CN203014756U - Percussion welding ceramic sealed housing and crystal oscillator employing same - Google Patents
Percussion welding ceramic sealed housing and crystal oscillator employing same Download PDFInfo
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- CN203014756U CN203014756U CN 201220628418 CN201220628418U CN203014756U CN 203014756 U CN203014756 U CN 203014756U CN 201220628418 CN201220628418 CN 201220628418 CN 201220628418 U CN201220628418 U CN 201220628418U CN 203014756 U CN203014756 U CN 203014756U
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Abstract
The utility model discloses a percussion welding ceramic sealed housing comprising a ceramic base and a cover plate, wherein the ceramic base comprises a ceramic substrate and a metallic flange ring mutually fixed, and an internal electrode and an external electrode, which are electrically conductive; and the ceramic base and the cover plate are bonded together through percussion welding via the metallic flange ring of the ceramic base. Percussion welding of a ceramic housing is achieved by a ceramic substrate and a percussion welding metallic flange ring, which solves the problem that a conventional multilayer ceramic sheet cofired housing structure depends on expensive parallel seam welding or precious metal fusion welding The percussion welding ceramic sealed housing is small, light and simply structured, improves production efficiency, and ensures high qualified rate of the product. The percussion welding ceramic packed housing is widely applicable to components with quartz crystal attached on the surface and other electronic components, and suitable for mass production. An existing percussion welding device for sealing metal-glass base can be used, thereby preventing use of expensive parallel seam welding devices and lowering production cost.
Description
Technical field
The utility model relates to a kind of package casing and uses the crystal oscillator of this shell.
Background technology
Due to the development of mobile phone, static digital camera, PC mainboard, notebook computer and video-game, increasing substantially can appear in the demand expectation of crystal oscillator.
As shown in Figure 1, traditional crystal oscillator comprises at least 2 layers of ceramic substrate 1,3, reaches the capping 9 fixing with ceramic substrate, and the top of inboard ceramic substrate 3 is provided with interior electrode 8, the below of outside ceramic substrate 1 is provided with external electrode 2, described interior electrode 8 and external electrode 2 mutual conduction.A quartz crystal 11 is fixed by tack coat 10 in the top of described interior electrode 8, and described quartz crystal 11 is arranged on by in ceramic substrate 3 and the formed enclosure space of capping 9.In order to increase enclosure space, also be installed with on the inboard ceramic substrate 3 of prior art on 4, the three layers of ceramic substrate 4 of the 3rd layer of ceramic substrate in a week and also be provided with metal layer 5, scolder 6 and becket 7.Capping 9 is adopted parallel seam welding or the melting welding of Precious Metals-Gold ashbury metal with the encapsulation of becket 7.
But because the ceramic wafer of traditional quartz crystal oscillator pasted on surface ceramic packaging shell is to be burnt altogether by three layers of potsherd stack to form, the production cost of ceramic substrate is always high, manufacturing expense is expensive, simultaneously three stackedly add common burning, during making, specification requirement is high, output is subject to the restriction of technology, equipment each side, and production efficiency and product yield reduce, and can not be satisfied with the growing market demand far away.Parallel seam welding or the weldering of Precious Metals-Gold ashbury metal are generally adopted in the encapsulation of device in addition, and sealing apparatus and material are very expensive, and production cost is very high.Therefore seek a kind of simple for structure, adopt comparatively cheap energy storage soldering and sealing packaged type, can mass industrialized production the ceramic packaging shell, the production that is used for quartz crystal device replaces existing product extremely urgent.
The utility model content
The utility model purpose is to provide a kind of stored energy welding ceramic packaging shell and uses the crystal oscillator of this shell.
The purpose of this utility model will be achieved by the following technical programs:
A kind of stored energy welding ceramic packaging shell, comprise base of ceramic and cover plate, described base of ceramic comprises ceramic substrate and the metal flange ring that interfixes, and the interior electrode and the external electrode that are separately positioned on the outside in described ceramic substrate, and described interior electrode and external electrode electrically conduct mutually; Described base of ceramic and cover plate rely on the metal flange ring of described base of ceramic to adopt stored energy welding technique to be sealed together.
Preferably, be provided with through hole on described ceramic substrate, described interior electrode is connected with external electrode by this through hole.
Preferably, be set to the flange of the easy fusing of triangular-section on described metal flange ring or cover plate.
Preferably, described cover plate is the metal pipe cap of intermediate projections, and the surrounding of described intermediate projections is the sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, and the sealing-in limit of described base of ceramic and metal pipe cap relies on stored energy welding technique to be sealed together.
Preferably, be set to the flange of the easy fusing of triangular-section on the sealing-in limit of described metal pipe cap.
Preferably, described cover plate is the planar metal cover plate parallel with described ceramic substrate, and described base of ceramic and plane metal cover board rely on stored energy welding technique to be sealed together.
Preferably, described cover plate is the metal cover board with locator protrusions, and described base of ceramic and metal cover board rely on stored energy welding technique to be sealed together.
Preferably, also be provided with supporting layer between described ceramic substrate and interior electrode.
Preferably, the metallization ring that the top setting of described ceramic substrate has the solderability function is used for the reliable welding of ceramic substrate and metal flange ring.
The utility model has also disclosed a kind of crystal oscillator that uses stored energy welding ceramic packaging shell, comprise base of ceramic and the cover plate that can interfix by stored energy welding, described base of ceramic comprises ceramic substrate and the metal flange ring that interfixes, and the interior electrode and the external electrode that are separately positioned on the outside in described ceramic substrate, described interior electrode and external electrode electrically conduct mutually; The top of described interior electrode is installed with a quartz crystal, and described quartz crystal is arranged on by in ceramic substrate and the formed enclosure space of cover plate, and described base of ceramic and cover plate rely on the metal flange ring of described base of ceramic to adopt stored energy welding technique to be sealed together.
Preferably, be set to the flange of the easy fusing of triangular-section on described metal flange ring or cover plate.
Preferably, described cover plate is the metal pipe cap of intermediate projections, and the surrounding of described intermediate projections is the sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, and the sealing-in limit of described base of ceramic and metal pipe cap relies on stored energy welding technique to be sealed together.
Preferably, described cover plate is the planar metal cover plate parallel with described ceramic substrate, and described base of ceramic and plane metal cover board rely on stored energy welding technique to be sealed together.
Preferably, described cover plate is the metal cover board with locator protrusions, and described base of ceramic and metal cover board rely on stored energy welding technique to be sealed together.
The beneficial effects of the utility model are mainly reflected in: this ceramic packaging shell adopts ceramic substrate to add the energy storage sealing that energy storage sealing metal flange ring structure is realized ceramic package, can change the present situation that traditional multi-layer ceramic chip co-sintering structure shell relies on expensive parallel seam welding or noble metal melting welding.This stored energy welding ceramic packaging enclosure volume is little, lightweight, simple in structure, and processing technology is ripe, improved production efficiency, guarantee the high qualification rate of product, can be widely used in surface attaching quartz crystal element and other electronic devices and components, be fit to industrialized mass.While, electronic device manufacturer can utilize the stored energy welding equipment of existing sealing-in metal-glass pedestal, carried out the production of surface mount ceramic packaging electronic device, can avoid using expensive parallel seam welding equipment, reduced production costs.
Description of drawings
Below in conjunction with drawings and Examples, the utility model is further described:
Fig. 1 is traditional quartz crystal oscillator pasted on surface ceramic packaging shell mechanism schematic diagram.
Fig. 2 is the structural representation of the utility model stored energy welding single-layer ceramic package casing pedestal.
Fig. 3 is the structural representation of the utility model stored energy welding Multi-layer ceramic package package header.
Fig. 4 is the utility model stored energy welding ceramic-packaged quartz crystal oscillator (planar metal cover plate) structural representation.
Fig. 5 is the utility model stored energy welding ceramic-packaged quartz crystal oscillator (metal pipe cap) structural representation.
Fig. 6 a is the first embodiment schematic diagram of the utility model external electrode.
Fig. 6 b is the second embodiment schematic diagram of the utility model external electrode.
Fig. 7 a is electrode and metal layer the first embodiment schematic diagram in the utility model.
Fig. 7 b is electrode and metal layer the second embodiment schematic diagram in the utility model.
Fig. 8 is the second embodiment schematic diagram of the utility model metal pipe cap.
Fig. 9 a is the first embodiment schematic diagram of the utility model metal flange ring.
Fig. 9 b is the second embodiment schematic diagram of the utility model metal flange ring.
Fig. 9 c is the 3rd embodiment schematic diagram of the utility model metal flange ring.
Fig. 9 d is the 4th embodiment schematic diagram of the utility model metal flange ring.
Figure 10 is the second embodiment schematic diagram of the utility model metal cover board.
Embodiment
In conjunction with Fig. 4 and shown in Figure 5, package casing of the present utility model comprises the base of ceramic that interfixes and the cover plate that is fit to stored energy welding, described base of ceramic comprises ceramic substrate 41,51 and metal flange ring 44,54, and the interior electrode 45,55 and external electrode 49,59 that is separately positioned on ceramic substrate 41, the 51 interior outsides.described interior electrode 45, 55 and external electrode 49, 59 through holes 47 by arranging on ceramic substrate, 57 electrically conduct mutually, interior electrode 45, 55 top is provided with silver slurry 402, 502, described silver slurry 402, 502 effect is to make on it to set firmly better a quartz crystal 401, 501, described quartz crystal 401, 501 are arranged on by ceramic substrate 41, 51 and the formed enclosure space of cover plate in, described metal flange ring 44, 54 tops can be set to the flange 403 of the easy fusing of triangular-section, 503, described base of ceramic and cover plate rely on described metal flange ring 44, this flange 403 that 54 tops arrange, 503 adopt stored energy welding to combine.
Described ceramic substrate 41,51 adopts the aluminium oxide ceramics array substrate, adopts ceramic chips, is conducive to precise silk screen typography and mass industrialized production, and production efficiency is high, can effectively reduce cost of manufacture.
Described ceramic substrate 41,51 tops are provided with the metallization ring 42,52 with solderability function; described metallization ring 42,52 adopts the W slurry to use silk-screen printing technique at ceramic substrate surface printing metal layer figure; the Ceramic Array substrate surface; then burn altogether in the high temperature protection atmosphere furnace with the Ceramic Array substrate and form; metal level and pottery interpenetrate to obtain the metal layer of high-bond, and nickel plating prevents from getting rusty on metal layer.
In conjunction with base of ceramic shown in Figure 2; be provided with silver-copper brazing alloy ring 23 between described metallization ring 22 and metal flange ring 24; this scolder ring is as braze; it can firmly be welded on ceramic substrate 21 with metal flange ring 24 in high temperature protection atmosphere soldering oven is in the same place, and forms the gastight cavity of holding quartz crystal or other electronic chips.
Also be provided with supporting layer 26 between described ceramic substrate 21 and interior electrode 25, specifically as shown in Fig. 2,4,5, supporting layer 56 adopts thick film high temperature dielectric paste silk screen printing and sintering process to make, supporting layer 56 is used for the height of padded quartz crystal 501, effectively makes quartz crystal 501 and ceramic substrate 52 maintain a certain distance (greater than 50 μ m).
Described interior electrode 55 and external electrode 59 are to fill the W metal paste by the through hole 57 on ceramic substrate, realize electrical connection after sintering curing, and metal paste again can be with the through hole shutoff simultaneously.
As shown in Fig. 2,3, required space when the thickness that described package casing can be by regulating metal flange ring 24 or the ceramic substrate number of plies are regulated the quartz crystal vibration, the ceramic substrate number of plies can be individual layer (Fig. 2) or multilayer (Fig. 3).
As shown in Figure 5, described cover plate is the metal pipe cap 50 of intermediate projections, and the surrounding of described intermediate projections is the sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, and the sealing-in limit of described base of ceramic and metal pipe cap 50 relies on the stored energy welding sealed knot to be combined.Perhaps, as shown in Figure 4, described cover plate is the planar metal cover plate 40 parallel with described ceramic substrate.Described metal cover board 40, metal pipe cap 50 adopt the iron-nickel alloy mechanical stamping of mating with the alumina ceramic substrate coefficient of expansion to form, and plating nickel on surface is to prevent corrosion.
Described metal flange ring 44, the flange 403,503 of 54 tops by striking out the triangular-section, purpose is used for the welding encapsulation of ceramic encapsulated base and metal cover board 40 or metal pipe cap 50, directly melting this triangular flanges 503 by stored energy welding during encapsulation can weld together metal pipe cap 50 or metal cover board 40 with metal flange ring 54,44, simplified the quartz oscillator packaging technology.
Specifically as shown in Fig. 6 a, 6b and Fig. 7 a, 7b, the square that is shaped as the both sides that are separately positioned on ceramic substrate 51 of described external electrode 55.Described interior electrode 59 be shaped as strip-like-shaped.External electrode and interior electrode adopt thick film conductor paste silk screen printing and sintering process to make metal layer at the ceramic substrate outer surface, can be the metals such as W, Mo/Mn, Cu, Ni, nickel plating or gold on metal layer.Interior electrode and external electrode are electrically connected to reliably by Ceramic Array via metal realization in flakes.
Fig. 8 has disclosed the embodiment of another kind of metal pipe cap, and the flange of punch forming triangular-section on this metal pipe cap adopts the metal flange ring shown in Fig. 9 a to get final product accordingly.Be that the metal flange ring shown in Fig. 9 a need not the flange of punch forming triangular-section again.
Fig. 9 b, 9c, 9d have disclosed the shape of other three kinds of metal flange rings, and flange can be arranged on three positions of upper, middle and lower of metal flange ring.
Figure 10 has disclosed a kind of cover plate, it is the metal cover board with locator protrusions 101, this locator protrusions can snap onto the effect of the position of playing the described metal cover board in location in the metal flange ring, and described base of ceramic and metal cover board rely on stored energy welding technique to be sealed together.
This ceramic substrate can be widely used in the level Hermetic Package of surface attaching quartz crystal element and other electronic devices and components.When for example being used for the surface mounting quartz crystal resonator making (shown in Figure 5), quartz wafer 501 is starched 502 by silver and is connected with interior electrode 55.Device adopts stored energy welding with the metal flange ring 54 on ceramic substrate and metal cover board 40(Fig. 4) or metal pipe cap 50(Fig. 5) weld together, form and hold the airtight space of protecting quartz wafer.Surface mount pottery-the stored energy welding packaging shell structure is simple, volume is little for this, lightweight, be convenient to mass industrialized production, meet electronic devices and components miniaturization and surface-pasted development trend.
The utility model surface mount stored energy welding ceramic packaging shell has following features:
1. compare the surface mount ceramic packaging shell of multi-layer ceramics co-sintering structure, volume is little, lightweight, simple in structure.Adopt mono-layer oxidized aluminium array ceramics and traditional thick-film technique, equipment is simple, and technical maturity is fit to industrialized mass.
2. adopt the thick film dielectric material to make supporting layer 56, effectively solve the problem of quartz wafer 501 and ceramic substrate 51 maintenance certain distances (greater than 50 μ m) with simple method.
3. directly melting this triangular flanges 503 by stored energy welding when encapsulating can simplify the quartz oscillator packaging technology with metal pipe cap 59 or metal cover board 49 and metal flange ring seal knot, has effectively reduced the process for sealing cost.
The utility model still has numerous embodiments, and all employing equivalents or equivalent transformation and all technical schemes of forming are within all dropping on protection range of the present utility model.
Claims (14)
1. stored energy welding ceramic packaging shell, comprise base of ceramic and cover plate, it is characterized in that: described base of ceramic comprises ceramic substrate (51) and the metal flange ring (54) that interfixes, and the interior electrode (55) and the external electrode (59) that are separately positioned on the outside in described ceramic substrate (51), described interior electrode (55) and external electrode (59) electrically conduct mutually; Described base of ceramic and cover plate rely on the metal flange ring (54) of described base of ceramic to adopt stored energy welding technique to be sealed together.
2. stored energy welding ceramic packaging shell according to claim 1, it is characterized in that: be provided with through hole (57) on described ceramic substrate (51), described interior electrode (55) is connected with external electrode by this through hole (57).
3. stored energy welding ceramic packaging shell according to claim 1, is characterized in that: the flange (503) that is set to the easy fusing of triangular-section on described metal flange ring (54) or cover plate.
4. according to claim 1 or 3 described stored energy welding ceramic packaging shells, it is characterized in that: described cover plate is the metal pipe cap (50) of intermediate projections, the surrounding of described intermediate projections is the sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, the sealing-in limit of described base of ceramic and metal pipe cap (50) relies on stored energy welding technique to be sealed together.
5. stored energy welding ceramic packaging shell according to claim 4 is characterized in that: the flange (503) that is set to the easy fusing of triangular-section on the sealing-in limit of described metal pipe cap (50).
6. according to claim 1 or 3 described stored energy welding ceramic packaging shells, it is characterized in that: described cover plate is the planar metal cover plate (40) parallel with described ceramic substrate (41), and described base of ceramic and plane metal cover board (40) rely on stored energy welding technique to be sealed together.
7. according to claim 1 or 3 described stored energy welding ceramic packaging shells is characterized in that: described cover plate is for having the metal cover board of locator protrusions (101), and described base of ceramic and metal cover board rely on stored energy welding technique to be sealed together.
8. stored energy welding ceramic packaging shell according to claim 1, is characterized in that: also be provided with supporting layer (56) between described ceramic substrate (51) and interior electrode (55).
9. stored energy welding ceramic packaging shell according to claim 1, is characterized in that: the metallization ring (52) with solderability function is set above described ceramic substrate (51), is used for the reliable welding of ceramic substrate (51) and metal flange ring (54).
10. crystal oscillator that uses stored energy welding ceramic packaging shell, it is characterized in that: comprise base of ceramic and the cover plate that can interfix by stored energy welding, described base of ceramic comprises ceramic substrate (51) and the metal flange ring (54) that interfixes, and the interior electrode (55) and the external electrode (59) that are separately positioned on the outside in described ceramic substrate (51), described interior electrode (55) and external electrode (59) electrically conduct mutually; The top of described interior electrode (55) is installed with a quartz crystal (501), described quartz crystal (501) is arranged on by in ceramic substrate (51) and the formed enclosure space of cover plate, and described base of ceramic and cover plate rely on the metal flange ring (54) of described base of ceramic to adopt stored energy welding technique to be sealed together.
11. crystal oscillator according to claim 10 is characterized in that: the flange (503) that is set to the easy fusing of triangular-section on described metal flange ring (54) or cover plate.
12. according to claim 10 or 11 described crystal oscillators, it is characterized in that: described cover plate is the metal pipe cap (50) of intermediate projections, the surrounding of described intermediate projections is the sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, the sealing-in limit of described base of ceramic and metal pipe cap (50) relies on stored energy welding technique to be sealed together.
13. according to claim 10 or 11 described crystal oscillators, it is characterized in that: described cover plate is the planar metal cover plate (40) parallel with described ceramic substrate (41), and described base of ceramic and plane metal cover board (40) rely on stored energy welding technique to be sealed together.
14. according to claim 10 or 11 described crystal oscillators is characterized in that: described cover plate is the metal cover board with locator protrusions, and described base of ceramic and metal cover board rely on stored energy welding technique to be sealed together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220628418 CN203014756U (en) | 2012-11-26 | 2012-11-26 | Percussion welding ceramic sealed housing and crystal oscillator employing same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220628418 CN203014756U (en) | 2012-11-26 | 2012-11-26 | Percussion welding ceramic sealed housing and crystal oscillator employing same |
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| CN203014756U true CN203014756U (en) | 2013-06-19 |
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| CN 201220628418 Expired - Fee Related CN203014756U (en) | 2012-11-26 | 2012-11-26 | Percussion welding ceramic sealed housing and crystal oscillator employing same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103840788A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Energy-storage-soldered ceramic packaging shell and crystal oscillator using shell |
| CN111599690A (en) * | 2020-05-27 | 2020-08-28 | 上海芯波电子科技有限公司 | Double-sided cavity digging ceramic packaging process based on coexistence of WB chip and FC chip |
-
2012
- 2012-11-26 CN CN 201220628418 patent/CN203014756U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103840788A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Energy-storage-soldered ceramic packaging shell and crystal oscillator using shell |
| CN111599690A (en) * | 2020-05-27 | 2020-08-28 | 上海芯波电子科技有限公司 | Double-sided cavity digging ceramic packaging process based on coexistence of WB chip and FC chip |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20151126 |