CN201830550U - Circuit board with novel welding plate structure - Google Patents
Circuit board with novel welding plate structure Download PDFInfo
- Publication number
- CN201830550U CN201830550U CN2010205884896U CN201020588489U CN201830550U CN 201830550 U CN201830550 U CN 201830550U CN 2010205884896 U CN2010205884896 U CN 2010205884896U CN 201020588489 U CN201020588489 U CN 201020588489U CN 201830550 U CN201830550 U CN 201830550U
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- circuit board
- welding
- welding plate
- pad
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Abstract
The utility model relates to a circuit board with a novel welding plate structure, comprising a circuit board base material; one surface of the base material is provided with a welding plate according to the layout requirement of electronic components; positioning holes penetrating through the welding plate are arranged on the base material at the position of the welding plate; circular welding-blocking isolation strips are arranged at the outer periphery of the positioning holes; the plurality of layers of circular welding-blocking isolation strips are arranged in the form of concentric circles taking the positioning hole as the center of the circle; the circular welding-blocking isolation strips comprise circular rings surrounding the periphery of the positioning hole; the circular rings are covered with welding-blocking oil copper foil; and the exposed base material clamped between the periphery of the welding-blocking isolation strip and the welding plate forms circular grooves. In the welding plate structure provided by the utility model, the impurities such as solder paste, rosin and like can be prevented from falling into the positioning hole in the technical process, but fall on an annular belt of the groove; and compared with the circuit board with the traditional welding plate structure, the circuit board with the novel welding plate structure can avoid bad phenomena such as poor soldering, false soldering, jack-up components, and the like appeared on the components, and improve quality and performance stabilities of circuit board products.
Description
Technical field
The utility model relates to board pads structure-design technique field, is specifically related to a kind of circuit board of novel pad structure.
Background technology
Electronic technology development rapidly, in the electronic technology industry, the design of circuit board basic composition unit---pad has tremendous influence to the electronic product quality, whether the pad quality is directly connected to entire circuit can operate as normal, affect circuit stability and reliability.At present, the electronic technology product is for adapting to social demand, the forward miniaturization, microminiaturized trend development, this is to the structure of circuit board, demands for higher performance, particularly require the circuit board volume more and more littler, even need paste element at the circuit board tow sides, the elements on circuit board location hole faces the situation of another element of reverse side and can't avoid, and this just exists serious problems: the tin cream on the reverse side component pads, foreign material such as rosin drain to another side by location hole easily when crossing Reflow Soldering or wave-soldering, thereby cause another side element generation rosin joint, dry joint, emit phenomenons such as tin sweat(ing), sometimes in addition can jack-up element cause damage of product.
The utility model content
Technical problem to be solved in the utility model provides a kind of circuit board that can avoid bad phenomenon such as pad rosin joint, dry joint, jack-up element and can effectively improve the novel pad structure of circuit board stability.
For effectively solving the problem of above-mentioned technology, the technical scheme that the utility model is realized is:
A kind of circuit board of novel pad structure comprises board substrate, is provided with pad in the one side of base material according to the layout needs of electronic devices and components, has the location hole that runs through pad on the base material at pad place, and described location hole periphery is provided with annular welding resistance isolation strip.
Described welding resistance isolation strip comprises the annulus of circle around the location hole periphery, is stamped welding resistance oil Copper Foil on the annulus, and the bare substrate between welding resistance isolation strip periphery and pad folder forms annular groove.
In order to play the multiple protective effect; guarantee that further the tin cream on the pad, rosin and so on foreign material at first all can overflow earlier in annular welding resistance isolation strip in the course of processing; can not go to component side by via hole, described annular welding resistance isolation strip is for being the multilayer of the concentric circles form in the center of circle with the location hole.
The beneficial effects of the utility model are: 1, the utility model location hole periphery is provided with annular welding resistance isolation strip, bare substrate between welding resistance isolation strip periphery and pad folder forms annular groove, can prevent effectively that the foreign material such as tin cream, rosin in the technical process from falling in the location hole, and foreign material are fallen on the groove endless belt, this compares with the circuit board of traditional pad structure, can avoid the generation of bad phenomenon such as element rosin joint, dry joint, jack-up element, improve the quality and the stability of circuit board product.2, the utility model can also reach the action effect that element is played multiple protective by annular welding resistance isolation strip being made with the location hole multilayer of the concentric circles form that is the center of circle, further guarantees the quality and the stability of product.
Description of drawings
Fig. 1 is annular welding resistance isolation strip the utility model structural representation when being individual layer;
Fig. 2 is annular welding resistance isolation strip the utility model structural representation when being multilayer.
Embodiment
For the ease of those skilled in the art's understanding, the utility model structural principle is further described in detail below in conjunction with specific embodiment and accompanying drawing:
As shown in Figure 1, a kind of circuit board of novel pad structure comprises board substrate 1, is provided with pad 2 in the one side of base material according to the layout needs of electronic devices and components, have the location hole 11 that runs through pad on the base material at pad place, the location hole periphery is provided with annular welding resistance isolation strip 12.The welding resistance isolation strip comprises the annulus of circle around the location hole periphery, is stamped welding resistance oil Copper Foil on the annulus, and the bare substrate between welding resistance isolation strip periphery and pad folder forms annular groove.The utility model location hole periphery is provided with annular welding resistance isolation strip, bare substrate between welding resistance isolation strip periphery and pad folder forms annular groove, can prevent effectively that the foreign material such as tin cream, rosin in the technical process from falling in the location hole, and foreign material are fallen on the groove endless belt, this compares with the circuit board of traditional pad structure, can avoid the generation of bad phenomenon such as element rosin joint, dry joint, jack-up element, improve the quality and the stability of circuit board product.Because annulus is than higher, and annular groove is relatively low, therefore form the groove that can take in foreign material between annulus and location hole inner edge, this makes that the tin cream on the pad, rosin and so on foreign material at first all can overflow earlier in the groove endless belt in the course of processing, can not go to component side by via hole.By such improvement, can prevent effectively that the foreign material such as tin cream, rosin in Reflow Soldering or the wave-soldering technical process from falling in the location hole, and foreign material are fallen on the groove endless belt, compare with the circuit board of traditional pad structure, can avoid the generation of bad phenomenon such as element rosin joint, dry joint, jack-up element, improve the quality and the stability of circuit board product.
As shown in Figure 2, a kind of circuit board of novel pad structure, comprise board substrate 1, be provided with pad 2 in the one side of base material according to the layout needs of electronic devices and components, on the base material at pad place, have the location hole 11 that runs through pad, the location hole periphery is provided with annular welding resistance isolation strip 12, and annular welding resistance isolation strip is for being the double-deck annular welding resistance isolation strip of the concentric circles form in the center of circle with the location hole.Each layer welding resistance isolation strip comprises the annulus of circle around the location hole periphery, is stamped welding resistance oil Copper Foil on the annulus, and the bare substrate in internal layer welding resistance isolation strip periphery and the outer welding resistance isolation strip between week, outer welding resistance isolation strip periphery and pad folder forms annular groove.
The difference of present embodiment and embodiment 1 is that annular welding resistance isolation strip is for double-deck; this uses when enough big or actual design needs at pad; its principle is identical with embodiment; but can play the multiple protective effect; can guarantee further that the tin cream on the pad, rosin and so on foreign material at first all can overflow earlier in the groove endless belt in the course of processing; can not go to component side, thereby the quality of circuit board and stability are further ensured by via hole.In the actual production, when enough big or actual design needed at pad, annular welding resistance isolation strip can also be more than three layers or three layers, and its principle is same as described above, does not repeat them here.
The foregoing description is a preferred implementation of the present utility model, and in addition, the utility model can also have other implementations.That is to say that under the prerequisite that does not break away from the utility model design, any conspicuous replacement also should fall within the protection range of the present utility model.
Claims (3)
1. the circuit board of a novel pad structure, comprise board substrate (1), be provided with pad (2) in the one side of base material according to the layout needs of electronic devices and components, have the location hole (11) that runs through pad on the base material at pad place, it is characterized in that: described location hole periphery is provided with annular welding resistance isolation strip (12).
2. the circuit board of novel pad structure according to claim 1 is characterized in that: described annular welding resistance isolation strip (12) is for being the multilayer of the concentric circles form in the center of circle with the location hole.
3. the circuit board of novel pad structure according to claim 1 and 2, it is characterized in that: described welding resistance isolation strip comprises the annulus of circle around the location hole periphery, be stamped welding resistance oil Copper Foil on the annulus, the bare substrate between welding resistance isolation strip periphery and pad folder forms annular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205884896U CN201830550U (en) | 2010-10-29 | 2010-10-29 | Circuit board with novel welding plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205884896U CN201830550U (en) | 2010-10-29 | 2010-10-29 | Circuit board with novel welding plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201830550U true CN201830550U (en) | 2011-05-11 |
Family
ID=43969060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205884896U Expired - Fee Related CN201830550U (en) | 2010-10-29 | 2010-10-29 | Circuit board with novel welding plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201830550U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105407633A (en) * | 2015-12-29 | 2016-03-16 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN105992461A (en) * | 2016-05-27 | 2016-10-05 | 努比亚技术有限公司 | Fixing structure for components and PCB and mobile terminal |
| CN106455313A (en) * | 2016-10-10 | 2017-02-22 | 深圳市证通电子股份有限公司 | Inside welding method for PCBs |
| CN106604526A (en) * | 2016-12-09 | 2017-04-26 | 浙江大华技术股份有限公司 | Heat-radiation pad, design method thereof and printed circuit board (PCB) |
| CN108811317A (en) * | 2018-07-03 | 2018-11-13 | 北京华悦龙驰科技有限公司 | A kind of via pad structure, a kind of circuit board connection type and a kind of circuit board |
| CN112533357A (en) * | 2020-11-17 | 2021-03-19 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board |
-
2010
- 2010-10-29 CN CN2010205884896U patent/CN201830550U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105407633A (en) * | 2015-12-29 | 2016-03-16 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN105407633B (en) * | 2015-12-29 | 2018-03-02 | 广东欧珀移动通信有限公司 | Flexible PCB and mobile terminal |
| CN105992461A (en) * | 2016-05-27 | 2016-10-05 | 努比亚技术有限公司 | Fixing structure for components and PCB and mobile terminal |
| CN105992461B (en) * | 2016-05-27 | 2019-08-16 | 努比亚技术有限公司 | A kind of fixed structure and mobile terminal of component and pcb board |
| CN106455313A (en) * | 2016-10-10 | 2017-02-22 | 深圳市证通电子股份有限公司 | Inside welding method for PCBs |
| CN106455313B (en) * | 2016-10-10 | 2020-02-14 | 深圳市证通电子股份有限公司 | PCB (printed circuit board) inner welding method |
| CN106604526A (en) * | 2016-12-09 | 2017-04-26 | 浙江大华技术股份有限公司 | Heat-radiation pad, design method thereof and printed circuit board (PCB) |
| CN108811317A (en) * | 2018-07-03 | 2018-11-13 | 北京华悦龙驰科技有限公司 | A kind of via pad structure, a kind of circuit board connection type and a kind of circuit board |
| CN112533357A (en) * | 2020-11-17 | 2021-03-19 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110511 Termination date: 20191029 |