CN202282941U

CN202282941U - Heat radiation structure

Info

Publication number: CN202282941U
Application number: CN2011204378478U
Authority: CN
Inventors: 陈正豪
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-11-08
Filing date: 2011-11-08
Publication date: 2012-06-20
Anticipated expiration: 2021-11-08

Abstract

The present utility model relates to a heat radiation structure which comprises a heat-conducting pedestal and a ceramic layer, the heat-conducting pedestal is a substrate or a foundation pillar, a plurality of heat radiation fins is formed by extending from the substrate or the foundation pillar respectively, and the ceramic layer is arranged on the surfaces of the substrate or the foundation pillar, and the heat radiation fins. Thus, heat radiation and heat conducting capability can be enhanced, and heat radiation efficiency of the structure is good.

Description

Radiator structure

Technical field

The utility model relates to a kind of heat radiation or heat-transfer device, refers to a kind of radiator structure especially.

Background technology

General electronic equipment all has many electronic components, and when electronic equipment when moving, electronic component will produce heat; Elevating the temperature influences its usefulness; And then let electronic equipment that situation such as deadlock take place, therefore, the heat energy that electronic component produced must effectively dispel the heat just to be unlikely and influence its task performance; With regard to existing electronic element radiating mode; It mostly uses a radiating fin group and a fan to be installed on the electronic component, and the heat that electronic component is produced is conducted to the radiating fin group, utilizes the wind convection current that fan produces again and the heat of being built up on the fins group is taken away.

In addition; The conduction of heat can be divided into three kinds of modes, is respectively convection current, conduction and radiation, and wherein convection current is meant that heat energy circulates through the transmission medium of liquid or gas; Make heat energy move toward the place of low temperature, finally reach temperature and be tending towards uniform process by the place of high temperature; Heat conduction is to betide solid to transmit the heat flow between the medium, heat energy is transmitted the result of shock energy by a molecule forming solid to another molecule; Thermal radiation then is that energy is transmitted with the kenel that ripple or subatomic particle move.

Yet above-mentioned radiating fin group is main with convection current and conduction mostly; And the conduction efficiency of these two kinds of heat-conducting modes very receives the influence of transmitting medium (being liquid, gas or solid) material and characteristic easily, and still, radiating efficiency all is crucial influencing factor concerning life-span of many electronic equipments or product and service efficiency; Simultaneously; Along with the prosperity of science and technology, electronic equipment or product nearly all are in the high power operation, therefore; Above-mentioned radiating fin group can not satisfy the heat radiation of electronic component and use with the thermal conductance mode of convection current and conduction.

Summary of the invention

In view of this, the main purpose of the utility model is to provide a kind of radiator structure, can improve heat radiation, heat conducting power, has good radiating efficiency.

For achieving the above object, the technical scheme of the utility model is achieved in that

A kind of radiator structure comprises a heat-conducting seat and the plurality of radiating fins of extending from a side of this heat-conducting seat respectively, is provided with a ceramic layer on the surface of this side heat-conducting seat and heat dissipation fins.

Preferably, this heat-conducting seat is a substrate or a pilum.

Preferably, this ceramic layer is arranged on the surface of this heat-conducting seat with continuation mode or discontinuous mode.

Preferably, this heat-conducting seat has the opposite face away from heat dissipation fins, and this opposite face is a clean surface.

Preferably, this heat-conducting seat is the element of glass material, metal material or Heat Conduction Material.

The utlity model has following technique effect; Ceramic layer can not convert heat to and is distributed in the air by the form of the electromagnetic radiation of metal material absorption with light quantum; Make the radiator structure of the utility model improve the ability of heat radiation, heat conduction, have good radiating efficiency.In addition, ceramic layer can change into harmless infrared ray electric magnetic radiation with the electromagnetic radiation that electronic component produces again, has increased whole safety in utilization.

Description of drawings

Fig. 1 is the schematic perspective view of the utility model radiator structure.

Fig. 2 is the generalized section of the utility model radiator structure.

Fig. 3 is another schematic perspective view of the utility model radiator structure.

Fig. 4 is the schematic perspective view of another embodiment of the utility model radiator structure.

Fig. 5 is the schematic perspective view of the utility model radiator structure second embodiment.

Fig. 6 is the schematic perspective view of the utility model radiator structure the 3rd embodiment.

[main element symbol description]

1 ... Main body

11a ... Substrate

11b ... Pilum

12 ... Radiating fin

13 ... Opposite face

2 ... Ceramic layer

Embodiment

Detailed description of relevant the utility model and technology contents, with the conjunction with figs. explanation as follows, however appended graphic only as illustrative purposes, be not to be used to limit to this creation.

Please refer to Fig. 1 to shown in Figure 3, the utility model provides a kind of radiator structure, and this radiator structure mainly comprises a main body 1 and a ceramic layer 2.

In first embodiment, heat-conducting seat is substrate 11a.The plurality of radiating fins 12 that main body 1 has a substrate 11a and extends from substrate 11a one side respectively, substrate 11a has the opposite face 13 away from heat dissipation fins 12 again, and wherein, substrate 11a is the element of glass material, metal material or Heat Conduction Material; Ceramic layer 2 is arranged on the surface of heat dissipation fins 12 and this side of substrate 11a, and this ceramic layer 2 is silicon nitride, carborundum, aluminium oxide, zirconia or aforementioned combination, and in addition, ceramic layer 2 can continuous or discrete mode be arranged in substrate 11a.

The combination of the radiator structure of the utility model is the surface that ceramic layer 2 is arranged on heat dissipation fins 12 and this side of substrate 11a, but ceramic layer is not set on opposite face 13; So that opposite face 13 is a clean surface; Let opposite face 13 attach electronic component, so that the heat that electronic component was produced is conducted to heat dissipation fins 12, by this; Because of ceramic layer 2 can convert heat not to the electromagnetic radiation that absorbed by metal material and is distributed in the air with the form of light quantum; Reach thermolysis very fast, make heat radiation, the heat conducting power of the radiator structure that has improved the utility model, and then have good radiating efficiency.

In addition; At present international cancer research institution has confirmed that the Extremely Low Frequency Electromagnetic width of cloth is penetrated and has been " possible carcinogenic substance "; Therefore a large amount of electromagnetic radiation possibility harmful to human; The ceramic layer 2 of the utility model is a kind of carrier of power conversion, the electron transition that the crystal structure of electromagnetic radiation through ceramic layer 2 formed transition metal forms, thus convert a kind of new form of energy into: the infrared ray electric magnetic radiation.Its emission wavelength is 2 ~ 18 μ m; Its emissivity reaches 93%, and diatomic and polyatomic molecule that the electromagnetic radiation of 2 ~ 18 μ m simultaneously can be contained hydrogen bond absorb, according to law of conservation of energy; After containing the diatomic and its radiation of polyatomic molecule absorption of hydrogen bond; Must cause that intermolecular high-speed motion makes it possess energy, make infrared electromagnetic radiation harmless useful on the contrary, so; The utility model can change into harmless infrared ray electric magnetic radiation with the electromagnetic radiation that electronic component produces, to increase whole safety in utilization.

Please refer to shown in Figure 4ly, be the utility model radiator structure second embodiment; Each radiating fin 12 that substrate 11a one side is extended can be like Fig. 1 or shown in Figure 4; The external form of each radiating fin 12 is not as limit; But ceramic layer 2 all is arranged on this side of substrate 11a and heat dissipation fins 12 surfaces, simultaneously ceramic layer 2 is not set on opposite face 13, so that opposite face 13 is a clean surface; Let opposite face 13 attach electronic component, so that the heat that electronic component was produced is conducted to heat dissipation fins 12; Can not convert heat to absorbed electromagnetic radiation by ceramic layer 2 again and be distributed in the air, make the radiator structure of utility model improve heat radiation, heat conducting power, and then have good radiating efficiency with the form of light quantum by metal material; In addition, ceramic layer 2 can change into harmless infrared ray electric magnetic radiation with the electromagnetic radiation that electronic component produces again, to increase whole safety in utilization.

Please refer to Fig. 5 to shown in Figure 6, be the 3rd embodiment of the utility model radiator structure, wherein heat-conducting seat is a pilum 11b; The plurality of radiating fins 12 that main body 1 has a pilum 11b and extends from pilum 11b one side respectively; Like Fig. 5 or shown in Figure 6; Heat dissipation fins 12 is from the outer peripheral edges elongation moulding of pilum 11b, and the external form of each radiating fin 12 and enclose the moulding of formation jointly is not as limit; But ceramic layer 2 all is arranged on the surface of this side of pilum 11b and heat dissipation fins 12; Ceramic layer 2 is not set on opposite face 13 simultaneously; So that opposite face 13 is a clean surface, let opposite face 13 attach electronic component, so that the heat that electronic component was produced is conducted to heat dissipation fins 12; Can not convert heat to absorbed electromagnetic radiation by ceramic layer 2 again and be distributed in the air, improve heat radiation, the heat conducting power of the utility model radiator structure, and then have good radiating efficiency with the form of light quantum by metal material; In addition, ceramic layer 2 can change into harmless infrared ray electric magnetic radiation with the electromagnetic radiation that electronic component produces again, to increase whole safety in utilization.

Claims

1. a radiator structure comprises a heat-conducting seat and the plurality of radiating fins of extending from a side of this heat-conducting seat respectively, it is characterized in that, is provided with a ceramic layer on the surface of this side heat-conducting seat and heat dissipation fins.

2. radiator structure as claimed in claim 1, its characteristic only are that this heat-conducting seat is a substrate or a pilum.

3. radiator structure as claimed in claim 1 is characterized in that, this ceramic layer is arranged on the surface of this heat-conducting seat with continuation mode or discontinuous mode.

4. radiator structure as claimed in claim 1 is characterized in that, this heat-conducting seat has the opposite face away from heat dissipation fins, and this opposite face is a clean surface.

5. radiator structure as claimed in claim 1 is characterized in that, this heat-conducting seat is the element of glass material, metal material or Heat Conduction Material.