CN203650722U - Guide wheel with asymmetrical guide wheel grooves - Google Patents
Guide wheel with asymmetrical guide wheel grooves Download PDFInfo
- Publication number
- CN203650722U CN203650722U CN201320781132.3U CN201320781132U CN203650722U CN 203650722 U CN203650722 U CN 203650722U CN 201320781132 U CN201320781132 U CN 201320781132U CN 203650722 U CN203650722 U CN 203650722U
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- Prior art keywords
- guide wheel
- cutting
- guided
- slot
- grooves
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- Expired - Fee Related
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- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 abstract description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 16
- 229910052710 silicon Inorganic materials 0.000 abstract description 16
- 239000010703 silicon Substances 0.000 abstract description 16
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 30
- 239000010959 steel Substances 0.000 description 30
- 238000005299 abrasion Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000004484 Briquette Substances 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a guide wheel with asymmetrical guide wheel grooves, and relates to the technical field of silicon wafer cutting devices. The guide wheel comprises a guide wheel body, a guide wheel coating is arranged on the periphery of the guide wheel body, the guide wheel grooves formed along the circumference of the guide wheel body are formed in the guide wheel coating, the guide wheel grooves are in a V shape in left-right asymmetry, and the included angle of the left side edges of the guide wheel grooves and vertical lines is larger than that of the right side edges of the guide wheel grooves and the vertical lines. The guide wheel is used for cutting a silicon wafer, cutting quality of the silicon wafer can be guaranteed, the guide wheel grooves can still meet the optimal cutting angle within certain time even though the guide wheel coating is abraded in the cutting process, and therefore the service life of the guide wheel is prolonged.
Description
Technical field
The utility model relates to the cutter sweep technical field of silicon chip, relates in particular to a kind of guide wheel with asymmetric guided wheel slot of long service life.
Background technology
At present, crystalline silicon is topmost solar cell material, what the cutting of polysilicon chip was used is the multi-wire saw equipment that precision is high, output is large, on the guide wheel of multi-wire saw equipment, be wound around hundreds of steel wires that participate in cutting, the core component of guaranteeing cutting accuracy is guide wheel, is processed with the guided wheel slot that is wound around steel wire on guide wheel.Before guide wheel comes into operation, need be to its processing of slotting; When multi-wire saw equipment used after a period of time, the rubbing action to guide wheel coating due to steel wire and abrasive material, makes the grooved gross distortion in guide wheel coating, thereby cannot ensure the positional precision of steel wire, now also needs again the guide wheel processing of slotting.
Guide wheel is mainly used in carrying steel wire, and the slot pitch of guide wheel affects the thickness of cutting silicon wafer, the cut direction of guided wheel slot constraint steel wire.In cutting process, guide wheel drives steel wire high speed rotating, and mortar ceaselessly flows on steel wire, and the suspension with toughness can carry on the steel wire that carborundum is attached to rotation.Along with the decline of silico briquette, steel wire carries carborundum cutting.Under normal circumstances, the silicon chip after cutting should be uniformly, if but the guided wheel slot that guide wheel leaves is excessively shallow, narrow etc., and steel wire is just easily jumped out guided wheel slot, thereby causes the oblique Si wafer quality problem that waits of cutting.Guided wheel slot is lack of standardization in addition or handling process in, guide pulley surface is collided with, cause that guided wheel slot is not parallel to each other, also can cause silicon chip cut quality problem.So guide wheel, in silicon chip cutting process, plays an important role.
Existing guided wheel slot is all generally symmetrical V-type groove, as shown in Figure 3.Steel wire, in cutting process high speed rotation, causes guided wheel slot distortion to a side extruding, can cause the angle of groove to increase after cutting certain hour, and grooved changes that to cause steel wire left and right in groove not stopped moving, affects silicon chip cut quality and reduces guide wheel service life simultaneously.Figure 4 shows that steel wire force diagram in wire casing, because steel wire tripartite's discontinuity when spiral cabling on guided wheel slot, steel wire has individual active force to the right, so directly cause steel wire degree of wear difference in the groove of right side, a side of quick abrasion must restrict guide wheel life-time dilatation.After cutting number cutter, guide wheel slot type is shown in Fig. 5, and steel wire horizontally slips in wire casing, causes the abnormal conditions such as silicon chip outlet kerf, TTV.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of guide wheel with asymmetric guided wheel slot, use described guide wheel to carry out silicon chip cutting, can ensure the cut quality of silicon chip and in cutting process, even guide wheel coating abrasion, guided wheel slot still can meet optimum cutting angle within a certain period of time, thereby has increased the service life of guide wheel.
For solving the problems of the technologies described above, technical solution adopted in the utility model is: a kind of guide wheel with asymmetric guided wheel slot, comprise guide wheel body, the periphery of described guide wheel body is provided with guide wheel coating, in described guide wheel coating, be provided with along the guided wheel slot of guide wheel body circumference, it is characterized in that: described guided wheel slot is " V " type of left-right asymmetry, the limit, left side of guided wheel slot and the angle of vertical line are greater than the right edge of guided wheel slot and the angle of vertical line.
Preferably, the limit, left side of guided wheel slot and the angle of vertical line are A, and A is 30-40 °.
Preferably, the right edge of guided wheel slot and the angle of vertical line are B, and B is 0-25 °.
The beneficial effect that adopts technique scheme to produce is: cutting steel wire mainly contains 0.13mm, 0.12mm, 0.11mm specification at present, guided wheel slot angle is generally 60-90 degree symmetric angle, according to current broaching load, in cutting, in steel wire High Rotation Speed, can cause guide wheel coating abrasion in the direction extruding of guide wheel walking to steel wire, attrition value is generally at 70-90um, after wearing and tearing, guide wheel becomes " recessed " type groove, causes steel wire double swerve to affect cut quality.
The utility model diminishes the angle of the right edge of guided wheel slot and vertical line to 25 degree, when cutting, can not cause guide wheel to occur concave groove, and be still " V " type groove, because it is more vertical that the right side of guided wheel slot is divided, can greatly reduce with respect to vertical line attrition value, generally at 30-60um, so calculate and can not cause the groove of right side part to become level according to wear extent, thereby there will not be concave groove, while making steel wire cutting, do not rock, ensured silicon chip cut quality.In cutting process, even guide wheel coating abrasion, guided wheel slot still can meet optimum cutting angle within a certain period of time, thereby increases the service life of guide wheel, has improved silicon chip cut quality.
Brief description of the drawings
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structure for amplifying schematic diagram of the utility model guided wheel slot;
Fig. 3 is the structure for amplifying schematic diagram of the guided wheel slot of prior art;
Fig. 4 is the force diagram of steel wire in the guided wheel slot of prior art;
Fig. 5 be prior art guided wheel slot through wearing and tearing after structure for amplifying schematic diagram;
Wherein: 1, guide wheel body 2, guide wheel coating 3, guided wheel slot 4, steel wire 5, vertical line.
Detailed description of the invention
As shown in Figure 1-2, a kind of guide wheel with asymmetric guided wheel slot, comprises guide wheel body 1, and the periphery of described guide wheel body 1 is provided with guide wheel coating 2, in described guide wheel coating 2, is provided with along the guided wheel slot 3 of guide wheel body 1 circumference.Described guided wheel slot 3 is " V " type of left-right asymmetry, and the limit, left side of guided wheel slot 3 and the angle of vertical line 5 are greater than the right edge of guided wheel slot 3 and the angle of vertical line 5.Further, the limit, left side of guided wheel slot 3 and the angle of vertical line 5 are A, and A is 30-40 °; The angle of the right edge of guided wheel slot 3 and vertical line 5 is B, and B is 0-25 °, and the numerical value of A and B can also be adjusted as required.
Cutting steel wire mainly contains 0.13mm, 0.12mm, 0.11mm specification at present, the guided wheel slot angle of the v-groove is generally 60-90 degree symmetric angle, according to current broaching load, in cutting, in steel wire High Rotation Speed, can cause guide wheel coating abrasion in the direction extruding of guide wheel walking to steel wire, attrition value is generally at 70-90um, after wearing and tearing, guide wheel becomes " recessed " type groove, causes steel wire double swerve to affect cut quality.
The utility model diminishes the angle of the right edge of guided wheel slot and vertical line to 25 degree, when cutting, can not cause guide wheel to occur concave groove, and be still " V " type groove, because it is more vertical that the right side of guided wheel slot is divided, can greatly reduce with respect to vertical line attrition value, generally at 30-60um, so calculate and can not cause the groove of right side part to become level according to wear extent, thereby there will not be concave groove, while making steel wire cutting, do not rock, ensured silicon chip cut quality.In cutting process, even guide wheel coating abrasion, guided wheel slot still can meet optimum cutting angle within a certain period of time, thereby increases the service life of guide wheel, has improved silicon chip cut quality.
Applied specific case herein principle of the present utility model and embodiment thereof are set forth, the explanation of above embodiment is just with helping understand method of the present utility model and core concept thereof.It should be pointed out that for the person of ordinary skill of the art, under the prerequisite that does not depart from the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection domain of the utility model claim.
Claims (3)
1. one kind has the guide wheel of asymmetric guided wheel slot, comprise guide wheel body (1), the periphery of described guide wheel body (1) is provided with guide wheel coating (2), in described guide wheel coating (2), be provided with along the guided wheel slot (3) of guide wheel body (1) circumference, it is characterized in that: described guided wheel slot (3) is " V " type of left-right asymmetry, the angle of the limit, left side of guided wheel slot (3) and vertical line (5) is greater than the right edge of guided wheel slot (3) and the angle of vertical line (5).
2. the guide wheel with asymmetric guided wheel slot according to claim 1, is characterized in that: the angle of the limit, left side of guided wheel slot (3) and vertical line (5) is A, and A is 30-40 °.
3. the guide wheel with asymmetric guided wheel slot according to claim 2, is characterized in that: the angle of the right edge of guided wheel slot (3) and vertical line (5) is B, and B is 0-25 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320781132.3U CN203650722U (en) | 2013-12-03 | 2013-12-03 | Guide wheel with asymmetrical guide wheel grooves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320781132.3U CN203650722U (en) | 2013-12-03 | 2013-12-03 | Guide wheel with asymmetrical guide wheel grooves |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203650722U true CN203650722U (en) | 2014-06-18 |
Family
ID=50917156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320781132.3U Expired - Fee Related CN203650722U (en) | 2013-12-03 | 2013-12-03 | Guide wheel with asymmetrical guide wheel grooves |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203650722U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107584683A (en) * | 2017-09-29 | 2018-01-16 | 苏州市爱司特塑胶五金有限公司 | A kind of deflecting roller for photovoltaic processing |
| WO2020083607A1 (en) * | 2018-10-22 | 2020-04-30 | Siltronic Ag | Method and device for simultaneously separating a plurality of slices from a workpiece |
-
2013
- 2013-12-03 CN CN201320781132.3U patent/CN203650722U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107584683A (en) * | 2017-09-29 | 2018-01-16 | 苏州市爱司特塑胶五金有限公司 | A kind of deflecting roller for photovoltaic processing |
| WO2020083607A1 (en) * | 2018-10-22 | 2020-04-30 | Siltronic Ag | Method and device for simultaneously separating a plurality of slices from a workpiece |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140618 |