CN202262070U - Printed circuit board and electronic terminal - Google Patents
Printed circuit board and electronic terminal Download PDFInfo
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- CN202262070U CN202262070U CN2011203306646U CN201120330664U CN202262070U CN 202262070 U CN202262070 U CN 202262070U CN 2011203306646 U CN2011203306646 U CN 2011203306646U CN 201120330664 U CN201120330664 U CN 201120330664U CN 202262070 U CN202262070 U CN 202262070U
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Abstract
The utility model provides a printed circuit board. A welding plate for welding with a ball grid array package is arranged on the printed circuit board. The ball grid array package is provided with a welded ball corresponding to the welding plate. The printed circuit board is characterized in that the diameter of the welding plate is larger than 80% of the diameter of the welded ball and smaller than 90% of the diameter of the welded ball. The utility model further provides an electronic terminal including the printed circuit board. By means of the printed circuit board and the electronic terminal, a welding success rate of the ball grid array (BGA) package on the printed circuit board (PCB) is increased, circuit stable performance and reliability of the electronic terminal are improved, and service life of the electronic terminal is prolonged.
Description
Technical field
The utility model relates to the electronic product field, in particular to a kind of printed circuit board (PCB) and electric terminal, relates in particular to the printed circuit board (PCB) that is connected with the soldered ball of BGA Package through pad, and comprises the electric terminal of this printed circuit board (PCB).
Background technology
The I/O terminal of BGA (Ball Grid Array BGA) encapsulation; With circle or column solder joint by array format be distributed in encapsulation below, increase though its advantage is the I/O terminal, pin-pitch does not reduce; Increase to some extent on the contrary, improved the rate of finished products of assembling.In the operation of reality, carry out according to IPC (Industrial Personal Computer industry PC)-7095Design and Assembly Process Implementation for BGAs (design of BGA and the enforcement of assembling process) specification recommends.
The IPC-7095 standard is under the situation of having considered material, welding and producer's working ability, and the land diameter (pad diameter) that recommends the BGA encapsulation to be designed is 75%～80% (the seeing table 1, table 2) of ball diameter (soldered ball diameter).Along with development of technology; Hand held electronic terminals is used more and more widely, and the PCB of hand held electronic terminals (Printed Circuit Board printed circuit board (PCB)) size is all less, and components and parts are integrated on the PCB more and more; The size of the size of components and parts and I/O terminal thereof is also corresponding to diminish; Because pad is still the ratio setting according to original and soldered ball diameter, will make the bga chip of special (size is less) when welding, the failure welding problem can occur, promptly because the diameter of soldered ball and pad is all less; Make the pad tining very little, rosin joint occurs.Because the components and parts on the pcb board are more, plate is extremely thin, brings very large inconvenience also for the detection of fault.
In the process that realizes the utility model, the inventor finds that there is following problem at least in prior art: for the pcb board in the hand held electronic terminals, because the size of components and parts is more and more littler; When BGA is encapsulated in and welds with pcb board; Also corresponding the reducing of size of solder ball on the BGA encapsulation I/O terminal, the pad size on the pcb board still is provided with in the ratio of original and corresponding size of solder ball, makes that pad size is more and more littler; Cause on the pad tining very little; Occur the rosin joint phenomenon easily, this causes the pcb board fault probably, and gives to detect to keep in repair and make troubles.
The utility model content
In view of this, the utility model technical problem to be solved is, a kind of new pcb board is provided, and when making BGA be encapsulated in to be welded on the pcb board, avoids occurring the rosin joint phenomenon, the success rate when improving BGA welded encapsulation on the pcb board.
On the one hand; The utility model provides a kind of printed circuit board (PCB) (pcb board); Said printed circuit board (PCB) is provided with the pad that is used for the BGA Package welding; Said BGA Package is provided with the soldered ball corresponding with said pad, and the diameter of said pad is greater than 80% of said soldered ball diameter, and less than 90% of said soldered ball diameter.
On the other hand, the utility model also provides a kind of electric terminal, comprises above-mentioned printed circuit board (PCB).
Above-mentioned printed circuit board (PCB) of the prior art has following beneficial effect: the printed circuit board (PCB) that the utility model provides; The diameter of pad is increased to greater than 80% of soldered ball diameter corresponding in the said BGA encapsulation; Greatly improve small size BGA and be encapsulated in the power that is welded on the pcb board, improved the stability and the reliability of pcb board circuit.
Electric terminal in the technique scheme has following beneficial effect: the utility model provides a kind of electric terminal that includes above-mentioned printed circuit board (PCB); Improve BGA and be encapsulated in the power that is welded on the pcb board; Improve the circuit stability ability and the reliability of electric terminal, prolong the useful life of electric terminal.
Description of drawings
Fig. 1 is the structural representation according to said printed circuit board (PCB) one embodiment of the utility model;
Fig. 2 is the sketch map that ratio is provided with an embodiment between diameter and the soldered ball diameter of pad among Fig. 1;
Fig. 3 is the diameter of pad among Fig. 1 and the sketch map that the soldered ball diameter proportion is provided with another embodiment;
Fig. 4 is diameter and the setting of the soldered ball diameter proportion sketch map of an embodiment again of pad among Fig. 1;
Fig. 5 is the schematic block diagram according to said electric terminal one embodiment of the utility model.
Embodiment
In order more to be expressly understood above-mentioned purpose, the feature and advantage of the utility model, the utility model is further described in detail below in conjunction with accompanying drawing and embodiment.
A lot of details have been set forth in the following description so that make much of the utility model; But; The utility model can also adopt other to be different from other modes described here and implement, and therefore, the utility model is not limited to the restriction of following disclosed specific embodiment.
Embodiment one:
Fig. 1 is the structural representation according to said printed circuit board (PCB) one embodiment of the utility model.
Table 1: the soldered ball diameter recommendation tables on the part BGA substrate that the IPC-7095 standard provides in the prior art
| Soldered ball diameter (mm) commonly used | Soldered ball diameter range (mm) | Substrate thickness (mm) |
| 0.75 | 0.90～0.65 | 1.5，1.27 |
| 0.60 | 0.70～0.50 | 1.0 |
| 0.50 | 0.55～0.45 | 1.0，0.8 |
| 0.45 | 0.50～0.40 | 1.0，0.8，0.75 |
| 0.40 | 0.45～0.35 | 0.80，0.75，0.65 |
| 0.30 | 0.35～0.25 | 0.8，0.75，0.65，0.50 |
Table 2: the part pad diameter recommendation tables that the IPC-7095 standard provides in the prior art
Shown in above-mentioned table 1 and table 2; Originally design according to IPC-7095; Selecting the PCB substrate thickness is that Ball diameter (soldered ball diameter) in 0.8mm, the corresponding BGA encapsulation is 0.4mm, and the Land diameter (pad diameter) that proportionally designs is 0.30mm (gets pad diameter be soldered ball diameter 75%).IPC-7095 recommends as above-mentioned table 1 and table 2, under the situation that substrate is qualified and welding each side technology satisfies that PCB manufacturing firm is processed, has occurred the rosin joint phenomenon in the experimental test.This phenomenon has explained that the pad diameter design is less than normal to some extent.
As shown in Figure 1; The utility model provides a kind of printed circuit board (PCB) 10; Said printed circuit board (PCB) 10 is provided with the pad 1 that is used for the BGA Package welding, and said pad is 6 * 6 array, and said BGA Package (not shown) is provided with the soldered ball corresponding with said pad; The diameter of said pad 1 is greater than 80% of said soldered ball diameter, and less than 90% of said soldered ball diameter.
Preferably, improve back Land diameter (soldered ball diameter) and be designed to 85% of Ball diameter (soldered ball diameter).
Further, said soldered ball comprises the soldering ball.The connection effect that adopts soldering to connect is better, and technology is also ripe relatively, can guarantee the good signal transmission capacity.
Preferably, said pad is made up of the material that can carry out soldering, comprises copper, copper alloy, gold, silver, zinc or nickel etc.
Preferably, between the adjacent two said pads 1 at least one printed circuit 2 is set.Because integrated degree is increasingly high; Therefore arrange the circuit of multiple function on the pcb board as much as possible; Consider the needs of wiring, also will pass circuit sometimes between the BGA encapsulation, to reach perfect wiring effect; So when the centre-to-centre spacing of design pad size and adjacent two pads, guarantee between adjacent two pads 1 at least one printed circuit 2 to be set.
Further, said printed circuit board (PCB) is connected with said BGA Package through reflow soldering.Because the size of BGA encapsulation is more and more littler; The size of the I/O terminal of BGA encapsulation and on size of solder ball also reduce accordingly; At this moment as adopting artificial welding will bring great inconvenience, influence packaging efficiency and quality, so the utility model adopts solder reflow process; Adopt machine to accomplish automatically, can guarantee good assembling quality and very high efficient.
Further, substrate 3 thickness of said printed circuit board (PCB) are 0.8mm.
In the present embodiment; At substrate 3 thickness is the master chip of high-end products such as 0.8mm or 1mm; When needing the situation of cabling between PCB manufacturing, reflow soldering and PCB layout (wiring) master chip pad; To Ball diameter (soldered ball diameter) 0.4mm, pitch (substrate thickness) is the bga chip of 0.75mm or 0.8mm, all can its Land diameter (pad diameter) be designed to 85% (being 0.34mm) of Ball diameter (soldered ball diameter).
After adopting this scheme, through test, very large effect has been played in the raising of success rate in the time of can finding out for the welding of realization electronic terminal product pcb board components and parts.
Fig. 2 is the sketch map that ratio is provided with an embodiment between diameter and the soldered ball diameter of pad among Fig. 1.
Fig. 2 shows a kind of proportionate relationship of the diameter and the soldered ball diameter of pad 1 in the present embodiment; The soldered ball of the certain diameter that a representes to select for use among the figure is projected in the circle on the pcb board; B representes that diameter is the circle of circle a diameter 75%; C representes that diameter is the circle of circle a diameter 80%, and d representes that diameter is the circle of circle a diameter 85%, and e representes that diameter is the circle of soldered ball diameter 90%.Wherein the dash area among the figure (promptly round b and the annular rings district that justifies between the c) is the diameter range (with respect to the ratio of the diameter of soldered ball) of the pad of available technology adopting; The improvement that the utility model provides is the increasing diameter of pad 1 is added to the diameter greater than circle c; And less than the diameter of justifying e, promptly the diameter range of pad 1 is the circle ring area between circle c and the circle e, preferably; The pad of present embodiment adopts circle d, and promptly the diameter of pad 1 is 85% of a soldered ball diameter.
Among Fig. 2, annulus is followed successively by round b, circle c, circle d, circle e, circle a from inside to outside.
Embodiment two:
Present embodiment and embodiment one are basic identical, and its difference is:
The diameter of pad is set to 83% of soldered ball diameter in the BGA encapsulation on the present embodiment pcb board.
The substrate thickness of getting pcb board is 0.8mm; And when the land (between the pad) that PCB manufacturing, reflow soldering and PCB Layout (printed circuit board wiring) master chip are satisfied in this BGA encapsulation requires to carry out the situation of cabling; To Ball diameter (soldered ball diameter) is that the substrate thickness of 0.4mm, pcb board is that the bga chip of 0.8mm all can be designed to its land diameter (pad diameter) 83% (being that pad diameter is 0.332mm) of Ball diameter (soldered ball diameter), and then can promote the land diameter (pad diameter) that requires to carry out situation such as cabling between the land (pad) of substrate thickness, PCB manufacturing, reflow soldering and PCB layout (printed circuit board wiring) master chip that will satisfy pcb board and be designed to 83% of Ball diameter (soldered ball diameter).
Fig. 3 is the diameter of pad among Fig. 1 and the sketch map that the soldered ball diameter proportion is provided with another embodiment.
As shown in Figure 3, the improvement of present embodiment is, selects for use pad to select round f for use, and promptly the diameter of pad 1 is 83% (diameter of circle f is 83% of circle a diameter) of soldered ball diameter.The pad that wherein round b, circle c, circle d represent is a reference group.
Through present embodiment for the improvement of pad on the pcb board with respect to the soldered ball diameter proportion, in the BGA encapsulation on I/O terminal and the pcb board corresponding bonding pad be connected effect and have greatly improved than prior art, but its effect is obvious, good not as the effect of embodiment one.
Annulus is followed successively by round b, circle c, circle f, circle d, circle a from the inside to the outside among Fig. 3.
Embodiment three:
Present embodiment and embodiment one are basic identical, and its difference is:
The diameter of pad is set to 88% of soldered ball diameter corresponding in the BGA encapsulation on the present embodiment pcb board.
The substrate thickness of getting pcb board is 0.8mm; And when the land (between the pad) that PCB manufacturing, reflow soldering and PCB Layout (printed circuit board wiring) master chip are satisfied in this BGA encapsulation requires to carry out the situation of cabling; To Ball diameter (soldered ball diameter) is that the substrate thickness of 0.4mm, pcb board is that the bga chip of 0.8mm all can be designed to its land diameter (pad diameter) 88% (being that pad diameter is 0.352mm) of Ball diameter (soldered ball diameter), and then can promote the land diameter (pad diameter) that requires to carry out situation such as cabling between the land (pad) of substrate thickness, PCB manufacturing, reflow soldering and PCB layout (printed circuit board wiring) master chip that will satisfy pcb board and be designed to 88% of Ball diameter (soldered ball diameter).
Fig. 4 is diameter and the setting of the soldered ball diameter proportion sketch map of an embodiment again of pad among Fig. 1.
As shown in Figure 4, the improvement of present embodiment is that pad is selected round g (diameter of circle g is 88% of circle a diameter) for use, and the pad that wherein round b, circle c, circle d represent is a reference group.
Improvement through present embodiment; In the BGA encapsulation on I/O terminal and the pcb board corresponding bonding pad be connected effect and obvious improvement arranged than prior art; Welding on I/O terminal and the pcb board between corresponding bonding pad is more firm, but its connection effect is slightly inferior than the effect of technical scheme among the embodiment one.
To sum up; The improvements of the utility model are: pad diameter is 75～80% scheme of soldered ball diameter in the BGA design that IPC-7095 is recommended to use and the enforcement of assembling process; Be improved to pad diameter greater than 80% of soldered ball diameter; And, preferably, the diameter of pad on the pcb board is improved to 85% o'clock best results of soldered ball diameter in the BGA encapsulation less than 90% of said soldered ball diameter.
The improvement data that the utility model provided are to make the raising of success rate when realizing pcb board components and parts welding on the electronic terminal product of technical scheme that the utility model provides play very large effect.
Annulus is followed successively by round b, circle c, circle d, circle g, circle a from the inside to the outside among Fig. 4.
Embodiment four:
Fig. 5 shows the schematic block diagram according to said electric terminal one embodiment of the utility model.
As shown in Figure 5, the utility model also provides a kind of electric terminal 20, comprises above-mentioned printed circuit board (PCB) 10.
The electric terminal that provides through the utility model; Especially hand-held mobile electronic end product; Under the situation that the size of I/O terminal reduces in integrated more, the BGA encapsulation of, components and parts less in its pcb board size,, make the diameter of pad on the pcb board greater than 80% of soldered ball diameter in the BGA encapsulation through the above-mentioned printed circuit board (PCB) that practical the utility model provides; And less than 90% of soldered ball diameter; This has improved tining quantity and the welding quality on the pad greatly, make BGA encapsulation be connected more securely on the pcb board, has guaranteed the connective stability and the reliability of circuit and bga chip on the pcb board; Improved the stability of electric terminal, made that simultaneously the physical life of electric terminal is longer.
The printed circuit board (PCB) that the utility model provides; Its improvement is: the diameter of the pad on the said printed circuit board (PCB) is greater than 80% of soldered ball diameter in the BGA encapsulation; And, so both increased the tining amount of pad on the pcb board less than 90% of soldered ball diameter, can the interference between circuit not appear because of the diameter that has increased pad again simultaneously; The rosin joint phenomenon that has occurred when greatly having avoided the BGA welded encapsulation on pcb board has improved the circuit stability of pcb board.
The electric terminal that the utility model provides, its improvements are: adopted above-mentioned printed circuit board (PCB).Adopted above-mentioned printed circuit board (PCB), when producing hand-held or mobile electronic terminal, the welding stability of circuit board is greatly improved; Avoided because of the BGA welded encapsulation on pcb board, the rosin joint phenomenon appears in pad tining very little, has reduced fault; Improve the stability of circuit on the pcb board; Practiced thrift circuit test and the leakage detection time of PCB circuit after welding is accomplished, enhanced productivity, the stability and the useful life of improving electric terminal greatly simultaneously.
Those skilled in the art is to be understood that; The printed circuit board (PCB) that the utility model provides is in welding BGA when encapsulation, the diameter of pad is increased to greater than 80% of soldered ball diameter, and less than 90% of soldered ball diameter; Therefore every in welding process; The diameter of pad is greater than soldered ball diameter 80%, and less than the pcb board of soldered ball diameter 90%, all should be included within the protection range of the utility model; Every electric terminal that comprises the described printed circuit board (PCB) of the utility model like mobile phone, palmtop PC etc., also all should be included within the protection range of the utility model.
The preferred embodiment that the above is merely the utility model is not limited to the utility model, and for a person skilled in the art, the utility model can have various changes and variation.All within the spirit and principle of the utility model, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection range of the utility model.
Claims (10)
1. printed circuit board (PCB); Said printed circuit board (PCB) is provided with the pad that is used for the BGA Package welding; Said BGA Package is provided with the soldered ball corresponding with said pad; It is characterized in that the diameter of said pad is greater than 80% of said soldered ball diameter, and less than 90% of said soldered ball diameter.
2. printed circuit board (PCB) according to claim 1 is characterized in that, the diameter of said pad is 85% of the said soldered ball diameter corresponding with said pad.
3. printed circuit board (PCB) according to claim 1 and 2 is characterized in that, the diameter of said soldered ball is 0.30～0.45mm.
4. printed circuit board (PCB) according to claim 3 is characterized in that, the diameter of said soldered ball is 0.4mm.
5. printed circuit board (PCB) according to claim 4 is characterized in that said soldered ball comprises the soldering ball.
6. printed circuit board (PCB) according to claim 1 is characterized in that, between the adjacent two said pads at least one printed circuit is set.
7. printed circuit board (PCB) according to claim 1 is characterized in that, said printed circuit board (PCB) is connected with said BGA Package through reflow soldering.
8. printed circuit board (PCB) according to claim 7 is characterized in that, the thickness of said printed circuit board (PCB) is 0.50～1.5mm.
9. printed circuit board (PCB) according to claim 8 is characterized in that, the thickness of said printed circuit board (PCB) is 0.8mm.
10. an electric terminal is characterized in that, comprises like arbitrary described printed circuit board (PCB) in the claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203306646U CN202262070U (en) | 2011-09-05 | 2011-09-05 | Printed circuit board and electronic terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203306646U CN202262070U (en) | 2011-09-05 | 2011-09-05 | Printed circuit board and electronic terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202262070U true CN202262070U (en) | 2012-05-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203306646U Expired - Fee Related CN202262070U (en) | 2011-09-05 | 2011-09-05 | Printed circuit board and electronic terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202262070U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108021733A (en) * | 2017-10-27 | 2018-05-11 | 努比亚技术有限公司 | A kind of integration module and its design method, mobile terminal |
-
2011
- 2011-09-05 CN CN2011203306646U patent/CN202262070U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108021733A (en) * | 2017-10-27 | 2018-05-11 | 努比亚技术有限公司 | A kind of integration module and its design method, mobile terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20190905 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |