CN206042648U - High -power power supply unit with hot superconductive heat radiator - Google Patents
High -power power supply unit with hot superconductive heat radiator Download PDFInfo
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- CN206042648U CN206042648U CN201620991230.3U CN201620991230U CN206042648U CN 206042648 U CN206042648 U CN 206042648U CN 201620991230 U CN201620991230 U CN 201620991230U CN 206042648 U CN206042648 U CN 206042648U
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Abstract
The utility model provides a high -power power supply unit with hot superconductive heat radiator, include: hot superconductive heat radiator, hot superconductive heat radiator is the composite plate type structure, be formed with the superconductive pipeline of heat of specific shape in the hot superconductive heat radiator, the superconductive pipeline of heat is sealed pipeline, the superconductive pipeline intussuseption of heat is filled with heat transfer medium, the power device, attach in hot superconductive heat radiator surface. The utility model discloses a hot superconductive heat radiator has and leads the thermal property fast, and its equivalent coefficient of heat conductivity can reach more than the 4000Wm DEG C, can realize whole hot superconductive heat radiator's samming. Owing to hot superconductive heat radiator has advantages such as heat conduction speed is fast, small, light in weight, structure flexibility, simple to operate, will hot superconductive heat radiator is applied to high -power power supply unit, can improve high -power power supply unit's heat -sinking capability and efficiency, effectively utilizes the power supply casing inner space, reduces fan speed or need not to use the fan to the noise has been reduced.
Description
Technical field
The utility model is related to power technique fields, more particularly to a kind of large power supply with hot superconducting radiator
Device.
Background technology
With the fast development of Power Electronic Technique, modularization, integrated, lightweight, cost degradation and high reliability
More and more higher is required, therefore in domestic type solar inverter, Modular UPS (UPS), high-power communication power supply,
Middle low power frequency converter, charging pile, power inverter, Active Power Filter-APF (APF), reactive-load compensator (SVG) etc. are generally adopted
With can high-frequency work low cost and high reliability discrete power device, such as MosFET, Diode, IGBT etc..High-power electricity
In the course of the work, the discrete such as switch transistor rectifier bridge components and parts are larger due to self-heating amount in source, have a strong impact on device use
In the life-span, need timely and effectively to radiate which.If quickly can not remove the heat that power device is produced in time, work(can be caused
Chip temperature in rate device is raised, and gently then causes efficiency to reduce, reduction of service life, failure that is heavy then can causing power device
Bombing is burnt with chip.
Large power supply device main heat sink structure is as shown in figure 1, power device 11 is fixed on gilled radiator at present
On 12 substrate, the heat that power device 11 is produced is conducted to fin by the substrate of gilled radiator 12, then scattered by flowing through
The cold air of hot device fin is taken away and is dissipated.Power device 11, gilled radiator 12, electric capacity 13, inductance 14, pcb board 15 are arranged
In power supply casing 16, power supply casing 16 is provided with ventilating opening, and cooling air realizes inner air and outer air by the ventilating opening of power supply casing
Convection current and heat is distributed into surrounding environment.As the material thermal conductivity factor of section bar fin radiator is low, such as aluminium is led
Hot coefficient is 220W/m DEG C, and fin efficiency is low, in order to meet radiating requirements, it usually needs by increasing the area of radiator and dissipating
Hot blast rate, this adds increased volume, weight, cost and noise of radiator etc., or even will be by the work(of the single power device of reduction
Rate, increases the quantity of power device, and purpose makes the heat flow density of single power device reduce to solve heat dissipation problem.
Hot super heat conduction, is included in the closed micro-channel system being interconnected and fills working media, by work
The hot pipe technique of hot superconductive heat transfer is realized in the evaporation and condensation phase transformation of making medium；Or it is micro- by controlling working media in enclosed system
Configuration state, i.e., in diabatic process, the boiling (or condensation of gaseous medium) of liquid medium is suppressed, and reaches on this basis
To the uniformity of working medium micro-structural, and realize that the phase transformation of efficient heat transfer suppresses (PCI) heat transfer technology.It is fast due to heat superconducting tech
Fast thermal conduction characteristic, its equivalent heat conductivity are capable of achieving the samming of whole hot superconductive plate up to more than 4000W/m DEG C.As heat surpasses
Guide plate is thin-slab structure, and heat conduction rate is fast, small volume, lightweight, flexible structure, easy for installation, is particularly suitable for solving big work(
The heat dissipation problem of rate power device.
Utility model content
In order to solve the deficiencies in the prior art, the utility model proposes a kind of high-power electricity with hot superconducting radiator
Source device, for solve in prior art using conventional fins formula radiator heat-dissipation exist volume is big, weight weight, high cost and
Noise is big, or even will increase the quantity of power device, reduce single power device by the power of the single power device of reduction
The problems such as heat flow density.
For achieving the above object and other related purposes, the utility model provides a kind of big work(with hot superconducting radiator
Rate supply unit, the large power supply device with hot superconducting radiator include：
Hot superconducting radiator, the hot superconducting radiator are composite board type structure, are formed with the hot superconducting radiator
The Super-conductive conduit road of given shape, the Super-conductive conduit road are closing pipe line, are filled with heat-transfer working medium in the Super-conductive conduit road；
Power device, adheres on the hot superconducting radiator surface.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the heat
Superconducting radiator is plate armature, top of the hot superconducting radiator from the power device surface to the power device
Extend.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the heat
Superconducting radiator is L-type plank frame, and the hot superconducting radiator extends to the power device from the power device surface
Top, and from the upper direction of the power device away from the power device side extend.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the heat
Superconducting radiator is wave bending L-type plank frame, and the hot superconducting radiator extends to institute from the power device surface
The top of power device is stated, and the side from the upper direction of the power device away from the power device extends.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the heat
Superconducting radiator is U-shaped plank frame；One end of the hot superconducting radiator adheres on the surface of power device described in a group, separately
One end adheres on power device surface described in another group for being adjacent.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the heat
Superconducting radiator is the U-shaped plank frame of wave bending；One end of the hot superconducting radiator adheres on power device described in a group
The surface of part, the other end adhere on power device surface described in another group for being adjacent.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the heat
Superconducting radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is
Plate armature, one end of the first sub hot superconducting radiator adhere on power device surface described in a group, and the other end certainly should
The group power device surface extends to the top of the power device, and from the upper direction of the group power device away from this
The side of the group power device extends；The second sub hot superconducting radiator be U-shaped plank frame, the second sub hot superconduction
The two ends of radiator adhere on the surface of power device described in other two groups respectively.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the heat
Superconducting radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is
L-type plank frame, one end of the first sub hot superconducting radiator adhere on power device surface described in a group, and the other end certainly should
The group power device surface extends to the top of the power device, and from the upper direction of the group power device away from this
The side of the group power device extends；The second sub hot superconducting radiator be U-shaped plank frame, the second sub hot superconduction
The two ends of radiator adhere on the surface of power device described in other two groups respectively.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the heat
Superconducting radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is
Wave bending L-type plank frame, one end of the first sub hot superconducting radiator adhere on power device surface described in a group,
The other end extends to the top of the power device from the group power device surface, and from the upper of the group power device
Direction extends away from the side of the group power device；The second sub hot superconducting radiator is U-shaped plank frame, described the
The two ends of two sub hot superconducting radiators adhere on the surface of power device described in other two groups respectively.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the heat
Superconducting radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is
Plate armature, one end of the first sub hot superconducting radiator adhere on power device surface described in a group, and the other end certainly should
The group power device surface extends to the top of the power device, and from the upper direction of the group power device away from this
The side of the group power device extends；The second sub hot superconducting radiator is the U-shaped plank frame of wave bending, described the
The two ends of two sub hot superconducting radiators adhere on the surface of power device described in other two groups respectively.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the heat
Superconducting radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is
L-type plank frame, one end of the first sub hot superconducting radiator adhere on power device surface described in a group, and the other end certainly should
The group power device surface extends to the top of the power device, and from the upper direction of the group power device away from this
The side of the group power device extends；The second sub hot superconducting radiator is the U-shaped plank frame of wave bending, described the
The two ends of two sub hot superconducting radiators adhere on the surface of power device described in other two groups respectively.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the heat
Superconducting radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is
Wave bending L-type plank frame, one end of the first sub hot superconducting radiator adhere on power device surface described in a group,
The other end extends to the top of the power device from the group power device surface, and from the upper of the group power device
Direction extends away from the side of the group power device；The second sub hot superconducting radiator is that wave bending is U-shaped board-like
Structure, the two ends of the second sub hot superconducting radiator adhere on the surface of power device described in other two groups respectively.
As a kind of preferred version of the large power supply device with hot superconducting radiator of the present utility model, the tool
The large power supply device for having hot superconducting radiator also includes：
Power supply casing；
Pcb board, in the power supply casing；
Electric capacity, in the power supply casing, and is fixed on the surface of the pcb board；
Inductance, in the power supply casing, and is fixed on the surface of the pcb board；
The power device is located in the power supply casing, and is fixed on the surface of the pcb board.
As described above, the large power supply device with hot superconducting radiator of the present utility model, with following beneficial effect
Really：Hot superconducting radiator of the present utility model has the characteristic of quick conductive, its equivalent heat conductivity up to 4000W/m DEG C with
On, it may be achieved the samming of whole hot superconducting radiator.As hot superconducting radiator is thin-slab structure, with heat conduction rate is fast, body
Product little, lightweight, flexible structure, it is easy for installation the advantages of, the hot superconducting radiator is applied to into large power supply device, can
With improve large power supply device heat-sinking capability and efficiency, effectively utilizes power supply casing inner space, reduce rotation speed of the fan or
Without using fan, so as to reduce noise.
Description of the drawings
Fig. 1 has the structural representation of the large power supply device of gilled radiator in being shown as prior art.
The large power supply device with hot superconducting radiator that Fig. 2 is provided in being shown as the utility model embodiment one
Structural representation.
In the large power supply device with hot superconducting radiator that Fig. 3 is provided in being shown as the utility model embodiment one
The dimensional structure diagram combined with power device by hot superconducting radiator.
In the large power supply device with hot superconducting radiator that Fig. 4 is provided in being shown as the utility model embodiment one
Hot superconducting radiator Super-conductive conduit road part partial cross section enlarged drawing.
In the large power supply device with hot superconducting radiator that Fig. 5 is provided in being shown as the utility model embodiment one
Inside Super-conductive conduit road the hot superconducting radiator for being shaped as hexagonal honeycomb shape structural representation.
The large power supply with hot superconducting radiator that Fig. 6 and Fig. 7 are provided in being shown as the utility model embodiment two
The structural representation of device.
The large power supply device with hot superconducting radiator that Fig. 8 is provided in being shown as the utility model embodiment three
Structural representation.
The large power supply device with hot superconducting radiator that Fig. 9 is provided in being shown as the utility model example IV
Structural representation.
Component label instructions
11 power devices
12 gilled radiators
13 electric capacity
14 inductance
15 pcb boards
16 power supply casings
21 hot superconducting radiators
211 first sub hot superconducting radiators
212 second sub hot superconducting radiators
213 first sheet materials
214 second sheet materials
215 Super-conductive conduit roads
216 non-pipeline portions
217 bulge-structures
218 heat-transfer working mediums
22 power devices
23 pcb boards
24 power supply casings
25 electric capacity
26 inductance
Specific embodiment
Embodiment of the present utility model is illustrated below by way of specific instantiation, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages of the present utility model and effect easily.The utility model can also be by addition
Different specific embodiments is carried out or applies, and the every details in this specification can also be based on different viewpoints and answer
With, without departing from it is of the present utility model spirit under carry out various modifications and changes.
Fig. 2 to Fig. 9 is referred to, it should be noted that the diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model, though when only showing the component relevant with the utility model in diagram rather than implementing according to reality
Component count, shape and size are drawn, and during its actual enforcement, the kenel of each component, quantity and ratio can change for a kind of random
Become, and its assembly layout kenel be likely to it is increasingly complex.
Embodiment one
Fig. 2 to Fig. 5 is referred to, the utility model provides a kind of large power supply device with hot superconducting radiator, institute
Stating the large power supply device with hot superconducting radiator includes：Hot superconducting radiator 21, the hot superconducting radiator 21 is multiple
Plank frame is closed, the Super-conductive conduit road 215 of given shape, the Super-conductive conduit road in the hot superconducting radiator 21, is formed with
215 is closing pipe line, is filled with heat-transfer working medium 218 in the Super-conductive conduit road 215；Power device 22, the power device 22
Adhere on 21 surface of hot superconducting radiator.
As an example, the hot superconducting radiator 21 is plate armature, and the hot superconducting radiator 21 is from the power
22 surface of device extends to the top of the power device 22.
As an example, the power device 22 can be multiple, and multiple power devices 22 are one group, multiple work(
Rate device 22 is spaced the surface for adhering on the hot superconducting radiator 21 successively, as shown in Figure 3.
As an example, 21 surface of hot superconducting radiator can be two-sided bulging state as shown in Figure 4, the hot superconduction
Radiator 21 includes the first sheet material 213 and the second sheet material 214, and first sheet material 213 passes through roll-in with second sheet material 214
Process combining is together；The Super-conductive conduit road 215 is formed by blowing-up technology, is forming the same of the Super-conductive conduit road 215
When, the projection corresponding with the Super-conductive conduit road 215 is formed in first sheet material 213 and 214 surface of the second sheet material
Structure 217.Except the structure shown in Fig. 4, the hot superconducting radiator 21 includes first sheet material 213 and second sheet material
When 214, can also by blowing-up technology while Super-conductive conduit road 215 are formed, on 213 surface of the first sheet material or
Second sheet material, 214 surface forms the bulge-structure 217 corresponding with the Super-conductive conduit road 215, i.e., described heat is super
The surface of conduction heat radiator 21 is in one side bulging state.The surface of the hot superconducting radiator 21 can also be two-sided flat shape state, now,
The concrete structure of the hot superconducting radiator 21 can be with the institute in the patent application document of Application No. 201511029540.3
State the two-sided structure for putting down the hardened structure of hot superconductive radiating identical, specifically refer to the patent application document, be not repeated herein.
As an example, the heat-transfer working medium 218 is fluid, it is preferable that the heat-transfer working medium 218 is gas or liquid or gas
The mixture of body and liquid, it is further preferable that in the present embodiment, the heat-transfer working medium 218 is the mixture of liquid and gas.
As an example, the shape on the Super-conductive conduit road 215 can be hexagonal honeycomb shape, crisscross netted, first
Any combination more than multiple U-shapeds of tail series connection, rhombus, triangle, annular or any of which.Fig. 5 is with the hot superconduction
Pipeline 215 is shaped as hexagonal honeycomb shape as an example.As shown in Figure 5, hexagonal inner and the hot superconductive radiating in Fig. 5
The fringe region of device 21 is non-pipeline portions 216, and the hexagon that each is interconnected is the Super-conductive conduit road
215。
As an example, the material of the hot superconducting radiator 21 should be the good material of thermal conductivity；Preferably, the present embodiment
In, the material of the hot superconducting radiator 21 can be copper, copper alloy, aluminum or aluminum alloy or any combination more than any one,
The material of i.e. described first sheet material 213 and second sheet material 214 can for copper, copper alloy, aluminum or aluminum alloy or any one with
On any combination.
As an example, please continue to refer to Fig. 2, the large power supply device with hot superconducting radiator also includes：Electricity
Source casing 24；Pcb board 23, the pcb board 23 are located in the power supply casing 24；Electric capacity 25, the electric capacity 25 are located at the electricity
In source casing 24, and it is fixed on the surface of the pcb board 23；Inductance 26, the inductance 26 are located in the power supply casing 24, and
It is fixed on the surface of the pcb board 23；The power device 22 is located in the power supply casing 24, and is fixed on the pcb board
23 surface.The position of the power device 22, the electric capacity 25 and the inductance 26 on the pcb board 23 can be according to reality
Border needs to be set, i.e., described power device 22, the electric capacity 25 and the inductance 26 can be appointed on 23 surface of the pcb board
Meaning arrangement.Arranged on 23 surface of the pcb board successively with the electric capacity 25, the inductance 26 and the power device 22 in Fig. 2
As an example, i.e., the electric capacity 25, the inductance 26 and the power device are followed successively by from 23 one end of the pcb board to the other end
22, but be not limited thereto in actual example.By taking Fig. 2 as an example, the hot superconducting radiator 21 may be located at the power device
Part 22 is near the inductance 26 and the side of the electric capacity 25, it is also possible to positioned at the power device 22 away from the inductance 26 and
The side of the electric capacity 25.
Embodiment two
Fig. 6 and Fig. 7 is referred to, the present embodiment also provides a kind of large power supply device with hot superconducting radiator, this
The structure of the large power supply device with hot superconducting radiator in embodiment with described in embodiment one with heat
The structure of the large power supply device of superconducting radiator is roughly the same, and the difference of the two is：In embodiment one, the hot superconduction
Radiator 21 is plate armature, and the hot superconducting radiator 21 is from 22 surface of the power device to the power device 22
Top extends；And in the present embodiment, the hot superconducting radiator 21 is L-type plank frame or wave bending L-type plank frame,
The hot superconducting radiator 21 is set to into L-type plank frame or wave bending L-type plank frame, can be with effectively utilizes power supply
Space in casing, increases the surface area of radiator, so as to heat radiation ability.
In one example, as shown in fig. 6, the hot superconducting radiator 21 is L-type plank frame, the hot superconducting radiator
21 tops for extending to the power device 22 from 22 surface of the power device, and it is remote from the upper direction of the power device 22
Extend from the side of the power device 22, i.e., described hot superconducting radiator 21 extends to described from 22 surface of the power device
The top of power device 22, and the top of the electric capacity 25 and the inductance 26 is extended to from the top of the power device 22.
In another example, it is as shown in fig. 7, the hot superconducting radiator 21 is wave bending L-type plank frame, described
Hot superconducting radiator 21 extends to the top of the power device 22 from 22 surface of the power device, and from the power device
22 upper direction extends away from the side of the power device 22, i.e., the hot superconducting radiator 21 is from 22 table of the power device
Face extends to the top of the power device 22, and extends to the electric capacity 25 and the electricity from the top of the power device 22
The top of sense 26.
Embodiment three
Fig. 8 is referred to, the present embodiment also provides a kind of large power supply device with hot superconducting radiator, the present embodiment
In the large power supply device with hot superconducting radiator structure and embodiment one described in dissipate with hot superconduction
The structure of the large power supply device of hot device is roughly the same, and the difference of the two is：In embodiment one, the hot superconducting radiator
21 is plate armature, and the hot superconducting radiator 21 prolongs from 22 surface of the power device to the top of the power device 22
Stretch；And in the present embodiment, the hot superconducting radiator 21 is U-shaped plank frame or the U-shaped plank frame of wave bending, will be described
Hot superconducting radiator 21 is set to U-shape structure or the U-shaped plank frame of wave bending, can be with the sky in effectively utilizes power supply casing
Between, increase the surface area of radiator, so as to heat radiation ability.
In one example, the hot superconducting radiator 21 is U-shaped plank frame；One end patch of the hot superconducting radiator 21
The surface of power device 22 described in a group is placed in, the other end of the hot superconducting radiator 21 adheres on another group for being adjacent
The surface of the power device 22；I.e. with the power device 22 as two groups as an example, described in two groups, power device 22 is distinguished
Adhere on the outer surface or inner surface near 21 two ends of hot superconducting radiator, i.e., described in one group, power device 22 is pasted
It is placed on the outer surface or inner surface of 21 adjacent one end of hot superconducting radiator, described in another group, power device 22 is posted
On the outer surface or inner surface near 21 other end of hot superconducting radiator.
In another example, the hot superconducting radiator 21 is the U-shaped plank frame of wave bending, as shown in Figure 8；It is described
One end of hot superconducting radiator 21 adheres on the surface of power device 22 described in a group, the other end of the hot superconducting radiator 21
Adhere on the surface of power device 22 described in another group for being adjacent；I.e. with the power device 22 as two groups as an example,
Power device 22 described in two groups is adhered on outer surface or inner surface near 21 two ends of hot superconducting radiator respectively,
I.e. described in one group, power device 22 is adhered on the outer surface or inner surface of 21 adjacent one end of hot superconducting radiator, separately
Power device 22 described in one group is adhered on outer surface or inner surface near 21 other end of hot superconducting radiator.
It should be noted that when the hot superconducting radiator 21 is wave bending U-shaped plank frame, can be the heat
The vertical portion of superconducting radiator 21 is plate-like structure, and the horizontal component for connecting the vertical portion is tied for wave bending
Structure, as shown in Figure 8, it is also possible to which the vertical portion and horizontal component for the hot superconducting radiator 21 is wave bending knot
Structure.
Example IV
Fig. 8 is referred to, the present embodiment also provides a kind of large power supply device with hot superconducting radiator, the present embodiment
In the large power supply device with hot superconducting radiator structure and embodiment one described in dissipate with hot superconduction
The structure of the large power supply device of hot device is roughly the same, and the difference of the two is：It is in embodiment one, described to dissipate with hot superconduction
The large power supply device of hot device includes power device 22 described in a group, and the hot superconducting radiator 21 is plate armature, institute
State top of the hot superconducting radiator 21 from 22 surface of the power device to the power device 22 to extend；And in the present embodiment,
The hot superconducting radiator 21 includes the first sub hot superconducting radiator 211 and the second sub hot superconducting radiator 212.
In one example, as shown in figure 9, the first sub hot superconducting radiator 211 is L-type plank frame, described first
One end of sub hot superconducting radiator 211 adheres on 22 surface of power device described in a group, and the other end is from the group power device
22 surfaces extend to the top of the power device 22, and from the upper direction of the group power device 22 away from the group work(
The side of rate device 22 extends；The second sub hot superconducting radiator 212 be the U-shaped plank frame of wave bending, described second
The two ends of sub hot superconducting radiator 212 adhere on the surface of power device 22 described in other two groups respectively；With the power device
22 be four groups as an example, described in four groups, power device 22 is arranged successively, and the first sub hot superconducting radiator 211 adheres on position
In 22 surface of power device described in two groups of outside, and prolong from 22 surface of the power device to the outside of the power device 22
Stretch, the two ends of the second sub hot superconducting radiator 212 adhere on the surface of power device 22 described in other two groups respectively, i.e., separately
Power device 22 described in outer two groups adheres on the outer surface or interior near the described second sub 212 two ends of hot superconducting radiator respectively
On side surface, i.e., described in one group, power device 22 adheres on the outside table of the described second sub 212 adjacent one end of hot superconducting radiator
On face or inner surface, power device 22 described in another group is adhered near described second sub 212 other end of hot superconducting radiator
Outer surface or inner surface on.
In another example, the described first sub hot superconducting radiator 211 is wave bending L-type plank frame, described the
One end of one sub hot superconducting radiator 211 adheres on 22 surface of power device described in a group, and the other end is from the group power device
22 surface of part extends to the top of the power device 22, and from the upper direction of the group power device 22 away from described in the group
The side of power device 22 extends；The second sub hot superconducting radiator 212 is the U-shaped plank frame of wave bending, described the
The two ends of two sub hot superconducting radiators 212 adhere on the surface of power device 22 described in other two groups respectively；With the power device
Part 22 for four groups as an example, described in four groups, arrange successively, and the first sub hot superconducting radiator 211 is adhered on by power device 22
Positioned at 22 surface of power device described in two groups of outside, and from 22 surface of the power device to the outside of the power device 22
Extend, the two ends of the second sub hot superconducting radiator 212 adhere on the surface of power device 22 described in other two groups respectively, i.e.,
Power device 22 described in other two groups adhere on respectively the outer surface near the described second sub 212 two ends of hot superconducting radiator or
On inner surface, i.e., described in one group, power device 22 adheres on the outside of the described second sub 212 adjacent one end of hot superconducting radiator
On surface or inner surface, it is attached that power device 22 described in another group adheres on described second sub 212 other end of hot superconducting radiator
On near outer surface or inner surface.
In another example, the first sub hot superconducting radiator 211 be plate armature, the first sub hot superconduction dissipate
One end of hot device 211 adheres on 22 surface of power device described in a group, and the other end extends from the group 22 surface of power device
To the top of the power device 22, and from the upper direction of the group power device 22 away from the group power device 22
Side extends；The second sub hot superconducting radiator 212 be the U-shaped plank frame of wave bending, the second sub hot superconduction dissipate
The two ends of hot device 212 adhere on the surface of power device 22 described in other two groups respectively；With the power device 22 as four groups of works
For example, described in four groups, power device 22 is arranged successively, and the first sub hot superconducting radiator 211 adheres on positioned at outside two
Group 22 surface of power device, and extending from 22 surface of the power device to the outside of the power device 22, described the
The two ends of two sub hot superconducting radiators 212 adhere on the surface of power device 22 described in other two groups respectively, i.e., other two groups of institutes
State power device 22 and adhere on outer surface or inner surface near the described second sub 212 two ends of hot superconducting radiator respectively
On, i.e., described in one group, power device 22 adheres on the outer surface or interior of the described second sub 212 adjacent one end of hot superconducting radiator
On side surface, power device 22 described in another group adheres on the outside near described second sub 212 other end of hot superconducting radiator
On surface or inner surface.
In another example, the first sub hot superconducting radiator 211 be plate armature, the first sub hot superconduction dissipate
One end of hot device 211 adheres on 22 surface of power device described in a group, and the other end extends from the group 22 surface of power device
To the top of the power device 22, and from the upper direction of the group power device 22 away from the group power device 22
Side extends；The second sub hot superconducting radiator 212 be U-shaped plank frame, the two of the second sub hot superconducting radiator 212
End adheres on the surface of power device 22 described in other two groups respectively；With the power device 22 as four groups as an example, four groups
The power device 22 is arranged successively, power described in the first sub hot superconducting radiator 211 adhere on positioned at outside two groups
22 surface of device, and extend from 22 surface of the power device to the outside of the power device 22, the second sub hot superconduction
The two ends of radiator 212 adhere on the surface of power device 22 described in other two groups respectively, i.e., it is other two groups described in power device
22 adhere on outer surface or inner surface near the described second sub 212 two ends of hot superconducting radiator respectively, i.e., one group institute
State power device 22 to adhere on the outer surface or inner surface of the described second sub 212 adjacent one end of hot superconducting radiator, separately
Power device 22 described in one group adheres on outer surface or inner side table near described second sub 212 other end of hot superconducting radiator
On face.
In another example, the first sub hot superconducting radiator 211 be L-type plank frame, the first sub hot superconduction
One end of radiator 211 adheres on 22 surface of power device described in a group, and the other end prolongs from the group 22 surface of power device
Extend the top of the power device 22, and from the upper direction of the group power device 22 away from the group power device 22
Side extend；The second sub hot superconducting radiator 212 is U-shaped plank frame, the second sub hot superconducting radiator 212
Two ends adhere on the surface of power device 22 described in other two groups respectively；With the power device 22 as four groups as an example, four
The group power device 22 is arranged successively, work(described in the first sub hot superconducting radiator 211 adhere on positioned at outside two groups
22 surface of rate device, and extend from 22 surface of the power device to the outside of the power device 22, the second son heat is super
The two ends of conduction heat radiator 212 adhere on the surface of power device 22 described in other two groups respectively, i.e., it is other two groups described in power device
Part 22 is adhered on outer surface or inner surface near the described second sub 212 two ends of hot superconducting radiator respectively, i.e., one group
The power device 22 is adhered on the outer surface or inner surface of the described second sub 212 adjacent one end of hot superconducting radiator,
Power device 22 described in another group adheres on the outer surface near described second sub 212 other end of hot superconducting radiator or inner side
On surface.
In another example, the first sub hot superconducting radiator 211 is wave bending L-type plank frame, described the
One end of one sub hot superconducting radiator 211 adheres on 22 surface of power device described in a group, and the other end is from the group power device
22 surface of part extends to the top of the power device 22, and from the upper direction of the group power device 22 away from described in the group
The side of power device 22 extends；The second sub hot superconducting radiator 212 be U-shaped plank frame, the second sub hot superconduction
The two ends of radiator 212 adhere on the surface of power device 22 described in other two groups respectively；With the power device 22 as four groups
As an example, described in four groups, power device 22 is arranged successively, and the first sub hot superconducting radiator 211 is adhered on positioned at outside
22 surface of power device described in two groups, and extend from 22 surface of the power device to the outside of the power device 22, it is described
The two ends of the second sub hot superconducting radiator 212 adhere on the surface of power device 22 described in other two groups respectively, i.e., other two groups
The power device 22 adheres on outer surface or inner surface near the described second sub 212 two ends of hot superconducting radiator respectively
On, i.e., described in one group, power device 22 adheres on the outer surface or interior of the described second sub 212 adjacent one end of hot superconducting radiator
On side surface, power device 22 described in another group adheres on the outside near described second sub 212 other end of hot superconducting radiator
On surface or inner surface.
In sum, the utility model provides a kind of large power supply device with hot superconducting radiator, described to have
The large power supply device of hot superconducting radiator includes：Hot superconducting radiator, the hot superconducting radiator are composite board type structure,
It is formed with the Super-conductive conduit road of given shape in the hot superconducting radiator, the Super-conductive conduit road is closing pipe line, the heat
Heat-transfer working medium is filled with superconduction pipeline；Power device, adheres on the hot superconducting radiator surface.Heat of the present utility model is super
Conduction heat radiator has the characteristic of quick conductive, and its equivalent heat conductivity is capable of achieving whole hot superconduction and dissipates up to more than 4000W/m DEG C
The samming of hot device.As hot superconducting radiator is thin-slab structure, with heat conduction rate is fast, small volume, lightweight, flexible structure,
The advantages of easy for installation, the hot superconducting radiator is applied to into large power supply device, large power supply device can be improved
Heat-sinking capability and efficiency, effectively utilizes power supply casing inner space, reduce rotation speed of the fan or without using fan, so as to reduce
Noise.
Above-described embodiment only illustrative principle of the present utility model and its effect are new not for this practicality is limited
Type.Any person skilled in the art all can be carried out to above-described embodiment under without prejudice to spirit and the scope of the present utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the essence disclosed in the utility model
All equivalent modifications completed under god and technological thought or change, should be covered by claim of the present utility model.
Claims (13)
1. a kind of large power supply device with hot superconducting radiator, it is characterised in that described with hot superconducting radiator
Large power supply device includes：
Hot superconducting radiator, the hot superconducting radiator are composite board type structure, are formed with specific in the hot superconducting radiator
The Super-conductive conduit road of shape, the Super-conductive conduit road are closing pipe line, are filled with heat-transfer working medium in the Super-conductive conduit road；
Power device, adheres on the hot superconducting radiator surface.
2. the large power supply device with hot superconducting radiator according to claim 1, it is characterised in that：The heat is super
Conduction heat radiator is plate armature, the hot superconducting radiator from the power device surface to the power device above prolong
Stretch.
3. the large power supply device with hot superconducting radiator according to claim 1, it is characterised in that：The heat is super
Conduction heat radiator is L-type plank frame, and the hot superconducting radiator extends to the power device from the power device surface
Top, and from the upper direction of the power device away from the power device side extend.
4. the large power supply device with hot superconducting radiator according to claim 1, it is characterised in that：The heat is super
Conduction heat radiator is wave bending L-type plank frame, and the hot superconducting radiator extends to described from the power device surface
The top of power device, and from the upper direction of the power device away from the power device side extend.
5. the large power supply device with hot superconducting radiator according to claim 1, it is characterised in that：The heat is super
Conduction heat radiator is U-shaped plank frame；One end of the hot superconducting radiator adheres on the surface of power device described in a group, another
End adheres on power device surface described in another group for being adjacent.
6. the large power supply device with hot superconducting radiator according to claim 1, it is characterised in that：The heat is super
Conduction heat radiator is the U-shaped plank frame of wave bending；One end of the hot superconducting radiator adheres on power device described in a group
Surface, the other end adheres on power device surface described in another group for being adjacent.
7. the large power supply device with hot superconducting radiator according to claim 1, it is characterised in that：The heat is super
Conduction heat radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is flat
Plank frame, one end of the first sub hot superconducting radiator adhere on power device surface described in a group, and the other end is from the group
The power device surface extends to the top of the power device, and from the upper direction of the group power device away from the group
The side of the power device extends；The second sub hot superconducting radiator be U-shaped plank frame, the second sub hot superconduction dissipate
The two ends of hot device adhere on the surface of power device described in other two groups respectively.
8. the large power supply device with hot superconducting radiator according to claim 1, it is characterised in that：The heat is super
Conduction heat radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is L
Plate-type structure, one end of the first sub hot superconducting radiator adhere on power device surface described in a group, and the other end certainly should
The group power device surface extends to the top of the power device, and from the upper direction of the group power device away from this
The side of the group power device extends；The second sub hot superconducting radiator be U-shaped plank frame, the second sub hot superconduction
The two ends of radiator adhere on the surface of power device described in other two groups respectively.
9. the large power supply device with hot superconducting radiator according to claim 1, it is characterised in that：The heat is super
Conduction heat radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is ripple
Unrestrained bending L-type plank frame, one end of the first sub hot superconducting radiator adhere on power device surface described in a group, separately
One end extends to the top of the power device from the group power device surface, and from the top of the group power device
Extend to the side away from the group power device；The second sub hot superconducting radiator be U-shaped plank frame, described second
The two ends of the hot superconducting radiator of son adhere on the surface of power device described in other two groups respectively.
10. the large power supply device with hot superconducting radiator according to claim 1, it is characterised in that：The heat
Superconducting radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is
Plate armature, one end of the first sub hot superconducting radiator adhere on power device surface described in a group, and the other end certainly should
The group power device surface extends to the top of the power device, and from the upper direction of the group power device away from this
The side of the group power device extends；The second sub hot superconducting radiator is the U-shaped plank frame of wave bending, described the
The two ends of two sub hot superconducting radiators adhere on the surface of power device described in other two groups respectively.
The 11. large power supply devices with hot superconducting radiator according to claim 1, it is characterised in that：The heat
Superconducting radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is
L-type plank frame, one end of the first sub hot superconducting radiator adhere on power device surface described in a group, and the other end certainly should
The group power device surface extends to the top of the power device, and from the upper direction of the group power device away from this
The side of the group power device extends；The second sub hot superconducting radiator is the U-shaped plank frame of wave bending, described the
The two ends of two sub hot superconducting radiators adhere on the surface of power device described in other two groups respectively.
The 12. large power supply devices with hot superconducting radiator according to claim 1, it is characterised in that：The heat
Superconducting radiator includes the first sub hot superconducting radiator and the second sub hot superconducting radiator, and the first sub hot superconducting radiator is
Wave bending L-type plank frame, one end of the first sub hot superconducting radiator adhere on power device surface described in a group,
The other end extends to the top of the power device from the group power device surface, and from the upper of the group power device
Direction extends away from the side of the group power device；The second sub hot superconducting radiator is that wave bending is U-shaped board-like
Structure, the two ends of the second sub hot superconducting radiator adhere on the surface of power device described in other two groups respectively.
The 13. large power supply devices with hot superconducting radiator according to any one of claim 1 to 12, its feature
It is：The large power supply device with hot superconducting radiator also includes：
Power supply casing；
Pcb board, in the power supply casing；
Electric capacity, in the power supply casing, and is fixed on the surface of the pcb board；
Inductance, in the power supply casing, and is fixed on the surface of the pcb board；
The power device is located in the power supply casing, and is fixed on the surface of the pcb board.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620991230.3U CN206042648U (en) | 2016-08-30 | 2016-08-30 | High -power power supply unit with hot superconductive heat radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620991230.3U CN206042648U (en) | 2016-08-30 | 2016-08-30 | High -power power supply unit with hot superconductive heat radiator |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132181A (en) * | 2016-08-30 | 2016-11-16 | 上海嘉熙科技有限公司 | There is the large power, electrically source apparatus of hot superconducting radiator |
| CN107204314A (en) * | 2017-06-30 | 2017-09-26 | 上海嘉熙科技有限公司 | Hot superconductive radiating component and its manufacture method |
| CN109271004A (en) * | 2018-09-21 | 2019-01-25 | 禾臻电子科技（上海）有限公司 | Radiator and water heater composite structure |
-
2016
- 2016-08-30 CN CN201620991230.3U patent/CN206042648U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106132181A (en) * | 2016-08-30 | 2016-11-16 | 上海嘉熙科技有限公司 | There is the large power, electrically source apparatus of hot superconducting radiator |
| CN107204314A (en) * | 2017-06-30 | 2017-09-26 | 上海嘉熙科技有限公司 | Hot superconductive radiating component and its manufacture method |
| CN109271004A (en) * | 2018-09-21 | 2019-01-25 | 禾臻电子科技（上海）有限公司 | Radiator and water heater composite structure |
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Effective date of registration: 20201116 Address after: Room 201, 2 / F, building 2, No. 9, Taiji Road, Yuhang Economic and Technological Development Zone, Yuhang District, Hangzhou City, Zhejiang Province Patentee after: ZHEJIANG JIAXI OPTOELECTRONIC EQUIPMENT MANUFACTURING Co.,Ltd. Address before: Room 06, 1 / F, jilou, 555 Dongchuan Road, Minhang District, Minhang District, Shanghai, 200241 Patentee before: KARHE TECHNOLOGY Co.,Ltd. |
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Address after: 311100 Room 201, 2 / F, building 2, No. 9, Taiji Road, Yuhang Economic and Technological Development Zone, Yuhang District, Hangzhou City, Zhejiang Province Patentee after: Zhejiang Jiaxi Technology Co.,Ltd. Address before: Room 201, 2 / F, building 2, No. 9, Taiji Road, Yuhang Economic and Technological Development Zone, Yuhang District, Hangzhou City, Zhejiang Province Patentee before: ZHEJIANG JIAXI OPTOELECTRONIC EQUIPMENT MANUFACTURING Co.,Ltd. |
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