CN201657483U - Reinforcement plate for printed circuit board - Google Patents
Reinforcement plate for printed circuit board Download PDFInfo
- Publication number
- CN201657483U CN201657483U CN2010201049116U CN201020104911U CN201657483U CN 201657483 U CN201657483 U CN 201657483U CN 2010201049116 U CN2010201049116 U CN 2010201049116U CN 201020104911 U CN201020104911 U CN 201020104911U CN 201657483 U CN201657483 U CN 201657483U
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- CN
- China
- Prior art keywords
- circuit board
- composite film
- printed circuit
- polyimide
- polyimide composite
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a reinforcement plate for a printed circuit board, which comprises a printing ink layer, a polyimide composite film and an adhering layer used for adhering the polyimide composite film to the printed circuit board. The polyimide composite film is fixedly clamped between the printing ink layer and the adhering layer; and the polyimide composite film consists of a plurality of layers of polyimide films and adhesive for adhering adjacent polyimide films, wherein the printing ink layer with certain thickness can reduce the tilting height of the reinforcement plate attached onto the circuit board, simultaneously is favorable for protecting circuit patterns of consumable electronic products. Besides, the printing ink layer of the reinforcement plate can contain color reagents, and can lead the circuit patterns to achieve better shading effect. Simultaneously, the printing ink layer can contain radiation powders, and thereby the reinforcement plate is capable of increasing radiation performance.
Description
Technical field
The utility model relates to a kind of stiffening plate that is used for printed circuit board (PCB), especially a kind ofly is difficult for warpage and has the stiffening plate that covers the circuit effect.
Background technology
The polyimide resin thermal stability is high and have excellent insulating properties, mechanical strength, reach resistance to chemical corrosion, is usually used in multiple electronics rapidoprint.As be used for the insulating barrier of flexible printed wiring board (Flexible Printed Circuit), perhaps be used for the electronics spare part further, for example the reinforcement purposes of printed circuit board (PCB).
Polyimide film has been widely used in electronic material, wherein, the polyimides stiffening plate that printed circuit board (PCB) is used, generally can divide into the polyimides stiffening plate of individual layer slab or combined type, and the stiffening plate of combined type, the polyimides plate structure of being announced as TaiWan, China patent I257898, it is the combined type polyimide plate that forms different-thickness with the thermmohardening solid of the polyimide plate of 2 Mills (mil) and different-thickness, yet, the problem that polyimide composite film meets with on using is to be subject to the thickness of polyimide film cost and composite membrane, can't cover the circuit layout pattern and is easy to be plagiarized by the same trade.In addition, composite membrane is by the combination of polyimide film and adhesion agent layer and get, but the composite membrane that its two thermal expansion coefficient difference often causes being used for reinforcement is pasting to flexible circuit board the phenomenon of generation warpage.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of stiffening plate that is used for printed circuit board (PCB), and this stiffening plate has the advantage of covering the circuit effect and the reduction depth of camber being arranged.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of stiffening plate that is used for printed circuit board (PCB), by ink lay, polyimide composite film be used for the adhesion coating that described polyimide composite film adheres on the printed circuit board (PCB) is constituted, described polyimide composite film geometrical clamp places between described ink lay and the described adhesion coating, described polyimide composite film is made of the bond adhesion agent layer of adjacent polyimide film of several layers polyimide film and being used to, wherein, the gross thickness Z of described polyimide composite film meets the relation of following formula (I):
mX+nY＝Z (I)
In the formula, m represents the described polyimide film number of plies; N represents the described adhesion agent layer number of plies; X represents the thickness of described polyimide film, and X is 1 to 2mil, is preferably 1.5 to 2mil; And Y represents the thickness of described adhesion agent layer, and the Y value is decided according to specific Z value.Wherein, the ink lay of specific thicknesses can reduce composite membrane and paste depth of camber to the circuit board, helps protecting the circuit pattern of consumption electronic products simultaneously.
Further technical scheme of the present utility model is:
The thickness of described ink lay is 13～15 μ m.
The thickness of described adhesion coating is 10～40 μ m.
Described ink lay is to contain the ink lay that having of epoxy resin and developer covered the circuit board effect.
Described ink lay is for being loose by epoxy resin, developer and hot powder constitutes has the ink lay that covers circuit board and radiating effect.
The beneficial effects of the utility model are: the ink lay that the utility model is used for the stiffening plate specific thicknesses of printed circuit board (PCB) can reduce composite membrane and paste depth of camber to the circuit board, helps the protective circuit pattern simultaneously.In addition, the ink lay of the utility model stiffening plate can comprise developer, can make the circuit pattern screening effect better, and ink lay can also comprise the heat radiation powder simultaneously, can improve heat dispersion like this.
Description of drawings
Fig. 1 is the stiffening plate profile that is used for printed circuit board (PCB) described in the utility model.
Embodiment
Below by particular specific embodiment execution mode of the present utility model is described, those of ordinary skills can understand advantage of the present utility model and effect easily by the content that this specification disclosed.The utility model also can be implemented by other different mode, promptly under not departing from the category that the utility model disclosed, can carry out different modifications and change.
Embodiment: a kind of stiffening plate 1 that is used for printed circuit board (PCB), as shown in Figure 1, by ink lay 10, polyimide composite film be used for the adhesion coating 13 that described polyimide composite film adheres on the printed circuit board (PCB) is constituted, described polyimide composite film geometrical clamp places between described ink lay and the described adhesion coating, described polyimide composite film by several layers polyimide film 11 and the adhesion agent layer 12 of the adjacent polyimide film that is used to bond constitute, wherein, the gross thickness Z of described polyimide composite film meets the relation of following formula (I):
mX+nY＝Z (I)
In the formula, m represents the described polyimide film number of plies; N represents the described adhesion agent layer number of plies; X represents the thickness of described polyimide film, and X is 1 to 2mil, is preferably 1.5 to 2mil; And Y represents the thickness of described adhesion agent layer, and the Y value is decided according to specific Z value.During concrete enforcement, when Z is 3, then m be 2 and X be 1mil; When Z is 4, then m is 2 or 3; When Z is 5, then m is 2 or 3; When Z is 6, then m is 3 or 4; When Z is 7, then m is 3 or 4; When Z is 8, then m is selected from one of 3,4 and 5; When Z is 9, then m is 4 or 5.Wherein, the ink lay of specific thicknesses can reduce stiffening plate and paste depth of camber to the circuit board, helps protecting the circuit pattern of consumption electronic products simultaneously.
The thickness of described ink lay is 13～15 μ m.
The thickness of described adhesion coating is 10～40 μ m.
Described ink lay comprises epoxy resin and developer.
Described developer is a kind of in white developer and the black developer.
Described white developer is to comprise at least a in the Chinese white of titanium dioxide, by weight percentage, described white developer accounts for 60～95% of described epoxy resin solid content, even if white developer content is up to 95% of resin solid content, but still can make ink lay be unlikely to come off 5～50 microns the time THICKNESS CONTROL of ink lay, wherein white developer with can make stiffening plate have excellent reflectivity after epoxy resin mixes.
Described black developer is at least a in black pigment, carbon dust and the carbon nanotube, by weight percentage, described black developer accounts for 3～15% of described epoxy resin solid content, and preferably 4～8%, wherein black developer circuit pattern screening effect is better.
In this specification, the toner that pigment is contained dyestuff or is commonly called as, and pigment can be obtained by the organic or inorganic material.
Described ink lay is made of epoxy resin, developer and heat radiation powder, can improve heat dispersion like this.
Described heat radiation powder is at least a in carborundum, boron nitride, aluminium oxide and the aluminium nitride.
Described solid and sticky material typically use the epoxide resin type resin.
Described polyimide film and solid kind are also without particular limitation, are preferably not halogen-containing polyimide material of use and solid, and better being to use has from stickiness and not halogen-containing solid.
The stiffening plate that the utility model is used for printed circuit board (PCB) can make by following method: at first, at polyimide film surface coated one deck thermmohardening solid, after placing the baking oven heat drying, with hot roller and another polyimide film pressing, by that analogy, to the thickness of required polyimide composite film; Then, slaking 1 hour under 180 ℃ condition; At last, apply ink lay and adhesion coating at these polyimide composite film two lateral surfaces respectively, be formed for the stiffening plate sample of printed circuit board (PCB).
Prepare the utility model stiffening plate according to the data in the following table 1, wherein, the composition of ink lay comprises epoxy resin, account for the epoxy resin mass percent is 6% carbon dust.Other prepares the reference examples sample, and the stiffening plate of this reference examples sample does not comprise ink lay, and all the other are the same with embodiment.The pure glue (trade name D3430) that the sticky material of the stiffening plate of embodiment and reference examples sample all is to use Sony Corporation to be produced.Then, stiffening plate is cut into the size of 25cm * 25cm, and on the 3-Layer double-surface flexible copper foil substrate that is pressure bonded to 74.5 ± 1 μ m under 180 ℃ the condition, carry out slaking with 160 ℃ condition again, again each embodiment sample and control sample are placed on the smooth flat, leave standstill 20 minutes after, measure the depth of camber of four corners, carry out the flatness test, the result is embedded in table 1.
Table 1
Prepare the utility model stiffening plate according to the data in the following table 2, wherein, the composition of ink lay comprises epoxy resin, account for the epoxy resin mass percent is 60% titanium dioxide powder.Other prepares the reference examples sample, and the stiffening plate of this reference examples sample does not comprise ink lay, and all the other are the same with embodiment.The pure glue (trade name D3430) that the sticky material of the stiffening plate of embodiment and reference examples sample all is to use Sony Corporation to be produced.Then, stiffening plate is cut into the size of 25cm * 25cm, and on the 3-Layer double-surface flexible copper foil substrate that is pressure bonded to 74.5 ± 1 μ m under 180 ℃ the condition, carry out slaking with 160 ℃ condition again, again each embodiment sample and control sample are placed on the smooth flat, leave standstill 20 minutes after, measure the depth of camber of four corners, carry out the flatness test, the result is embedded in table 2.
Table 2
Shown in table 1 and table 2 result, under the identical condition of gross thickness, compared to the stiffening plate sample that does not paste ink lay, the depth of camber of the utility model stiffening plate is less relatively, thereby have preferable flatness, and along with gross thickness increases, flatness is more obvious.
Above-mentioned specification and embodiment only are exemplary illustration principle of the present utility model and effect thereof, are not to be to restriction of the present utility model.Any creation that falls in the utility model claim scope all belongs to the scope that the utility model is protected.
Claims (3)
1. stiffening plate that is used for printed circuit board (PCB), it is characterized in that: by ink lay, polyimide composite film be used for the adhesion coating that described polyimide composite film adheres on the printed circuit board (PCB) is constituted, described polyimide composite film geometrical clamp places between described ink lay and the described adhesion coating, described polyimide composite film is made of the bond adhesion agent layer of adjacent polyimide film of several layers polyimide film and being used to, wherein, the gross thickness Z of described polyimide composite film meets the relation of following formula (I):
mX+nY＝Z (I)
In the formula, m represents the described polyimide film number of plies; N represents the described adhesion agent layer number of plies; X represents the thickness of described polyimide film, and X is 1 to 2mil; And Y represents the thickness of described adhesion agent layer, and the Y value is decided according to specific Z value.
2. the stiffening plate that is used for printed circuit board (PCB) according to claim 1 is characterized in that: the thickness of described ink lay is 13～15 μ m.
3. the stiffening plate that is used for printed circuit board (PCB) according to claim 1 is characterized in that: the thickness of described adhesion coating is 10～40 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201049116U CN201657483U (en) | 2010-01-28 | 2010-01-28 | Reinforcement plate for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201049116U CN201657483U (en) | 2010-01-28 | 2010-01-28 | Reinforcement plate for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201657483U true CN201657483U (en) | 2010-11-24 |
Family
ID=43122710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201049116U Expired - Lifetime CN201657483U (en) | 2010-01-28 | 2010-01-28 | Reinforcement plate for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201657483U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143646A (en) * | 2010-01-28 | 2011-08-03 | 昆山雅森电子材料科技有限公司 | Stiffening plate for printed circuit board |
| CN102300409A (en) * | 2011-07-08 | 2011-12-28 | 深圳市精诚达电路有限公司 | Method for bonding between flexible circuit board base material and reinforcing material and product manufactured by method |
-
2010
- 2010-01-28 CN CN2010201049116U patent/CN201657483U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143646A (en) * | 2010-01-28 | 2011-08-03 | 昆山雅森电子材料科技有限公司 | Stiffening plate for printed circuit board |
| CN102143646B (en) * | 2010-01-28 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Stiffening plate for printed circuit board |
| CN102300409A (en) * | 2011-07-08 | 2011-12-28 | 深圳市精诚达电路有限公司 | Method for bonding between flexible circuit board base material and reinforcing material and product manufactured by method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20101124 Effective date of abandoning: 20100128 |
|
| RGAV | Abandon patent right to avoid regrant |