CN203445108U - Chip packaging and switching board and circuit board with chip packaging and switching board - Google Patents
Chip packaging and switching board and circuit board with chip packaging and switching board Download PDFInfo
- Publication number
- CN203445108U CN203445108U CN201320408517.5U CN201320408517U CN203445108U CN 203445108 U CN203445108 U CN 203445108U CN 201320408517 U CN201320408517 U CN 201320408517U CN 203445108 U CN203445108 U CN 203445108U
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- China
- Prior art keywords
- chip
- packing forms
- keyset
- substrate
- circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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Abstract
The utility model discloses a chip packaging and switching board and a circuit board with the chip packaging and switching board. The chip packaging and switching board includes a substrate which is provided with a plurality of chip bonding pads corresponding to a first packaging mode, a redistribution circuit and a plurality of switch pins corresponding to a second packaging mode, and the plurality of chip bonding pads are electrically connected with the plurality of switch pins through the redistribution circuit. According to the chip packaging and switching board, the plurality of chip bonding pads, the redistribution circuit and the plurality of switch pins are disposed on the chip packaging and switching board substrate, so that a semiconductor chip which is not easy to weld can be welded conveniently, and the semiconductor chip and a PCB which have different packaging modes can match with each other; the cost of developers is saved, standard packaging can be prepared, and universality of PCB and efficiency for preparing circuit boards are raised; and the chip packaging and switching board and the circuit board with the chip packaging and switching board can be widely applied to packaging and switching chips.
Description
Technical field
The utility model relates to electric solid state device, relates in particular to chip package keyset and with the circuit board of chip package keyset.
Background technology
PCB:Printed Circuit Board, Chinese is printed circuit board, claims again printed circuit board (PCB), printed substrate, is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.
The PCB of BGA:Ball Grid Array(ball grid array structure), it is a kind of package method that integrated circuit adopts organic support plate.
SOP:Small Out-Line Package, a kind of very common component encapsulation form.
DIP:Dual Inline-pin Package, is also dual in-line package technology, two lambda line encapsulation, a kind of component encapsulation form.
Development along with semiconductor technology, the function of one single chip from strength to strength, but the dimensional requirement for semiconductor chip is more and more less, the pin number of semiconductor chip unit are is also more and more accordingly, and this has just proposed stricter requirement to semiconductor chip and being connected of circuit board; The packing forms of semiconductor chip is also varied, and as DIP, SOP and BGA etc., the welding hole of pcb board or the dimensions of weld pad need match with the packing forms of semiconductor chip, and versatility is not enough.
Welding for the semiconductor chip of some packing forms in prior art need to be used special-purpose welding equipment just can complete, and the welding equipment of specialty needs high use cost conventionally, be unfavorable for developer, especially the developer's of individual or small business's tissue Application and Development; Semiconductor chip is varied, and prior art formulates for special package form the pcb board matching conventionally, but such inefficiency, versatility is not enough, easily causes the wasting of resources.
Utility model content
In order to solve the problems of the technologies described above, the purpose of this utility model is to provide a kind of semiconductor chip that can conveniently weld, can allow different packing forms and chip package keyset that pcb board matches and with the circuit board of chip package keyset.
The technical scheme that the utility model adopts is:
Chip package keyset, it comprises substrate, on described substrate, be provided with a plurality of chip bonding pads corresponding to the first packing forms, distribute electric line and corresponding to a plurality of switching pins of the second packing forms again, described a plurality of chip bonding pads are electrically connected by distribute electric line and a plurality of switching pin again.
Preferably, described the first packing forms is BGA packing forms, and described the second packing forms is SOP packing forms or DIP packing forms.
Preferably, on described chip bonding pad, be provided with the welding plate hole that runs through substrate, on described through hole, be provided with conducting medium.
Preferably, on described substrate, be provided with the positioning through hole that at least one runs through substrate.
Preferably, described substrate is flexible PCB.
Circuit board with chip package keyset, it comprises chip, chip package keyset and circuit board base plate, described chip comprises a plurality of chip pins, described chip package keyset comprises substrate, on described substrate, be provided with a plurality of chip bonding pads corresponding to the first packing forms, the electric line that distributes again and corresponding to a plurality of switching pins of the second packing forms, described a plurality of chip bonding pad is electrically connected by distribute electric line and a plurality of switching pin again, described circuit board base plate comprises a plurality of pin pads, the electric connection corresponding to a plurality of chip bonding pads of described a plurality of chip pin, described a plurality of switching pin and the corresponding electric connection of a plurality of pin pads.
Preferably, described the first packing forms is BGA packing forms, and described the second packing forms is SOP packing forms or DIP packing forms.
Preferably, on described substrate, be provided with the positioning through hole that at least one runs through substrate, on described circuit board base plate, be provided with capture pad corresponding and positioning through hole.
Preferably, described substrate is flexible PCB, and described circuit board base plate is pcb board.
The beneficial effects of the utility model are:
Chip package keyset is by arranging a plurality of chip bonding pads, distribute electric line and a plurality of switching pin again on chip package keyset substrate, make the semiconductor chip that is difficult for welding can conveniently weld, allow the semiconductor chip of different packing forms and pcb board match, saved developer's cost, can be made into standard packaging, improve the versatility of pcb board and the efficiency of circuit board making.
Circuit board with chip package keyset passes through the connection of chip, chip package keyset and circuit board base plate, make the semiconductor chip that is difficult for welding can conveniently weld, allow the semiconductor chip of different packing forms and pcb board match by chip package keyset, saved developer's cost, can be made into standard packaging, improve the versatility of pcb board and the efficiency of circuit board making.
In addition, chip package keyset is provided with the welding plate hole that runs through substrate on chip bonding pad, is provided with conducting medium on through hole, by welding, can make chip package keyset better be fixed on above pcb board; On chip package keyset, be provided with positioning through hole, be conducive to the precise positioning welding of chip package keyset and pcb board; Substrate adopts flexible PCB, makes keyset more frivolous, has saved space.
The utility model can be widely used in the encapsulation switching of chip.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, embodiment of the present utility model is described further:
Fig. 1 is the structural representation of a kind of embodiment of chip package keyset;
Fig. 2 is the structural representation with a kind of embodiment of circuit board of chip package keyset.
Embodiment
It should be noted that, in the situation that not conflicting, embodiment and the feature in embodiment in the application can combine mutually.
Preferably, the first packing forms is BGA packing forms, and the second packing forms is SOP packing forms or DIP packing forms.Because the chip of BGA packing forms needs professional tool or professional person to weld, small business or personal user want welding chip need to buy or rent professional tool, this may be a high cost concerning them, by keyset, the chip pin of BGA packing forms 21 is drawn, become SOP packing forms or the DIP packing forms of more easily welding, for user has brought huge facility.
Preferably, on chip bonding pad 12, be provided with the welding plate hole 15 that runs through substrate 11, on through hole, be provided with conducting medium.Be conducive to chip package keyset 10 and be connected better chip and circuit board, make the overall structure of chip, encapsulation keyset and circuit board base plate 30 more firm.
In the present embodiment, on switching pin 14, be also provided with the switching pin through hole 17 that runs through substrate, in the time of welding, scolding tin can connect chip package keyset 10 and circuit board base plate 30 by through hole, makes overall structure more firm, and electric conductivity is better.
Preferably, on substrate 11, be provided with at least one positioning through hole that runs through substrate 11 16.Be conducive to the corresponding connection of chip package keyset 10 and circuit board base plate 30.
Preferably, substrate 11 is flexible PCB.Use flexible PCB to make chip package keyset 10 more frivolous.
Circuit board with chip package keyset, it comprises chip 20, chip package keyset 10 and circuit board base plate 30, chip 20 comprises a plurality of chip pins 21, chip package keyset 10 comprises substrate 11, on substrate 11, be provided with a plurality of chip bonding pads 12 corresponding to the first packing forms, the electric line that distributes again 13 and corresponding to a plurality of switching pins 14 of the second packing forms, a plurality of chip bonding pads 12 are electrically connected with a plurality of switching pins 14 by the electric line 13 that distributes again, circuit board base plate 30 comprises a plurality of pin pads, a plurality of chip pins 21 and the corresponding electric connection of a plurality of chip bonding pads 12, a plurality of switching pins 14 and the corresponding electric connection of a plurality of pin pads.The first packing forms can be that some envelopes that are difficult to welding or need professional tool could facilitate weld turn form, can be also that some are non-standard or use fewer packing forms, as BGA, BQFP or PGA etc.; The second packing forms can be chip 20 packing forms of more common or more convenient welding, as SOP, DIP or PLCC etc.The distributed circuit wiring of chip package keyset 10 and the quantity of switching pin 14 can need customization according to user's actual use, during use, can or use professional tool by professional person, unified first the welding corresponding to chip package keyset 10 of the chip 20 of the first packing forms, user only need use the welded encapsulation mode of common soldering appliance or the standard of use can complete the correspondence welding of chip 20 and circuit board base plate 30.
Preferably, the first packing forms is BGA packing forms, and the second packing forms is SOP packing forms or DIP packing forms.
Preferably, on substrate 11, be provided with at least one positioning through hole that runs through substrate 11 16, on circuit board base plate 30, be provided with capture pad corresponding and positioning through hole 16.
Preferably, substrate 11 is flexible PCB, and circuit board base plate 30 is pcb board.
More than that better enforcement of the present utility model is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to the utility model spirit, and the distortion that these are equal to or replacement are all included in the application's claim limited range.
Claims (9)
1. chip package keyset, it is characterized in that, it comprises substrate, on described substrate, be provided with a plurality of chip bonding pads corresponding to the first packing forms, distribute electric line and corresponding to a plurality of switching pins of the second packing forms again, described a plurality of chip bonding pads are electrically connected by distribute electric line and a plurality of switching pin again.
2. chip package keyset according to claim 1, is characterized in that, described the first packing forms is BGA packing forms, and described the second packing forms is SOP packing forms or DIP packing forms.
3. chip package keyset according to claim 2, is characterized in that, is provided with the welding plate hole that runs through substrate on described chip bonding pad, on described through hole, is provided with conducting medium.
4. according to the chip package keyset described in claim 1～3 any one, it is characterized in that, on described substrate, be provided with the positioning through hole that at least one runs through substrate.
5. according to the chip package keyset described in claim 1～3 any one, it is characterized in that, described substrate is flexible PCB.
6. with the circuit board of chip package keyset, it is characterized in that, it comprises chip, chip package keyset and circuit board base plate, described chip comprises a plurality of chip pins, described chip package keyset comprises substrate, on described substrate, be provided with a plurality of chip bonding pads corresponding to the first packing forms, the electric line that distributes again and corresponding to a plurality of switching pins of the second packing forms, described a plurality of chip bonding pad is electrically connected by distribute electric line and a plurality of switching pin again, described circuit board base plate comprises a plurality of pin pads, the electric connection corresponding to a plurality of chip bonding pads of described a plurality of chip pin, described a plurality of switching pin and the corresponding electric connection of a plurality of pin pads.
7. the circuit board with chip package keyset according to claim 6, is characterized in that, described the first packing forms is BGA packing forms, and described the second packing forms is SOP packing forms or DIP packing forms.
8. the circuit board with chip package keyset according to claim 7, is characterized in that, is provided with the positioning through hole that at least one runs through substrate on described substrate, is provided with capture pad corresponding and positioning through hole on described circuit board base plate.
9. the circuit board with chip package keyset according to claim 8, is characterized in that, described substrate is flexible PCB, and described circuit board base plate is pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320408517.5U CN203445108U (en) | 2013-07-10 | 2013-07-10 | Chip packaging and switching board and circuit board with chip packaging and switching board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320408517.5U CN203445108U (en) | 2013-07-10 | 2013-07-10 | Chip packaging and switching board and circuit board with chip packaging and switching board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203445108U true CN203445108U (en) | 2014-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320408517.5U Expired - Fee Related CN203445108U (en) | 2013-07-10 | 2013-07-10 | Chip packaging and switching board and circuit board with chip packaging and switching board |
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| CN (1) | CN203445108U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105608257A (en) * | 2015-12-15 | 2016-05-25 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | Method for generating large-scale optimal pinouts in BGA package based on genetic algorithm |
| CN107186119A (en) * | 2016-03-14 | 2017-09-22 | 南京理工大学 | A kind of SOP types paster pin turns DIP pin arrangements |
| CN108072469A (en) * | 2017-11-21 | 2018-05-25 | 麒盛科技股份有限公司 | For the circuit board mounting structure of inching sensor |
| CN108120471A (en) * | 2016-11-28 | 2018-06-05 | 大陆汽车投资（上海）有限公司 | Detection device and vehicle speed variation system |
| CN108183109A (en) * | 2018-01-03 | 2018-06-19 | 京东方科技集团股份有限公司 | Display device, array substrate, integrated circuit panel and preparation method thereof |
| CN108695295A (en) * | 2018-07-27 | 2018-10-23 | 上海泽丰半导体科技有限公司 | A kind of chip change-over panel and its manufacturing method |
| CN108808285A (en) * | 2017-05-05 | 2018-11-13 | 富顶精密组件（深圳）有限公司 | Electric coupler component |
| CN109379841A (en) * | 2018-10-29 | 2019-02-22 | Oppo（重庆）智能科技有限公司 | Electronic equipment and its board structure of circuit and BGA Package mould group |
| CN110933859A (en) * | 2019-11-26 | 2020-03-27 | 嘉兴军胜电子科技有限公司 | Method for correcting BGA design through BGA adapting circuit board |
| CN111315139A (en) * | 2020-02-29 | 2020-06-19 | 成都易信达科技股份有限公司 | Welding auxiliary board and welding method for water meter Internet of things chip |
| CN111968942A (en) * | 2020-08-24 | 2020-11-20 | 浙江集迈科微电子有限公司 | Interconnecting process for interconnecting radio frequency modules on side walls of adapter plates |
-
2013
- 2013-07-10 CN CN201320408517.5U patent/CN203445108U/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105608257A (en) * | 2015-12-15 | 2016-05-25 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | Method for generating large-scale optimal pinouts in BGA package based on genetic algorithm |
| CN105608257B (en) * | 2015-12-15 | 2018-12-21 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | The optimal pin of extensive BGA package based on genetic algorithm is distributed generation method |
| CN107186119A (en) * | 2016-03-14 | 2017-09-22 | 南京理工大学 | A kind of SOP types paster pin turns DIP pin arrangements |
| CN108120471A (en) * | 2016-11-28 | 2018-06-05 | 大陆汽车投资（上海）有限公司 | Detection device and vehicle speed variation system |
| CN108808285A (en) * | 2017-05-05 | 2018-11-13 | 富顶精密组件（深圳）有限公司 | Electric coupler component |
| CN108072469A (en) * | 2017-11-21 | 2018-05-25 | 麒盛科技股份有限公司 | For the circuit board mounting structure of inching sensor |
| CN108183109A (en) * | 2018-01-03 | 2018-06-19 | 京东方科技集团股份有限公司 | Display device, array substrate, integrated circuit panel and preparation method thereof |
| CN108183109B (en) * | 2018-01-03 | 2023-03-14 | 京东方科技集团股份有限公司 | Display device, array substrate, panel of integrated circuit and manufacturing method of panel |
| CN108695295A (en) * | 2018-07-27 | 2018-10-23 | 上海泽丰半导体科技有限公司 | A kind of chip change-over panel and its manufacturing method |
| CN109379841A (en) * | 2018-10-29 | 2019-02-22 | Oppo（重庆）智能科技有限公司 | Electronic equipment and its board structure of circuit and BGA Package mould group |
| CN110933859A (en) * | 2019-11-26 | 2020-03-27 | 嘉兴军胜电子科技有限公司 | Method for correcting BGA design through BGA adapting circuit board |
| CN111315139A (en) * | 2020-02-29 | 2020-06-19 | 成都易信达科技股份有限公司 | Welding auxiliary board and welding method for water meter Internet of things chip |
| CN111315139B (en) * | 2020-02-29 | 2022-05-03 | 成都易信达科技股份有限公司 | Welding auxiliary board and welding method for water meter Internet of things chip |
| CN111968942A (en) * | 2020-08-24 | 2020-11-20 | 浙江集迈科微电子有限公司 | Interconnecting process for interconnecting radio frequency modules on side walls of adapter plates |
| CN111968942B (en) * | 2020-08-24 | 2023-08-04 | 浙江集迈科微电子有限公司 | Interconnection technology for interconnecting radio frequency modules on side walls of adapter plates |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140219 Termination date: 20150710 |
|
| EXPY | Termination of patent right or utility model |