CN202003978U - Heating component heat-conducting base structure with diamond heat-conducting thick film - Google Patents
Heating component heat-conducting base structure with diamond heat-conducting thick film Download PDFInfo
- Publication number
- CN202003978U CN202003978U CN201120020569.6U CN201120020569U CN202003978U CN 202003978 U CN202003978 U CN 202003978U CN 201120020569 U CN201120020569 U CN 201120020569U CN 202003978 U CN202003978 U CN 202003978U
- Authority
- CN
- China
- Prior art keywords
- heat
- thick film
- conducting base
- diamond
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The utility model relates to a heating component heat-conducting base structure with a diamond heat-conducting thick film, which comprises a heat-conducting base, wherein a diamond heat-conducting thick film with thickness of 40-800micron is pasted on the plane of the heat-conducting base, and a heating component is arranged at the upper part of the diamond heat-conducting thick film. A circuit insulating layer covering the upper surface of the heat-conducting base is arranged at the region keeping off the upper surface of the diamond heat-conducting thick film. A circuit can be arranged at the upper surface of the circuit insulating layer and is powered by connecting the electrodes of the heating component through a metal lead. According to the heat-conducting base structure of the light-emitting diode, heat can be transferred through the diamond heat-conducting thick film so as to maintain the normal working temperature of the heating component.
Description
Technical field
The utility model relates to the field of heat conduction application, is specifically related to a kind of heat conducting base structure of heat generating component of tool diamond heat conduction thick film, belongs to International Classification of Patents H01L technical field.
Background technology
Along with improving constantly of various electronic building brick power, the hot type of electronic building brick high-volume also increases relatively, and forms serious problem.Make a general survey of present heat-conducting mode, mode one: electronic building brick is sticked in polymeric dielectric layer.Mode two: electronic building brick is sticked in ceramic insulating layer, as using the mode of aluminium nitride ceramics substrate.Mode three: electronic building brick is linked heat conduction by heat-conducting cream and cooling base.Above-mentioned several occupation mode still exists following shortcoming: polymeric dielectric layer, ceramic substrate insulating barrier or heat-conducting cream are all high thermal resistance structural material, the heating conduction of electronic building brick is blocked, the working temperature of electronic building brick rises, and causes the instability of equipment, even damage equipment.
Summary of the invention
The purpose of this utility model is to provide a kind of heat conducting base structure of tool diamond heat conduction thick film heat generating component.
The technical solution of the utility model is as follows.
A kind of heat generating component heat conducting base structure of tool diamond heat conduction thick film, it comprises a heat conducting base; The diamond heat conduction thick film that above thickness is the 40-800 micron, the bottom of this diamond heat conduction thick film fits on the plane of described heat conducting base; On diamond heat conduction thick film, be fitted with the heating electronic building brick; The circuit insulating barrier that is equipped with more than one deck is arranged on surface at heat conducting base; Described circuit insulating barrier has been avoided the zone that diamond heat conduction thick film is pasted, the upper surface that covers heat conducting base on heat conducting base.
Described heat conducting base, its raw material are selected from a kind of in silicon, pottery, graphite or the metal.
Described heating electronic building brick, the light-emitting diode of forming by p type and n N-type semiconductor N.
Described diamond heat conduction thick film also can be taked to be bumped on described heat conducting base.
The heat conducting base structure of the utility model light-emitting diode can see through diamond heat conduction thick film and conduct heat rapidly, keeping the normal working temperature of heat generating component, thereby has solved a difficult problem of the prior art.
Description of drawings
Fig. 1 is the sectional structure schematic diagram of a kind of execution mode of the utility model;
Fig. 2 is the sectional structure schematic diagram of the another kind of execution mode of the utility model.
Among the figure: 1. heat conducting base, 2. diamond heat conduction thick film, 3. light-emitting diode, 4. circuit insulating barrier, 5. circuit, 6. lead, 7. graphite linings.
Embodiment
Referring to Fig. 1, structure of the present utility model comprises: the heat conducting base 1 that with copper is structure, applying a slice thickness is 300 microns diamond heat conduction thick film 2 on the plane of heat conducting base 1, diamond heat conduction thick film 2 tops are fitted with two light-emitting diodes 3, in the zone of avoiding diamond heat conduction thick film 2 upper surfaces, make the circuit insulating barrier 4 that one deck covers the heat conducting base upper surface, these circuit insulating barrier 4 upper faces row circuits 5, this circuit 5 connects semi-conductive each electrode power supply with plain conductor 6.Therefore, the heat conducting base structure of light-emitting diode 3 can see through diamond heat conduction thick film 2 conduction heat rapidly, to keep the normal working temperature of light-emitting diode 3.
Referring to Fig. 2, structure of the present utility model comprises: be the heat conducting base 1 of complex structure body with graphite and copper, at the upper surface of graphite linings 7, making a slice thickness is 60 microns diamond heat conduction thick film 2, two light-emitting diode 3 structures of diamond heat conduction thick film 2 tops applying; In the zone of avoiding diamond heat conduction thick film 2 upper surfaces, make the circuit insulating barrier 4 that one deck covers the heat conducting base upper surface, these circuit insulating barrier 4 upper faces row circuits 5, this circuit 5 connects semi-conductive each electrode power supply with plain conductor 6.Therefore, the heat conducting base structure of light-emitting diode 3 can see through diamond heat conduction thick film 2 conduction heat rapidly, to keep the normal working temperature of light-emitting diode 3.
Claims (4)
1. the heat generating component heat conducting base structure of a tool diamond heat conduction thick film, it is characterized in that: it comprises a heat conducting base; The diamond heat conduction thick film that above thickness is the 40-800 micron, the bottom of this diamond heat conduction thick film fits on the plane of described heat conducting base; On diamond heat conduction thick film, be fitted with the heating electronic building brick; The circuit insulating barrier that is equipped with more than one deck is arranged on surface at heat conducting base; Described circuit insulating barrier has been avoided the zone that diamond heat conduction thick film is pasted, the upper surface that covers heat conducting base on heat conducting base.
2. the heat generating component heat conducting base structure of tool diamond heat conduction thick film according to claim 1 is characterized in that: described heat conducting base, its raw material are selected from a kind of in silicon, pottery, graphite or the metal.
3. the heat generating component heat conducting base structure of tool diamond heat conduction thick film according to claim 1 is characterized in that: described heating electronic building brick, the light-emitting diode of being made up of p type and n N-type semiconductor N.
4. the heat generating component heat conducting base structure of tool diamond heat conduction thick film according to claim 1 is characterized in that: described diamond heat conduction thick film is bumped on described heat conducting base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120020569.6U CN202003978U (en) | 2011-01-24 | 2011-01-24 | Heating component heat-conducting base structure with diamond heat-conducting thick film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120020569.6U CN202003978U (en) | 2011-01-24 | 2011-01-24 | Heating component heat-conducting base structure with diamond heat-conducting thick film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202003978U true CN202003978U (en) | 2011-10-05 |
Family
ID=44706705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120020569.6U Expired - Fee Related CN202003978U (en) | 2011-01-24 | 2011-01-24 | Heating component heat-conducting base structure with diamond heat-conducting thick film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202003978U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103078052A (en) * | 2013-01-16 | 2013-05-01 | 东莞市中实创半导体照明有限公司 | Nano-diamond coating package substrate |
| GB2529512A (en) * | 2014-06-18 | 2016-02-24 | Element Six Technologies Ltd | An electronic device component with an integral diamond heat spreader |
| WO2019000285A1 (en) * | 2017-06-28 | 2019-01-03 | 陈鸿文 | Heat conductive adhesive film |
-
2011
- 2011-01-24 CN CN201120020569.6U patent/CN202003978U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103078052A (en) * | 2013-01-16 | 2013-05-01 | 东莞市中实创半导体照明有限公司 | Nano-diamond coating package substrate |
| GB2529512A (en) * | 2014-06-18 | 2016-02-24 | Element Six Technologies Ltd | An electronic device component with an integral diamond heat spreader |
| GB2529512B (en) * | 2014-06-18 | 2016-09-21 | Element Six Tech Ltd | An electronic device component with an integral diamond heat spreader |
| US10366936B2 (en) | 2014-06-18 | 2019-07-30 | Element Six Technologies Limited | Electronic device component with an integral diamond heat spreader |
| WO2019000285A1 (en) * | 2017-06-28 | 2019-01-03 | 陈鸿文 | Heat conductive adhesive film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111005 Termination date: 20150124 |
|
| EXPY | Termination of patent right or utility model |