CN203775411U CN 203775411 U CN203775411 U CN 203775411U CN 201420151563 U CN201420151563 U CN 201420151563U CN 203775411 U CN203775411 U CN 203775411U
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- CN
- China
- Prior art keywords
- circuit board
- transmission channel
- cavity
- mems microphone
- sound transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 39
- 239000008393 encapsulating agent Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 abstract description 10
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000001681 protective effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Details Of Audible-Bandwidth Transducers (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses an MEMS microphone. The MEMS microphone comprises a circuit board, a housing, a sound transmission channel structural member, an MEMS sensor and an ASIC integrated circuit. The housing is in sealing connection with the circuit board to enclose and form a cavity, the sound transmission channel structural member arranged in the cavity separates the cavity into a front cavity and a rear cavity, the MEMS sensor and the ASIC integrated circuit are arranged on the circuit board in the rear cavity and are electrically connected, a sound hole is arranged in the portion, which encloses to form the front cavity, of the housing, and the circuit board is provided with a sound transmission channel communicating with the front cavity and the rear cavity at the bottom of the MEMS sensor. The MEMS microphone effectively solves the problems of quite low sensitivity caused by small volume of the rear cavity at the bottom in a conventional MEMS microphone and failure caused by entering of foreign matters.
Description
Technical field
The utility model relates to acoustic-electric switch technology field, more particularly, relates to a kind of MEMS microphone.
Background technology
Existing MEMS(Micro-Electro-Mechanical System, MEMS (micro electro mechanical system)) microphone adopts top to enter sound design.As shown in fig. 1, sound hole 05 is arranged on shell 01; MEMS transducer 04 and ASIC(Application Specific Integrated Circuit, functional integrated circuit) chip 03 is all arranged on circuit board 02, and forms electrical connection by wire.Sound enters from sound hole 05 the ante-chamber 06(being surrounded with circuit board 02 by shell 01 and is connected with the external world) among, and act on MEMS transducer 04 vibrating diaphragm.Because the volume of ante-chamber 06 is much larger than the cavity that vibrating diaphragm, sensor outer housing and circuit board 02 surround jointly in the bottom back cavity 07(MEMS transducer 04 of MEMS transducer 04, be not in communication with the outside), cause adopting the MEMS sensitivity of microphone of such design lower.Meanwhile, because ante-chamber 06 is directly connected with outside by sound hole 05, extraneous air-flow and foreign matter easily enter into MEMS microphone inside, cause MEMS microphone to lose efficacy.
By the above, how a kind of MEMS microphone of new structure is provided, low to solve existing product sensitivity, the problem easily losing efficacy because of entering of foreign matter, becomes those skilled in the art and needs badly the technical problem of solution.
Utility model content
In view of this, the utility model provides a kind of MEMS microphone, low to solve existing product sensitivity, the problem easily losing efficacy because of entering of foreign matter.
For achieving the above object, the utility model provides following technical scheme:
A kind of MEMS microphone, comprise circuit board, seal the shell being connected and the MEMS transducer electrically connecting each other and ASIC integrated circuit with circuit board, MEMS transducer and ASIC integrated circuit are all arranged on circuit board, and be arranged in the cavity that circuit board and shell surround, on shell, be provided with sound hole, also comprise the sound transmission channel structural member that cavity is divided into ante-chamber and back cavity, sound hole is positioned at shell and surrounds front cavity segment, MEMS transducer and ASIC integrated circuit are arranged in back cavity, in circuit board, be provided with the sound transmission channel that is communicated with bottom back cavity in ante-chamber and MEMS transducer.
Preferably, in above-mentioned MEMS microphone, between sound transmission channel structural member and shell and/or sound transmission channel structural member and circuit board, be provided with encapsulant.
Preferably, in above-mentioned MEMS microphone, encapsulant is foam, solder(ing) paste or adhesive.
Preferably, in above-mentioned MEMS microphone, sound transmission channel structural member is square plate, arc or sketch plate.
Preferably, in above-mentioned MEMS microphone, sound transmission channel structural member comprises the first riser, the second riser fitting with circuit board fitting with the inwall of shell and is connected the first riser and the horizontal baffle of the second riser, the first riser and the second riser are perpendicular to circuit board, and sound hole drops on horizontal baffle completely with respect to the orthographic projection of circuit board.
The utility model provides a kind of MEMS microphone, comprises circuit board, shell, sound transmission channel structural member, MEMS transducer and ASIC integrated circuit.Shell is connected with circuit board sealing, surrounds formation cavity.Cavity is divided into ante-chamber and back cavity by the sound transmission channel structural member being arranged among cavity.MEMS transducer and ASIC integrated circuit are all arranged on the circuit board in back cavity, both electrical connections.Sound hole is arranged in the part that shell surrounds ante-chamber, is provided with the sound transmission channel that is communicated with bottom back cavity in ante-chamber and MEMS transducer on circuit board.
In MEMS microphone provided by the utility model, utilizing sound transmission channel structural member is ante-chamber and back cavity by MEMS microphone interior separation, and utilize transmission channel to be communicated with ante-chamber and bottom back cavity, thereby improve the sensitivity of MEMS microphone, efficiently solved the little sensitivity causing of back cavity volume lower problem in bottom in original structure.Meanwhile, ante-chamber and sound transmission channel have played buffer gas flow and protective effect, and the foreign matter being entered by sound hole is difficult for touching MEMS transducer and ASIC integrated circuit, thereby have solved the problem losing efficacy because of entering of foreign matter.
Brief description of the drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of existing MEMS microphone;
Fig. 2 provides the structural representation of MEMS microphone for the utility model embodiment;
Fig. 3 provides the structural representation of MEMS microphone for another embodiment of the utility model.
In above Fig. 1-3:
Shell 01, circuit board 02, ASIC integrated circuit 03, MEMS transducer 04, sound hole 05, ante-chamber 06, bottom back cavity 07;
Shell 1, circuit board 2, sound transmission channel structural member 3, encapsulant 31, the first riser 32, the second riser 33, horizontal baffle 34, MEMS transducer 4, bottom back cavity 41, ASIC integrated circuit 5, ante-chamber 6, back cavity 7, sound hole 8 and sound transmission channel 9.
Embodiment
The utility model embodiment discloses a kind of MEMS microphone, low to solve existing product sensitivity, the problem easily losing efficacy because of entering of foreign matter.
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
Please refer to Fig. 2, in the MEMS microphone that the utility model embodiment provides, comprise shell 1, circuit board 2, sound transmission channel structural member 3, MEMS transducer 4 and ASIC integrated circuit 5.
Shell 1 is tightly connected with circuit board 2, has jointly surrounded cavity, and this cavity is divided into ante-chamber 6 and back cavity 7 by sound transmission channel structural member 3.
The MEMS transducer 4 being electrically connected to each other and ASIC integrated circuit 5 are all arranged on the circuit board 2 of back cavity 7.
On the shell 1 of ante-chamber 6 parts, be provided with sound hole 8.
On circuit board 2, be provided with the sound transmission channel 9 that is communicated with bottom back cavity 41 in ante-chamber 6 and MEMS transducer 4.
In the MEMS microphone that the present embodiment provides, utilize sound transmission channel structural member 3 that the cavity of original integral type is divided into ante-chamber 6 and back cavity 7, meanwhile, utilize the sound transmission channel 9 in circuit board 2 to be communicated with bottom back cavity in ante-chamber 6 and MEMS transducer 4.Thereby improve the sensitivity of MEMS microphone, efficiently solved the little sensitivity causing of back cavity volume lower problem in bottom in original structure.Meanwhile, ante-chamber 6 and sound transmission channel 9 have played buffer gas flow and protective effect, and the foreign matter being entered by sound hole is difficult for touching MEMS transducer and ASIC integrated circuit, thereby have solved the problem losing efficacy because of entering of foreign matter.
In order further to improve the performance of MEMS microphone, in the MEMS microphone providing at above-described embodiment, between sound transmission channel structural member 3 and shell 1, encapsulant 31 is set, to strengthen the sealing between ante-chamber 6 and back cavity 7, avoid sound wave to reveal, improving the utility model embodiment provides sensitivity and the signal to noise ratio of MEMS microphone.
It will be understood by those skilled in the art that, can also between sound transmission channel structural member 3 and circuit board 2, encapsulant 31 be set, or between shell 1, circuit board 2 and sound transmission channel structural member 3 threes, encapsulant 31 is all set, to ensure the sealing effectiveness between ante-chamber 6 and back cavity 7.
Concrete, providing in MEMS microphone at above-described embodiment, encapsulant 31 is foam, solder(ing) paste or adhesive.
Further, sound transmission channel structural member 3 in MEMS microphone is provided can be square plate (as shown in Figure 3), arc or sketch plate to the above embodiments.
As preferred version, the utility model embodiment provides and in MEMS microphone, uses the sound transmission channel structural member 3 of sketch plate structure as shown in Figure 2.
Sound transmission channel structural member 3 comprises the first riser 32, the second riser 33 and horizontal baffle 34.Wherein, the first riser 32 fits with the inwall of shell 1, and the second riser 33 fits with circuit board 2, and both are all perpendicular to circuit board setting.Horizontal baffle 34 connects the first riser 32 and the second riser 33, and sound hole 8 drops on horizontal baffle 34 completely with respect to the orthographic projection of circuit board 2.
The sound transmission channel structural member 3 of sketch plate structure has increased the number of turns of sound wave in MEMS microphone, and air-flow has been played to better cushioning effect; Sound hole 8 is relative with horizontal baffle 34 positions, and entering of foreign matter played to certain shielding action.In sum, the sound transmission channel structural member 3 of sketch plate structure has played better protective effect to MEMS microphone.
Concrete, in the MEMS microphone providing at above-described embodiment, sound transmission channel can be both the hollow channel directly processing in circuit board 2, also can be for being arranged on the individual components on circuit board 2.As, first the installation position of groove shape is set on circuit board 2, then on the surface of installation position, covering is set, its part is hidden, thus " hollow pipeline " formula of formation structure.Those skilled in the art, according to conventional means, can utilize multiple mode to realize this structure of sound transmission channel in MEMS microphone, repeat no more herein.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is and the difference of other embodiment, between each embodiment identical similar part mutually referring to.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (5)
1. a MEMS microphone, comprise circuit board, seal the shell being connected and the MEMS transducer electrically connecting each other and ASIC integrated circuit with described circuit board, described MEMS transducer and described ASIC integrated circuit are all arranged on described circuit board, and be arranged in the cavity that described circuit board and described shell surround, on described shell, be provided with sound hole, it is characterized in that, also comprise the sound transmission channel structural member that described cavity is divided into ante-chamber and back cavity, described sound hole is positioned at described shell and surrounds described front cavity segment, described MEMS transducer and described ASIC integrated circuit are arranged in described back cavity, in described circuit board, be provided with the sound transmission channel that is communicated with bottom back cavity in ante-chamber and described MEMS transducer.
2. MEMS microphone according to claim 1, is characterized in that, between described sound transmission channel structural member and described shell and/or described sound transmission channel structural member and described circuit board, is provided with encapsulant.
3. MEMS microphone according to claim 2, is characterized in that, described encapsulant is foam, solder(ing) paste or adhesive.
4. MEMS microphone according to claim 1, is characterized in that, described sound transmission channel structural member is square plate, arc or sketch plate.
5. MEMS microphone according to claim 1, it is characterized in that, described sound transmission channel structural member comprises the first riser fitting with the inwall of described shell, the second riser fitting with described circuit board and the horizontal baffle that is connected described the first riser and described the second riser, described the first riser and described the second riser are perpendicular to described circuit board, and described sound hole drops on described horizontal baffle completely with respect to the orthographic projection of described circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420151563.6U CN203775411U (en) | 2014-03-31 | 2014-03-31 | MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420151563.6U CN203775411U (en) | 2014-03-31 | 2014-03-31 | MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203775411U true CN203775411U (en) | 2014-08-13 |
Family
ID=51292551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420151563.6U Expired - Lifetime CN203775411U (en) | 2014-03-31 | 2014-03-31 | MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203775411U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105721998A (en) * | 2016-04-27 | 2016-06-29 | 歌尔声学股份有限公司 | Separated cavity packaging structure of integrated sensor |
| WO2016179896A1 (en) * | 2015-05-08 | 2016-11-17 | 中兴通讯股份有限公司 | Seal structure of microphone and electronic device |
| CN112369045A (en) * | 2018-07-16 | 2021-02-12 | Oppo广东移动通信有限公司 | Shell assembly and electronic equipment |
| CN113891198A (en) * | 2020-07-03 | 2022-01-04 | 加高电子股份有限公司 | Microphone structure |
-
2014
- 2014-03-31 CN CN201420151563.6U patent/CN203775411U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016179896A1 (en) * | 2015-05-08 | 2016-11-17 | 中兴通讯股份有限公司 | Seal structure of microphone and electronic device |
| CN105721998A (en) * | 2016-04-27 | 2016-06-29 | 歌尔声学股份有限公司 | Separated cavity packaging structure of integrated sensor |
| CN112369045A (en) * | 2018-07-16 | 2021-02-12 | Oppo广东移动通信有限公司 | Shell assembly and electronic equipment |
| CN112369045B (en) * | 2018-07-16 | 2022-07-12 | Oppo广东移动通信有限公司 | Shell assembly and electronic equipment |
| CN113891198A (en) * | 2020-07-03 | 2022-01-04 | 加高电子股份有限公司 | Microphone structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140813 |