CN102942895A - Heat-conduction electronic potting adhesive and preparation method thereof - Google Patents

Heat-conduction electronic potting adhesive and preparation method thereof Download PDF

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Publication number
CN102942895A
CN102942895A CN2012104620269A CN201210462026A CN102942895A CN 102942895 A CN102942895 A CN 102942895A CN 2012104620269 A CN2012104620269 A CN 2012104620269A CN 201210462026 A CN201210462026 A CN 201210462026A CN 102942895 A CN102942895 A CN 102942895A
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heat conductive
retarding
conductive flame
powder
pouring sealant
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CN102942895B (en
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唐丽
王建斌
陈田安
解海华
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Yantai Darbond Technology Co Ltd
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Yantai Darbond Technology Co Ltd
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Abstract

The invention relates to the field of a potting adhesive and particularly relates to a low-viscosity heat-conduction electronic potting adhesive applicable to each electronic element and a preparation method thereof. The heat-conduction electronic potting adhesive is formed by a component A and a component B in a weight ratio from 100: 90 to 100: 110; the component A comprises the following raw materials in weight percentage of 39.20-79.60% of heat-conduction inflaming retarding powder, 0.80-2.00% of color matching agent, 0.40-1.00% of silane coupling agent, 16.20-43.80% of liquid silicon oil and 3.00-14.50% of silane cross-linking agent; and the component B comprises the following raw materials in weight percentage of 39.20-79.60% of heat-conduction inflaming retarding powder, 18.00-57.80% of liquid silicon oil, 0.20-1.00% of silane coupling agent, 1.00-1.96% of color matching agent and 0.04-1.00% of catalyst. The low-viscosity heat-conduction electronic potting adhesive has lower viscosity, excellent mobility, good heat-conduction performance and high inflaming retarding grade; the potting requirement of a seam less than 0.02 mm can be met and the construction is convenient; and after the heat-conduction electronic potting adhesive is cured, the strength is good, and the dustproof, moisture-proof and vibration-proof performances are good, the electronic element can be effectively protected and the service life of the electronic element is prolonged.

Description

A kind of heat conductive electronic pouring sealant and preparation method thereof
Technical field
The present invention relates to the embedding adhesive area, particularly a kind of low viscosity heat conductive electronic pouring sealant that is applicable to various electronic devices and components and preparation method thereof.
Background technology
Organic silicon potting material has that operating temperature range is wide, the high-low temperature resistant impact property excellent, does not absorb heat when solidifying, heat release, does not shrink after the curing, and electric property and chemical stability are excellent, corrosion-resistant, good weatherability, the advantage of heat conductivility excellence.As electronic encapsulation material, can play the effect of dustproof, moistureproof, against shock, heat conduction, the stability of raising electronic devices and components.Compare the advantage such as the add-on type electron pouring sealant has does not emit low molecule by product, easy to control without the burn into crosslinking structure, and the vulcanizate shrinking percentage is little with traditional condensed type electron pouring sealant.Have in addition simple process, quick, energy-efficient advantage.Therefore, be the extremely rising used in electronic industry type material of generally acknowledging both at home and abroad.
And along with the development of electronic industry, electronic devices and components are tending towards densification and miniaturization, and the raising of its power is also had higher requirement to thermal conductivity and the flame retardant resistance of joint sealant.In order to realize this requirement, when the preparation joint sealant, need to add a large amount of heat conduction and fire-retardant mineral filler, because filler and basic glue consistency are poor, be easy to cause viscosity increase, the strength decreased of joint sealant, finally cause poor fluidity, intensity low, can't effectively satisfy the embedding requirement of electronic devices and components.Using Ball-type packing can address this problem to a certain extent, but because Ball-type packing is expensive, finally causes the terminal price of product high, thereby has limited the Application Areas of joint sealant.
Summary of the invention
The present invention avoid adding expensive sphere or class Ball-type packing, viscosity lower, have excellent flowability, low viscous heat conductive flame-retarding electron pouring sealant of a kind of low cost and preparation method thereof is provided.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: described heat conductive flame-retarding electron pouring sealant is by by weight forming for the A component of 100:90~100:110 and B component,
Described A component comprises the raw material of following weight percent: heat conductive flame-retarding powder 39.20%~79.60%, toning agent 0.80~2.00%, silane coupling agent 0.40~1.00%, liquid silicone oil 16.20%~43.80%, silane crosslinker 3.00%~14.50%;
Described B component comprises the raw material of following weight percent: heat conductive flame-retarding powder 39.20%~79.60%, liquid silicone oil 18.00%~57.80%, silane coupling agent 0.20~1.00%, toning agent 1.00~1.96%, catalyzer 0.04%~1.00%.
The invention has the beneficial effects as follows: viscosity is lower, has excellent flowability, can satisfy the embedding requirement less than the slit of 0.2mm, easy construction.Cured strength is high, and is dustproof, moistureproof, the against shock performance is good, can effectively protect electronic devices and components.Good heat conductivity, the heat that is beneficial to electronic devices and components is dispersed, and effectively improves the work-ing life of electronic devices and components; Fire-retardant rank is high, has guaranteed the reliability of electronic devices and components.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described heat conductive flame-retarding powder is silicon oxide, aluminum oxide, a kind of or any several mixture in aluminium nitride, boron nitride, silicon nitride, titanium oxide, aluminium hydroxide, the magnesium hydroxide.The shape characteristic of described heat conductive flame-retarding powder is irregular aciculiform, fibrous, and regularity is lower.
Adopt the beneficial effect of above-mentioned further scheme to be, because the shape characteristic of irregular powder, directly contact and the probability of formation thermal conducting path is larger has reduced thermal resistance, thereby has been conducive to the raising of thermal conductivity mutually.
Further, the particle diameter of described heat conductive flame-retarding powder is 0.10~60.00 μ m.
Adopt the beneficial effect of above-mentioned further scheme to be, sized particles is used, energy Effective Raise thermal conductivity, and the viscosity increase is not obvious.
Further, described liquid silicone oil is the silicone oil that vinyl-terminated silicone fluid or side chain contain vinyl.
Adopt the beneficial effect of above-mentioned further scheme to be, the curing of vinyl silicone oil belongs to addition curing, and solidification process is overflowed without small molecules, can not pollute the corrosion device surface; Heat resistance is good, can use in-50 ℃~260 ℃ scopes.The silicone oil that vinyl-terminated silicone fluid and side chain contain vinyl vulcanizes jointly, and raising cross-linking density that can be suitable is put forward high-intensity purpose thereby reach.
Further, the viscosity that described vinyl-terminated silicone fluid and/or side chain contain the silicone oil of vinyl is 40~5000m Pas, and the molar ratio of the described liquid silicone oil of ethene fiduciary point is 0.20%~0.80%.
Adopt the beneficial effect of above-mentioned further scheme to be, the vinyl silicone oil of different viscosity is used and is falling the low viscous while, can form the Concentrative crosslinking point, can be greatly improved thereby improve intensity, particularly tear strength.
Further, the mass content of reactive hydrogen is 0.05%~1.00% in the described silane crosslinker, and described silane crosslinker is terminal methyl hydrogen polysiloxanes or pending methyl group hydrogen polysiloxanes.
Adopt the beneficial effect of above-mentioned further scheme to be, select low viscous low hydrogeneous methylhydrogenpolysi,oxane, can reduce system viscosity, by regulating kind and the consumption of crosslinking component, can regulate the intensity of the rear product of sulfuration simultaneously.
Further, described catalyzer is highly active platinum catalyst, comprise in Platinic chloride Virahol complex compound, Platinic chloride divinyl tetramethyl-silica alkane complex compound or the Platinic chloride diethyl phthalate complex compound any one, the mass content of platinum is 1000~5000ppm in the described catalyzer.
Adopt the beneficial effect of above-mentioned further scheme to be, by adopting highly active platinum catalyst, can improve catalytic efficiency, shorten curing time.
Further, described toning agent is any one in carbon black, barba hispanica or the titanium dioxide.
Adopt the beneficial effect of above-mentioned further scheme to be, can regulate as requested the color of joint sealant, with suitable with the colour match of embedding device.And can judge whether two components mix.
Further, described silane coupling agent is any one or a few of γ-aminopropyl triethoxysilane, γ-(2,3-epoxy the third oxygen) propyl trimethoxy silicane, γ-(methacryloxypropyl) propyl trimethoxy silicane.
Adopt the beneficial effect of above-mentioned further scheme to be, utilize silane coupling agent that the heat conductive flame-retarding powder is carried out surface modification treatment, can reduce surface energy and the surface polarity of filler, increase loading level, improve the degree of scatter of filler, when the silica gel after guaranteeing to vulcanize has good heat conductive flame-retarding performance, possesses good flowability and intensity.
The another technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of preparation method of heat conductive flame-retarding electron pouring sealant may further comprise the steps:
1) the heat conductive flame-retarding powder is placed ball grinder, with silane coupling agent (consumption be heat conductive flame-retarding powder weight 0.20%~1.00%) with dehydrated alcohol by weight for adding after the dilution proportion of 1:20 in the ball grinder, after stirring, put into ball mill and carry out ball milling modification.Grind and take out oven dry after 2 hours, continue again the heat conductive flame-retarding powder grinding obtains modification after 1 hour after.
2) will account for the vinyl silicone oil of system total mass umber 16.20%~43.80%, add successively in the kneader (be about to weight ratio and be in heat conductive flame-retarding powder and the liquid silicone oil adding kneader after the described modification of 39.20:16.20~79.60:43.80) through the heat conductive flame-retarding powder of the system that the accounts for total mass mark 39.20%~79.60% of ball milling modification, 120-130 ℃ lower vacuum kneading 2-4 hour, obtain base-material.
3) successively with a certain amount of base-material, silane crosslinker 3.00%~14.50%, toning agent 0.80~2.00% adds in the 5L double-planet dynamic mixing stirrer, rotational velocity is 200-2000 rev/min, revolution speed is 8-30 rev/min, in vacuum tightness-0.08MP~-condition of 0.1MPa under mechanical stirring made the A component in 2~3 hours;
4) successively with a certain amount of base-material, low-viscosity (mobile) liquid silicone oil 1.80%~14.00%, catalyzer 0.04%~1.00%, toning agent 1.00~1.96% adds in the 5L double-planet dynamic mixing stirrer, rotational velocity is 200-2000 rev/min, revolution speed is 8-30 rev/min, in vacuum tightness-0.08MP~-condition of 0.1MPa under mechanical stirring made the B component in 2~3 hours;
When 5) using, A, B component are mixed self-vulcanizing 24 hours, i.e. described heat conductive flame-retarding electron pouring sealant with the weight ratio of 100:90~100:110.
Further, the kneader described in the step 1) is vacuum kneader.
Embodiment
Below principle of the present invention and feature are described, institute only gives an actual example and to be used for explanation the present invention, is not be used to limiting scope of the present invention.
Embodiment 1
Be the irregular silica powder 2560.00g of 10 μ m successively with median size, median size is the irregular alumina powder jointed 6400.00g of 60 μ m, median size is that the aluminium hydroxide powder 3840.00g of 20 μ m places container, 25.60g silane coupling agent γ-aminopropyl triethoxysilane is added in the heat conductive flame-retarding powder with the dilution of 512.00g dehydrated alcohol is rear, and stirring is placed in the ball grinder.Put into ball mill and carry out ball milling modification.Grind and take out oven dry after 2 hours, continue again the heat conductive flame-retarding powder grinding obtains modification after 1 hour after.
Accurately take by weighing vinyl-terminated silicone fluid 2592.00g, the heat conductive flame-retarding powder 12825.60g after the modification adds in the vacuum kneader successively, and 120~130 ℃ of lower vacuum kneadings 4 hours obtain base-material.
Accurately take by weighing base-material 6156.80g, silane crosslinker terminal methyl hydrogen polysiloxanes 192.00g, carbon black 51.20g, add in the 10L double-planet dynamic mixing stirrer, rotational velocity is 2000 rev/mins, revolution speed is 30 rev/mins, and mechanical stirring obtained the A component in 3 hours under the condition of vacuum tightness-0.1MPa;
Accurately take by weighing base-material 6156.80g, low viscosity vinyl-terminated silicone fluid 115.20g, catalyzer Platinic chloride Virahol complex compound 2.56g, titanium dioxide 125.44g, add in the 10L double-planet dynamic mixing stirrer, rotational velocity is 2000 rev/mins, and revolution speed is 30 rev/mins, and mechanical stirring obtained the B component in 2~3 hours under the condition of vacuum tightness-0.1MPa;
During use, A, B component are mixed with the weight ratio of 100:90~100:110, self-vulcanizing 24 hours, and get final product.
Wherein, the viscosity of described vinyl-terminated silicone fluid is 50m Pas; Described silane crosslinker is that hydrogen content is 1.00% silicon oil of low hydrogen content terminal methyl hydrogen polysiloxanes; The concentration of platinum is 5000ppm in the described catalyzer.
Embodiment 2
Be the irregular silica powder 2305.00g of 5 μ m successively with median size, median size is the irregular silica powder 3455.00g of 13 μ m, median size is that the magnesium hydrate powder 3840.00g of 40 μ m places container, with 48.00g silane coupling agent γ-(2,3-epoxy the third oxygen) propyl trimethoxy silicane adds in the heat conductive flame-retarding powder with the dilution of 960.00g dehydrated alcohol is rear, and stirring is placed in the ball grinder.Put into ball mill and carry out ball milling modification.Grind and take out oven dry after 2 hours, continue again the heat conductive flame-retarding powder grinding obtains modification after 1 hour after.
Accurately take by weighing vinyl silicone oil 4800.00g, the heat conductive flame-retarding powder 9648.00g after the modification adds in the vacuum kneader successively, and 120-130 ℃ of lower vacuum kneading 3 hours obtains base-material.
Accurately take by weighing base-material 5760.00g, silane crosslinker pending methyl group hydrogen polysiloxanes 512.00g, carbon black (making barba hispanica into) 128.00g, add in the 10L double-planet dynamic mixing stirrer, rotational velocity is 1500 rev/mins, revolution speed is 28 rev/mins, and mechanical stirring obtained the A component in 3 hours under the condition of vacuum tightness-0.1MPa;
Accurately take by weighing base-material 5760.00g, the low viscosity side chain contains vinyl silicone oil 499.20g, catalyzer Platinic chloride divinyl tetramethyl-silica alkane complex compound 32g, titanium dioxide 108.80g, add in the 10L double-planet dynamic mixing stirrer, rotational velocity is 1500 rev/mins, and revolution speed is 28 rev/mins, and mechanical stirring obtained the B component in 3 hours under the condition of vacuum tightness-0.1MPa;
During use, A, B component are mixed with the weight ratio of 100:90~100:110, self-vulcanizing 24 hours, and get final product.
Wherein, to contain the viscosity of vinyl silicone oil be 200m Pas to described side chain; Described silane crosslinker pending methyl group hydrogen polysiloxanes is that hydrogen content is 0.50% silicon oil of low hydrogen content; The concentration of platinum is 3000ppm in the described catalyzer Platinic chloride divinyl tetramethyl-silica alkane complex compound.
Embodiment 3
Be the irregular silica powder 1920.00g of 2 μ m successively with median size, median size is the irregular alumina powder jointed 3200.00g of 20 μ m, median size is that the titanium oxide powder 1280.00g of 13 μ m places container, with 64.00g silane coupling agent γ-(2,3-epoxy the third oxygen) propyl trimethoxy silicane adds in the heat conductive flame-retarding powder with the dilution of 1280.00g dehydrated alcohol is rear, and stirring is placed in the ball grinder.Put into ball mill and carry out ball milling modification.Grind and take out oven dry after 2 hours, continue again the heat conductive flame-retarding powder grinding obtains modification after 1 hour after.
Accurately take by weighing vinyl-terminated silicone fluid 7040.00g, the heat conductive flame-retarding powder 6464.00g after the modification adds in the vacuum kneader successively, and 120-130 ℃ of lower vacuum kneading 3 hours obtains base-material.
Accurately take by weighing base-material 5376.00g, silane crosslinker pending methyl group hydrogen polysiloxanes 928.00g, carbon black 96.00g, add in the 10L double-planet dynamic mixing stirrer, rotational velocity is 1800 rev/mins, revolution speed is 28 rev/mins, and mechanical stirring obtained the A component in 3 hours under the condition of vacuum tightness-0.1MPa;
Accurately take by weighing base-material 5376.00g, low viscosity vinyl-terminated silicone fluid 896.00g, catalyzer Platinic chloride diethyl phthalate complex compound 64g, titanium dioxide 64.00g, add in the 10L double-planet dynamic mixing stirrer, rotational velocity is 1800 rev/mins, and revolution speed is 28 rev/mins, and mechanical stirring obtained the B component in 3 hours under the condition of vacuum tightness-0.1MPa;
During use, A, B component are mixed with the weight ratio of 100:90~100:110, self-vulcanizing 24 hours, and get final product.
Wherein, the viscosity of described vinyl-terminated silicone fluid is 500m Pas; Described silane crosslinker pending methyl group hydrogen polysiloxanes is that hydrogen content is 0.25% silicon oil of low hydrogen content; The concentration of platinum is 1000ppm in the described catalyzer Platinic chloride diethyl phthalate complex compound.
The comparative example 1
Accurately take by weighing following various raw material, viscosity is the vinyl silicone oil 2816.00g of 500m Pas, silane crosslinker 928.00g, median size is 5 μ m aluminium hydroxide 512.00g, median size is the alumina powder jointed 1280.00g of 50 μ m, median size is the silica powder 768.00g of 25 μ m, carbon black 96.00g adds in the 10L double-planet dynamic mixing stirrer mixing and stirring successively, obtain component A, packing is placed stand-by; Viscosity is the vinyl silicone oil 2816.00g of 500m Pas, concentration is 1000ppm platinum catalyst 64.00g, median size is 5 μ m aluminium hydroxide 512.00g, and median size is the alumina powder jointed 1280.00g of 50 μ m, and median size is the silica powder 768.00g of 25 μ m, titanium dioxide 64.00g, viscosity is the vinyl silicone oil 896.00g of 200m Pas, adds successively in the 10L double-planet dynamic mixing stirrer mixing and stirring, obtain B component, packing is placed stand-by;
During use, with A component and the B component that makes, mix with the weight proportion of 100:100, solidified 24 hours in 25 ℃, carry out polyreaction, get final product.
Wherein, described silane crosslinker is the silicon oil of low hydrogen content of 0.25% reactive hydrogen content.
The comparative example 2
Accurately take by weighing following various raw material, viscosity is the vinyl silicone oil 1036.80g of 200m Pas, silane crosslinker 192.00g, median size is the ball-aluminium oxide 1024.00g of 5 μ m, median size is the ball-aluminium oxide powder 2560.00g of 50 μ m, median size is the aluminium hydroxide powder 1536.00g of 25 μ m, carbon black 51.20g adds in the 10L double-planet dynamic mixing stirrer mixing and stirring successively, obtain component A, packing is placed stand-by; Accurately take by weighing following various raw material, viscosity is the vinyl silicone oil 1036.80g of 200m Pas, viscosity is the vinyl silicone oil 115.20g of 40m Pas, median size is the ball-aluminium oxide 1024.00g of 5 μ m, median size is the ball-aluminium oxide powder 2560.00g of 50 μ m, median size is the aluminium hydroxide powder 1536.00g of 25 μ m, titanium dioxide 125.44g, concentration is that 1000ppm platinum catalyst 64.00g adds in the 10L double-planet dynamic mixing stirrer successively, mixing and stirring, obtain component A, packing is placed stand-by; During use, with A component and the B component that makes, mix with the weight proportion of 100:100, solidified 24 hours in 25 ℃, carry out polyreaction, get final product.
Wherein, described silane crosslinker is the silicon oil of low hydrogen content of 0.50% reactive hydrogen content.
Concrete test example
Performance by following experimental test two-pack embedding of the present invention silica gel.
Testing method:
A, the B component of contrast case and case study on implementation are mixed the final vacuum deaeration, according to standard GB/T2794-1995 tested viscosity; A, B component mix the final vacuum deaeration, evenly are coated on the mould that thickness is 2mm, solidify the tensile strength of pressing the GB/T528-1998 test sample behind the 72h, elongation at break; According to ASTM D5470 test thermal conductivity.
Table one test acquired results
Figure BDA00002411188800091
From table, can find out, when filler umber content is higher, heat conduction joint sealant of the present invention is suitable with the thermal conductivity, tensile strength and the elongation at break that contain the joint sealant of Ball-type packing, viscosity is slightly high, but because Ball-type packing is expensive, therefore heat conduction joint sealant cost performance of the present invention is higher.When filler umber content was low, heat conduction joint sealant of the present invention had the thermal conductivity of lower viscosity, better intensity and Geng Gao.Can effectively satisfy the embedding requirement of electronic devices and components.
The above only is preferred embodiment of the present invention, and is in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. a heat conductive flame-retarding electron pouring sealant is characterized in that, described heat conductive flame-retarding electron pouring sealant is by by weight forming for the A component of 100:90~100:110 and B component,
Described A component comprises the raw material of following weight percent: heat conductive flame-retarding powder 39.20%~79.60%, toning agent 0.80~2.00%, silane coupling agent 0.40~1.00%, liquid silicone oil 16.20%~43.80%, silane crosslinker 3.00%~14.50%;
Described B component comprises the raw material of following weight percent: heat conductive flame-retarding powder 39.20%~79.60%, liquid silicone oil 18.00%~57.80%, silane coupling agent 0.20~1.00%, toning agent 1.00~1.96%, catalyzer 0.04%~1.00%.
2. heat conductive flame-retarding electron pouring sealant according to claim 1, it is characterized in that, described heat conductive flame-retarding powder is silicon oxide, aluminum oxide, a kind of or any several mixture in aluminium nitride, boron nitride, silicon nitride, titanium oxide, aluminium hydroxide, the magnesium hydroxide.
3. heat conductive flame-retarding electron pouring sealant according to claim 1 and 2 is characterized in that, the particle diameter of described heat conductive flame-retarding powder is 0.10~60.00 μ m.
4. heat conductive flame-retarding electron pouring sealant according to claim 1 and 2 is characterized in that, described liquid silicone oil is the silicone oil that vinyl-terminated silicone fluid or side chain contain vinyl; The viscosity that described vinyl-terminated silicone fluid and/or side chain contain the silicone oil of vinyl is 40~5000m Pas, and the molar ratio of the described liquid silicone oil of ethene fiduciary point is 0.20%~0.80%.
5. heat conductive flame-retarding electron pouring sealant according to claim 1 and 2 is characterized in that, the mass content of reactive hydrogen is 0.05%~1.00% in the described silane crosslinker, and described silane crosslinker is terminal methyl hydrogen polysiloxanes or pending methyl group hydrogen polysiloxanes.
6. heat conductive flame-retarding electron pouring sealant according to claim 1 and 2, it is characterized in that, described catalyzer is any one in Platinic chloride Virahol complex compound, Platinic chloride divinyl tetramethyl-silica alkane complex compound or the Platinic chloride diethyl phthalate complex compound, and the mass content of platinum is 1000~5000ppm in the described catalyzer.
7. heat conductive flame-retarding electron pouring sealant according to claim 1 and 2 is characterized in that, described toning agent is any one in carbon black, barba hispanica or the titanium dioxide.
8. heat conductive flame-retarding electron pouring sealant according to claim 1 and 2, it is characterized in that, described silane coupling agent is any one or a few of γ-aminopropyl triethoxysilane, γ-(2,3-epoxy the third oxygen) propyl trimethoxy silicane, γ-(methacryloxypropyl) propyl trimethoxy silicane.
9. the preparation method of a heat conductive flame-retarding electron pouring sealant is characterized in that, will carry out modification such as the arbitrary described heat conductive flame-retarding powder of claim 1 to 8, again the heat conductive flame-retarding powder after the modification is carried out kneader and processes.
10. the preparation method of heat conductive flame-retarding electron pouring sealant according to claim 9, it is characterized in that, the modification of described heat conductive flame-retarding powder is: described heat conductive flame-retarding powder is placed ball grinder, to account for as described in the adding after with the mass ratio dilution of dehydrated alcohol by 1:20 such as claim 1 or 5 described silane coupling agents of described heat conductive flame-retarding powder weight 0.20%~1.00% in the ball grinder, stir, put into ball mill and carry out ball milling modification, grind and take out oven dry after 2 hours, continue the heat conductive flame-retarding powder grinding obtains modification after 1 hour after; Described kneader is treated to: with weight ratio be after the described modification of 39.20:16.20~79.60:43.80 the heat conductive flame-retarding powder with as claim 1 or 4 described liquid silicone oil adding kneaders in, at 120~130 ℃ of lower vacuum kneading 2-4 hours.
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CN105542708A (en) * 2015-12-29 2016-05-04 江苏创景科技有限公司 Two-component low-hardness high-heat-conduction organic silicone pouring sealant
CN103450710B (en) * 2013-08-19 2016-05-18 铜陵瑞莱科技有限公司 A kind of coated fire-retardant iron oxide blue
CN106675507A (en) * 2016-12-29 2017-05-17 大连亚泰科技新材料股份有限公司 Heat-conducting flame-retardant electronic-pouring sealant and preparation method thereof
CN107652944A (en) * 2017-11-10 2018-02-02 烟台德邦科技有限公司 A kind of two-component soft, high resiliency, low migration, high heat conduction organosilicon filling and sealing gum and preparation method thereof
CN108117859A (en) * 2017-01-10 2018-06-05 曹云来 A kind of super-hydrophobic bi-component organic silicon casting glue and preparation method thereof
CN108410416A (en) * 2018-03-30 2018-08-17 深圳天鼎新材料有限公司 A kind of embedding silica gel and its preparation method and application
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CN112852380A (en) * 2021-01-18 2021-05-28 竹山县秦巴钡盐有限公司 Barium sulfate electronic pouring sealant and preparation method and application thereof
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CN114806494A (en) * 2022-05-22 2022-07-29 青岛卓尤新材料有限公司 Low-density high-thermal-conductivity silica gel joint mixture and preparation method thereof
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CN105542708A (en) * 2015-12-29 2016-05-04 江苏创景科技有限公司 Two-component low-hardness high-heat-conduction organic silicone pouring sealant
CN106675507A (en) * 2016-12-29 2017-05-17 大连亚泰科技新材料股份有限公司 Heat-conducting flame-retardant electronic-pouring sealant and preparation method thereof
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CN110105926A (en) * 2019-05-10 2019-08-09 苏州环明电子科技有限公司 It is a kind of can dispensing operation high thermal conductivity gel and its preparation process
CN110105926B (en) * 2019-05-10 2021-10-15 苏州环明电子科技有限公司 High-thermal-conductivity gel capable of being subjected to dispensing operation and preparation process thereof
CN111117558A (en) * 2019-05-15 2020-05-08 浙江天易新材料有限公司 Low-density heat-conducting organic silicon electronic pouring sealant and preparation method thereof
CN111117558B (en) * 2019-05-15 2022-07-08 浙江天易新材料有限公司 Low-density heat-conducting organic silicon electronic pouring sealant and preparation method thereof
CN112852380A (en) * 2021-01-18 2021-05-28 竹山县秦巴钡盐有限公司 Barium sulfate electronic pouring sealant and preparation method and application thereof
CN112852380B (en) * 2021-01-18 2022-02-18 竹山县秦巴钡盐有限公司 Barium sulfate electronic pouring sealant and preparation method and application thereof
CN114292520A (en) * 2021-12-31 2022-04-08 深圳先进电子材料国际创新研究院 Flame-retardant heat-conducting silicone gel and preparation method and application thereof
CN114806494A (en) * 2022-05-22 2022-07-29 青岛卓尤新材料有限公司 Low-density high-thermal-conductivity silica gel joint mixture and preparation method thereof
CN115895277A (en) * 2022-12-22 2023-04-04 广州市白云化工实业有限公司 Pre-cured single-component heat-conducting gel and preparation method thereof
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