CN103489506A - Short circuit chip for surface gold-coated microwave circuit and manufacturing method thereof - Google Patents
Short circuit chip for surface gold-coated microwave circuit and manufacturing method thereof Download PDFInfo
- Publication number
- CN103489506A CN103489506A CN201310479364.8A CN201310479364A CN103489506A CN 103489506 A CN103489506 A CN 103489506A CN 201310479364 A CN201310479364 A CN 201310479364A CN 103489506 A CN103489506 A CN 103489506A
- Authority
- CN
- China
- Prior art keywords
- plating
- short
- circuit
- golden
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a short circuit chip for a surface gold-coated microwave circuit and a manufacturing method thereof. The short circuit chip comprises a ceramic substrate and an electrode layer, wherein the electrode layer is covered on the surface of the ceramic substrate, the electrode layer is composed of inner metal films and outer gold films, the inner metal films are plated on four or more surfaces of the ceramic substrate in a barrel plating or vibration plating mode by using a chemical plating method, and the outer gold films are plated on the four or more surfaces of the inner metal films in a barrel plating or vibration plating mode by using an electroplating method. The short circuit chip for the surface gold-coated microwave circuit, disclosed by the invention, is simple in structure, smooth in surface, good in welding resistance, simple in manufacturing and low in production cost, and has good microwave characteristics and reliability.
Description
Technical field
The present invention relates to a kind of microwave circuit short-circuit piece, especially relate to a kind of surface and cover golden microwave circuit short-circuit piece, the invention still further relates to this surface and cover the manufacture method of golden microwave circuit with short-circuit piece.
Background technology
Short-circuit piece for microwave circuit (Microwave Circuit Shorts is called for short MCS) is to adapt to microwave circuit module high frequency, highly integrated, microminiaturization, the new ceramics element that the requirement of low-power consumption and high reliability grows up.Microwave integrated circuit is more and more towards the future development of high frequency, and in circuit, increasing electronic component requires ground connection, or the different components in circuit requires to interconnect.
Chinese patent ZL200810026894.6 discloses a kind of structure and manufacture method of microwave film short-circuit piece.This patent provides two kinds to ceramic body, to carry out metallized method, a kind of is print process, another kind is magnetron sputtering method, its described print process is metallized to ceramic body, be gold paste on four or more surface of ceramic body or four surface printings, then sintering curing gold on surface of ceramic body coats forms short-circuit piece.The shortcoming of print process mainly contains two aspects, and the first, gold layer surface irregularity, the product lossy microwave is large; The second, metal structure is single gold layer, and the heat-resisting welding performance of this metal structure is bad, during the gold layer is easy to be melting into tin when soldering, thereby causes the poor reliability of product.Its described magnetron sputtering method is metallized to ceramic body, is that ceramic body carries out deposit metal films in the magnetron sputtering machine.The method must use expensive magnetron sputtering machine, so product cost is high, is unfavorable for promoting the use of of product.
Summary of the invention
First purpose of the present invention is to provide a kind of simple in structure, surfacing, and soldering resistance can be good, has good microwave property and reliability, manufactures simply, and golden microwave circuit short-circuit piece is covered on the surface that production cost is low.
Second purpose of the present invention provides a kind of surface to cover the manufacture method of golden microwave circuit with short-circuit piece.
First purpose of the present invention adopts following technical scheme:
Golden microwave circuit short-circuit piece is covered on a kind of surface, comprises ceramic substrate and the electrode layer that covers described ceramic substrate surface, and described electrode layer is comprised of inner layer metal film and outer gold film.
Further, described inner layer metal film is plated in four or more surface of described ceramic substrate with the method for form by chemical plating of barrel plating or the plating of shaking.
Further, described outer gold film is plated in four or more surface of described inner layer metal film with the form of barrel plating or the plating of shaking by electric plating method.
Further, the electrode layer of described ceramic substrate lower surface is for the ground connection welding, and the electrode layer of upper surface is for Bonding, and the remaining surface electrode layer all is connected with upper surface and lower surface electrode layer, plays the short circuit effect.
Further, described inner layer metal film is copper, nickel or ambrose alloy hybrid metal film.
Further, described ceramic substrate is alundum (Al2O3), aluminium nitride or beryllium oxide ceramics substrate, and preferentially selecting the purity that high frequency characteristics is good is to be more than or equal to 99.6% alundum (Al2O3) ceramic substrate.
Second purpose of the present invention adopts following technical scheme:
The manufacture method of golden microwave circuit short-circuit piece is covered on a kind of surface, comprises the steps:
Step 1: select the thickness ceramic substrate consistent with the thickness requirement of microwave film short-circuit piece, and pass through accurate scribing process, by ceramic substrate according to target the size cutting-up become ceramic blockage;
Step 2: by the ceramic blockage that obtains, with the form of barrel plating or the plating of shaking, the method by chemical plating all plates internal layer copper, nickel or ambrose alloy hybrid metal film uniformly on four or more surface of ceramic blockage;
Step 3: the ceramic blockage that is coated with copper, nickel or ambrose alloy hybrid metal film that will obtain with barrel plating or shake the plating form by electric plating method outer gold film on four or more plated surface of ceramic blockage, described outer gold film thickness is 0.01 micron-20 microns;
Step 4: will obtain the gold film pottery blockage that is coated with finally obtain surface after by cleaning, drying and cover golden microwave circuit short-circuit piece.
Compared with prior art, the first method inner layer metal film on four or more plated surface of described ceramic substrate with chemical plating of short-circuit piece for golden microwave circuit is covered on surface of the present invention, then plate again outer gold film on the inner layer metal film with electric plating method, thereby it is simple in structure with short-circuit piece to have guaranteed that golden microwave circuit is covered on surface of the present utility model, surfacing, soldering resistance can be good, has good microwave property and reliability, manufacture simply, production cost is low.
The accompanying drawing explanation
Fig. 1 is overall structure schematic diagram of the present invention;
The A-A profile that Fig. 2 is Fig. 1.
Embodiment
Below in conjunction with the drawings and specific embodiments, to the present invention, the present invention is described in detail.
Refer to Fig. 1 and Fig. 2, golden microwave circuit short-circuit piece is covered on a kind of surface, comprise ceramic substrate 1 and the electrode layer 2 that covers described ceramic substrate surface, described ceramic substrate 1 is alundum (Al2O3), aluminium nitride or beryllium oxide ceramics substrate, preferentially selecting the purity that high frequency characteristics is good is to be more than or equal to 99.6% alundum (Al2O3) ceramic substrate, described ceramic substrate 1, described electrode layer 2 is rectangular configuration, described electrode layer 2 is comprised of inner layer metal film 21 and outer gold film 22, described inner layer metal film 21 is copper, nickel or ambrose alloy hybrid metal film etc., the method of form by chemical plating with barrel plating or the plating of shaking is plated on described ceramic substrate 1 four or more surface, described inner layer metal film 21 four or more surfaces are coated with outer gold film 22 with the form of barrel plating or the plating of shaking by electric plating method, described outer gold film 22 thickness are 0.01 micron-20 microns.The electrode layer 2 of described ceramic substrate 1 lower surface is for the ground connection welding, and the electrode layer 2 of upper surface is for Bonding, and remaining surface electrode layer 2 all is connected with upper surface and lower surface electrode layer 2, plays the short circuit effect.
Embodiment 1
It is as follows by the manufacture method of short-circuit piece that golden microwave circuit is covered on the surface of the present embodiment: selecting thickness is 0.381mm, length and the wide 50.8mm that is, the alundum (Al2O3) ceramic substrate 1 that purity is 99.6%, according to target size becomes the ceramic cuboid of 3.90mm * 0.381mm * 0.25mm by accurate scribing process cutting-up, then pass through method internal layer copper metal film 21 on four or more plated surface of ceramic cuboid of chemical plating with the form of barrel plating, and then with the form of barrel plating by the outer gold film 22 of electric plating method 4 micron thick on four or more plated surface of the ceramic cuboid that is coated with internal layer copper metal film 21, last cleaning, drying obtains surface and covers golden microwave circuit short-circuit piece.
Embodiment 2
It is as follows by the manufacture method of short-circuit piece that golden microwave circuit is covered on the surface of the present embodiment: selecting thickness is 0.381mm, length and the wide 50.8mm that is, the alundum (Al2O3) ceramic substrate 1 that purity is 99.6%, according to target size becomes the ceramic cuboid of 1.5mm * 0.381mm * 0.30mm by accurate scribing process cutting-up, then pass through method internal layer copper metal film 21 on four or more plated surface of ceramic cuboid of chemical plating with the form of the plating of shaking, and then the form of plating to shake is by the outer gold film 22 of electric plating method 6 micron thick on four or more plated surface of the ceramic cuboid that is coated with internal layer copper metal film 21, last cleaning, drying obtains surface and covers golden microwave circuit short-circuit piece.
Embodiment 3
It is as follows by the manufacture method of short-circuit piece that golden microwave circuit is covered on the surface of the present embodiment: selecting thickness is 0.381mm, length and the wide 50.8mm that is, the alundum (Al2O3) ceramic substrate 1 that purity is 99.6%, according to target size becomes the ceramic cuboid of 1.2mm * 0.381mm * 0.25mm by accurate scribing process cutting-up, then pass through method internal layer nickel metal film 21 on four or more plated surface of ceramic cuboid of chemical plating with the form of barrel plating, and then the form of plating to shake is by the outer gold film 22 of electric plating method 8 micron thick on four or more plated surface of the ceramic cuboid that is coated with internal layer nickel metal film 21, last cleaning, drying obtains surface and covers golden microwave circuit short-circuit piece.
Embodiment 4
It is as follows by the manufacture method of short-circuit piece that golden microwave circuit is covered on the surface of the present embodiment: selecting thickness is 0.635mm, length and the wide 50.8mm that is, the aluminium nitride ceramic substrate 1 that purity is 99%, according to target size becomes the ceramic cuboid of 1.6mm * 0.45mm * 0.635mm by accurate scribing process cutting-up, then pass through method internal layer nickel metal film 21 on four or more plated surface of ceramic cuboid of chemical plating with the form of barrel plating, and then with the form of barrel plating by the outer gold film 22 of electric plating method 10 micron thick on four or more plated surface of the ceramic cuboid that is coated with internal layer nickel metal film 21, last cleaning, drying obtains surface and covers golden microwave circuit short-circuit piece.
Embodiment 5
It is as follows by the manufacture method of short-circuit piece that golden microwave circuit is covered on the surface of the present embodiment: selecting thickness is 0.254mm, length and the wide 50.8mm that is, the aluminium nitride ceramic substrate 1 that purity is 99%, according to target size becomes the ceramic cuboid of 0.254mm * 0.254mm * 0.254mm by accurate scribing process cutting-up, then pass through method internal layer copper metal film 21 on four or more plated surface of ceramic cuboid of chemical plating with the form of barrel plating, and then with the form of barrel plating by the outer gold film 22 of electric plating method 12 micron thick on four or more plated surface of the ceramic cuboid that is coated with internal layer copper metal film 21, last cleaning, drying obtains surface and covers golden microwave circuit short-circuit piece.
Embodiment 6
It is as follows by the manufacture method of short-circuit piece that golden microwave circuit is covered on the surface of the present embodiment: selecting thickness is 0.381mm, length and the wide 50.8mm that is, the beryllium oxide ceramics substrate 1 that purity is 98%, according to target size becomes the ceramic cuboid of 0.508mm * 0.254mm * 0.254mm by accurate scribing process cutting-up, then pass through method internal layer copper metal film 21 on four or more plated surface of ceramic cuboid of chemical plating with the form of the plating of shaking, and then with the form of barrel plating by the outer gold film 22 of electric plating method 14 micron thick on four or more plated surface of the ceramic cuboid that is coated with internal layer copper metal film 21, last cleaning, drying obtains surface and covers golden microwave circuit short-circuit piece.
Above in conjunction with most preferred embodiment, invention has been described, but the present invention is not limited to the embodiment of above announcement, and should contain the various modifications of carrying out according to essence of the present invention, equivalent combinations.
Claims (7)
1. golden microwave circuit short-circuit piece is covered on a surface, it is characterized in that: comprise ceramic substrate and the electrode layer that covers described ceramic substrate surface, described electrode layer is comprised of inner layer metal film and outer gold film.
2. golden microwave circuit short-circuit piece is covered on surface as claimed in claim 1, it is characterized in that: described inner layer metal film is plated in four or more surface of described ceramic substrate with the method for form by chemical plating of barrel plating or the plating of shaking.
3. golden microwave circuit short-circuit piece is covered on surface as claimed in claim 1, it is characterized in that: described outer gold film is plated in four or more surface of described inner layer metal film with the form of barrel plating or the plating of shaking by electric plating method.
4. golden microwave circuit short-circuit piece is covered on surface as claimed in claim 1, it is characterized in that: the electrode layer of described ceramic substrate lower surface is for the ground connection welding, the electrode layer of upper surface is for Bonding, and the remaining surface electrode layer all is connected with upper surface and lower surface electrode layer, plays the short circuit effect.
5. golden microwave circuit short-circuit piece is covered on surface as claimed in claim 1, it is characterized in that: described inner layer metal film is copper, nickel or ambrose alloy hybrid metal film.
6. golden microwave circuit short-circuit piece is covered on surface as claimed in claim 1, it is characterized in that: described ceramic substrate is alundum (Al2O3), aluminium nitride or beryllium oxide ceramics substrate, and selecting the purity that high frequency characteristics is good is to be more than or equal to 99.6% alundum (Al2O3) ceramic substrate.
7. the manufacture method of golden microwave circuit with short-circuit piece covered on a surface, comprises the steps:
Step 1: select the thickness ceramic substrate consistent with the thickness requirement of microwave film short-circuit piece, and pass through accurate scribing process, by ceramic substrate according to target the size cutting-up become ceramic blockage;
Step 2: by the ceramic blockage that obtains, with the form of barrel plating or the plating of shaking, the method by chemical plating all plates internal layer copper, nickel or ambrose alloy hybrid metal film uniformly on four or more surface of ceramic blockage;
Step 3: the ceramic blockage that is coated with copper, nickel or ambrose alloy hybrid metal film that will obtain with barrel plating or shake the plating form by electric plating method outer gold film on four or more plated surface of ceramic blockage, described gold film thickness is 0.01 micron-20 microns;
Step 4: will obtain the gold film pottery blockage that is coated with finally obtain surface after by cleaning, drying and cover golden microwave circuit short-circuit piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310479364.8A CN103489506A (en) | 2013-10-14 | 2013-10-14 | Short circuit chip for surface gold-coated microwave circuit and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310479364.8A CN103489506A (en) | 2013-10-14 | 2013-10-14 | Short circuit chip for surface gold-coated microwave circuit and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103489506A true CN103489506A (en) | 2014-01-01 |
Family
ID=49829667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310479364.8A Pending CN103489506A (en) | 2013-10-14 | 2013-10-14 | Short circuit chip for surface gold-coated microwave circuit and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103489506A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54107671A (en) * | 1978-02-10 | 1979-08-23 | Mitsubishi Electric Corp | Manufacture for semiconductor device |
| CN1049686A (en) * | 1989-08-22 | 1991-03-06 | 中国人民解放军装甲兵工程学院 | The method of roll plating of non-metallic surface |
| CN1832067A (en) * | 2006-02-15 | 2006-09-13 | 广州翔宇微电子有限公司 | Surface adhesive broadband microwave single-layer chip capacitor and manufacturing method thereof |
| CN101256852A (en) * | 2008-03-20 | 2008-09-03 | 广州翔宇微电子有限公司 | Thin film short circuit tablet for microwave circuit and manufacturing method thereof |
| CN101458975A (en) * | 2007-12-12 | 2009-06-17 | 清华大学 | Electronic element |
| CN203535979U (en) * | 2013-10-14 | 2014-04-09 | 广州天极电子科技有限公司 | Short circuit chip for surface gold-coated microwave circuit |
-
2013
- 2013-10-14 CN CN201310479364.8A patent/CN103489506A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54107671A (en) * | 1978-02-10 | 1979-08-23 | Mitsubishi Electric Corp | Manufacture for semiconductor device |
| CN1049686A (en) * | 1989-08-22 | 1991-03-06 | 中国人民解放军装甲兵工程学院 | The method of roll plating of non-metallic surface |
| CN1832067A (en) * | 2006-02-15 | 2006-09-13 | 广州翔宇微电子有限公司 | Surface adhesive broadband microwave single-layer chip capacitor and manufacturing method thereof |
| CN101458975A (en) * | 2007-12-12 | 2009-06-17 | 清华大学 | Electronic element |
| CN101256852A (en) * | 2008-03-20 | 2008-09-03 | 广州翔宇微电子有限公司 | Thin film short circuit tablet for microwave circuit and manufacturing method thereof |
| CN203535979U (en) * | 2013-10-14 | 2014-04-09 | 广州天极电子科技有限公司 | Short circuit chip for surface gold-coated microwave circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105931839B (en) | Ceramic electronic assembly and its manufacturing method | |
| US8130485B2 (en) | Ceramic electronic component and method for manufacturing the same | |
| CN107995781A (en) | A kind of aluminium nitride ceramics circuit board and preparation method | |
| CN102376449B (en) | Laminate type ceramic electronic component and manufacturing method therefor | |
| CN102683012B (en) | Ceramic electronic component | |
| WO2008023496A1 (en) | Laminated electronic component and method for manufacturing laminated electronic component | |
| JP2006295077A (en) | Ceramic chip electronic component and its manufacturing process | |
| JP2013069713A (en) | Chip type electronic component and manufacturing method of the same | |
| CN101714607B (en) | Piezoelectric ceramic element of metal aluminium electrode and preparation method thereof | |
| CN102496436A (en) | Method for manufacturing large-power thick-diaphragm resistor | |
| CN102256441A (en) | Metal substrate of heat conducting aluminium-based core and preparation method thereof | |
| CN102291928A (en) | Heat-conducting insulating aluminum nitride metal base plate and manufacturing method thereof | |
| CN106601480A (en) | High-temperature high-frequency polyimide sheet type film capacitor and manufacturing process thereof | |
| CN210491313U (en) | Metallized ceramic through hole substrate | |
| TWI636716B (en) | Process to produce multiple plane metalization on a ceramic substrate | |
| CN203535979U (en) | Short circuit chip for surface gold-coated microwave circuit | |
| JP2012064779A (en) | Electronic component | |
| CN109565939A (en) | Ceramic substrate and module having built-in electronic parts | |
| CN103489506A (en) | Short circuit chip for surface gold-coated microwave circuit and manufacturing method thereof | |
| CN107708333B (en) | Preparation method of copper-reducing circuit board of new energy automobile battery | |
| JP2009224651A (en) | Wiring board and manufacturing process therefor | |
| CN102800475B (en) | Vacuum sputtering multilayer metallic electrode disk ceramic capacitor and preparation method thereof | |
| CN102820111A (en) | Chip film fixed resistor and production method thereof | |
| JP2014143241A (en) | Multiple patterning wiring board | |
| CN106507612A (en) | A kind of method for making solid metal hole on substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140101 |