CN203128644U - Linear evaporation source nozzle - Google Patents
Linear evaporation source nozzle Download PDFInfo
- Publication number
- CN203128644U CN203128644U CN 201320109809 CN201320109809U CN203128644U CN 203128644 U CN203128644 U CN 203128644U CN 201320109809 CN201320109809 CN 201320109809 CN 201320109809 U CN201320109809 U CN 201320109809U CN 203128644 U CN203128644 U CN 203128644U
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- source nozzle
- jet
- vapor deposition
- deposition source
- evaporation
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Abstract
The utility model discloses a linear evaporation source nozzle and belongs to the field of vacuum evaporation equipment. The linear evaporation source nozzle comprises an injection hood and an injection plate arranged on the injection hood, wherein an injection orifice is formed in the lengthwise direction of the injection plate, and a shielding sheet is arranged at the injection orifice. The injection orifice in the injection plate is subjected to optimization design, and the shielding sheet is arranged at the injection orifice according to the difference between temperatures of linear sources, so that when the linear evaporation source nozzle with the structure is used for evaporation, the uniformity of obtained coating films is within 3%, the pollution problem of materials in the evaporation process of evaporation sources can also be avoided, and meanwhile the materials are effectively utilized. The linear evaporation source nozzle is simple in structure, low in manufacturing cost and suitable for industrial large-scale production application.
Description
Technical field
The utility model belongs to the vacuum evaporation equipment field, is specifically related to a kind of linear vapor deposition source nozzle.
Background technology
The vapor deposition source nozzle is used for vacuum evaporation equipment, is used for spraying on the evaporation substrate forming continuous and uniform film.General evaporation coating method is: deposition material is placed the evaporation container, again this evaporation container is placed certain well heater, well heater is by heating the evaporation container, thereby reaches in the purpose that is formed thin film layer by the substrate of evaporation.The point-like vapor deposition source is suitable for forming film comparatively uniformly in the small area scope.For the big area evaporation, point source can't satisfy the whole homogeneity of thin film layer.Along with the increase of decentering evaporation point distance, the film thickness of edge descends obviously.In the preparation of many functional devices, wish that generally the ununiformity of thin film layer thickness is controlled in 3%.
For the preparation large area uniform film, adopt linear vapor deposition source.Linear vapor deposition source is suitable for forming the continuous large-area film.Yet this simple wide orifice design though compare with the point-like vapor deposition source, has enlarged uniformity of film width and area, but still causes the thickness of edge film and the thickness of central film that very big difference is arranged.
Therefore, consider the manufacturing cost of evaporated device and the utilization ratio of deposition material, it is very necessary that the nozzle configuration of vapor deposition source is optimized design.
The utility model content
The technical problem that the utility model solves is to provide a kind of material use efficiency height, plated film good uniformity, evaporated device linear vapor deposition source nozzle with low cost.
The utility model is to be achieved through the following technical solutions:
A kind of linear vapor deposition source nozzle comprises jet cover and the jet tray that is arranged on the jet cover, offers jet orifice on the lengthwise direction of described jet tray, and jet orifice is provided with shielding plate.
Described jet orifice is is shaped as rectangle.
The width of described jet orifice is 0.5～1.5cm.
The length of described shielding plate accounts for 1/6 of whole jet orifice length.
Described shielding plate is apart from jet tray left end 8～15cm.
Described jet cover is prismatoid.
Described jet tray adopts metal sheet or silica glass.
Compared with prior art, the utlity model has following beneficial technical effects:
Linear vapor deposition source nozzle of the present utility model, by the jet orifice width on the jet tray is optimized setting, and according to the difference of line source temperature, add shielding plate at jet orifice, adopt the line source nozzle of this structure to carry out evaporation, obtaining the plated film uniformity coefficient can reach in 3%, also can avoid the material contamination problem of other vapor deposition source in evaporate process, material also is utilized effectively simultaneously, reuse after using the material of staying later on the nozzle chambers body wall to reclaim, improved material use efficiency greatly.The utility model is simple in structure, and the device fabrication cost is low, is suitable for the large-scale industrialization production application.
Description of drawings
Fig. 1 is the front view of linear vapor deposition source nozzle of the present utility model;
Fig. 2 is the vertical view of linear vapor deposition source jet orifice of the present utility model;
Fig. 3 is that the linear vapor deposition source of prior art is sprayed the film uniformity figure as a result that measures substrate in the back;
Fig. 4 is that linear vapor deposition source of the present utility model is sprayed the film uniformity figure as a result that measures substrate in the back.
Wherein: 1 is jet cover; 2 is jet orifice; 3 is shielding plate.
Embodiment
Below in conjunction with accompanying drawing the utility model is done and to be described in further detail:
Referring to Fig. 1, linear vapor deposition source nozzle of the present utility model, comprise jet cover 1 and the jet tray that is arranged on the jet cover 1, offer jet orifice 2 on the lengthwise direction of described jet tray, described jet orifice 2 is provided with shielding plate 3, and shielding plate 3 is divided into two sections with jet orifice 2, and described jet cover 1 is a prismatoid jet cover, during use, this prismatoid jet cover places on the linear vapor deposition source.
Referring to Fig. 2, be provided with shielding plate 3 apart from jet tray left end 8～15cm on the jet orifice 2, jet orifice 2 sheet 3 that is blocked is separated, and the length of shielding plate 3 accounts for 1/6 of whole jet orifice 2 length, jet orifice 2 is used for the outgoing deposition material, can control the outgoing scope of linear vapor deposition source.
Wanting the substrate basic size of evaporation when this device is 400 * 400mm, and then the base square of jet cover is 500mm, and last top is 440mm.Prior art be with this jet cover as on the line source, shielding plate is not set, to the substrate behind evaporation test film uniformity, test result as shown in Figure 3: as can be seen from the figure, use this device to record the thickness thick middle, both sides are thin.Adopt structure of the present utility model, after jet orifice is provided with shielding plate, substrate is carried out evaporation, substrate behind the evaporation is carried out the uniform film thickness property testing, the result as shown in Figure 4, as can be seen from the figure, the substrate that adopts this linearity evaporation nozzle evaporation to obtain, film uniformity has reached 1.23%, can reach in the industry the control that requires 3% with interior standard.
The above only is a kind of embodiment of the present utility model, it or not whole or unique embodiment, the conversion of any equivalence that those of ordinary skills take technical solutions of the utility model by reading the utility model specification sheets is claim of the present utility model and contains.
Claims (7)
1. a linear vapor deposition source nozzle is characterized in that, comprises jet cover (1) and is arranged on jet tray on the jet cover (1), and offer jet orifice (2) on the lengthwise direction of described jet tray, jet orifice (2) is provided with shielding plate (3).
2. a kind of linear vapor deposition source nozzle according to claim 1 is characterized in that, described jet orifice (2) be shaped as rectangle.
3. a kind of linear vapor deposition source nozzle according to claim 2 is characterized in that the width of described jet orifice (2) is 0.5～1.5cm.
4. a kind of linear vapor deposition source nozzle according to claim 2 is characterized in that, the length of described shielding plate (3) accounts for 1/6 of whole jet orifice (2) length.
5. a kind of linear vapor deposition source nozzle according to claim 4 is characterized in that described shielding plate (3) is apart from jet tray left end 8～15cm.
6. a kind of linear vapor deposition source nozzle according to claim 1 is characterized in that described jet cover (1) is prismatoid.
7. a kind of linear vapor deposition source nozzle according to claim 1 is characterized in that, described jet tray adopts metal sheet or silica glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320109809 CN203128644U (en) | 2013-03-11 | 2013-03-11 | Linear evaporation source nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320109809 CN203128644U (en) | 2013-03-11 | 2013-03-11 | Linear evaporation source nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203128644U true CN203128644U (en) | 2013-08-14 |
Family
ID=48936640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320109809 Expired - Fee Related CN203128644U (en) | 2013-03-11 | 2013-03-11 | Linear evaporation source nozzle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203128644U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9783881B2 (en) | 2014-08-12 | 2017-10-10 | National Chung-Shan Institute Of Science And Technology | Linear evaporation apparatus for improving uniformity of thin films and utilization of evaporation materials |
| TWI607103B (en) * | 2016-11-08 | 2017-12-01 | 財團法人工業技術研究院 | Deposition source and deposition apparatus having the same |
| CN108103443A (en) * | 2017-12-29 | 2018-06-01 | 上海升翕光电科技有限公司 | Line source is deposited in a kind of slit OLED |
-
2013
- 2013-03-11 CN CN 201320109809 patent/CN203128644U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9783881B2 (en) | 2014-08-12 | 2017-10-10 | National Chung-Shan Institute Of Science And Technology | Linear evaporation apparatus for improving uniformity of thin films and utilization of evaporation materials |
| TWI607103B (en) * | 2016-11-08 | 2017-12-01 | 財團法人工業技術研究院 | Deposition source and deposition apparatus having the same |
| CN108103443A (en) * | 2017-12-29 | 2018-06-01 | 上海升翕光电科技有限公司 | Line source is deposited in a kind of slit OLED |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130814 Termination date: 20140311 |