CN103531517B - Based on chip bonding processing procedure chip laminating glass picks up device - Google Patents
Based on chip bonding processing procedure chip laminating glass picks up device Download PDFInfo
- Publication number
- CN103531517B CN103531517B CN201310490437.3A CN201310490437A CN103531517B CN 103531517 B CN103531517 B CN 103531517B CN 201310490437 A CN201310490437 A CN 201310490437A CN 103531517 B CN103531517 B CN 103531517B
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- China
- Prior art keywords
- glass
- picks
- suction nozzle
- chip
- vacuum slot
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
The applicable chip laminating glass processing procedure of the present invention uses encapsulation technology field.The present invention discloses a kind of based on chip bonding processing procedure chip laminating glass picks up device, the fix bar fixed including two suction nozzle supports be arrangeding in parallel and with the suction nozzle support, each suction nozzle support is respectively arranged at two ends with moveable at least one vacuum slot, and the vacuum slot is connected with vacuum mechanism.During work, for the glass of different specifications, by adapting to adjust the position of each vacuum slot, it is allowed to match with glass size.Compared with prior art, can avoid inhaling when picking up the glass of different size size, change the time of workload that picks up device increases and debugging, the raising picks up device adapts to the time debugged during different glass size sizes, and then improve production efficiency.
Description
Technical field
The present invention relates to chip laminating glass (Chip On Glass；COG) processing procedure uses encapsulation technology field, particularly relates to
It is a kind of for by chip laminating glass carry out picking up mobile picks up device.
Background technology
During traditional COG processing procedures, need for chip laminating glass to move to chip bonding position, facilitate subsequent handling
Operation is processed.Existing chip laminating glass movement is to inhale to pick up by vacuum slot by glass, then is moved, for different specifications
Glass when, it usually needs change with glass size size be adapted attracting device, increase debugging etc. workload, affect work
Efficiency.
The content of the invention
The invention mainly solves the technical problem of providing a kind of chip bonding processing procedure chip laminating glass that is based on picks up dress
Put, the chip laminating glass picks up device can avoid inhaling when picking up the glass of different size size, change what picks up device increased
Workload and the time of debugging, the raising picks up device adapt to the time debugged during different glass size sizes, and then improve
Production efficiency.
In order to solve above-mentioned technical problem, the present invention provides a kind of chip bonding processing procedure chip laminating glass that is based on and picks up dress
Put, the chip laminating glass picks up device includes：Two suction nozzle supports be arrangeding in parallel and the fixation fixed with the suction nozzle support
Bar, each suction nozzle support are respectively arranged at two ends with moveable at least one vacuum slot, and the vacuum slot connected with vacuum mechanism
Connect, the vacuum slot includes the body for being provided with bulge loop, and grip block is arranged with the body, between the grip block and body
The elastomeric element for making grip block move to body lower end is provided with, rotatable depression bar is provided with the grip block, in the depression bar
Middle part be provided with the straight-bar contacted with bulge loop, be provided with latch at least one shoulder of the fixing groove, the latch and grip block
The card article arranged on lower surface coordinates.
Further say, the suction nozzle support is respectively provided on two sides with fixing groove positioned at fix bar, the section of the fixing groove
In convex shape.
Further say, chip laminating glass picks up device also includes located at vacuum slot and real-time detection glass
Position sensor, the position sensor are connected with control module, and the control module is also believed with the drive mechanism for being connected vacuum slot
Number connection.
Further say, the fixing groove is provided with position scale sign.
Chip of the present invention is fitted glass picks up device, including two suction nozzle supports be arrangeding in parallel and solid with the suction nozzle support
Fixed fix bar, each suction nozzle support are respectively arranged at two ends with moveable at least one vacuum slot, the vacuum slot with it is true
Empty mechanism's connection.During work, for the glass of different specifications, by adapting to adjust the position of each vacuum slot, be allowed to
Glass size matches.Compared with prior art, can avoid inhaling when picking up the glass of different size size, change picks up device and increase
Plus workload and debugging time, the raising picks up device adapts to the time debugged during different glass size sizes, and then
Improve production efficiency.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, and the accompanying drawing in describing is the one of the present invention
A little embodiments, to those skilled in the art, on the premise of not paying creative work, can be with according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 is chip laminating glass picks up device example structure schematic diagram of the present invention.
Fig. 2 is along A-A directions cross-sectional schematic in Fig. 1.
Fig. 3 is along vacuum slot centrage cross-sectional schematic.
With reference to embodiment, and referring to the drawings, the realization, functional characteristics and advantage to the object of the invention is made furtherly
It is bright.
Specific embodiment
In order that invention purpose, technical scheme and advantage it is clearer, below in conjunction with the embodiment of the present invention in it is attached
Figure, is clearly and completely described to the technical scheme in the embodiment of the present invention, it is clear that described embodiment is invention one
Section Example, rather than the embodiment of whole.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing
The every other embodiment obtained on the premise of going out creative work, belongs to the scope of protection of the invention.
As shown in Figure 1, Figure 2 and Figure 3, the present invention provides a kind of based on chip bonding processing procedure chip laminating glass picks up device
Embodiment.
The chip laminating glass picks up device includes：Two suction nozzle supports 2 be arrangeding in parallel and 2 are fixed with the suction nozzle support
Fix bar 1, each suction nozzle support 2 is respectively arranged at two ends with moveable at least one vacuum slot 3, the vacuum slot 3 with
Vacuum mechanism connects.
Specifically, the suction nozzle support 2 is located at fix bar 1 and is respectively provided on two sides with fixing groove 21, the fixing groove 21
Section is in convex shape.The vacuum slot 3 includes the body 30 for being provided with bulge loop 35, on the body 30 is arranged with grip block
31, the elastomeric element 34 for making grip block move to body lower end, such as compression spring etc. are provided between the grip block 31 and body 30,
Rotatable depression bar 32 is provided with the grip block 31, the straight-bar contacted with bulge loop 35 is provided with the middle part of the depression bar 32.It is logical
Cross the contracting spring to coordinate with the limiting section 33 on grip block 31 and body 30 so that grip block 31 is clamped to 21 phase of fixing groove
To fixed position, by appropriate regulation, spring 34 can be made to have sufficient spring energy vacuum slot horizontal direction is not moved,
There is the change that can be disregarded when picking up glass simultaneously in vertical direction.Latch is provided with 21 at least one shoulder of the fixing groove
310, the latch 310 is coordinated with the card article of the lower surface setting of grip block 31 so that vacuum slot 3 is coordinated more with suction nozzle support 2
Closely, will not be moved in the horizontal direction.The fixing groove 21 is provided with position scale sign, and user can be facilitated to make each true
The position of suction mouth is corresponding.Pressed down on by depression bar when needing to move so that grip block is moved up so that with fixing groove
Between matching loose, can realize when acting on movement to vacuum slot horizontal direction.
During work, for the glass of different specifications, by adapting to adjust the position of each vacuum slot, it is allowed to and glass
Size matches.Compared with prior art, can avoid inhaling when picking up the glass of different size size, change what picks up device increased
Workload and the time of debugging, the raising picks up device adapt to the time debugged during different glass size sizes, and then improve
Production efficiency.
As needed, the chip laminating glass picks up device also includes the position located at vacuum slot real-time detection glass
Put sensor, the position sensor is connected with control module, the control module also with the drive mechanism signal for being connected vacuum slot
Connection.By the specification of position sensor real-time detection glass during work, vacuum slot is made by control module control drive mechanism
Position is made to adapt to move earthquake, realizes automatically adjusting.
Above example only to illustrate technical scheme, rather than a limitation；Although with reference to the foregoing embodiments
The present invention has been described in detail, it will be understood by those within the art that：Which still can be to aforementioned each enforcement
Technical scheme described in example is modified, or equivalent is carried out to which part technical characteristic, and these are changed or replace
Change, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (3)
1. based on chip bonding processing procedure chip laminating glass picks up device, it is characterised in that：Including two suction nozzles be arrangeding in parallel
Support and the fix bar fixed with the suction nozzle support, each suction nozzle support are respectively arranged at two ends with moveable at least one vacuum
Suction nozzle, the vacuum slot are connected with vacuum mechanism；The suction nozzle support is respectively provided on two sides with bar shaped fixing groove positioned at fix bar,
The fixation slot cross-section includes the body in bulge loop, is arranged with grip block on the body in convex shape, the vacuum slot, is somebody's turn to do
The elastomeric element for making grip block move to body lower end is provided between grip block and body, is provided with rotatable on the grip block
Depression bar, the straight-bar contacted with bulge loop is provided with the middle part of the depression bar, latch is provided with least one shoulder of the fixing groove, should
The card article arranged on the lower surface of latch and grip block coordinates.
2. according to claim 1 based on chip bonding processing procedure chip laminating glass picks up device, it is characterised in that：It is described
Chip laminating glass picks up device also includes the position sensor located at vacuum slot real-time detection glass, the position sensor
It is connected with control module, the control module is also connected with the drive mechanism signal for being connected vacuum slot.
3. according to claim 1 and 2 based on chip bonding processing procedure chip laminating glass picks up device, it is characterised in that：
The fixing groove is provided with position scale sign.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310490437.3A CN103531517B (en) | 2013-10-19 | 2013-10-19 | Based on chip bonding processing procedure chip laminating glass picks up device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310490437.3A CN103531517B (en) | 2013-10-19 | 2013-10-19 | Based on chip bonding processing procedure chip laminating glass picks up device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103531517A CN103531517A (en) | 2014-01-22 |
| CN103531517B true CN103531517B (en) | 2017-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310490437.3A Active CN103531517B (en) | 2013-10-19 | 2013-10-19 | Based on chip bonding processing procedure chip laminating glass picks up device |
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| Country | Link |
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| CN (1) | CN103531517B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742224A (en) * | 2014-12-11 | 2016-07-06 | 南京瀚宇彩欣科技有限责任公司 | Substrate absorption apparatus |
| CN107275275B (en) * | 2017-06-16 | 2018-05-29 | 英特尔产品（成都）有限公司 | Vacuum cups and crawl and placing device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201532943U (en) * | 2009-11-10 | 2010-07-21 | 中芯国际集成电路制造(上海)有限公司 | Wafer moving device |
| CN102332489A (en) * | 2011-07-21 | 2012-01-25 | 常州海硕机械制造有限公司 | Laminated suction cup |
| CN202481753U (en) * | 2012-03-09 | 2012-10-10 | 深圳市华星光电技术有限公司 | Transfer equipment for liquid crystal panel |
| CN202662583U (en) * | 2012-06-01 | 2013-01-09 | 深圳市新益昌自动化设备有限公司 | Support suction device for LED (light-emitting diode) die bonder |
| CN103280422A (en) * | 2013-05-10 | 2013-09-04 | 华南理工大学 | LED (Light-Emitting Diode) suction-nozzle modularizing device |
| CN203536399U (en) * | 2013-10-19 | 2014-04-09 | 深圳市鑫三力自动化设备有限公司 | COG (chip on glass) pick-up apparatus based on chip bonding process |
-
2013
- 2013-10-19 CN CN201310490437.3A patent/CN103531517B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201532943U (en) * | 2009-11-10 | 2010-07-21 | 中芯国际集成电路制造(上海)有限公司 | Wafer moving device |
| CN102332489A (en) * | 2011-07-21 | 2012-01-25 | 常州海硕机械制造有限公司 | Laminated suction cup |
| CN202481753U (en) * | 2012-03-09 | 2012-10-10 | 深圳市华星光电技术有限公司 | Transfer equipment for liquid crystal panel |
| CN202662583U (en) * | 2012-06-01 | 2013-01-09 | 深圳市新益昌自动化设备有限公司 | Support suction device for LED (light-emitting diode) die bonder |
| CN103280422A (en) * | 2013-05-10 | 2013-09-04 | 华南理工大学 | LED (Light-Emitting Diode) suction-nozzle modularizing device |
| CN203536399U (en) * | 2013-10-19 | 2014-04-09 | 深圳市鑫三力自动化设备有限公司 | COG (chip on glass) pick-up apparatus based on chip bonding process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103531517A (en) | 2014-01-22 |
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