CN202242153U - Polyimide composite film for printed circuit board - Google Patents
Polyimide composite film for printed circuit board Download PDFInfo
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- CN202242153U CN202242153U CN2011203156545U CN201120315654U CN202242153U CN 202242153 U CN202242153 U CN 202242153U CN 2011203156545 U CN2011203156545 U CN 2011203156545U CN 201120315654 U CN201120315654 U CN 201120315654U CN 202242153 U CN202242153 U CN 202242153U
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- polyimide
- film
- thickness
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- circuit board
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Abstract
The utility model discloses a polyimide composite film for a printed circuit board, which comprises a plurality of layers of single-layer polyimide films and a plurality of layers of adhesive layers. The adhesive layers are located between adjacent polyimide films and adhered to the adjacent polyimide films. The plurality of layers of polyimide films and the plurality of layers of adhesive layers form a composite lamination structure. The warping height of the polyimide composite film after being adhered to the circuit board is reduced by using specific thickness of the lamination structure and specific thickness of each material layer in the composite lamination structure. The warping height can be further reduced when a printing ink layer is arranged, and the polyimide composite film is more suitable for consumer electronics with requirements of protective circuit images.
Description
Technical field
The utility model relates to a kind of polyimides coverlay, and is especially a kind of smooth and have a polyimide composite film that covers the circuit effect.
Background technology
The polyimide resin heat endurance is high and have excellent insulating properties, mechanical strength, reach resistance to chemical corrosion, is usually used in multiple electronics rapidoprint.As be used for the insulating barrier of flexible printed wiring board (Flexible Printed Circuit), perhaps be used for the electronics spare part further, for example the reinforcement purposes of printed circuit board (PCB).
Kapton has been widely used in electronic material; Wherein, the polyimides stiffening plate that printed circuit board (PCB) is used generally can be divided into individual layer slab or combined type polyimides stiffening plate; And the combined type stiffening plate; Like the polyimides plate structure that Taiwan patent I257898 is disclosed, it is that (mil, the thermmohardening solid of polyimide plate 1mil=0.0254mm) and different-thickness forms the combined type polyimide plate of different-thickness with 2 Mills.Yet polyimide composite film is to be subject to the thickness of polyimide film cost and composite membrane in the problem that use to go up meets with, and can't cover the circuit layout pattern and is easy to plagiarized by the same trade.In addition, composite membrane is by the combination of polyimides and adhesion agent layer and get, but the composite membrane that its two thermal expansion coefficient difference often causes being used for reinforcement is pasting to flexible circuit board the phenomenon of generation warpage.
Therefore, still need a kind of polyimide composite film that is difficult for warpage and has screening effect.
The utility model content
In order to overcome above-mentioned defective, the utility model provides a kind of polyimide composite film that is used for printed circuit board (PCB), and the said polyimide composite film that is used for printed circuit board (PCB) can reduce composite membrane and paste the depth of camber to the circuit board.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of polyimide composite film that is used for printed circuit board (PCB); The polyimide film and the several layers adhesion agent layer that comprise the several layers individual layer; Said adhesion agent layer is between adjacent polyimide film and bonding adjacent polyimide film; Said several layers polyimide film and several layers adhesion agent layer constitute composite lamainated structure, and the gross thickness Z of said composite lamainated structure meets the relation of following formula (I):
mX
1+m’X
2+nY＝Z (I)
(I) in the formula, X
1Expression thickness is the polyimide film of the individual layer of 1mil, X
2Expression thickness is the polyimide film of the individual layer of 2mil; M is X
1The number of plies of represented polyimide film, m ' is X
2The number of plies of represented polyimide film; N representes the number of plies of said adhesion agent layer; Y representes the thickness of every layer of said adhesion agent layer, and said Y value decides according to specific Z value, and wherein, said Z value is 6 to 15mil, and said composite lamainated structure is a symmetrical structure.
The utility model also can adopt following technical measures further to realize in order to solve its technical problem:
Preferably, said m be 2, m ' be 1 and Z be 6mil.That is, the gross thickness of composite lamainated structure is 6mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 1, the number of plies of solid be 2 and thickness be 25 μ m.
Preferably, said m be 1, m ' be 2 and Z be 7mil.That is, the gross thickness of composite lamainated structure is 7mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 1, thickness is polyimide film-X of 2mil
2The number of plies be 2, the number of plies of solid be 2 and thickness be 25 μ m.
Preferably, said m is 2, and m ' is 2, and Z is one of 8mil and 9mil.That is, when the gross thickness of composite lamainated structure was 8mil, wherein, thickness was polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 2, the number of plies of solid be 3 and thickness be 16.7 μ m; When the gross thickness of composite lamainated structure was 9mil, wherein, thickness was polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 2, the number of plies of solid be 3 and thickness be 25 μ m.Preferably, the outermost layer of said composite lamainated structure is all the polyimide film that thickness is 2mil.
Preferably, said m be 4, m ' be 1 and Z be 10mil.That is, the gross thickness of composite lamainated structure is 10mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 4, thickness is polyimide film-X of 2mil
2The number of plies be 1, the number of plies of solid be 4 and thickness be 25 μ m.
Preferably, said m be 2, m ' be 3 and Z be 11mil.That is, the gross thickness of composite lamainated structure is 11mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 3, the number of plies of solid be 4 and thickness be 18.7 μ m.The outermost layer of said composite lamainated structure is all the polyimide film that thickness is 2mil.
Preferably, said m be 2, m ' be 3 and Z be 12mil.That is, the gross thickness of composite lamainated structure is 12mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 3, the number of plies of solid be 4 and thickness be 25 μ m.The outermost layer of said composite lamainated structure is all the polyimide film that thickness is 1mil.
Preferably, said m be 1, m ' be 4 and Z be 13mil.That is, the gross thickness of composite lamainated structure is 13mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 1, thickness is polyimide film-X of 2mil
2The number of plies be 4, the number of plies of solid be 4 and thickness be 25 μ m.
Preferably, said m is 2, and m ' is 4, and Z is one of 14mil and 15mil.That is, when the gross thickness of composite lamainated structure was 14mil, wherein, thickness was polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 4, the number of plies of solid be 5 and thickness be 20 μ m; When the gross thickness of composite lamainated structure was 15mil, wherein, thickness was polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 4, the number of plies of solid be 5 and thickness be 25 μ m.The outermost layer of said composite lamainated structure is all the polyimide film that thickness is 2mil.
Preferably; The said polyimide composite film that is used for printed circuit board (PCB) also comprises pure glue-line, and said pure glue-line is formed on the bottom surface of said composite lamainated structure, and pure glue-line is used for said polyimide composite film is covered on circuit board; Preferably, the thickness of said pure glue-line is 10 to 40 μ m.
Preferably, the said polyimide composite film that is used for printed circuit board (PCB) also comprises ink lay, and said composite lamainated structure is folded between said pure glue-line and the ink lay, and preferably, the thickness of said ink lay is 13 to 15 μ m.In addition, said ink lay can comprise developers such as carbon dust, carbon nanotube or titanium dioxide, or even the heat radiation powder of one or more mixing formations in carborundum, boron nitride, aluminium oxide and the aluminium nitride, therefore, has more the circuit screening effect.
The beneficial effect of the utility model is: the polyimide composite film that is used for printed circuit board (PCB) of the utility model is a specific thicknesses of utilizing the specific thickness of its composite lamainated structure and each material layer of composite lamainated structure; Reduce polyimide composite film and paste the depth of camber to the circuit board; When having ink lay; Can further reduce depth of camber, and be more suitable for being used to have the consumption electronic products of holding circuit pattern demand.
Description of drawings
Fig. 1 is the polyimide composite film structure (not having ink lay) of the utility model;
Fig. 2 is the polyimide composite film structure with ink lay of the utility model;
Fig. 3 is that the gross thickness Z of the said composite lamainated structure of the utility model is 8 or 9 polyimide composite film structural representation;
Fig. 4 is that the gross thickness Z of the said composite lamainated structure of the utility model is 11 polyimide composite film structural representation;
Fig. 5 is that the gross thickness Z of the said composite lamainated structure of the utility model is 12 polyimide composite film structural representation;
Fig. 6 is that the gross thickness Z of the said composite lamainated structure of the utility model is 14 or 15 polyimide composite film structural representation.
The specific embodiment
Below, be familiar with advantage and effect that this skill personage can be understood the utility model easily by the content that this specification disclosed through the embodiment of specific instantiation explanation the utility model.The utility model also can be implemented with other different mode,, under the category that discloses from the utility model that is not contrary to, can give different modifications and change that is.
As shown in Figure 1; The polyimide composite film 100 of the utility model; Comprise several layers polyimide film 101 and be formed at the adhesion agent layer 102 between the said polyimide film 101; Said several layers polyimide film 101 constitutes composite lamainated structures with several layers adhesion agent layer 102, also can comprise the pure glue-line 103 of the bottom surface that is formed at said composite lamainated structure, and said polyimide composite film 100 is for as stiffening plate.
As shown in Figure 2; Another polyimide composite film 100 ' structure for the utility model; Polyimide composite film 100 ' shown in Figure 2 is roughly the same with polyimide composite film 100 structures shown in Figure 1; Difference is that polyimide composite film 100 ' shown in Figure 2 is than polyimide composite film shown in Figure 1 one deck more than 100 ink lay 104, and said ink lay 104 is formed at the end face of said composite lamainated structure.
In the utility model, the thickness of said ink lay is between 13 to 15 μ m; And the thickness of said pure glue-line is between 10 to 40 μ m.
The ink lay that the polyimide composite film of the utility model comprises comprises the developer of white or black.Said ink lay also can comprise epoxy resin, one or more are selected from the heat radiation powder of carborundum, boron nitride, aluminium oxide and group that aluminium nitride becomes, and has heat sinking function with the polyimide composite film that makes the utility model.For satisfying various electronic product demand, white products application demand person, this white developer is selected from one or more of titanium dioxide and group that Chinese white is formed.And the preferred circuit of needs pattern screening effect person is arranged, and can select the black developer for use, it is selected from black pigment, carbon dust and group that carbon nanotube is formed one or more.In this article, the toner that pigment is also contained dyestuff or is commonly called as, and pigment can comprise with the obtained person of organic or inorganic material.
Find after deliberation; The used white developer of the utility model is with after epoxy resin mixes; Can make composite membrane have excellent reflectivity, wherein, white developer account for this epoxy resin solid content 60 to 95wt%; Even and if white developer content is up to the 95wt% of resin solid content, but the thickness of control reflection layer still can make the reflecting layer be unlikely to come off between 5 to 50 microns.As for the content of black developer then with account for this epoxy resin solid content 3 to 15wt%, and be preferable with 4 to 8wt%.
In this polyimide composite film, the material category of employed polyimide film and adhesion agent layer does not have special restriction, is preferably not halogen-containing polyimide material of use and solid, and better being to use has from stickiness and not halogen-containing solid.
Institute is stressed that; In the polyimide composite film of the utility model; Can be according to the gross thickness needs of composite lamainated structure; And according to individual layer polyimide film number of stories m and the m ' of 1mil in formula (I) the adjustment composite membrane with 2mil, the thickness Y and the adhesion agent layer number of plies n of each adhesion agent layer adjusted in collocation, to form the composite lamainated structure of required gross thickness:
mX
1+m’X
2+nY＝Z (I)
(I) in the formula, X
1Expression thickness is the polyimide film of the individual layer of 1mil, X
2Expression thickness is the polyimide film of the individual layer of 2mil; M is X
1The number of plies of represented polyimide film, m ' is X
2The number of plies of represented polyimide film; N representes the number of plies of said adhesion agent layer; Y representes the thickness of every layer of said adhesion agent layer, and said Y value decides according to specific Z value, and wherein, said Z value is 6 to 15mil, and said composite lamainated structure is a symmetrical structure.
That is, the polyimide composite film of the utility model can be adjusted the composition number of plies and the thickness of polyimide film and adhesion agent layer according to desire composite lamainated structure gross thickness, has the polyimide composite film of high flatness with formation.
The utility model is to utilize the specific thicknesses of polyimide film in specific thickness of composite lamainated structure and the composite lamainated structure and the thickness of adhesion agent layer; Reduce polyimide composite film and paste the depth of camber to the circuit board; In addition; In order to improve the flatness of said polyimide film, though there is not more concrete theoretical foundation, the utility model applies ink lay and pure glue-line respectively at the end face and the bottom surface of said composite lamainated structure; Said composite lamainated structure is folded between said pure glue-line and the said ink lay, further reduces depth of camber.
In the utility model, do not limit employed solid and pure glue material, but usually, be to use the epoxide resin type resin.
Each embodiment general configuration of the utility model is identical; Difference be polyimide film thickness and the number of plies, adhesion agent layer the thickness and the number of plies and whether have ink lay, below the distinctive points of each embodiment of the utility model is shown in the following table 1 with tabular form:
Table 1:
Wherein, in embodiment 5,6,7 and 8, the outermost layer of said composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 3, said polyimide composite film comprises two layers of polyimide film 101a that is positioned at the outermost 2mil of composite lamainated structure; Two layers of polyimide film 101b that is folded in the 1mil in the middle of the said polyimide film 101a; And be formed at the adhesion agent layer 102 between said polyimide film 101a or the 101b.
Wherein, in embodiment 11 and 12, the outermost layer of said composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 4, said polyimide composite film comprises two layers of polyimide film 101a that is positioned at the outermost 2mil of composite lamainated structure; Be folded in polyimide film 101b, the polyimide film 101a of 2mil and the polyimide film 101b of 1mil of the middle 1mil of said polyimide film 101a in regular turn; And be formed at the adhesion agent layer 102 between said polyimide film 101a or the 101b.
Wherein, in embodiment 13 and 14, the outermost layer of said composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 5, said polyimide composite film comprises two layers of polyimide film 101b that is positioned at the outermost 2mil of composite lamainated structure; Be folded in the polyimide film 101a of 3 layers of middle 2mil of said polyimide film 101b; And be formed at the adhesion agent layer 102 between said polyimide film 101a or the 101b.
Wherein, in embodiment 17,18,19 and 20, the outermost layer of said composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 6, said polyimide composite film comprises two layers of polyimide film 101a that is positioned at the outermost 2mil of composite lamainated structure; Be folded in polyimide film 101a, the polyimide film 101b of 1mil, the polyimide film 101b of 1mil and the polyimide film 101a of 2mil of the middle 2mil of said polyimide film 101a in regular turn; And be formed at the adhesion agent layer 102 between said polyimide film 101a or the 101b.
The preparation method of the polyimide composite film of the utility model is following:
At first, at individual layer polyimide film surface coated one deck thermmohardening solid of 1mil (Asia electricity material epoxide-resin glue, model AEM-HQLV-N-002); Also can adopt the thermoplasticity polyimide resin of model AEM-TPI-N-001, place the baking oven heat drying after, through the individual layer polyimide film pressing of hot roller and another layer 2mil; Then, slaking is 1 hour under 180 ℃ of conditions, then in this composite membrane sample surfaces coating one deck thermmohardening solid; After placing the baking oven heat drying, be the individual layer polyimide film pressing of 1mil or 2mil through hot roller and another layer, slaking 1 hour under 180 ℃ of conditions again; So repeat above-mentioned steps; At last, apply pure glue-line, form the polyimide composite film sample in an outermost polyimide film lateral surface.
Also can be last, apply ink lay and pure glue respectively at these several layers polyimide film two outermost surface, form the polyimide composite film sample.
On the other hand, the polyimide composite film structure of the utility model can be formed through range upon range of pressing by the individual layer polyimide film of odd-level 1mil and the individual layer polyimide film of even level 2mil.Perhaps, the polyimide composite film structure of the utility model can be formed by the individual layer polyimide film of odd-level 2mil and the individual layer polyimide film pressing one on top of another of even level 1mil.
Test case: the measurement of polyimide composite film angularity
The polyimide composite film for preparing the utility model by the data of each embodiment in the above-mentioned table 1.In including the polyimide composite film of ink lay, said ink lay comprises epoxy resin, carbon dust or titanium dioxide powder (E.I.Du Pont Company produces, and model is R-103).
In addition; Prepare the reference examples sample again; The composite membrane of said reference examples sample is the polyimides plate structure that is disclosed like Taiwan patent I257898, and it does not comprise ink lay, only forms the combined type polyimide plate of different-thickness with the thermmohardening solid of the polyimide plate of 2mil and different-thickness.The reference examples sample of same sequence number is identical with the gross thickness of embodiment sample.
The composite membrane of embodiment and reference examples sample all is to use the pure glue (trade name D3430) that Sony Corporation produced.Then, composite membrane is cut into the size of 25cm * 25cm, and on 3-Layer (three layers) double-surface flexible copper foil substrate that is pressure bonded to 74.5 ± 1um under 180 ℃ of conditions; Carry out slaking with 160 ℃ condition again; Again each embodiment sample is placed on the smooth flat, leave standstill 20 minutes after, measure four corners depth of camber (centimetre); Carry out the flatness test, the result is embedded in table 2.
Table 2:
Shown in table 2 result; Under the identical condition of gross thickness (Z); Only with 2mil polyimide plate and the formed polyimide composite film of different-thickness solid, the depth of camber of the polyimide composite film of the utility model is less relatively, thereby has preferable flatness compared to reference examples; And along with gross thickness increases, flatness is more obvious.In addition, compare, the depth of camber of polyimide composite film sample that is covered with ink lay is littler.
Above-mentioned specification and embodiment are merely the principle and the effect thereof of illustrative the utility model, but not are used to limit the utility model.The rights protection scope of the utility model should be listed like claims.
Claims (15)
1. polyimide composite film that is used for printed circuit board (PCB); The polyimide film and the several layers adhesion agent layer that comprise the several layers individual layer; Said adhesion agent layer is between adjacent polyimide film and bonding adjacent polyimide film; Said several layers polyimide film and several layers adhesion agent layer constitute composite lamainated structure, and it is characterized in that: the gross thickness Z of said composite lamainated structure meets the relation of following formula (I):
mX
1+m’X
2+nY＝Z (I)
(I) in the formula, X
1Expression thickness is the polyimide film of the individual layer of 1mil, X
2Expression thickness is the polyimide film of the individual layer of 2mil; M is X
1The number of plies of represented polyimide film, m ' is X
2The number of plies of represented polyimide film; N representes the number of plies of said adhesion agent layer; Y representes the thickness of every layer of said adhesion agent layer, and said Y value decides according to specific Z value, and wherein, said Z value is 6 to 15mil, and said composite lamainated structure is a symmetrical structure.
2. the polyimide composite film that is used for printed circuit board (PCB) according to claim 1 is characterized in that: said m is 2, m ' be 1 and Z be 6mil.
3. the polyimide composite film that is used for printed circuit board (PCB) according to claim 1 is characterized in that: said m is 1, m ' be 2 and Z be 7mil.
4. the polyimide composite film that is used for printed circuit board (PCB) according to claim 1 is characterized in that: said m is 2, and m ' is 2, and Z is one of 8mil and 9mil.
5. the polyimide composite film that is used for printed circuit board (PCB) according to claim 4 is characterized in that: the outermost layer of said composite lamainated structure is all the polyimide film that thickness is 2mil.
6. the polyimide composite film that is used for printed circuit board (PCB) according to claim 1 is characterized in that: said m is 4, m ' be 1 and Z be 10mil.
7. the polyimide composite film that is used for printed circuit board (PCB) according to claim 1 is characterized in that: said m is 2, m ' be 3 and Z be 11mil.
8. the polyimide composite film that is used for printed circuit board (PCB) according to claim 7 is characterized in that: the outermost layer of said composite lamainated structure is all the polyimide film that thickness is 2mil.
9. the polyimide composite film that is used for printed circuit board (PCB) according to claim 1 is characterized in that: said m is 2, m ' be 3 and Z be 12mil.
10. the polyimide composite film that is used for printed circuit board (PCB) according to claim 9 is characterized in that: the outermost layer of said composite lamainated structure is all the polyimide film that thickness is 1mil.
11. the polyimide composite film that is used for printed circuit board (PCB) according to claim 1 is characterized in that: said m is 1, m ' be 4 and Z be 13mil.
12. the polyimide composite film that is used for printed circuit board (PCB) according to claim 1 is characterized in that: said m is 2, and m ' is 4, and Z is one of 14mil and 15mil.
13. the polyimide composite film that is used for printed circuit board (PCB) according to claim 12 is characterized in that: the outermost layer of said composite lamainated structure is all the polyimide film that thickness is 2mil.
14. according to each described polyimide composite film that is used for printed circuit board (PCB) in the claim 1 to 13, it is characterized in that: comprise pure glue-line, said pure glue-line is formed on the bottom surface of said composite lamainated structure, the thickness of said pure glue-line is 10 to 40 μ m.
15. according to each described polyimide composite film that is used for printed circuit board (PCB) in the claim 1 to 13; It is characterized in that: comprise pure glue-line and ink lay; Said composite lamainated structure is folded between said pure glue-line and the ink lay; The thickness of said ink lay is 13 to 15 μ m, and the thickness of said pure glue-line is 10 to 40 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203156545U CN202242153U (en) | 2011-08-26 | 2011-08-26 | Polyimide composite film for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203156545U CN202242153U (en) | 2011-08-26 | 2011-08-26 | Polyimide composite film for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202242153U true CN202242153U (en) | 2012-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203156545U Withdrawn - After Issue CN202242153U (en) | 2011-08-26 | 2011-08-26 | Polyimide composite film for printed circuit board |
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| CN (1) | CN202242153U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950856A (en) * | 2011-08-26 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Polyimide composite film for printed circuit boards |
| CN106584988A (en) * | 2016-12-16 | 2017-04-26 | 湖北奥马电子科技有限公司 | Composite metal-clad plate for flexible printed circuit board and preparation method of composite cover film |
| CN106808698A (en) * | 2016-12-27 | 2017-06-09 | 广东正业科技股份有限公司 | A kind of preparation technology of multilayer film |
-
2011
- 2011-08-26 CN CN2011203156545U patent/CN202242153U/en not_active Withdrawn - After Issue
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950856A (en) * | 2011-08-26 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Polyimide composite film for printed circuit boards |
| CN102950856B (en) * | 2011-08-26 | 2014-10-29 | 昆山雅森电子材料科技有限公司 | Polyimide composite film for printed circuit boards |
| CN106584988A (en) * | 2016-12-16 | 2017-04-26 | 湖北奥马电子科技有限公司 | Composite metal-clad plate for flexible printed circuit board and preparation method of composite cover film |
| CN106584988B (en) * | 2016-12-16 | 2019-04-16 | 湖北奥马电子科技有限公司 | The compound production method for covering metal plate or compound cover film used for flexible printed circuit board |
| CN106808698A (en) * | 2016-12-27 | 2017-06-09 | 广东正业科技股份有限公司 | A kind of preparation technology of multilayer film |
| CN106808698B (en) * | 2016-12-27 | 2019-11-19 | 广东正业科技股份有限公司 | A kind of preparation process of multilayer film |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120530 Effective date of abandoning: 20141029 |
|
| RGAV | Abandon patent right to avoid regrant |