CN203350556U - Array substrate motherboard and array substrate lead inspection device - Google Patents
Array substrate motherboard and array substrate lead inspection device Download PDFInfo
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- CN203350556U CN203350556U CN 201320488241 CN201320488241U CN203350556U CN 203350556 U CN203350556 U CN 203350556U CN 201320488241 CN201320488241 CN 201320488241 CN 201320488241 U CN201320488241 U CN 201320488241U CN 203350556 U CN203350556 U CN 203350556U
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Abstract
The utility model provides an array substrate motherboard and an array substrate lead inspection device, which belong to the technical field of display and can solve the problem that the conventional array substrates and the conventional array substrate lead inspection device cannot cooperate for lead inspection. The array substrate motherboard comprises a plurality of array substrates, and the same types of leads of the neighboring array substrates are connected by lead-connecting mechanisms. By means of the lead-connecting mechanisms, the array substrates to be inspected can be simultaneously connected and inspected, and thereby the problem that the array substrates to be inspected and the array substrate lead inspection device cannot match each other for lead inspection due to the small size of the array substrate to be inspected or the array substrate lead inspection device is solved. The array substrate motherboard and the array substrate lead inspection device are utilized to perform lead inspection to determine the unfavorable open circuit and short circuit conditions of lead structures, thus having an early warning effect on produced leads, and moreover, by repairing poor spots, the yield of produced leads can be increased.
Description
Technical field
The utility model belongs to the display technique field, is specifically related to a kind of array base palte motherboard and array base palte lead-in wire pick-up unit.
Background technology
In Thin Film Transistor-LCD (TFT-LCD) preparation technology after the preparation that completes gate line on array base palte and data line, need to be detected lead-in wire, determine that as soon as possible pin configuration opens circuit and the unfavorable condition of short circuit, play the effect of early warning to producing line, and, by being keeped in repair of bad point, improve the product yield that produces line.
As shown in Figure 1, traditional array base palte motherboard 12 comprises a plurality of isolated array base paltes (after cutting, each array base palte forms independently for the array base palte of display device).It is that one group of lead-in wire that carries out array base palte 3 detects that general array base palte lead-in wire pick-up unit is used two sensor units 1,2, one of them sensor unit 1 sends detection signal for the end at lead-in wire, another sensor unit 2 receives detection signal at the other end of lead-in wire, the detection signal power and the waveform that by signal processing unit (not illustrating on figure) analysis, receive, whether the lead-in wire detected for judgement exists extremely.
During test, one group of sensor unit 1,2 can be scanned along the lead-in wire direction of the array base palte 3 perpendicular to be detected, can draw the whether bad conclusion of certain lead-in wire of array base palte 3 after having scanned.
As shown in Figure 2, because the detection of array base palte need have sensor unit to scan above array base palte, and the size of sensor unit 1,2 own, distance between meeting limiting sensor unit 1,2, this distance has also just limited the minimum dimension (minimum detects size) that this array base palte lead-in wire pick-up unit can detect, on the array base palte that causes array base palte lead-in wire pick-up unit to be applied to being less than its minimum to detect size.
At present array base palte lead-in wire pick-up unit the small size array base palte detect application in gate line is opened circuit and detects and be of a size of 7 inches with the short circuit minimum, data line is opened circuit and detects and be of a size of 10.1 inches with the short circuit minimum, for most of small-size products, as 7 feet and following product of current main flow, can't in technique, apply such array base palte lead-in wire pick-up unit and go between and detect.
The utility model content
The purpose of this utility model is to solve existing array base palte due to the less problem that can't go between and detect of self size, and a kind of array base palte motherboard that goes between and detect is provided.
The technical scheme that solution the utility model technical matters adopts is a kind of array base palte motherboard, and this array base palte motherboard comprises: a plurality of array base paltes, the lead-in wire of the same type of adjacent array base palte is connected by lead-in wire bindiny mechanism.
Array base palte motherboard of the present utility model, by lead-in wire bindiny mechanism is set between array base palte, the lead-in wire of array base palte is connected, can be simultaneously to the detection that goes between of plural array base palte, overcome due to the array base palte size less can't with the array base palte problem that the size of pick-up unit is complementary that goes between, can be according to the go between number of the array base palte that the size Selection of pick-up unit detects of array base palte simultaneously, the product that realization is produced line to the small size array base palte detection that goes between, determine that pin configuration opens circuit and the unfavorable condition of short circuit, play the effect of early warning to producing line, and by being keeped in repair bad point, improve the product yield that produces line.
Preferably, described lead-in wire bindiny mechanism comprises: switch element, for conducting and the disconnection of the lead-in wire of the same type of controlling adjacent array base palte; The switch element control line, controlled for the break-make to switch element, and be connected reception control signal with switch element control line input end.
Preferably, switch element comprises the thin film transistor switch that a plurality of and described lead-in wire of the same type is connected.
Preferably, the array base palte of described array base palte motherboard is arranged as m * n array base palte matrix, and wherein, m, n are positive integer, and m >=2, n >=2.
Preferably, the described lead-in wire of the same type connected by lead-in wire bindiny mechanism comprises one or more in data line, gate line, public electrode wire.
Another purpose of the present utility model is to solve existing array base palte lead-in wire pick-up unit due to the problem that the reason of self size can't detect the carrying out lead-in wire of the less array base palte of size, and a kind of array base palte array base palte that detects pick-up unit that goes between that go between that can be less to size is provided.
The technical scheme that solution the utility model technical matters adopts is a kind of array base palte lead-in wire pick-up unit, comprising:
Lead-in wire bindiny mechanism, for conducting and the disconnection of the lead-in wire of the same type of controlling adjacent array base palte;
Lead-in wire testing agency, send detection signal and receive detection signal for pair array substrate lead-in wire, and the detection signal that analysis receives is with judgement lead-in wire state.
Preferably, the described testing agency that goes between comprises: two sensor units for detection of lead-in wire, one of them sensor unit sends detection signal for an end of the lead-in wire of the array base palte in conducting, and another sensor unit receives detection signal for the other end of the lead-in wire of the array base palte in conducting; Signal processing unit, described signal processing unit is processed to judge the failure condition of lead-in wire for the detection signal that described sensor unit is received.
Preferably, described lead-in wire bindiny mechanism comprises: switch element, for conducting and the disconnection of the lead-in wire of the same type of controlling adjacent array base palte; The switch element control line, controlled for the break-make to switch element, and be connected reception control signal with switch element control line input end.
Preferably, also comprise: the switch element control gear, with described switch element control line input end, be connected, for input control signal, control the state of lead-in wire bindiny mechanism.
Preferably, described switch element control gear comprises: driver element and the support that is connected in this driver element, and an end of described support is connected with for the output probe to switch element control line output control signal; Described support is transferred to switch element control line input end by control signal under described driver element drives.
Further preferably, also comprise for carrying the board of array base palte to be detected; Described driver element is arranged at described board below, and is connected with described board by spring assembly; Be provided with air bag between described driver element and described board, described driver element sends inflation signal or disappointing signal to described air bag.
Preferably, described support rotatably is connected on described driver element.
Preferably, described output probe is flexible output probe.
Array base palte lead-in wire pick-up unit of the present utility model, by lead-in wire, bindiny mechanism connects the lead-in wire between the adjacent array substrate, can be simultaneously to the detection that goes between of plural array base palte, now, lead-in wire conducting by the switch element control gear by array base palte to be detected, while by lead-in wire testing agency, the lead-in wire of the array base palte of conducting being detected, make array base palte lead-in wire pick-up unit not be subject to the restriction of array base palte size, can be according to the go between size Selection number of detection arrays substrate simultaneously of pick-up unit of array base palte.The product that by above-mentioned array base palte lead-in wire pick-up unit, can produce line to the small size array base palte detection that go between, determine that pin configuration opens circuit and the unfavorable condition of short circuit, play the effect of early warning to producing line, and, by being keeped in repair of bad point, improve the product yield that produces line.
The accompanying drawing explanation
Fig. 1: the detection schematic diagram of traditional array base palte and lead-in wire pick-up unit.
Fig. 2: traditional array base palte and the non-detectable schematic diagram of lead-in wire pick-up unit.
Fig. 3: the detection schematic diagram of array base palte motherboard of the present utility model and lead-in wire pick-up unit.
Fig. 4: the structural representation of the switch element control gear of the array base palte lead-in wire pick-up unit provided of the present utility model.
Wherein: 1. sensor unit; 2. sensor unit; 3. array base palte; 4. data line; 5. gate line; 6. data switch unit; 7. gate switch unit; 8. data switch elementary control line; 9. gate switch elementary control line; 10. data switch elementary control line input end; 11. gate switch elementary control line input end; 12. array base palte motherboard; 13. board; 14. output probe; 15. support; 16. air bag; 17. spring assembly; 18. driver element; 19. control signal input line.
Embodiment
For making those skilled in the art understand better the technical solution of the utility model, below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
The present embodiment provides a kind of array base palte motherboard 12, and this array base palte motherboard 12 comprises: a plurality of array base paltes 3, the lead-in wire of the same type of adjacent array base palte 3 is connected by lead-in wire bindiny mechanism.Preferably, described lead-in wire of the same type comprises one or more in data line 4, gate line 5, public electrode wire.The present embodiment is to take that the carrying out of data line 4 and gate line 5 detected is the example introduction, in practical application, can the lead-in wire of other type be detected, for example, and public electrode wire etc., its method is identical, and array base palte line detection apparatus used is similar.
As shown in Figure 3, array base palte motherboard 12 comprises four array base paltes 3, array base palte to be detected 3 is arranged as on board 13 to 2 * 2 matrixes, certainly, also can be arranged as the matrix of other shape, for example, m * n array base palte matrix, wherein, m, n are positive integer, and m >=2, n >=2, the row matrix columns depends on the size of array base palte motherboard 12; As long as can make array base palte lead-in wire pick-up unit complete the detection of data line 4 and gate line 5, the arrangement mode of array base palte 3 can be selected as required; Preferably, m=n, now, the arrangement of array base palte 3 is convenient.
When array base palte 3 to be detected being pressed to 4 one-tenth of data lines when transversely arranged, be provided with lead-in wire bindiny mechanism between array base palte 3 to be detected at two row, for data line 4 connections (data line 4 of adjacent array substrate 3 connects one to one) of 3 of the array base paltes by be detected; Preferably, described lead-in wire bindiny mechanism is data switch unit 6; Preferably, described data switch unit 6 comprises a plurality of thin film transistor switch that are connected with data line, the source electrode of each thin film transistor switch connects the data line 4 of the array base palte 3 of a side, drain electrode connects the data line 4 of the array base palte 3 of opposite side, the grid connection data switch element control line 8 of thin film transistor switch.Above-mentioned data switch unit 6 is connected successively, and be connected with data switch elementary control line input end 10.
Lead-in wire bindiny mechanism is set, for gate line 5 connections (gate line 5 of adjacent array substrate 3 connects one to one) of 3 of the array base paltes by be detected between array base palte 3 to be detected at two row; Preferably, described lead-in wire bindiny mechanism is gate switch unit 7; Preferably, described gate switch unit 7 comprises a plurality of thin film transistor switch that are connected with gate line, the source electrode of each thin film transistor switch connects the gate line 5 of the array base palte 3 of a side, drain electrode connects the gate line 5 of the array base palte 3 of opposite side, and the grid of thin film transistor switch connects gate switch elementary control line 9.Above-mentioned gate switch unit 7 is connected successively, and be connected with gate switch elementary control line input end 11.
Break-make can be selected according to the needs of test in above-mentioned data switch unit 6 and gate switch unit 7 when detecting.Due to above-mentioned switch element, in the normal off state, other that can pair array substrate 3 detects and produces interfere with or compromise.
Preferably, data switch elementary control line input end 10 and gate switch elementary control line input end 11 are arranged at intervals at the position at four angles of array base palte matrix to be detected, and Convenient switch unit controls mechanism carries out the transmission of control signal.
Preferably, above-mentioned lead-in wire bindiny mechanism also can adopt a kind of simpler structure to realize, can be with better simply technique preparation in the preparation technology of array base palte, the gate line that completes the different array base paltes of gate line 5(of array base palte in preparation is not connected) after, deposition one deck plated metal different from gate metal, thereby the gate line of different array base paltes 5 is connected, form disposable lead-in wire bindiny mechanism, after test completes, the plated metal etching is removed and got final product.
Equally, above-mentioned disposable lead-in wire bindiny mechanism also can be applied to the connection between the data line 4 of adjacent array substrate 3.
Array base palte motherboard 12 of the present utility model, by lead-in wire bindiny mechanism is set between array base palte 3, the data line of array base palte 34 or gate line 5 are connected, can be simultaneously to the detection that goes between of plural array base palte 3, overcome due to array base palte 3 sizes less can't with the array base palte problem that the size of pick-up unit is complementary that goes between, the number of the array base palte 3 simultaneously detected according to the size Selection of array base palte lead-in wire pick-up unit, the product that realization is produced line to the small size array base palte detection that goes between, determine that pin configuration opens circuit and the unfavorable condition of short circuit, play the effect of early warning to producing line, and by being keeped in repair bad point, improve the product yield that produces line.
The present embodiment provides a kind of array base palte lead-in wire pick-up unit, comprising: lead-in wire bindiny mechanism, for conducting and the disconnection of the lead-in wire of the same type of controlling adjacent array base palte;
Lead-in wire testing agency, send detection signal and receive detection signal for pair array substrate lead-in wire, and analyze the state of the detection signal judgement lead-in wire received, and specifically sees the lead-in wire testing agency in above-mentioned enforcement;
Above-mentioned lead-in wire bindiny mechanism comprises: switch element, for conducting and the disconnection of the lead-in wire of the same type of controlling adjacent array base palte; The switch element control line, controlled for the break-make to switch element, and be connected reception control letter with switch element control line input end, and concrete structure is referring to described in the above embodiments.
Above-mentioned lead-in wire testing agency, comprise: two sensor units for detection of lead-in wire, one of them sensor unit sends detection signal for an end of the lead-in wire of the array base palte in conducting, and another sensor unit receives detection signal for the other end of the lead-in wire of the array base palte in conducting;
Signal processing unit, described signal processing unit is processed to judge the failure condition of lead-in wire for the detection signal that sensor unit is received, described signal processing unit can be a main frame.
Preferably, array base palte lead-in wire pick-up unit also comprises: the switch element control gear, with switch element control line input end, be connected, and for input control signal, control the state of lead-in wire bindiny mechanism.
As shown in Figure 4, above-mentioned switch element control gear comprises: for the board 13 that carries array base palte motherboard 12 to be detected; Driver element 18, this driver element 18 is arranged at board 13 belows, and with board 13, is connected by spring assembly 17, certain, this driver element 18 also can not arrange with board 13 on, be separately set on other stationary installation;
Be connected in the support 15 of this driver element 18, an end of support 15 is connected with output probe 14, and this output probe 14 is connected with control signal input line 19; Described support 15 is transferred to data switch elementary control line input end 10 or gate switch elementary control line input end 11 by control signal under driver element 18 drives.Preferably, output probe 14 is flexible output probe, like this due to have flexibility (can produce deformation) with data switch elementary control line input end 10, be connected or gate switch elementary control line input end 11 contact repeatedly after, still can keep contacting preferably effect.
Be provided with air bag 16 between driver element 18 and board 13, driver element 18 is inflated by send the inflation signal to air bag 16, spring assembly 17 stretches, make driver element 18 drive support 15 and move downward, output probe 14 contacts with data switch elementary control line input end 10 or gate switch elementary control line input end 11;
By send the signal that loses heart to air bag 16, lost heart, spring assembly 17 is retracted, and makes driver element 18 drive support 15 and moves upward, and output probe 14 separates with data switch elementary control line input end 10 or gate switch elementary control line input end 11.
Preferably, described support 15 is rotatable to be connected on driver element 18, can better prevent the impact that this structure is placed and taken out glass, support 15 can be arranged to rotatable mode, when not testing, support 15 rotates to board 13 outsides, after having placed glass, support 15 rotates to board 13 inboards to carry out contacting with data switch elementary control line input end 10 or gate switch elementary control line input end 11 on array base palte 3, thus transfer control signal.
The course of work that above-mentioned array base palte lead-in wire pick-up unit detects data line 4 is: the voltage signal that control signal input line 19 sends reaches data switch elementary control line input end 10 through the switch element control gear, make 6 conductings of data switch unit, it is the data line 4 corresponding conducting one by one of adjacent array substrate 3, two sensor units of lead-in wire testing agency, along the direction vertical with data line 4, scanned, the detection signal power and the waveform that by the signal processing unit analysis, receive, whether the lead-in wire that judgement detects exists extremely.
The course of work that above-mentioned array base palte lead-in wire pick-up unit detects gate line 5 is: the voltage signal that control signal input line 19 sends reaches gate switch elementary control line input end 11 through the switch element control gear, make 11 conductings of gate switch unit, it is the gate line 5 corresponding conducting one by one of adjacent array substrate 3, two sensor units of lead-in wire testing agency, along the direction vertical with gate line 5, scanned, the detection signal power and the waveform that by the signal processing unit analysis, receive, whether the lead-in wire that judgement detects exists extremely.
Array base palte lead-in wire pick-up unit of the present utility model, by lead-in wire bindiny mechanism, the data line 4 between adjacent array substrate 3 or gate line 5 are connected, can be simultaneously to the detection that goes between of plural array base palte 3, now, lead-in wire conducting by the switch element control gear by array base palte to be detected 3, while by lead-in wire testing agency, the lead-in wire of the array base palte 3 of conducting being detected, make array base palte lead-in wire pick-up unit not be subject to the restriction of array base palte 3 sizes, can be according to the go between size Selection number of detection arrays substrate 3 simultaneously of pick-up unit of array base palte.The product that by above-mentioned array base palte lead-in wire pick-up unit, can produce line to the small size array base palte detection that go between, determine that pin configuration opens circuit and the unfavorable condition of short circuit, play the effect of early warning to producing line, and, by bad point is keeped in repair, improve the product yield that produces line.
Be more than the structure be positioned on array base palte 3 that bindiny mechanism is embodiment 1 that goes between be example, if but lead-in wire bindiny mechanism be independently, for connected also being fine of lead-in wire of the array base palte by independent.
Be understandable that, above embodiment is only the illustrative embodiments adopted for principle of the present utility model is described, yet the utility model is not limited to this.For those skilled in the art, in the situation that do not break away from spirit of the present utility model and essence, can make various modification and improvement, these modification and improvement also are considered as protection domain of the present utility model.
Claims (13)
1. an array base palte motherboard, is characterized in that, this array base palte motherboard comprises: a plurality of array base paltes, the lead-in wire of the same type of adjacent array base palte is connected by lead-in wire bindiny mechanism.
2. array base palte motherboard as claimed in claim 1, is characterized in that,
Described lead-in wire bindiny mechanism comprises: switch element, for conducting and the disconnection of the lead-in wire of the same type of controlling adjacent array base palte; The switch element control line, controlled for the break-make to switch element, and be connected reception control signal with switch element control line input end.
3. array base palte motherboard as claimed in claim 2, is characterized in that,
Switch element comprises the thin film transistor switch that a plurality of and described lead-in wire of the same type is connected.
4. array base palte motherboard as claimed in claim 1, is characterized in that,
The array base palte of described array base palte motherboard is arranged as m * n array base palte matrix, and wherein, m, n are positive integer, and m >=2, n >=2.
5. described array base palte motherboard as arbitrary as claim 1-4, is characterized in that,
The described lead-in wire of the same type connected by lead-in wire bindiny mechanism comprises one or more in data line, gate line, public electrode wire.
6. an array base palte lead-in wire pick-up unit, is characterized in that, comprising:
Lead-in wire bindiny mechanism, for conducting and the disconnection of the lead-in wire of the same type of controlling adjacent array base palte;
Lead-in wire testing agency, send detection signal and receive detection signal for pair array substrate lead-in wire, and the detection signal that analysis receives is with judgement lead-in wire state.
7. array base palte lead-in wire pick-up unit as claimed in claim 6, is characterized in that,
The described testing agency that goes between comprises: two sensor units for detection of lead-in wire, one of them sensor unit sends detection signal for an end of the lead-in wire of the array base palte in conducting, and another sensor unit receives detection signal for the other end of the lead-in wire of the array base palte in conducting; Signal processing unit, described signal processing unit is processed to judge the failure condition of lead-in wire for the detection signal that described sensor unit is received.
8. array base palte lead-in wire pick-up unit as claimed in claim 6, is characterized in that,
Described lead-in wire bindiny mechanism comprises: switch element, for conducting and the disconnection of the lead-in wire of the same type of controlling adjacent array base palte; The switch element control line, controlled for the break-make to switch element, and be connected reception control signal with switch element control line input end.
9. array base palte lead-in wire pick-up unit as claimed in claim 8, is characterized in that,
Also comprise: the switch element control gear, with described switch element control line input end, be connected, for input control signal, control the state of lead-in wire bindiny mechanism.
10. array base palte as claimed in claim 9 lead-in wire pick-up unit, it is characterized in that, described switch element control gear, comprise: driver element and the support that is connected in this driver element, an end of described support is connected with for the output probe to switch element control line output control signal; Described support is transferred to switch element control line input end by control signal under described driver element drives.
11. array base palte lead-in wire pick-up unit as claimed in claim 10, is characterized in that, also comprises for carrying the board of array base palte to be detected; Described driver element is arranged at described board below, and is connected with described board by spring assembly; Be provided with air bag between described driver element and described board, described driver element sends inflation signal or disappointing signal to described air bag.
12. array base palte lead-in wire pick-up unit as claimed in claim 10 is characterized in that described support rotatably is connected on described driver element.
13. array base palte lead-in wire pick-up unit as claimed in claim 10, is characterized in that, described output probe is flexible output probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320488241 CN203350556U (en) | 2013-08-09 | 2013-08-09 | Array substrate motherboard and array substrate lead inspection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320488241 CN203350556U (en) | 2013-08-09 | 2013-08-09 | Array substrate motherboard and array substrate lead inspection device |
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| CN203350556U true CN203350556U (en) | 2013-12-18 |
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| CN 201320488241 Expired - Lifetime CN203350556U (en) | 2013-08-09 | 2013-08-09 | Array substrate motherboard and array substrate lead inspection device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104101743A (en) * | 2014-07-16 | 2014-10-15 | 北京京东方视讯科技有限公司 | Probe, circuit detecting device and method for detecting circuit |
| WO2017124609A1 (en) * | 2016-01-21 | 2017-07-27 | 武汉华星光电技术有限公司 | Method for inspecting yield of liquid crystal display panels |
| CN108490654A (en) * | 2018-04-03 | 2018-09-04 | 京东方科技集团股份有限公司 | A kind of array substrate, array substrate motherboard and display device |
| CN111462666A (en) * | 2020-05-20 | 2020-07-28 | 京东方科技集团股份有限公司 | Array substrate mother board, detection method thereof, array substrate and display device |
| CN114495778A (en) * | 2022-02-07 | 2022-05-13 | 深圳市华星光电半导体显示技术有限公司 | Detection method and detection equipment for array substrate |
| CN115223470A (en) * | 2022-08-15 | 2022-10-21 | 上海中航光电子有限公司 | Detection circuit, display panel and display device |
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2013
- 2013-08-09 CN CN 201320488241 patent/CN203350556U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104101743A (en) * | 2014-07-16 | 2014-10-15 | 北京京东方视讯科技有限公司 | Probe, circuit detecting device and method for detecting circuit |
| CN104101743B (en) * | 2014-07-16 | 2017-03-29 | 北京京东方视讯科技有限公司 | The method of probe, line detection apparatus and detection circuit |
| WO2017124609A1 (en) * | 2016-01-21 | 2017-07-27 | 武汉华星光电技术有限公司 | Method for inspecting yield of liquid crystal display panels |
| CN108490654A (en) * | 2018-04-03 | 2018-09-04 | 京东方科技集团股份有限公司 | A kind of array substrate, array substrate motherboard and display device |
| CN108490654B (en) * | 2018-04-03 | 2021-01-22 | 京东方科技集团股份有限公司 | Array substrate, array substrate motherboard and display device |
| CN111462666A (en) * | 2020-05-20 | 2020-07-28 | 京东方科技集团股份有限公司 | Array substrate mother board, detection method thereof, array substrate and display device |
| CN111462666B (en) * | 2020-05-20 | 2023-11-03 | 京东方科技集团股份有限公司 | Array substrate mother board, detection method thereof, array substrate and display device |
| CN114495778A (en) * | 2022-02-07 | 2022-05-13 | 深圳市华星光电半导体显示技术有限公司 | Detection method and detection equipment for array substrate |
| CN115223470A (en) * | 2022-08-15 | 2022-10-21 | 上海中航光电子有限公司 | Detection circuit, display panel and display device |
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