CN202513205U - Light emitting diode packaging structure - Google Patents
Light emitting diode packaging structure Download PDFInfo
- Publication number
- CN202513205U CN202513205U CN2012201401157U CN201220140115U CN202513205U CN 202513205 U CN202513205 U CN 202513205U CN 2012201401157 U CN2012201401157 U CN 2012201401157U CN 201220140115 U CN201220140115 U CN 201220140115U CN 202513205 U CN202513205 U CN 202513205U
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- Prior art keywords
- storage tank
- package structure
- circuit layer
- bearing substrate
- insulating barrier
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- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000000084 colloidal system Substances 0.000 claims abstract description 27
- 238000004020 luminiscence type Methods 0.000 claims description 53
- 230000004888 barrier function Effects 0.000 claims description 23
- 238000012856 packing Methods 0.000 claims description 22
- 230000003287 optical effect Effects 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000002650 habitual effect Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Abstract
The utility model discloses a light emitting diode packaging structure contains bearing substrate, insulating layer, positive pole, negative pole, solid-state semiconductor light emitting chip, drive integrated circuit, first encapsulation colloid and second encapsulation colloid. The carrier substrate has a circuit layer thereon. The insulating layer is located on the bearing substrate. The insulating layer is formed with a first receiving groove and a second receiving groove. The first receiving groove and the second receiving groove are provided with a part of circuit layers which are exposed. The positive electrode is formed on the insulating layer and connected to the circuit layer. The negative electrode is formed on the insulating layer and connected to the circuit layer. The solid semiconductor light-emitting chip is positioned in the first accommodating groove and is electrically connected with the circuit layer. The driving integrated circuit is located in the second containing groove and electrically connected with the circuit layer and used for driving the light-emitting chip. The first packaging colloid covers the light-emitting chip. The second packaging colloid covers the driving integrated circuit.
Description
Technical field
The utility model is relevant a kind of package structure for LED.
Background technology
In daily life, lighting apparatus is indispensable important tool.Existing light fixture mostly with bulb or fluorescent tube as light source.In these fluorescent tubes or bulb; Comparatively common person has fluorescent tube, incandescent lamp bulb and based on halogen bulb; Owing to when luminous, need consume a large amount of electric energy, (Light-Emitting Diode is that the light fixture of light source is more and more welcome LED) therefore to use light-emitting diode in recent years.
Light-emitting diode is a kind of semiconductor element, and early stage LED is applied to the indicator light of electronic installation or the light-emitting component of display panel mostly, but is widely used in the lighting apparatus in recent years.When light fixture utilizes LED as light source; Use bulb to compare with tradition as the light fixture of light source; The LED light fixture not only have the life-span long, power consumption is low, volume is little, advantage such as shatter-proof and of many uses, and be difficult for as conventional bulb as fragmentation easily, safer for the user.
Fig. 1 illustrates known stereogram with light fixture 100 of package structure for LED 110.As shown in the figure, light fixture 100 comprises package structure for LED 110, lamp socket 120 and drive integrated circult 130.Wherein package structure for LED 110 comprises bearing substrate 114 and luminescence chip 112, and bearing substrate 114 is positioned on the lamp socket 120, and luminescence chip 112 is positioned on the bearing substrate 114.Drive integrated circult 130 is arranged in the cavity 122 of lamp socket 120 inside, and electrically connects bearing substrate 114, and luminescence chip 112 can be driven by drive integrated circult 130.
Yet therefore such design needs to reserve the position of cavity 122 because drive integrated circult 130 is to be positioned at lamp socket 120.Thus, the geometry of lamp socket 120 or size can be subject to drive integrated circult 130.
The utility model content
One purpose of the utility model is for providing a kind of package structure for LED.
According to the utility model one execution mode, a kind of package structure for LED comprises bearing substrate, insulating barrier, positive pole, negative pole, a M solid-state semiconductor luminescence chip, at least one drive integrated circult, first packing colloid and second packing colloid.Bearing substrate has circuit layer on it.Insulating barrier is positioned on the bearing substrate.Be formed with at least one first storage tank and second storage tank on the insulating barrier.Also have the partial circuit layer to be exposed out in first storage tank and second storage tank.Positive pole is formed on the insulating barrier and with circuit layer and is connected.Negative pole is formed on the insulating barrier and with circuit layer and is connected.The solid-state semiconductor luminescence chip is arranged in first storage tank and electrically connects circuit layer respectively, and wherein M is a natural number.Drive integrated circult is arranged in second storage tank and electrically connects circuit layer, in order to the driven for emitting lights chip.First packing colloid covers luminescence chip.Second packing colloid covers drive integrated circult.
In the utility model one execution mode, wherein above-mentioned first packing colloid also comprises a plurality of optical lenses.
In the utility model one execution mode, wherein the quantity of above-mentioned optical lens is identical with the quantity of luminescence chip.
In the utility model one execution mode, the arrangement that wherein above-mentioned luminescence chip is arranged in first storage tank in the form of a ring, straight line or aforementioned both combination.
In the utility model one execution mode, wherein the edge of above-mentioned bearing substrate is formed with at least one recess, and through recess and one first retaining element bearing substrate is fixed on the light fixture loading end.
In the utility model one execution mode; Wherein above-mentioned bearing substrate has a plurality of first fixing holes; It is corresponding with the first fixing hole position that insulating barrier has a plurality of second fixing holes, and through first, second fixing hole and a plurality of second retaining element bearing substrate is fixed on the light fixture loading end.
In the utility model one execution mode, the shape of wherein above-mentioned first storage tank and second storage tank comprises circle or N limit shape, and N is the natural number more than or equal to 3.
In the utility model one execution mode, wherein above-mentioned first storage tank and second storage tank are the next-door neighbours.
In the utility model one execution mode, wherein above-mentioned first storage tank and second storage tank are the distances of being separated by.
In the above-mentioned execution mode of the utility model; Owing to be formed with first storage tank and second storage tank on the insulating barrier; And solid-state semiconductor luminescence chip and drive integrated circult lay respectively in first storage tank and second storage tank, and the light fixture that therefore has this package structure for LED need not reserved the space of other ccontaining drive integrated circults.In addition, solid-state semiconductor luminescence chip and drive integrated circult electrically connect circuit layer respectively, and it is luminous to make drive integrated circult can drive the luminescence chip that is exposed in first storage tank.
Description of drawings
Fig. 1 illustrates known stereogram with light fixture of package structure for LED;
Fig. 2 illustrates the stereogram according to the package structure for LED of the utility model one execution mode;
Fig. 3 illustrates the profile of the package structure for LED section along the line 3-3 ' of Fig. 2;
Fig. 4 A illustrates the solid-state semiconductor luminescence chip of Fig. 2 and the schematic top plan view that drive integrated circult electrically connects circuit layer;
Fig. 4 B illustrates the solid-state semiconductor luminescence chip of Fig. 4 A and the circuit diagram that drive integrated circult electrically connects circuit layer;
Exploded view when the package structure for LED that Fig. 5 illustrates Fig. 2 is applied to light fixture;
Fig. 6 illustrates the stereogram according to the package structure for LED of another execution mode of the utility model;
Fig. 7 illustrates the stereogram according to the package structure for LED of the another execution mode of the utility model;
Fig. 8 A illustrates the luminescence chip of Fig. 7 and the schematic top plan view that drive integrated circult electrically connects circuit layer;
Fig. 8 B illustrates the solid-state semiconductor luminescence chip of Fig. 8 A and the circuit diagram that drive integrated circult electrically connects circuit layer;
Fig. 9 illustrates according to the utility model stereogram of the package structure for LED of an execution mode again.
[main element symbol description]
100: light fixture 110: package structure for LED
112: luminescence chip 114: bearing substrate
120: lamp socket 122: cavity
130: drive integrated circult 200: package structure for LED
210: bearing substrate 212: circuit layer
213: positive contact 214: recess
215: 216: the first fixing holes of negative contacts
Retaining element 220 in 218: the second: insulating barrier
224: the second storage tanks of 222: the first storage tanks
Fixing hole 230 in 226: the second: positive pole
240: negative pole 250: the solid-state semiconductor luminescence chip
260: 270: the first packing colloids of drive integrated circult
Packing colloid 290 in 280: the second: optical lens
300: light fixture 310: the light fixture loading end
312: 320: the first retaining elements of hole
3-3 ': line segment D: distance
Embodiment
Below will disclose a plurality of the execution modes of the utility model with accompanying drawing, for the purpose of offering some clarification on, the details on many practices will explanation in the lump in following narration.Yet, should be appreciated that the details on these practices is not used with restriction the utility model.That is to say that in the utility model part execution mode, the details on these practices is inessential.In addition, for the purpose of simplifying accompanying drawing, some known habitual structures and element will illustrate with the mode of simple signal in the accompanying drawings.
Fig. 2 illustrates the stereogram according to the package structure for LED 200 of the utility model one execution mode.Fig. 3 illustrates the profile of 200 along the line sections 3-3 ' of package structure for LED of Fig. 2.Consult Fig. 2 and Fig. 3 simultaneously, package structure for LED 200 comprises bearing substrate 210, insulating barrier 220, positive pole 230, negative pole 240, a M solid-state semiconductor luminescence chip 250, drive integrated circult 260, first packing colloid 270 and second packing colloid 280.M equals 3 in this execution mode, yet in other embodiments, M can be the natural number beyond 3.
Solid-state semiconductor luminescence chip 250 is arranged in first storage tank 222 and electrically connects circuit layer 212 respectively.Drive integrated circult 260 is arranged in second storage tank 224 and electrically connects circuit layer 212, in order to drive solid-state semiconductor luminescence chip 250.Wherein, solid-state semiconductor luminescence chip 250 can adopt chip directly to encapsulate (Chip On Board with drive integrated circult 260; COB) mode electrically connects the mode of circuit layer 212, and directly the processing procedure of encapsulation can comprise the chip adhesion to chip, lead connects and sealing.In this execution mode, as shown in Figure 3, first packing colloid 270 covers solid-state semiconductor luminescence chip 250, and second packing colloid 280 covers drive integrated circult 260.Wherein, first packing colloid 270 is the colloid of printing opacity, and penetrable first packing colloid 270 of the light that solid-state semiconductor luminescence chip 250 is sent sends.In addition, the arrangement that solid-state semiconductor luminescence chip 250 is arranged in first storage tank 222 linearly but in other embodiments can be in the form of a ring or the combination of straight line and ring-type, decides according to designer's demand.
Particularly, be formed at positive pole 230 and negative pole 240 on the insulating barrier 220, also be connected (not being illustrated in figure) with externally fed equipment except with circuit layer 212 is connected.When anodal 230 are powered with negative pole 240 because solid-state semiconductor luminescence chip 250 electrically connects circuit layer 212 respectively with drive integrated circult 260, so drive integrated circult 260 can to drive solid-state semiconductor luminescence chip 250 luminous.In addition, because solid-state semiconductor luminescence chip 250 is arranged in first storage tank 222, therefore when solid-state semiconductor luminescence chip 250 is luminous, light can be via first packing colloid 270 of printing opacity from 222 bright dippings of first storage tank.
Fig. 4 A illustrates the schematic top plan view of solid-state semiconductor luminescence chip 250 with the drive integrated circult 260 electric connection circuit layers 212 of Fig. 2.Fig. 4 B illustrates the solid-state semiconductor luminescence chip 250 of Fig. 4 A and the circuit diagram of drive integrated circult 260 electric connection circuit layers 212.Consult Fig. 4 A and Fig. 4 B simultaneously; Solid-state semiconductor luminescence chip 250 is arranged in a linear; The positive contact 213 of circuit layer 212 connects drive integrated circult 260; The negative contacts 215 of circuit layer 212 connects solid-state semiconductor luminescence chip 250, and three solid-state semiconductor luminescence chips 250 are electrically connected with the mode of series connection.
Exploded view when the package structure for LED 200 that Fig. 5 illustrates Fig. 2 is applied to light fixture 300.In this execution mode, first retaining element 320 is positioned on the light fixture loading end 310 with hole 312.The edge of bearing substrate 210 is formed with recess 214, and the position of recess 214 is corresponding to the position of first retaining element 320.Therefore, the recess 214 and first retaining element 320 can make bearing substrate 210 be fixed on the light fixture loading end 310.In addition, bearing substrate 210 also can have first fixing hole 216, and insulating barrier 220 has second fixing hole 226 corresponding with first fixing hole, 216 positions.Wherein, second retaining element 218 can be coupled in first fixing hole 216, second fixing hole 226 and hole 312.Therefore, first fixing hole 216, second fixing hole 226 and second retaining element 218 can make bearing substrate 210 be fixed on the light fixture loading end 310.
Owing to be formed with first storage tank 222 and second storage tank 224 on the insulating barrier 220; And solid-state semiconductor luminescence chip 250 lays respectively in first storage tank 222 and second storage tank 224 with drive integrated circult 260, and the light fixture 300 that therefore has this package structure for LED 200 need not reserved the space of other ccontaining drive integrated circults 260.
Fig. 6 illustrates the stereogram according to the package structure for LED 200 of another execution mode of the utility model.First packing colloid 270 also optionally comprises optical lens 290, and the quantity of optical lens 290 is identical with the quantity of solid-state semiconductor luminescence chip 250.In this execution mode, the quantity of optical lens 290 is 3.When solid-state semiconductor luminescence chip 250 was luminous, light can be via first packing colloid 270 and optical lens 290 bright dippings of printing opacity.
Should be appreciated that in following narration, the content of having narrated in the above-described embodiment will no longer repeat to give unnecessary details, only replenish with regard to the execution mode of different numbers with the solid-state semiconductor luminescence chip 250 of different arrangement modes, close chat earlier bright.
Fig. 7 illustrates the stereogram according to the package structure for LED 200 of the another execution mode of the utility model.Package structure for LED 200 comprises bearing substrate 210, insulating barrier 220, positive pole 230, negative pole 240, a M solid-state semiconductor luminescence chip 250, drive integrated circult 260, first packing colloid 270 and second packing colloid 280.The place different with above-mentioned execution mode is that M equals 9, and solid-state semiconductor luminescence chip 250 be arranged in first storage tank 222 linearly with annular arrangement.
Fig. 8 A illustrates the schematic top plan view of solid-state semiconductor luminescence chip 250 with the drive integrated circult 260 electric connection circuit layers 212 of Fig. 7.Fig. 8 B illustrates the solid-state semiconductor luminescence chip 250 of Fig. 8 A and the circuit diagram of drive integrated circult 260 electric connection circuit layers 212.Consult Fig. 8 A and Fig. 8 B simultaneously; Solid-state semiconductor luminescence chip 250 linearly with annular arrangement; The positive contact 213 of circuit layer 212 connects drive integrated circult 260; The negative contacts 215 of circuit layer 212 connects solid-state semiconductor luminescence chip 250, and the solid-state semiconductor luminescence chip 250 of three series connection is electrically connected in parallel.
Fig. 9 illustrates according to the utility model stereogram of the package structure for LED 200 of an execution mode again.First packing colloid 270 still optionally comprises optical lens 290, and the quantity of optical lens 290 is identical with the quantity of solid-state semiconductor luminescence chip 250.In this execution mode, the quantity of optical lens 290 is 9.
Above-mentioned execution mode of the utility model and prior art are compared, and have the following advantages:
(1) is formed with first storage tank and second storage tank on the insulating barrier; And solid-state semiconductor luminescence chip and drive integrated circult lay respectively in first storage tank and second storage tank, and the light fixture that therefore has this package structure for LED need not reserved the space of other ccontaining drive integrated circults.
(2) solid-state semiconductor luminescence chip and drive integrated circult electrically connect circuit layer respectively, and it is luminous to make drive integrated circult can drive the luminescence chip that is exposed in first storage tank.
Though the utility model discloses as above with execution mode; Right its is not in order to limit the utility model; Anyly be familiar with this art; In spirit that does not break away from the utility model and scope, when can doing various changes and retouching, so the protection range of the utility model is as the criterion when looking the scope that appending claims defines.
Claims (9)
1. a package structure for LED is characterized in that, comprises:
One bearing substrate has a circuit layer on it;
One insulating barrier is positioned on this bearing substrate, is formed with at least one first storage tank and one second storage tank on this insulating barrier, wherein also has this circuit layer of part to be exposed out in this first storage tank and this second storage tank;
One positive pole is formed on this insulating barrier, and is connected with this circuit layer;
One negative pole is formed on this insulating barrier, and is connected with this circuit layer;
M solid-state semiconductor luminescence chip is arranged in this first storage tank and electrically connects this circuit layer respectively, and wherein M is a natural number;
At least one drive integrated circult is arranged in this second storage tank and electrically connects this circuit layer, in order to drive those luminescence chips;
One first packing colloid covers those luminescence chips; And
One second packing colloid covers this drive integrated circult.
2. package structure for LED according to claim 1 is characterized in that, this first packing colloid also comprises a plurality of optical lenses.
3. package structure for LED according to claim 2 is characterized in that, the quantity of those optical lenses is identical with the quantity of those luminescence chips.
4. package structure for LED according to claim 1 is characterized in that, the arrangement that those luminescence chips are arranged in this first storage tank in the form of a ring, straight line or aforementioned both combination.
5. package structure for LED according to claim 1 is characterized in that the edge of this bearing substrate is formed with at least one recess, and through this recess and one first retaining element this bearing substrate is fixed on the light fixture loading end.
6. package structure for LED according to claim 5; It is characterized in that; This bearing substrate has a plurality of first fixing holes; It is corresponding with those first fixing hole positions that this insulating barrier has a plurality of second fixing holes, and through those first, second fixing holes and a plurality of second retaining element this bearing substrate is fixed on this light fixture loading end.
7. package structure for LED according to claim 1 is characterized in that, the shape of this first storage tank and this second storage tank comprises circle or N limit shape, and N is the natural number more than or equal to 3.
8. package structure for LED according to claim 1 is characterized in that, this first storage tank and this second storage tank are the next-door neighbours.
9. package structure for LED according to claim 1 is characterized in that, this first storage tank and this second storage tank are the distances of being separated by.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101202748U TWM430006U (en) | 2012-02-15 | 2012-02-15 | Light emitting diode package structure |
| TW101202748 | 2012-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202513205U true CN202513205U (en) | 2012-10-31 |
Family
ID=46551143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201401157U Expired - Lifetime CN202513205U (en) | 2012-02-15 | 2012-03-31 | Light emitting diode packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202513205U (en) |
| TW (1) | TWM430006U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104658983A (en) * | 2013-11-22 | 2015-05-27 | 弘凯光电(深圳)有限公司 | LED holding seat module and LED light emitting device |
| CN104976526A (en) * | 2014-04-03 | 2015-10-14 | 弘凯光电(深圳)有限公司 | LED light emitting device and lamp with LED light emitting device |
| CN105280622A (en) * | 2014-07-01 | 2016-01-27 | 四川新力光源股份有限公司 | LED packaging structure and light emitting device |
| CN105336733A (en) * | 2014-07-01 | 2016-02-17 | 四川新力光源股份有限公司 | LED package structure and light-emitting device |
-
2012
- 2012-02-15 TW TW101202748U patent/TWM430006U/en not_active IP Right Cessation
- 2012-03-31 CN CN2012201401157U patent/CN202513205U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104658983A (en) * | 2013-11-22 | 2015-05-27 | 弘凯光电(深圳)有限公司 | LED holding seat module and LED light emitting device |
| CN104976526A (en) * | 2014-04-03 | 2015-10-14 | 弘凯光电(深圳)有限公司 | LED light emitting device and lamp with LED light emitting device |
| CN105280622A (en) * | 2014-07-01 | 2016-01-27 | 四川新力光源股份有限公司 | LED packaging structure and light emitting device |
| CN105336733A (en) * | 2014-07-01 | 2016-02-17 | 四川新力光源股份有限公司 | LED package structure and light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM430006U (en) | 2012-05-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121031 |
|
| CX01 | Expiry of patent term |