CN202231055U - 发光二极管支架和发光二极管 - Google Patents
发光二极管支架和发光二极管 Download PDFInfo
- Publication number
- CN202231055U CN202231055U CN2011203278788U CN201120327878U CN202231055U CN 202231055 U CN202231055 U CN 202231055U CN 2011203278788 U CN2011203278788 U CN 2011203278788U CN 201120327878 U CN201120327878 U CN 201120327878U CN 202231055 U CN202231055 U CN 202231055U
- Authority
- CN
- China
- Prior art keywords
- substrate
- support
- zone
- led
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011203278788U CN202231055U (zh) | 2011-09-02 | 2011-09-02 | 发光二极管支架和发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011203278788U CN202231055U (zh) | 2011-09-02 | 2011-09-02 | 发光二极管支架和发光二极管 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202231055U true CN202231055U (zh) | 2012-05-23 |
Family
ID=46081633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011203278788U Expired - Lifetime CN202231055U (zh) | 2011-09-02 | 2011-09-02 | 发光二极管支架和发光二极管 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202231055U (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103427000A (zh) * | 2013-07-24 | 2013-12-04 | 海宁市智慧光电有限公司 | 一种led灯支架 |
CN103441204A (zh) * | 2013-07-24 | 2013-12-11 | 海宁市智慧光电有限公司 | 一种led灯支架及该支架的成型设备 |
CN103855146A (zh) * | 2014-01-13 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | Led灯丝及照明器具 |
CN104051592A (zh) * | 2013-03-15 | 2014-09-17 | 深圳市斯迈得光电子有限公司 | 一种高可靠性的led支架 |
-
2011
- 2011-09-02 CN CN2011203278788U patent/CN202231055U/zh not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104051592A (zh) * | 2013-03-15 | 2014-09-17 | 深圳市斯迈得光电子有限公司 | 一种高可靠性的led支架 |
CN103427000A (zh) * | 2013-07-24 | 2013-12-04 | 海宁市智慧光电有限公司 | 一种led灯支架 |
CN103441204A (zh) * | 2013-07-24 | 2013-12-11 | 海宁市智慧光电有限公司 | 一种led灯支架及该支架的成型设备 |
CN103855146A (zh) * | 2014-01-13 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | Led灯丝及照明器具 |
WO2015103812A1 (zh) * | 2014-01-13 | 2015-07-16 | 深圳市瑞丰光电子股份有限公司 | Led灯丝及照明器具 |
CN103855146B (zh) * | 2014-01-13 | 2017-01-25 | 深圳市瑞丰光电子股份有限公司 | Led灯丝及照明器具 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHENZHEN LT PHOTOELECTRICITY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN REFOND OPTOELECTRONICS CO., LTD. Effective date: 20140508 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518055 SHENZHEN, GUANGDONG PROVINCE TO: 518000 SHENZHEN, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20140508 Address after: 518000, Guangdong, Shenzhen, Baoan District Xixiang street, hang Chau Hengfeng Industrial City, B15 plant, five or six floor Patentee after: Shenzhen Lingtao Photoelectric Technology Co., Ltd. Address before: Shenzhen Nanshan District City, Guangdong province 518055 White Pine Road Baiwang letter Industrial Park two District Sixth. Patentee before: Shenzhen Refond Optoelectronics Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20120523 |
|
CX01 | Expiry of patent term |