CN202816893U - Material guide rail system for semiconductor lead frame - Google Patents
Material guide rail system for semiconductor lead frame Download PDFInfo
- Publication number
- CN202816893U CN202816893U CN 201220440667 CN201220440667U CN202816893U CN 202816893 U CN202816893 U CN 202816893U CN 201220440667 CN201220440667 CN 201220440667 CN 201220440667 U CN201220440667 U CN 201220440667U CN 202816893 U CN202816893 U CN 202816893U
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- CN
- China
- Prior art keywords
- guide rail
- lead frame
- guide groove
- vertical component
- component effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to the technical field of guide rails, and specifically relates to a material guide rail system for a semiconductor lead frame. The material guide rail system comprises a lead frame, a first material guide rail and a second material guide rail, wherein the lead frame comprises a lead frame body, a chip and gold threads connecting the chip and the lead frame body; the first material guide rail is provided with a first guide groove, the second material guide rail is provided with a second guide groove, and the first guide groove and the second guide groove are arranged opposite to each other; and the second material guide rail has a noninterference structure by which there is no interference between the gold threads and the second material guide rail. The noninterference structure is used in the material guide rail system, so that the line feed problem, which is caused by the interference between an upper part of the second material guide rail and the gold threads, is solved.
Description
Technical field
The utility model relates to the guide rail technical field, particularly a kind of guide rail system for semiconductor lead carriage.
Background technology
Lead frame, it act as the extremely outside circuit board of electronic devices and components work in the integrated circuit.
In the prior art, the guide rail system that is used for semiconductor lead carriage includes lead frame, the first guide rail and the second guide rail, lead frame comprises the gold thread of lead frame main body, chip and connection chip and lead frame main body, wherein the second guide rail is half worker's shape, lead frame has the phenomenon of rocking when transmitting, cause gold thread to interfere with the second guide rail top, the situation that line is burst occurs.
The utility model content
The purpose of this utility model is to avoid above-mentioned weak point of the prior art and a kind of guide rail system that is used for semiconductor lead carriage that avoids gold thread and the second guide rail to interfere is provided.
The purpose of this utility model is achieved through the following technical solutions:
The guide rail system that is used for semiconductor lead carriage is provided, include lead frame, the first guide rail and the second guide rail, described lead frame comprises the gold thread of lead frame main body, chip and connection chip and lead frame main body, described the first guide rail offers the first guide groove, described the second guide rail offers the second guide groove, described the first guide groove and described the second guide groove are oppositely arranged, and described the second guide rail has the anti-interference structure that can avoid described gold thread and described the second guide rail to interfere.
Wherein, described the second guide rail comprises L shaped guide rail body and fixing press claw, described L shaped guide rail body comprises the first vertical component effect and the second vertical component effect, described fixing press claw is connected with described L shaped guide rail body, described fixing press claw and described the second vertical component effect are fitted, described fixing press claw and described the first vertical component effect are provided with spacing and form described the second guide groove, the projection of described fixing press claw and described gold thread to be projected in the first vertical component effect not overlapping.
Wherein, the spacing that is provided with of described fixing press claw and described the first vertical component effect is greater than the thickness of lead frame.
Wherein, described the second guide rail comprises the first straight section, the second straight section and the 3rd chamfered section, forms described the second guide groove between the described first straight section and described the 3rd chamfered section, and described the 3rd chamfered section and gold thread are not interfered.
Wherein, the minimum spacing of the described first straight section and described the 3rd chamfered section formation is greater than the thickness of lead frame.
The beneficial effects of the utility model:
The guide rail system that is used for semiconductor lead carriage, include lead frame, the first guide rail and the second guide rail, described lead frame comprises the lead frame main body, chip and the gold thread that is connected chip and lead frame main body, described the first guide rail offers the first guide groove, described the second guide rail offers the second guide groove, described the first guide groove and described the second guide groove are oppositely arranged, described the second guide rail has the anti-interference structure that can avoid described gold thread and described the second guide rail to interfere, the routed problem of line that has adopted the structure of anti-interference to avoid the interference on gold thread and the second guide rail top to cause.
Description of drawings
The utility model is described in further detail to utilize accompanying drawing, but the embodiment in the accompanying drawing does not consist of any restriction of the present utility model, for those of ordinary skill in the art, under the prerequisite of not paying creative work, can also obtain according to the following drawings other accompanying drawing.
Fig. 1 is the structural representation of the guide rail system embodiment one for semiconductor lead carriage of the present utility model.
Fig. 2 is the structural representation of the guide rail system embodiment two for semiconductor lead carriage of the present utility model.
Reference numeral:
1-the first guide rail, 2-lead frame, 21-chip, 22-gold thread, 31-the first vertical component effect, 32-the second vertical component effect, 33-fixing press claw, 41-the first straight section, 42-the second straight section, 43-the 3rd chamfered section.
Embodiment
With the following Examples the utility model is further described.
Embodiment one
One of embodiment of guide rail system for semiconductor lead carriage of the present utility model, as shown in Figure 1, include lead frame 2, the first guide rail 1 and the second guide rail, described lead frame 2 comprises lead frame 2 main bodys, chip 21 and is connected the gold thread 22 of chip 21 and lead frame 2 main bodys, described the first guide rail 1 offers the first guide groove, described the second guide rail offers the second guide groove, described the first guide groove and described the second guide groove are oppositely arranged, and described the second guide rail has the anti-interference structure that can avoid described gold thread 22 and the second guide rail to interfere.
Particularly, described the second guide rail comprises L shaped guide rail body and fixing press claw 33, described L shaped guide rail body comprises the first vertical component effect 31 and the second vertical component effect 32, described fixing press claw 33 is connected with described L shaped guide rail body, described fixing press claw 33 is fitted with described the second vertical component effect 32, described fixing press claw 33 is provided with spacing and forms described the second guide groove with described the first vertical component effect 31, the projection of described fixing press claw 33 and described gold thread 22 to be projected in the first vertical component effect 31 not overlapping.
Since the projection of described fixing press claw 33 and described gold thread 22 to be projected in the first vertical component effect 31 not overlapping, the routed problem of gold thread 22 lines can not appear in described lead frame 2 in transport process.
Further in the present embodiment, the spacing that described fixing press claw 33 and described the first vertical component effect 31 are provided with is greater than the thickness of lead frame 2, because described fixing press claw 33 is described the second guide groove with the spacing of described the first vertical component effect 31, so lead frame 2 can pressed by described the second guide groove in transport process, has avoided the phenomenon of rocking.
Embodiment two
Two of the embodiment of the guide rail system for semiconductor lead carriage of the present utility model, the main technical schemes of present embodiment is identical with embodiment one, unaccounted feature adopts the explanation among the embodiment one in the present embodiment, no longer gives unnecessary details at this.The difference of present embodiment and embodiment one is, described the second guide rail comprises the first straight section 41, the second straight section 42 and the 3rd chamfered section 43,43 of the described first straight section 41 and described the 3rd chamfered section form described the second guide groove, and described the 3rd chamfered section 43 is not interfered with gold thread 22.
Further in the present embodiment, the minimum spacing that the described first straight section 41 and described the 3rd chamfered section 43 form is greater than the thickness of lead frame 2,43 of the described first straight section 41 and described the 3rd chamfered section form described the second guide groove, simultaneously, described the 3rd chamfered section 43 has overlapping with the first straight section 41 that is projected in of lead frame 2, so lead frame 2 can pressed by described the second guide groove in transport process, has avoided the phenomenon of rocking.
Should be noted that at last; above embodiment is only in order to illustrate the technical solution of the utility model; but not to the restriction of the utility model protection range; although with reference to preferred embodiment the utility model has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement the technical solution of the utility model, and not break away from essence and the scope of technical solutions of the utility model.
Claims (5)
1. the guide rail system that is used for semiconductor lead carriage, include lead frame, the first guide rail and the second guide rail, described lead frame comprises the gold thread of lead frame main body, chip and connection chip and lead frame main body, described the first guide rail offers the first guide groove, described the second guide rail offers the second guide groove, described the first guide groove and described the second guide groove are oppositely arranged, and it is characterized in that: described the second guide rail has the anti-interference structure that can avoid described gold thread and described the second guide rail to interfere.
2. the guide rail system for semiconductor lead carriage according to claim 1, it is characterized in that: described the second guide rail comprises L shaped guide rail body and fixing press claw, described L shaped guide rail body comprises the first vertical component effect and the second vertical component effect, described fixing press claw is connected with described L shaped guide rail body, described fixing press claw and described the second vertical component effect are fitted, described fixing press claw and described the first vertical component effect are provided with spacing and form described the second guide groove, the projection of described fixing press claw and described gold thread to be projected in the first vertical component effect not overlapping.
3. the guide rail system for semiconductor lead carriage according to claim 2, it is characterized in that: the spacing that described fixing press claw and described the first vertical component effect are provided with is greater than the thickness of lead frame.
4. the guide rail system for semiconductor lead carriage according to claim 1, it is characterized in that: described the second guide rail comprises the first straight section, the second straight section and the 3rd chamfered section, form described the second guide groove between the described first straight section and described the 3rd chamfered section, described the 3rd chamfered section and gold thread are not interfered.
5. the guide rail system for semiconductor lead carriage according to claim 4 is characterized in that: the minimum spacing that the described first straight section and described the 3rd chamfered section form is greater than the thickness of lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220440667 CN202816893U (en) | 2012-08-31 | 2012-08-31 | Material guide rail system for semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220440667 CN202816893U (en) | 2012-08-31 | 2012-08-31 | Material guide rail system for semiconductor lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202816893U true CN202816893U (en) | 2013-03-20 |
Family
ID=47875735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220440667 Expired - Fee Related CN202816893U (en) | 2012-08-31 | 2012-08-31 | Material guide rail system for semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202816893U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199943A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | Lead frame and lead frame piles up with supporting positioner thereof |
-
2012
- 2012-08-31 CN CN 201220440667 patent/CN202816893U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199943A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | Lead frame and lead frame piles up with supporting positioner thereof |
| CN111199943B (en) * | 2018-11-16 | 2021-11-12 | 泰州友润电子科技股份有限公司 | Lead frame and lead frame piles up with supporting positioner thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20130831 |