CN202813289U - LED lamp and heat pipe thereof - Google Patents
LED lamp and heat pipe thereof Download PDFInfo
- Publication number
- CN202813289U CN202813289U CN2012203073369U CN201220307336U CN202813289U CN 202813289 U CN202813289 U CN 202813289U CN 2012203073369 U CN2012203073369 U CN 2012203073369U CN 201220307336 U CN201220307336 U CN 201220307336U CN 202813289 U CN202813289 U CN 202813289U
- Authority
- CN
- China
- Prior art keywords
- nano
- heat
- heat pipe
- oxide
- nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model provides a heat pipe belonging to the field of LED light sources. The heat pipe comprises a pipe shell composed of a general material layer and a nanometer heat dissipation layer formed on the outer surface of the general material layer, wherein the material of the nanometer heat dissipation layer adopts water-based organic-inorganic hybridization resin or micro-nano heat dissipation powder. The utility model further provides an LED lamp with the heat pipe, through the nanometer heat dissipation layer, the heat dissipation property of the LED lamp is improved. Compared with a conventional heat pipe for the LED lamp, the heat pipe provided by the utility model has a thermal conductivity improved by more than 40 times, and can greatly improve the service life of the lighting fitting when being applied to the high-power LED lamps. Besides, the nanometer heat dissipation layer on the pipe shell of the heat pipe has anticorrosion performance of being resistant to acid, alkali and salt.
Description
Technical field
The utility model relates to a kind of LED(Light Emitting Diode, light emitting diode) light source, relate in particular to a kind of LED lamp and heat pipe thereof.
Background technology
Along with becoming increasingly conspicuous of global energy problem, augmentation of heat transfer plays vital effect in the exploitation of the energy with in saving, and is also more and more higher to the requirement of the performance indications such as efficient low-resistance compactness of heat-exchange system.
The characteristics such as high brightness LED (LED) has that power consumption is little, life-span length, fast response time, volume are little, pollution-free, easy of integrationization are the light sources of new generation that causes illumination revolution and traditional lighting upgrading of industries.Particularly in today that energy-saving and emission-reduction, protection of the environment become to be the theme, semiconductor lighting becomes new growth engines especially, thereby is subject to the great attention of national governments and industrial circle.
The American market investigation StrategiesUnlimited of company estimates that by 2010, high-brightness LED market will reach 8,300,000,000 dollars, and the sum than 2005 is above 2 times.In recent years, the form that is applied to throw light on along with great power LED forms gradually, solve heat dissipation problem and become the prerequisite that great power LED is used, for existing LED light efficiency level, 70% ~ 80% of input electric energy is transformed into the heat that can't discharge by radiation, and led chip is small-sized, if it is bad to dispel the heat, chip temperature is raise, cause thermal stress distribution inequality, chip light emitting Efficiency Decreasing, the sharp decrease in efficiency of penetrating of fluorescent material.
Studies show that: when temperature surpasses certain value, it is soaring that the crash rate of device will be index law, the every rising 2e of device temperature, and reliability then descends 10%.If a plurality of high-power LED chip dense arrangement consist of white lumination system, the dissipation problem of heat is even more serious.Therefore, how improving the package cooling ability is present stage one of the key technology that needs to be resolved hurrily of illumination level great power LED.
And adopt the high-performance heat radiation coating to come the heat radiation of strengthening electronic device a kind of preferably method of can yet be regarded as.For example, patent CN101659829A discloses a kind of infra-red radiation composite radiating coating.Patent adopts dual-coating, and bottom is charcoal blacking, and surface layer is high radiation nano composite dope, utilizes the investment precoat high radiant rate to reach the purpose of radiating and cooling.But this coating application complex process, demanding coating layer thickness is realized radiating and cooling again simultaneously, so cost is higher.Patent CN101070448A has related to a kind of preparation method who has boron nitride filler and bond to make heat radiation coating.Its method is that the bond reaction by the boron nitride of 30-70% and 30-70% makes, and then adopts spraying and 80 ℃ of lower heated bakings to make, and the radiating effect of coating is obvious.Find through the surface area test: compare with tabula rasa, the microcosmic surface of coating is long-pending to have increased about 154 times.Patent CN101993621A relates to the condense composition of heat dissipation film of a kind of spraying, and it consists of heat-resisting Teflon resin and silicon carbide powder.Owing to be a kind of solvent based coating, environmental pollution is larger.Patent CN101942270A relates to a kind of LED heat radiation coating, and it has used the larger beryllium oxide of toxicity and the more expensive aluminium nitride of price to improve the radiating effect of coating.
More than the heat radiation coating of report is conventional solvent type coating mostly, no matter a large amount of toxic harmful exhaust gas, the discharging of waste water are all arranged in manufacture process or construction application process, environment, atmosphere and water resource are polluted, also cause the waste of resource and the energy simultaneously.In addition, the coating after the film forming is comprised of organic matter mostly, and burning causes potential safety hazard to environment easily.Therefore, cause people's extensive concern based on water-based hybrid inorganic-organic technology, high-performance coating material with inorganic and organic matter cooperative effect, become one of main direction of current surface functional material research and development.
Summary of the invention
The purpose of this utility model is to provide a kind of heat pipe, and it can be delivered to radiator with the heat of led light source, and the amount of heat that the led chip that exists with the solution prior art produces is difficult to timely problem of outwards distributing.
Another purpose of the present utility model is to provide a kind of LED lamp that contains above-mentioned heat pipe.
The heat pipe that the utility model provides comprises shell, and described shell comprises common material layers and nanometer heat dissipating layer, and described nanometer heat dissipating layer is formed at the outer surface of common material layers.
The material of described nanometer heat dissipating layer is water-based organic-inorganic hybrid resin or micro-nano heat radiation powder.
Described water-based organic-inorganic hybrid resin is take metal alkoxide and Nano sol as inorganic precursor, take with the trialkoxy silane of functional group as organic precursor, form through hydrolysis and condensation under given conditions.The number-average molecular weight of described water-based organic-inorganic hybrid resin is 1000 ~ 30000, and solid content is 45-55%, and the weight ratio of described metal alkoxide, Nano sol and described trialkoxy silane with functional group is 1:1 ~ 5:2 ~ 10.
Alkyl in the described metal alkoxide is C
1-8Alkyl, metal are silicon, titanium, zirconium or aluminium.Described metal alkoxide is preferably one or more in ethyl orthosilicate, zirconium-n-propylate and the butyl titanate.
Described Nano sol is one or more in nano-titanium colloidal sol, Nano silica sol, nano aluminum colloidal sol and the nanometer zirconium colloidal sol.
Described trialkoxy silane with functional group is one or more in MTES, isobutyl triethoxy silane, octyltri-ethoxysilane, MTES, dimethyldiethoxysilane, vinyltrimethoxy silane, VTES, γ-glycidyl ether oxygen propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane, γ-methacryloxypropyl trimethoxy silane and trimethyl one Ethoxysilane.
Described micro-nano heat radiation powder is a kind of in carbide, oxide and the nitride.Described carbide is selected from a kind of in nanometer tungsten carbide, carborundum, zirconium carbide, aluminium carbide and the titanium carbide.Described oxide is selected from a kind of in boron oxide, sodium oxide molybdena, magnesia, aluminium oxide, silica, calcium oxide, transition metal oxide and the rare earth oxide.Described nitride is selected from a kind of in nano-silicon nitride, nano vanadium nitride and the Nano titanium nitride of nano-silicon nitride magnesium, nano aluminum nitride, nm-class boron nitride, order orientation structure.
When the material of described nanometer heat dissipating layer was the mixture of water-based organic-inorganic hybrid resin and micro-nano heat radiation powder, the weight ratio of water-based organic-inorganic hybrid resin and micro-nano heat radiation powder was 100:0.3 ~ 3.5.
Described micro-nano heat radiation powder preferably passes through surface modification treatment.
The LED lamp that the utility model provides contains above-mentioned heat pipe.
The beneficial effects of the utility model: the shell of heat pipe of the present utility model is coated with the nanometer heat dissipating layer, its heat dissipating layer can improve the heat dispersion of LED lamp, more existing heat pipe for the LED lamp, heat pipe for thermal conductivity rate of the present utility model improves more than 40 times, the service life that it can obviously improve light fixture when being used for high-powered LED lamp.In addition, the nanometer heat dissipating layer that applies on the shell of the utility model heat pipe has the antiseptic property of acid and alkali resistance, salt, adopt the GB/T1763-89 standard detecting method that the heat pipe that is coated with the nanometer heat dissipating layer is detected, respectively it is dipped in 30d in the salt solution of 10% sulfuric acid, 10% sodium hydroxide solution and 30g/L, non-foaming, nondiscolouring, do not come off, non-corroding.
Description of drawings
Fig. 1 is the front view of LED lamp of the present utility model.
Fig. 2 is the internal structure schematic diagram of LED lamp of the present utility model.
Fig. 3 is the structure for amplifying schematic diagram between light source of the present utility model, lamp stand and the heat pipe.
Fig. 4 is the wall section structural representation of heat pipe of the present utility model.
Reference numeral: 1 first radiator, 2 upper-lower casing padlocks, 3 second radiators, 4 lower houses, 5 cloches, 10 heat pipes, 11 shells, 12LED light source, 13, radiator, 16 lamp stands, 110 common material layers, 120 nanometer heat dissipating layers.
The specific embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described in further details.
The utility model is illustrated as an example of LED light fixture with two-stage radiation example, and concrete structure is described as follows:
As shown in Figure 1, modular two-stage radiation LED street lamp of the present utility model, comprise lamp housing, led light source, cloche 5, wherein lamp housing is to be provided with the first radiator 1 and as the structure of the second radiator 3 of upper shell, upper-lower casing padlock 2 is the latch-up structure of lower house 4 and the second radiator 3 at lower house 4.Led light source 12 connects and composes the one-level heat radiation by heat pipe 10 and the first radiator 1 that is located at the light source bottom, and in addition, led light source 12 is connected to form two-class heat dissipation by lamp stand 16 and the second radiator 3.
The shell 11 of heat pipe 10 comprises common material layers 110 and nanometer heat dissipating layer 120, and this nanometer heat dissipating layer 120 is formed at the outer surface of common material layers 110.
In addition, as the material of nanometer heat dissipating layer 120, can be the water-based organic-inorganic hybrid resin, can also be micro-nano heat radiation powder, also can be the mixture of the two.The below discusses one one.
With the organic-inorganic hybrid resin of making coatings, can be to represent the metal alkoxide of inorganic part such as silane oxide, zirconium alkoxide, alkyl titanium oxide etc., and Nano sol; And the water-based organic-inorganic hybrid resin that makes by hydrolysis and condensation with the trialkoxy silane of functional group that represents organic moiety, the number-average molecular weight of the GPC(gel permeation chromatography) testing this water-based organic-inorganic hybrid resin is 1000 ~ 30000, solid content is 45-55%, and the weight ratio of described metal alkoxide, Nano sol and described trialkoxy silane with functional group is 1:1 ~ 5:2 ~ 10.
Alkyl in the described metal alkoxide can be C
1-8Alkyl, metal can be silicon, titanium, zirconium, aluminium.Such as, described silane oxide can be ethyl orthosilicate; Described zirconium alkoxide can be zirconium-n-propylate; Described alkyl titanium oxide can be butyl titanate.
Described Nano sol can be one or more in nano-titanium colloidal sol, Nano silica sol, nano aluminum colloidal sol and the nanometer zirconium colloidal sol.Preferred titanium dioxide, silica, aluminium dioxide or the mass percent concentration of zirconium dioxide received are 20-40%.
Described trialkoxy silane with functional group can be one or more in MTES, isobutyl triethoxy silane, octyltri-ethoxysilane, MTES, dimethyldiethoxysilane, vinyltrimethoxy silane, VTES, γ-glycidyl ether oxygen propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane, γ-methacryloxypropyl trimethoxy silane and trimethyl one Ethoxysilane.
The preparation method of above-mentioned water-based organic-inorganic hybrid resin is as follows:
(1) preparation of Nano sol: commercially available nano titanium oxide, nano silicon, nanometer titanium dioxide aluminium or Nanosized Zirconia Powders are scattered in the corresponding Nano sol of formation in the organic solvent by ultrasonic wave;
(2) preparation of water-based organic-inorganic hybrid resin: mix with metal alkoxide with the trialkoxy silane of functional group by said ratio, then by said ratio Nano sol is at the uniform velocity added, solution becomes is muddy, continue to stir and drip simultaneously phosphoric acid as catalyst, until solution is transparent, thereby obtain organic-inorganic hybrid resin.
The below enumerates several examples.
Embodiment 1
Step 1 is scattered in commercially available nano-titanium dioxide powder (particle diameter 30nm) in the butyl acetate by ultrasonic wave that to form mass percent concentration be 30% Ludox;
Step 1 is scattered in commercially available nano-titanium dioxide powder (particle diameter 30nm) in the butyl acetate by ultrasonic wave that to form mass percent concentration be 30% Ludox;
As one of micro-nano heat radiation powder, can be metal or nonmetallic carbide, such as nanometer tungsten carbide.Can certainly be other metal or the nonmetallic nano-carbides such as carborundum, zirconium carbide, aluminium carbide or titanium carbide.
Why choose tungsten carbide as micro-nano heat radiation powder, be because: compare with ferrous materials, Talide has special chemistry and physical property, for example, the thermal conductivity of tungsten carbide is higher 2～4 times than ferrous materials, and it has high strength and the high tenacity that equates with high-speed steel, and in the time of 600 ℃, its high temperature hardness still surpasses the normal temperature hardness of high-speed steel, still surpasses the normal temperature hardness of carbon steel in the time of 1000 ℃.
Single tungsten carbide particle only has about 10～100nm, BET surface area 1～50m
2/ g, help very much to improve its heat dispersion, when particularly it joins in the coating that above-mentioned hybrid resin consists of as filler, the bulk effect that can take full advantage of the nano functional filler is filled the unavoidable structure hole of conventional coating (aperture is more than 1nm), form the compacted zone of atresia, stop the infiltration of various corrosive mediums, realize that heat radiation and corrosion-resistant are integrated.
Preparation method as tungsten carbide: industrial useful W elements and carbon commonly used directly react, perhaps tungstic acid and carbon react in inert atmosphere, also can adopt the preparation method (Chinese patent CN101780982B) who utilizes wolframic acid base inorganic-organic hybrid lamellar compound to prepare tungsten carbide nano-powder for single source predecessor.
As micro-nano heat radiation powder, can also be metal or nonmetal oxide, such as one or more the mixture in boron oxide, sodium oxide molybdena, magnesia, aluminium oxide, silica, calcium oxide, transition metal oxide or the rare earth oxide.
As micro-nano heat radiation powder, can also be metal or non-metal nitride, such as one or several the mixture in the multiple super-high heat-conductive fillers such as nano-silicon nitride magnesium, nano aluminum nitride, nm-class boron nitride, nano-silicon nitride (order orientation structure), nano vanadium nitride or Nano titanium nitride.After deliberation, these micro-nano heat radiation powders are the high heat conductive insulating composite granule.
The mixture that uses multiple nitride is during as the heat radiation powder, can be according to easy wetability, doping mark, self heat conductivility different in the particle diameter of every kind of material and form, surface, use the different particle of particle diameter, allow and form maximum degree of piling up between filler, heat conduction network in the system is formed to the full extent and reach effective heat conduction (also namely forming the almost compacted zone of atresia), acquisition high heat conductive body system, thermal conductivity factor even can reach more than the 400W/MK, and insulating properties is fine, resistivity more than 10 16 powers, and can be anti-1800 degree high temperature.Be suitable for very much the heat radiation of high-powered LED lamp.
When the material as nanometer heat dissipating layer 120 is the mixture of above-mentioned water-based organic-inorganic hybrid resin and above-mentioned micro-nano heat radiation powder, the weight ratio of above-mentioned water-based organic-inorganic hybrid resin solids and above-mentioned micro-nano heat radiation powder is 100:0.3 ~ 3.5, is preferably 100:1.
In addition, can carry out surface modification treatment to described micro-nano heat radiation powder, thereby introduce organic reaction functional group, like this, can improve the dispersiveness of micro-nano heat radiation powder in coating material on the one hand, in film forming procedure, make on the other hand the reaction of the organic reaction functional group that is introduced into and resin generation chemical graft, thus improve heat dissipating layer compactness, hardness, shock resistance and with the adhesive force of ground.Such as above-mentioned nitride, if process through special surface, after introducing organic reaction functional group, its content of surface oxygen is extremely low, thereby can the success be applied in epoxy resin, polyurethane, heat conductive silica gel, heat-conducting silicone grease, the plastics, because its heat conductivility is extremely strong, general adding proportion is the 1%(mass ratio) about, can make macromolecule resin reach thermal conductivity factor about 3W.
The below enumerates an example of micro-nano heat radiation powder surface modification.
Ethyl orthosilicate is dissolved in a certain amount of absolute ethyl alcohol, the hydrochloric acid that adds again quantitative 1mol/L in the system, regulating the pH value is 2, then according to ethyl orthosilicate: γ-glycidyl ether oxygen propyl trimethoxy silicane is the 1:4(mol ratio) add the distilled water of γ-glycidyl ether oxygen propyl trimethoxy silicane and metering, 78 ℃ of lower reaction 6h in the reaction system; Reaction after finishing is taken out accessory substance, and reaction system is sealed ageing, obtains the transparent modified silicon dioxide sol of homogeneous.
In addition, according to above-mentioned discussion as can be known, shell 11 as the heat pipe 10 among the utility model Fig. 3, also can include only common material layers 110, only this common material layers 110 is to be formed by one or more plastics that mix among above-mentioned nitride, oxide and the person's carbide person that 0.5-3wt% is arranged, and common plastics are because be added with above-mentioned additive, so its thermal conductivity brings up to 2.0 from original 0.1, thermal conductivity has improved 20 times.Realized the effect that can heat conduction alleviates again the weight of LED street lamp.
As the radiation nano powder body material is applied to the method that heat pipe package gets on, can by the method for spraying, can by the method (CN102181212A) of electrophoresis, also can be the whole bag of tricks such as plasma spraying also.
Nanometer tungsten carbide can make an addition in the binding agents such as pottery or macromolecular material or the agent for fixing, is coated in the outer wall surface of this common material layers 110 after the mixing.
In addition, above-mentioned nanometer heat radiation coating can also form at upper-lower casing except being formed at heat pipe.
As known by the technical knowledge, the utility model can be realized by other the embodiment that does not break away from its Spirit Essence or essential feature.Therefore, above-mentioned disclosed embodiment with regard to each side, all just illustrates, and is not only.All in the utility model scope or the change that is being equal in the scope of the present utility model all be included in the utility model.
Claims (4)
1. a heat pipe comprises shell, it is characterized in that, described shell comprises common material layers and nanometer heat dissipating layer, and described nanometer heat dissipating layer is formed at the outer surface of common material layers.
2. heat pipe according to claim 1 is characterized in that, the material of described nanometer heat dissipating layer is water-based organic-inorganic hybrid resin or micro-nano heat radiation powder.
3. heat pipe according to claim 2 is characterized in that, described micro-nano heat radiation powder is a kind of in carbide, oxide and the nitride; Wherein, described carbide is selected from a kind of in nanometer tungsten carbide, carborundum, zirconium carbide, aluminium carbide and the titanium carbide; Described oxide is selected from a kind of in boron oxide, sodium oxide molybdena, magnesia, aluminium oxide, silica, calcium oxide, transition metal oxide and the rare earth oxide; Described nitride is selected from a kind of in nano-silicon nitride, nano vanadium nitride and the Nano titanium nitride of nano-silicon nitride magnesium, nano aluminum nitride, nm-class boron nitride, order orientation structure.
4. a LED lamp is characterized in that, comprises the described heat pipe of one of claim 1 ~ 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203073369U CN202813289U (en) | 2012-06-28 | 2012-06-28 | LED lamp and heat pipe thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203073369U CN202813289U (en) | 2012-06-28 | 2012-06-28 | LED lamp and heat pipe thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202813289U true CN202813289U (en) | 2013-03-20 |
Family
ID=47872154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012203073369U Expired - Fee Related CN202813289U (en) | 2012-06-28 | 2012-06-28 | LED lamp and heat pipe thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202813289U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143405A (en) * | 2013-05-10 | 2014-11-12 | 上海联影医疗科技有限公司 | Connection structure and manufacturing method thereof |
-
2012
- 2012-06-28 CN CN2012203073369U patent/CN202813289U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143405A (en) * | 2013-05-10 | 2014-11-12 | 上海联影医疗科技有限公司 | Connection structure and manufacturing method thereof |
| CN104143405B (en) * | 2013-05-10 | 2018-08-31 | 上海联影医疗科技有限公司 | A kind of connection structure and its manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102748737B (en) | LED (light-emitting diode) lamp and radiating pipe thereof | |
| CN102134474B (en) | Thermal grease composition | |
| CN104087125B (en) | A kind of ocean Epoxy zinc-rich anticorrosive powdery paint and preparation method thereof | |
| CN103531693B (en) | A kind of preparation method of the COB area light source of big lighting angle | |
| CN1295629A (en) | Method for protecting metallic substrate against corrosion | |
| CN103627223B (en) | Graphene heat-conductive coating and preparation method thereof | |
| CN105219208B (en) | A kind of preparation method of epoxy novolac nano anticorrosive coating | |
| CN102585638A (en) | Preparation method for waterborne nano radiating and cooling environment-friendly coating, and coating | |
| CN106247193A (en) | A kind of LED bulb | |
| CN107325686A (en) | Binary polymerization graphene nano anticorrosive paint and technology of preparing | |
| CN105970192B (en) | The preparation method and application of intelligent corrosion-inhibiting coating | |
| CN102942895A (en) | Heat-conduction electronic potting adhesive and preparation method thereof | |
| WO2014175344A1 (en) | Aqueous coating material, heat-dissipating member, metallic part, and electronic device | |
| CN108373592A (en) | Heat conductive silicone grease composition and heat-conducting silicone grease and LED illumination device | |
| CN103665875B (en) | A kind of preparation method of conductive silicon rubber | |
| CN110776819A (en) | Graphene heat dissipation coating for electronic and electric appliances | |
| CN202813289U (en) | LED lamp and heat pipe thereof | |
| CN106634862A (en) | Thermal conductive gel and preparation method thereof | |
| CN104088003B (en) | A kind of preparation method of LED lamp aluminium alloy radiator surface radiating composite coating material | |
| CN102732148A (en) | Urushiol silicon high temperature resistant liquid anti-corrosion paint | |
| CN110317519A (en) | A kind of preparation method of environment friendly flame-retardant LED heat radiation coating | |
| CN108730940B (en) | Graphene heat dissipation LED street lamp tube | |
| CN108731531B (en) | Reversible energy storage material and preparation method thereof | |
| CN109181442A (en) | A kind of photovoltaic apparatus water-based anticorrosive paint | |
| CN109705725A (en) | A kind of heat radiating type polyamide powder coating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20160628 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |