CN102748737B - LED (light-emitting diode) lamp and radiating pipe thereof - Google Patents
LED (light-emitting diode) lamp and radiating pipe thereof Download PDFInfo
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- CN102748737B CN102748737B CN201210219764.0A CN201210219764A CN102748737B CN 102748737 B CN102748737 B CN 102748737B CN 201210219764 A CN201210219764 A CN 201210219764A CN 102748737 B CN102748737 B CN 102748737B
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Abstract
The invention provides a heat pipe belonging to the field of LED (light-emitting diode) light sources and an LED lamp containing the heat pipe. The heat pipe comprises a pipe shell. The pipe shell comprises a common material layer and a nano radiating layer, wherein the nano radiating layer is formed on the external surface of the common material layer and is made of hydrophobic organic and inorganic hybrid resin or the hydrophobic organic-inorganic hybrid resin and micro-nano radiating powder; the hydrophobic organic-inorganic hybrid resin is formed by hydrolysis and condensation under a specific condition and using metal alkoxide and nano sol as inorganic precursor, and trialkoxy silane with functional groups as organic precursor, the number-average molar mass of the hydrophobic organic-inorganic hybrid resin is 1000-3000, the solid content is 45-55%, and the weight ratio of the metal alkoxide, the nano sol and the trialkoxy silane with the functional groups is 1:1-5:2-10. Compared with the existing heat pipe used for the LED lamp, the heat conductivity of the heat pipe provided by the invention is improved by more than 40 times.
Description
Technical field
The present invention relates to a kind of LED(Light Emitting Diode, light emitting diode) light source, relate in particular to a kind of LED lamp and heat pipe thereof.
Background technology
Along with becoming increasingly conspicuous of global energy problem, augmentation of heat transfer plays vital effect in the exploitation of the energy with in saving, and the requirement of the performance indications such as the efficient low-resistance compactness to heat-exchange system is also more and more higher.
The features such as high brightness LED (LED) has that power consumption is little, life-span length, fast response time, volume are little, pollution-free, easy of integrationization are the light sources of new generation that causes illumination revolution and traditional lighting upgrading of industries.The today that particularly becomes to be the theme in energy-saving and emission-reduction, protection of the environment, semiconductor lighting becomes new growth engines especially, thereby is subject to the great attention of national governments and industrial circle.
The American market investigation StrategiesUnlimited of company expectation, by 2010, high-brightness LED market will reach 8,300,000,000 dollars, exceed 2 times than the sum of 2005.In recent years, the form that is applied to illumination along with great power LED forms gradually, solving heat dissipation problem has become the prerequisite of great power LED application, for existing LED light efficiency level, 70%～80% of input electric energy is transformed into the heat that cannot discharge by radiation, and LED chip is small-sized, if it is bad to dispel the heat, can make chip temperature raise, cause thermal stress distribution inequality, chip light emitting Efficiency Decreasing, the sharp decrease in efficiency of penetrating of fluorescent material.
Research shows: when temperature exceedes certain value, it is soaring that the crash rate of device will be exponential law, the every rising 2e of device temperature, and reliability declines 10%.If multiple high-power LED chip dense arrangement form white lumination system, the dissipation problem of heat is even more serious.Therefore, how improving package cooling ability is one of present stage illumination level great power LED key technology urgently to be resolved hurrily.
And the heat radiation that adopts high-performance heat radiation coating to carry out strengthening electronic device a kind of method preferably of can yet be regarded as.For example, patent CN101659829A discloses a kind of infra-red radiation composite radiating coating.Patent adopts dual-coating, and bottom is charcoal blacking, and surface layer is high radiation nano composite dope, utilizes investment precoat high radiant rate to reach the object of radiating and cooling.But this coating application complex process, requires again high coating layer thickness to realize radiating and cooling simultaneously, and therefore cost is higher.Patent CN101070448A has related to a kind of preparation method who has boron nitride filler and bonding agent to make heat radiation coating.Its method is to make by the reaction of the boron nitride of 30-70% and the bonding agent of 30-70%, then adopts heated baking at spraying and 80 DEG C to make, and the radiating effect of coating is obvious.Find through surface area test: with tabula rasa comparison, the microcosmic surface of coating is long-pending has increased approximately 154 times.Patent CN101993621A relates to the condense composition of heat dissipation film of a kind of spraying, and it consists of heat-resisting Teflon resin and silicon carbide powder.Owing to being a kind of solvent based coating, environmental pollution is larger.Patent CN101942270A relates to a kind of LED heat radiation coating, and it has used beryllium oxide that toxicity is larger and the more expensive aluminium nitride of price to improve the radiating effect of coating.
More than the heat radiation coating of report is conventional solvent type coating mostly, no matter in manufacture process or construction application process, all there are a large amount of toxic harmful exhaust gas, the discharge of waste water, environment, atmosphere and water resource are polluted, also cause the waste of resource and the energy simultaneously.In addition, the coating after film forming is made up of organic matter mostly, and easily burning, causes potential safety hazard to environment.Therefore, cause people's extensive concern based on water-based hybrid inorganic-organic technology, the high-performance coating material with inorganic and organic matter cooperative effect, become one of main direction of current surface functional material research and development.
Summary of the invention
The object of the present invention is to provide a kind of heat pipe, it can be delivered to radiator by the heat of LED light source, is difficult to the problem of outwards distributing in time to solve the amount of heat that LED chip that prior art exists produces.
Another object of the present invention is to provide a kind of LED lamp that contains above-mentioned heat pipe.
Heat pipe provided by the invention, comprise shell, described shell comprises common material layers and nanometer heat dissipating layer, described nanometer heat dissipating layer is formed at the outer surface of common material layers, the material of described nanometer heat dissipating layer is water-based organic-inorganic hybrid resin or water-based organic-inorganic hybrid resin and micro-nano heat radiation powder
Described water-based organic-inorganic hybrid resin, taking metal alkoxide and Nano sol as inorganic precursor, taking the trialkoxy silane with functional group as organic precursor, forms through hydrolysis and condensation under given conditions.The number-average molecular weight of described water-based organic-inorganic hybrid resin is 1000～30000, and solid content is 45-55%, and the weight ratio of described metal alkoxide, Nano sol and the described trialkoxy silane with functional group is 1:1～5:2～10.
Alkyl in described metal alkoxide is C
1-8alkyl, metal is silicon, titanium, zirconium or aluminium.Described metal alkoxide is preferably one or more in ethyl orthosilicate, zirconium-n-propylate and butyl titanate.
Described Nano sol is one or more in nano-titanium colloidal sol, Nano silica sol, nano aluminum colloidal sol and nanometer zirconium colloidal sol.
The described trialkoxy silane with functional group is one or more in MTES, isobutyl triethoxy silane, octyltri-ethoxysilane, MTES, dimethyldiethoxysilane, vinyltrimethoxy silane, VTES, γ-glycidyl ether oxygen propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane, γ-methacryloxypropyl trimethoxy silane and trimethyl one Ethoxysilane.
When the material of described nanometer heat dissipating layer is water-based organic-inorganic hybrid resin and micro-nano heat radiation powder, described micro-nano heat radiation powder is one or more in metal or nonmetallic carbide, metal or nonmetal oxide and metal or non-metal nitride.Described carbide is selected from one or more in nanometer tungsten carbide, carborundum, zirconium carbide, aluminium carbide and titanium carbide.Described oxide is selected from one or more the mixture in boron oxide, sodium oxide molybdena, magnesia, aluminium oxide, silica, calcium oxide, transition metal oxide and rare earth oxide.Described nitride is selected from one or several the mixture in nano-silicon nitride, nano vanadium nitride and the Nano titanium nitride of nano-silicon nitride magnesium, nano aluminum nitride, nm-class boron nitride, order orientation structure.
In the time that the material of described nanometer heat dissipating layer is the mixture of water-based organic-inorganic hybrid resin and micro-nano heat radiation powder, the weight ratio of water-based organic-inorganic hybrid resin and micro-nano heat radiation powder is 100:0.3～3.5.
Described micro-nano heat radiation powder preferably passes through surface modification treatment.
LED lamp provided by the invention, contains above-mentioned heat pipe.
Beneficial effect of the present invention: the shell of heat pipe of the present invention is coated with nanometer heat dissipating layer, its heat dissipating layer can improve the heat dispersion of LED lamp, compared with the existing heat pipe for LED lamp, heat pipe for thermal conductivity rate of the present invention improves more than 40 times, the service life that it can obviously improve light fixture during for high-powered LED lamp.In addition, the nanometer heat dissipating layer applying on the shell of heat pipe of the present invention has the antiseptic property of acid and alkali resistance, salt, adopt GB/T1763-89 standard detecting method to detect the heat pipe that is coated with nanometer heat dissipating layer, be dipped in respectively 30d in the salt solution of 10% sulfuric acid, 10% sodium hydroxide solution and 30g/L, non-foaming, nondiscolouring, do not come off, non-corroding.
Brief description of the drawings
Fig. 1 is the front view of LED lamp of the present invention.
Fig. 2 is the internal structure schematic diagram of LED lamp of the present invention.
Fig. 3 is the structure for amplifying schematic diagram between light source of the present invention, lamp stand and heat pipe.
Fig. 4 is the wall portion structural representation of heat pipe of the present invention.
Reference numeral: 1 first radiator, 2 upper-lower casing padlocks, 3 second radiators, 4 lower houses, 5 cloches, 10 heat pipes, 11 shells, 12LED light source, 13, radiator, 16 lamp stands, 110 common material layers, 120 nanometer heat dissipating layers.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described in further details.
The present invention is illustrated as an example of the LED light fixture with two-stage radiation example, and concrete structure is described as follows:
As shown in Figure 1, modular two-stage radiation LED street lamp of the present invention, comprise lamp housing, LED light source, cloche 5, wherein lamp housing is the structure that is provided with the first radiator 1 and the second radiator (upper shell) 3 on lower house 4, and 2 is the latch-up structure (upper-lower casing padlock) of lower house 4 and upper shell 3.LED light source 12 connects and composes one-level heat radiation by the heat pipe 10 and the first radiator 1 that are located at light source bottom, and in addition, LED light source 12 is connected to form two-class heat dissipation by lamp stand 16 and the second radiator 3.
The shell 11 of heat pipe 10 comprises common material layers 110 and nanometer heat dissipating layer 120, and this nanometer heat dissipating layer 120 is formed at the outer surface of common material layers 110.
In addition, as the material of nanometer heat dissipating layer 120, can be water-based organic-inorganic hybrid resin, can also be micro-nano heat radiation powder, can be also the mixture of the two.Below one one is discussed.
With the organic-inorganic hybrid resin of making coatings, can be to represent that the metal alkoxide of inorganic part is as silane oxide, zirconium alkoxide, alkyl titanium oxide etc., and Nano sol; And the trialkoxy silane with functional group that represents organic moiety is by the water-based organic-inorganic hybrid resin being hydrolyzed and condensation makes, GPC(gel permeation chromatography) number-average molecular weight of testing this water-based organic-inorganic hybrid resin is 1000～30000, solid content is 45-55%, and the weight ratio of described metal alkoxide, Nano sol and the described trialkoxy silane with functional group is 1:1～5:2～10.
Alkyl in described metal alkoxide can be C
1-8alkyl, metal can be silicon, titanium, zirconium, aluminium.Such as, described silane oxide can be ethyl orthosilicate; Described zirconium alkoxide can be zirconium-n-propylate; Described alkyl titanium oxide can be butyl titanate.
Described Nano sol can be one or more in nano-titanium colloidal sol, Nano silica sol, nano aluminum colloidal sol and nanometer zirconium colloidal sol.Preferably titanium dioxide, silica, aluminium dioxide or the mass percent concentration of zirconium dioxide received are 20-40%.
The described trialkoxy silane with functional group can be one or more in MTES, isobutyl triethoxy silane, octyltri-ethoxysilane, MTES, dimethyldiethoxysilane, vinyltrimethoxy silane, VTES, γ-glycidyl ether oxygen propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane, γ-methacryloxypropyl trimethoxy silane and trimethyl one Ethoxysilane.
The preparation method of above-mentioned water-based organic-inorganic hybrid resin is as follows:
(1) preparation of Nano sol: commercially available nano titanium oxide, nano silicon, nanometer titanium dioxide aluminium or Nanosized Zirconia Powders are scattered in and are formed corresponding Nano sol in organic solvent by ultrasonic wave;
(2) preparation of water-based organic-inorganic hybrid resin: mix by metal alkoxide with the trialkoxy silane of functional group by said ratio, then by said ratio, Nano sol is at the uniform velocity added, it is muddy that solution becomes, continue to stir and drip phosphoric acid as catalyst simultaneously, until solution is transparent, thereby obtain organic-inorganic hybrid resin.
Row give some instances below.
Embodiment 1
Step 1, is scattered in commercially available nano-titanium dioxide powder (particle diameter 30nm) that in butyl acetate, to form mass percent concentration be 30% Ludox by ultrasonic wave;
Step 1, is scattered in commercially available nano-titanium dioxide powder (particle diameter 30nm) that in butyl acetate, to form mass percent concentration be 30% Ludox by ultrasonic wave;
As one of micro-nano heat radiation powder, can be metal or nonmetallic carbide, such as nanometer tungsten carbide.Can certainly be other metal or the nonmetallic nano-carbides such as carborundum, zirconium carbide, aluminium carbide or titanium carbide.
Why choose tungsten carbide as micro-nano heat radiation powder, be because: compared with ferrous materials, Talide has special chemistry and physical property, for example, the thermal conductivity of tungsten carbide is higher 2～4 times than ferrous materials, and it has the high strength and the high tenacity that equate with high-speed steel, and in the time of 600 DEG C, its high temperature hardness still exceedes the normal temperature hardness of high-speed steel, still exceedes the normal temperature hardness of carbon steel 1000 DEG C time.
Single tungsten carbide particle only has 10～100nm left and right, BET surface area 1～50m
2/ g, contribute to very much to improve its heat dispersion, when particularly it joins in the coating that above-mentioned hybrid resin forms as filler, the bulk effect that can make full use of nano functional filler is filled the unavoidable structure hole of conventional coating (aperture is more than 1nm), form the compacted zone of atresia, stop the infiltration of various corrosive mediums, realize heat radiation integrated with corrosion-resistant.
Preparation method as tungsten carbide: industrial conventional useful W elements and carbon directly react, or tungstic acid reacts in inert atmosphere with carbon, also can adopt and utilize wolframic acid base inorganic-organic hybrid lamellar compound to prepare the preparation method (Chinese patent CN101780982B) of tungsten carbide nano-powder for single source predecessor.
As micro-nano heat radiation powder, can also be metal or nonmetal oxide, such as one or more the mixture in boron oxide, sodium oxide molybdena, magnesia, aluminium oxide, silica, calcium oxide, transition metal oxide or rare earth oxide.
As micro-nano heat radiation powder, can also be metal or non-metal nitride, such as one or several the mixture in the multiple super-high heat-conductive fillers such as nano-silicon nitride magnesium, nano aluminum nitride, nm-class boron nitride, nano-silicon nitride (order orientation structure), nano vanadium nitride or Nano titanium nitride.After deliberation, these micro-nano heat radiation powders are high heat conductive insulating composite granule.
The mixture that uses multiple nitride is during as heat radiation powder, can be according to the easily difference of wetability, doping mark, self heat conductivility of the particle diameter of every kind of material and form, surface, use the different particle of particle diameter, allow between filler and to form maximum degree of piling up, heat conduction network in system is formed to the full extent and reach effective heat conduction (also forming the almost compacted zone of atresia), acquisition high heat conductive body system, more than thermal conductivity factor even can reach 400W/MK, and insulating properties is fine, resistivity more than 10 16 powers, and can be resistance to 1800 degree high temperature.Be suitable for very much the heat radiation of high-powered LED lamp.
In the time being the mixture of above-mentioned water-based organic-inorganic hybrid resin and above-mentioned micro-nano heat radiation powder as the material of nanometer heat dissipating layer 120, the weight ratio of above-mentioned water-based organic-inorganic hybrid resin solids and above-mentioned micro-nano heat radiation powder is 100:0.3～3.5, is preferably 100:1.
In addition, can carry out surface modification treatment to described micro-nano heat radiation powder, thereby introduce organic reaction functional group, like this, can improve the dispersiveness of micro-nano heat radiation powder in coating material on the one hand, in film forming procedure, make on the other hand the organic reaction functional group being introduced into react with resin generation chemical graft, thereby improve heat dissipating layer compactness, hardness, shock resistance and the adhesive force with ground.Such as above-mentioned nitride, if through special surface processing, introduce after organic reaction functional group, its content of surface oxygen is extremely low, thereby can successfully be applied in epoxy resin, polyurethane, heat conductive silica gel, heat-conducting silicone grease, plastics, because its heat conductivility is extremely strong, general adding proportion is 1%(mass ratio) left and right, can make macromolecule resin reach the thermal conductivity factor of 3W left and right.
Enumerate an example of micro-nano heat radiation powder surface modification below.
Embodiment 3 silicon-dioxide powdery modifications
Ethyl orthosilicate is dissolved in a certain amount of absolute ethyl alcohol, again to the hydrochloric acid that adds quantitative 1mol/L in system, regulating pH value is 2, then according to ethyl orthosilicate: γ-glycidyl ether oxygen propyl trimethoxy silicane is 1:4(mol ratio) to the distilled water that adds γ-glycidyl ether oxygen propyl trimethoxy silicane and metering in reaction system, react 6h at 78 DEG C; After reaction finishes, accessory substance is pumped, reaction system is sealed to ageing, obtain the modified silicon dioxide sol that homogeneous is transparent.
In addition, known according to above-mentioned discussion, as the shell 11 of the heat pipe 10 in Fig. 3 of the present invention, also can only include common material layers 110, only this common material layers 110 be have the above-mentioned nitride of 0.5-3wt% by mixing, one or more plastics in oxide and person's carbide person form, and common plastics are because be added with above-mentioned additive, so its thermal conductivity brings up to 2.0 from original 0.1, thermal conductivity has improved 20 times.Realize the effect that can heat conduction alleviates again the weight of LED street lamp.
As radiation nano powder body material is applied to the method that heat pipe package gets on, can pass through the method for spraying, also can be by the method for electrophoresis (CN102181212A), can be also the whole bag of tricks such as plasma spraying.
Nanometer tungsten carbide can make an addition in the binding agent such as pottery or macromolecular material or agent for fixing, is coated in the outer wall surface of this common material layers 110 after mixing.
In addition, above-mentioned nanometer heat radiation coating, except being formed at heat pipe, can also form on upper-lower casing.
As known by the technical knowledge, the present invention can realize by other the embodiment that does not depart from its Spirit Essence or essential feature.Therefore, above-mentioned disclosed embodiment, with regard to each side, all just illustrates, and is not only.Within the scope of the present invention all or be all included in the invention in the change being equal in scope of the present invention.
Claims (8)
1. a heat pipe, comprises shell, and described shell comprises common material layers and nanometer heat dissipating layer, and described nanometer heat dissipating layer is formed at the outer surface of common material layers,
The material of described common material layers is selected from the one in copper, aluminum steel, carbon steel, stainless steel, iron Nitinol and thermal conductivity macromolecular material,
The material of described nanometer heat dissipating layer is water-based organic-inorganic hybrid resin or water-based organic-inorganic hybrid resin and micro-nano heat radiation powder,
It is characterized in that, described water-based organic-inorganic hybrid resin, taking metal alkoxide and Nano sol as inorganic precursor, taking the trialkoxy silane with functional group as organic precursor, forms through hydrolysis and condensation under given conditions; Wherein, the number-average molecular weight of described water-based organic-inorganic hybrid resin is 1000～30000, and solid content is 45-55%, and the weight ratio of described metal alkoxide, Nano sol and the described trialkoxy silane with functional group is 1:1～5:2～10.
2. heat pipe according to claim 1, is characterized in that, the alkyl in described metal alkoxide is C1-8 alkyl, and metal is titanium, zirconium or aluminium; Described Nano sol is one or more in nano-titanium colloidal sol, Nano silica sol, nano aluminum colloidal sol and nanometer zirconium colloidal sol; The described trialkoxy silane with functional group is one or more in MTES, isobutyl triethoxy silane, octyltri-ethoxysilane, dimethyldiethoxysilane, vinyltrimethoxy silane, VTES, γ-glycidyl ether oxygen propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane, γ-methacryloxypropyl trimethoxy silane and trimethyl one Ethoxysilane.
3. heat pipe according to claim 2, is characterized in that, described metal alkoxide is zirconium-n-propylate and/or butyl titanate.
4. heat pipe according to claim 1, it is characterized in that, when the material of described nanometer heat dissipating layer is water-based organic-inorganic hybrid resin and micro-nano heat radiation powder, described micro-nano heat radiation powder is one or more the mixture in metal or nonmetallic carbide, metal or nonmetallic oxide and metal or nonmetallic nitride; Wherein, described carbide is selected from one or more the mixture in nanometer tungsten carbide, carborundum, zirconium carbide, aluminium carbide and titanium carbide; Described oxide is selected from one or more the mixture in boron oxide, sodium oxide molybdena, magnesia, aluminium oxide, silica, calcium oxide, transition metal oxide and rare earth oxide; Described nitride is selected from one or more the mixture in nano-silicon nitride, nano vanadium nitride and the Nano titanium nitride of nano-silicon nitride magnesium, nano aluminum nitride, nm-class boron nitride, order orientation structure.
5. heat pipe according to claim 4, is characterized in that, described micro-nano heat radiation powder is through surface modification treatment.
6. heat pipe according to claim 1, it is characterized in that, when the material of described nanometer heat dissipating layer is water-based organic-inorganic hybrid resin and micro-nano heat radiation powder, the water-based organic-inorganic hybrid resin in the material of described nanometer heat dissipating layer and the weight ratio of micro-nano heat radiation powder are 100:0.3～3.5.
7. heat pipe according to claim 6, is characterized in that, the water-based organic-inorganic hybrid resin in the material of described nanometer heat dissipating layer and the weight ratio of micro-nano heat radiation powder are 100:1.
8. a LED lamp, is characterized in that, comprises the arbitrary described heat pipe of claim 1-7.
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| CN201210219764.0A CN102748737B (en) | 2012-06-28 | 2012-06-28 | LED (light-emitting diode) lamp and radiating pipe thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104696925A (en) * | 2013-12-06 | 2015-06-10 | 苏州浩华光电科技有限公司 | LED radiating module |
| CN104896452A (en) * | 2015-06-11 | 2015-09-09 | 固态照明张家口有限公司 | Heat dissipation material, LED spot light radiator based on same, and LED spot light |
| CN105062292A (en) * | 2015-08-06 | 2015-11-18 | 苏州好洁清洁器具有限公司 | High-corrosion-resistance aluminum alloy pipe material |
| CN105754475A (en) * | 2016-03-29 | 2016-07-13 | 东莞艾宝纳米科技有限公司 | Nano heat-dissipation coating and preparation method |
| CN105885094B (en) * | 2016-06-29 | 2019-02-26 | 海信集团有限公司 | A kind of Heat dissipation composition and the preparation method and application thereof |
| CN108489311A (en) * | 2018-02-09 | 2018-09-04 | 上海大学 | The removal alloying preparation method of high heat transfer rate heat-transfer pipe |
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