TW201509257A - Flexible printed circuit board and method for manufacturing same - Google Patents
Flexible printed circuit board and method for manufacturing same Download PDFInfo
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- TW201509257A TW201509257A TW102131934A TW102131934A TW201509257A TW 201509257 A TW201509257 A TW 201509257A TW 102131934 A TW102131934 A TW 102131934A TW 102131934 A TW102131934 A TW 102131934A TW 201509257 A TW201509257 A TW 201509257A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0495—Cold welding
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
本發明涉及電路板製作技術，尤其涉及一種軟性電路板及其製作方法。The invention relates to a circuit board manufacturing technology, in particular to a flexible circuit board and a manufacturing method thereof.
由於電子產品向個性化發展，對於應用於電子產品的印刷軟性電路板的要求也越來越多樣化。目前有一種軟性電路板，其用於承載和保護導電線路圖形的絕緣基板、保護膜層等為高透光材料，從而內部的導電線路圖形由於絕緣材料為高透光材料而變得可見。一般地，所述軟性電路板所採用的高透光的絕緣基板及保護膜層材料為聚對苯二甲酸乙二酯（PET），PET材料的耐熱性較差，從而限制了使用所述PET材料的軟性電路板的應用範圍，如，使用所述PET材料的軟性電路板上不能焊接零件等。Due to the personalization of electronic products, the requirements for printed flexible circuit boards for electronic products are becoming more diverse. At present, there is a flexible circuit board for insulating and protecting a conductive circuit pattern, a protective film layer and the like as a high light transmissive material, so that the inner conductive line pattern becomes visible because the insulating material is a high light transmissive material. Generally, the high-transparent insulating substrate and the protective film layer material used in the flexible circuit board are polyethylene terephthalate (PET), and the heat resistance of the PET material is poor, thereby limiting the use of the PET material. The application range of the flexible circuit board, for example, the parts on the flexible circuit board using the PET material cannot be welded.
有鑒於此，有必要提供一種耐熱性較好的軟性電路板的製作及其方法，使所軟性電路板上能夠焊接零件。In view of the above, it is necessary to provide a flexible circuit board having a good heat resistance and a method thereof for soldering parts on a flexible circuit board.
一種軟性電路板的製作方法，包括步驟：提供覆銅基板，所述覆銅基板包括第一銅箔層及第一介電層，其中，所述第一介電層的材質為聚萘二甲酸乙二醇酯；將所述第一銅箔層製作形成第一導電線路圖形；於所述第一導電線路圖形的一側形成覆蓋膜，所述覆蓋膜具有至少一個貫通所述覆蓋膜的開口，部分所述第一導電線路圖形從所述開口中暴露出來，從所述開口中暴露出來的所述第一導電線路圖形形成焊墊；以及在所述焊墊上形成低溫錫膏層，並將一電子零件焊接於所述低溫錫膏層，所述電子零件藉由所述低溫錫膏層與所述焊墊電連接，從而得到軟性電路板，其中，焊接所述電子零件時設定焊接的最高溫度在所述第一介電層的耐熱溫度範圍內。A method for fabricating a flexible circuit board, comprising the steps of: providing a copper clad substrate, wherein the copper clad substrate comprises a first copper foil layer and a first dielectric layer, wherein the first dielectric layer is made of polynaphthalene dicarboxylic acid a polyethylene glycol ester; forming the first copper foil layer to form a first conductive line pattern; forming a cover film on one side of the first conductive line pattern, the cover film having at least one opening penetrating the cover film a portion of the first conductive trace pattern is exposed from the opening, the first conductive trace pattern exposed from the opening forms a solder pad; and a low temperature solder paste layer is formed on the solder pad, and An electronic component is soldered to the low temperature solder paste layer, and the electronic component is electrically connected to the solder pad by the low temperature solder paste layer, thereby obtaining a flexible circuit board, wherein the soldering of the electronic component is set to be the highest The temperature is within the heat resistant temperature range of the first dielectric layer.
一種軟性電路板，其包括依次相貼的覆蓋膜、導電線路圖形及第一介電層，所述覆蓋膜具有至少一個貫通所述覆蓋膜的開口，部分所述導電線路圖形從所述開口中暴露出來，從所述開口中暴露出來的所述導電線路圖形形成焊墊，所述焊墊上形成有低溫錫膏層，一電子零件焊接於所述低溫錫膏層，所述電子零件藉由所述低溫錫膏層與所述焊墊電連接，所述第一介電層的材質為聚萘二甲酸乙二醇酯。A flexible circuit board comprising a cover film, a conductive line pattern and a first dielectric layer which are sequentially attached, the cover film having at least one opening penetrating the cover film, and a part of the conductive line pattern is from the opening Exposed, the conductive trace pattern exposed from the opening forms a solder pad on which a low temperature solder paste layer is formed, an electronic component is soldered to the low temperature solder paste layer, and the electronic component is The low temperature solder paste layer is electrically connected to the solder pad, and the first dielectric layer is made of polyethylene naphthalate.
與先前技術相比，本技術方案提供的軟性電路板及製作方法採用的聚萘二甲酸乙二醇酯（PEN）作為介電層且採用低溫錫膏層焊接電子零件，因PEN的耐熱性能比PET的耐熱性能好，及低溫錫膏的熔點較低，從而使得所述軟性電路板上可以焊接零件，並且還可以使所述軟性電路板與模組相黏結，從而擴大了軟性電路板的使用範圍。Compared with the prior art, the flexible circuit board and the manufacturing method provided by the technical solution use polyethylene naphthalate (PEN) as a dielectric layer and a low temperature solder paste layer for soldering electronic parts, because of the heat resistance ratio of PEN The heat resistance of PET is good, and the melting point of the low temperature solder paste is low, so that the flexible circuit board can be soldered, and the flexible circuit board can be bonded to the module, thereby expanding the use of the flexible circuit board. range.
圖1係本技術方案第一實施例提供的覆銅基板的剖面示意圖。1 is a schematic cross-sectional view of a copper clad substrate provided by a first embodiment of the present technical solution.
圖2係圖1的覆銅基板製作形成電路基板後的剖面示意圖。2 is a schematic cross-sectional view showing the copper-clad substrate of FIG. 1 after forming a circuit board.
圖3係在圖2的電路基板上形成覆蓋膜後的的剖面示意圖。3 is a schematic cross-sectional view showing a cover film formed on the circuit substrate of FIG. 2.
圖4係在圖3的形成覆蓋膜後的電路基板上印刷錫膏及焊接電子零件後形成的軟性電路板的剖面示意圖。4 is a schematic cross-sectional view showing a flexible circuit board formed by printing solder paste and soldering electronic parts on the circuit board on which the cover film is formed in FIG.
圖5係本技術方案第二實施例提供的覆銅基板的剖面示意圖。FIG. 5 is a cross-sectional view of a copper clad substrate provided by a second embodiment of the present technical solution.
圖6係圖5的覆銅基板上形成導電通孔後的剖面示意圖。6 is a schematic cross-sectional view showing a conductive via hole formed on the copper clad substrate of FIG. 5.
圖7係圖6的形成導電通孔後的覆銅基板製作形成電路基板後的剖面示意圖。FIG. 7 is a schematic cross-sectional view showing the formation of a circuit board after the copper-clad substrate having the conductive via holes formed in FIG.
圖8係在圖7的電路基板上形成覆蓋膜後的的剖面示意圖。Fig. 8 is a schematic cross-sectional view showing a cover film formed on the circuit board of Fig. 7.
圖9係在圖8的形成覆蓋膜後的電路基板上印刷低溫錫膏及焊接電子零件後形成的軟性電路板的剖面示意圖。9 is a schematic cross-sectional view showing a flexible circuit board formed by printing a low-temperature solder paste and soldering electronic parts on the circuit board on which the cover film is formed in FIG.
下面以具體實施例對本發明提供的軟性電路板及其製作方法進行進一步的說明。The flexible circuit board and the manufacturing method thereof provided by the present invention will be further described below by way of specific embodiments.
本技術方案第一實施例提供的軟性電路板製作方法包括如下步驟：The flexible circuit board manufacturing method provided by the first embodiment of the present technical solution includes the following steps:
第一步，請參閱圖1，提供覆銅基板110。In the first step, referring to FIG. 1, a copper clad substrate 110 is provided.
本實施例中，覆銅基板110為單面覆銅基板，其包括依次相貼的銅箔層111、第一膠層112及第一介電層113。In this embodiment, the copper clad substrate 110 is a single-sided copper clad substrate, and includes a copper foil layer 111, a first adhesive layer 112, and a first dielectric layer 113 which are sequentially attached.
所述銅箔層111可以為電解銅箔，也可以為壓延銅箔。所述第一膠層112的材質為高透光的環氧丙烯酸酯樹脂（Epoxy-Acrylate）或環氧樹脂（Epoxy）等。所述第一介電層113的材質為高透光的聚萘二甲酸乙二醇酯（polyethylenenaphthalate，PEN）。PEN材料比PET材料具有更高的耐熱性能、物理機械性能、氣體阻隔性能、化學穩定性能等。The copper foil layer 111 may be an electrolytic copper foil or a rolled copper foil. The material of the first adhesive layer 112 is a high light transmission epoxy resin (Epoxy-Acrylate) or epoxy resin (Epoxy). The material of the first dielectric layer 113 is high light transmission polyethylenenaphthalate (PEN). PEN materials have higher heat resistance, physical and mechanical properties, gas barrier properties, and chemical stability properties than PET materials.
當然，所述覆銅基板110也可以不包括所述第一膠層112。Of course, the copper clad substrate 110 may not include the first adhesive layer 112.
第二步，請參閱圖2，將所述銅箔層111製作形成導電線路圖形120，從而得到電路基板101。In the second step, referring to FIG. 2, the copper foil layer 111 is formed into a conductive line pattern 120, thereby obtaining the circuit substrate 101.
本步驟中，採用影像轉移工藝及蝕刻工藝，將部分銅箔層111蝕刻去除，從而得到導電線路圖形120。In this step, a portion of the copper foil layer 111 is etched away by using an image transfer process and an etching process to obtain a conductive line pattern 120.
第三步，請參閱圖3，提供覆蓋膜130，將所述覆蓋膜130壓合於所述電路基板101的導電線路圖形120的一側。In the third step, referring to FIG. 3, a cover film 130 is provided to press the cover film 130 to one side of the conductive trace pattern 120 of the circuit substrate 101.
所述覆蓋膜130包括相貼合的第二膠層131和第二介電層132。所述第二膠層131的材質為高透光的環氧丙烯酸酯樹脂或環氧樹脂等。所述第二介電層132的材質為高透光的聚萘二甲酸乙二醇酯。壓合時，將所述第二膠層131與所述導電線路圖形120直接相貼。所述覆蓋膜130上形成有一個開口133，所述開口133貫通所述第二膠層131和第二介電層132，部分所述導電線路圖形120從所述開口133中暴露出來，從所述開口133中暴露出來的所述導電線路圖形120形成一焊墊121。The cover film 130 includes a second adhesive layer 131 and a second dielectric layer 132 that are in contact with each other. The material of the second adhesive layer 131 is a high light transmittance epoxy acrylate resin, epoxy resin or the like. The second dielectric layer 132 is made of high light transmission polyethylene naphthalate. When pressing, the second adhesive layer 131 is directly attached to the conductive trace pattern 120. An opening 133 is formed in the cover film 130. The opening 133 extends through the second adhesive layer 131 and the second dielectric layer 132. A portion of the conductive trace pattern 120 is exposed from the opening 133. The conductive trace pattern 120 exposed in the opening 133 forms a pad 121.
當然，所述開口133的數量也可以為複數，從而形成複數焊墊121，所述覆蓋膜130也可以僅包括第二介電層132，藉由塗佈等方式形成於導電線路圖形的一側。Certainly, the number of the openings 133 may also be plural, thereby forming a plurality of pads 121. The cover film 130 may also include only the second dielectric layer 132, and is formed on one side of the conductive line pattern by coating or the like. .
第四步，請參閱圖4，在所述焊墊121上藉由印刷的方式形成低溫錫膏層140，並將一電子零件150焊接於所述低溫錫膏層140上，從而形成軟性電路板100。In the fourth step, referring to FIG. 4, a low-temperature solder paste layer 140 is formed on the solder pad 121 by printing, and an electronic component 150 is soldered on the low-temperature solder paste layer 140 to form a flexible circuit board. 100.
常用的無鉛錫膏的熔點一般在216攝氏度至220攝氏度，而PEN材料的最高耐熱溫度一般在175攝氏度左右，即，常用無鉛錫高的熔點超出了PEN材料的耐熱溫度；而低溫錫膏的熔點一般在138攝氏度左右，此溫度在PEN材料的耐熱溫度範圍；故，本案中選用低溫錫膏焊接電子零件150。其中將低溫錫膏印刷於所述焊墊121上形成低溫錫膏層140後，將所述電子零件960置於所述低溫錫膏層140上並過回焊爐以將所述電子零件150焊接於所述低溫錫膏層140上。其中，過回焊爐焊接所述電子零件150的最高溫度不超過PEN的最高耐熱溫度，也即，焊接所述電子零件150時設定焊接的最高溫度在PEN材料的耐熱溫度範圍內。本實施例中，所述低溫錫膏的組成包括錫鉍合金及焊劑等，其中，優選地，錫鉍合金為Sn42Bi58，所述低溫錫膏中焊劑的含量為10.5%±0.5%。當然，也可以藉由其他方式在所述焊墊121上形成低溫錫膏層140。The commonly used lead-free solder pastes generally have a melting point of 216 degrees Celsius to 220 degrees Celsius, while the highest heat resistant temperature of PEN materials is generally around 175 degrees Celsius. That is, the melting point of commonly used lead-free tin is higher than the heat-resistant temperature of PEN materials; and the melting point of low-temperature solder paste Generally at about 138 degrees Celsius, this temperature is in the heat resistant temperature range of the PEN material; therefore, in this case, the low temperature solder paste is used to solder the electronic component 150. After the low temperature solder paste is printed on the solder pad 121 to form the low temperature solder paste layer 140, the electronic component 960 is placed on the low temperature solder paste layer 140 and passed through a reflow furnace to solder the electronic component 150. On the low temperature solder paste layer 140. Wherein, the maximum temperature of the electronic component 150 soldered by the over-reflow oven does not exceed the highest heat-resistant temperature of the PEN, that is, the highest temperature at which the soldering of the electronic component 150 is set is within the heat-resistant temperature range of the PEN material. In this embodiment, the composition of the low-temperature solder paste includes a tin-bismuth alloy, a flux, and the like. Among them, preferably, the tin-bismuth alloy is Sn42Bi58, and the content of the flux in the low-temperature solder paste is 10.5%±0.5%. Of course, the low temperature solder paste layer 140 can also be formed on the pad 121 by other means.
所述軟性電路板100包括依次相貼的第二介電層132、第二膠層131、導電線路圖形120、第一膠層112及第一介電層113。所述軟性電路板100上形成有一開口133，所述開口133貫通所述第二膠層131和第二介電層132，部分所述導電線路圖形120從所述開口133中暴露出來，從所述開口133中暴露出來的所述導電線路圖形120形成一焊墊121。所述焊墊121上形成有低溫錫膏層140，所述低溫錫膏層140上焊接有電子零件150，所述電子零件150藉由所述低溫錫膏層140與所述焊墊121電連接。其中，各所述膠層的材質為高透光的環氧丙烯酸酯樹脂或環氧樹脂等。各所述介電層的材質為高透光的聚萘二甲酸乙二醇酯。The flexible circuit board 100 includes a second dielectric layer 132, a second adhesive layer 131, a conductive line pattern 120, a first adhesive layer 112, and a first dielectric layer 113. An opening 133 is formed in the flexible circuit board 100. The opening 133 extends through the second adhesive layer 131 and the second dielectric layer 132. A portion of the conductive trace pattern 120 is exposed from the opening 133. The conductive trace pattern 120 exposed in the opening 133 forms a pad 121. A low-temperature solder paste layer 140 is formed on the solder pad 121. The low-temperature solder paste layer 140 is soldered with an electronic component 150. The electronic component 150 is electrically connected to the solder pad 121 by the low-temperature solder paste layer 140. . The material of each of the adhesive layers is a high light transmittance epoxy acrylate resin or epoxy resin. Each of the dielectric layers is made of a highly transparent polyethylene naphthalate.
另外，上述軟性電路板100的製作方法中，還可以包括貼合模組的步驟，具體為在壓合覆蓋膜後或焊接電子零件後，提供一模組及一第三膠層，將所述模組藉由所述第三膠層與所述第一介電層113黏結，從而，形成的所述軟性電路板100還包括一模組，所述模組藉由一第三膠層與所述軟性電路板100的第一介電層113相黏結。所述模組可以為高透光的面板等。In addition, the manufacturing method of the flexible circuit board 100 may further include the step of bonding the module, specifically, after pressing the cover film or after soldering the electronic component, providing a module and a third adhesive layer, The module is bonded to the first dielectric layer 113 by the third adhesive layer, so that the formed flexible circuit board 100 further includes a module, and the module is separated by a third adhesive layer The first dielectric layer 113 of the flexible circuit board 100 is bonded. The module may be a high light transmission panel or the like.
本技術方案製作的軟性電路板100，其中的導電線路圖形120可以透過軟性電路板100的高透光的第二介電層132及第二膠層131被較清晰的觀測到。另外，為了使形成的導電線路圖形120的透明感更強，還可以在所述覆銅基板110的所述銅箔層111的與所述第一膠層112相貼的第一表面及與所述第一表面相對的第二表面分別形成黑化層。In the flexible circuit board 100 manufactured by the present technical solution, the conductive circuit pattern 120 can be clearly observed through the high-transmission second dielectric layer 132 and the second adhesive layer 131 of the flexible circuit board 100. In addition, in order to make the formed conductive line pattern 120 more transparent, the first surface and the surface of the copper foil layer 111 of the copper-clad substrate 110 that are adjacent to the first adhesive layer 112 may be The opposite surfaces of the first surface respectively form a blackening layer.
本技術方案第二實施例提供的軟性電路板製作方法包括如下步驟：The flexible circuit board manufacturing method provided by the second embodiment of the present technical solution includes the following steps:
第一步，請參閱圖5，提供覆銅基板910。In the first step, referring to FIG. 5, a copper clad substrate 910 is provided.
本實施例中，覆銅基板910為雙面覆銅基板，其包括依次堆疊設置的第一銅箔層911、第一膠層912、第一介電層913、第二膠層914及第二銅箔層915。In this embodiment, the copper-clad substrate 910 is a double-sided copper-clad substrate, and includes a first copper foil layer 911, a first adhesive layer 912, a first dielectric layer 913, a second adhesive layer 914, and a second layer. Copper foil layer 915.
所述第一及第二銅箔層911、915可以為電解銅箔，也可以為壓延銅箔。所述第一及第二膠層912、914的材質為高透光的環氧丙烯酸酯樹脂或環氧樹脂等。所述第一介電層913的材質為高透光的聚萘二甲酸乙二醇酯。PEN材料比PET材料具有更高的耐熱性能、物理機械性能、氣體阻隔性能、化學穩定性能等。The first and second copper foil layers 911 and 915 may be an electrolytic copper foil or a rolled copper foil. The material of the first and second adhesive layers 912 and 914 is a high light transmittance epoxy acrylate resin or epoxy resin. The material of the first dielectric layer 913 is high light transmission polyethylene naphthalate. PEN materials have higher heat resistance, physical and mechanical properties, gas barrier properties, and chemical stability properties than PET materials.
當然，所述覆銅基板910也可以不包括所述第一及第二膠層912、914，即所述覆銅基板910包括依次相貼的第一銅箔層、第一介電層及第二銅箔層。Of course, the copper-clad substrate 910 may not include the first and second adhesive layers 912 and 914, that is, the copper-clad substrate 910 includes a first copper foil layer, a first dielectric layer, and a first layer. Two copper foil layers.
第二步，請參閱圖6，在所述覆銅基板910上形成至少一個導電通孔916。In the second step, referring to FIG. 6, at least one conductive via 916 is formed on the copper clad substrate 910.
所述導電通孔916貫通所述覆銅基板910並電連接所述第一銅箔層911及第二銅箔層915。The conductive via 916 penetrates the copper clad substrate 910 and electrically connects the first copper foil layer 911 and the second copper foil layer 915.
本實施例中，所述導電通孔916的形成方式為：首先，藉由機械鑽孔在所述覆銅基板910上形成至少一個貫通孔；之後電鍍從而在所述貫通孔孔壁形成導電銅層，在所述第一銅箔層911表面形成第一面銅917，以及在所述第二銅箔層915表面形成第二面銅918，並使所述導電銅層電連接所述第一銅箔層911及第二銅箔層915，從而形成所述導電通孔916。當然，也可以藉由雷射蝕孔的方式形成所述貫通孔。In this embodiment, the conductive via 916 is formed by first forming at least one through hole on the copper clad substrate 910 by mechanical drilling; then electroplating to form conductive copper on the through hole wall. a first surface copper 917 is formed on the surface of the first copper foil layer 911, and a second surface copper 918 is formed on the surface of the second copper foil layer 915, and the conductive copper layer is electrically connected to the first The copper foil layer 911 and the second copper foil layer 915 form the conductive via 916. Of course, the through hole may be formed by laser etching.
第三步，請參閱圖7，將所述第一銅箔層911及所述第一面銅917製作形成第一導電線路圖形920，以及將所述第二銅箔層915及所述第二面銅918製作形成第二導電線路圖形922，從而得到電路基板901。The third step, referring to FIG. 7, the first copper foil layer 911 and the first copper 917 are formed into a first conductive trace pattern 920, and the second copper foil layer 915 and the second The surface copper 918 is formed to form a second conductive line pattern 922, thereby obtaining the circuit substrate 901.
本步驟中，採用影像轉移工藝及蝕刻工藝得到所述第一及第二導電線路圖形920、922。所述導電通孔916電連接所述第一導電線路圖形920及所述第二導電線路圖形922。In this step, the first and second conductive trace patterns 920, 922 are obtained by an image transfer process and an etching process. The conductive via 916 electrically connects the first conductive trace pattern 920 and the second conductive trace pattern 922.
第四步，請參閱圖8，提供第一覆蓋膜930及第二覆蓋膜940，將所述第一覆蓋膜930壓合於所述電路基板901的第一導電線路圖形920的一側，將所述第二覆蓋膜940壓合於所述電路基板901的第二導電線路圖形922的一側。In a fourth step, referring to FIG. 8 , a first cover film 930 and a second cover film 940 are provided. The first cover film 930 is pressed onto one side of the first conductive line pattern 920 of the circuit substrate 901. The second cover film 940 is pressed against one side of the second conductive line pattern 922 of the circuit substrate 901.
所述第一覆蓋膜930包括第三膠層931和第二介電層932。所述第二覆蓋膜940包括第四膠層941和第三介電層942。所述第三及第四膠層931、941的材質為高透光的環氧丙烯酸酯樹脂或環氧樹脂等。所述第二及第三介電層932、942的材質為高透光的聚萘二甲酸乙二醇酯。所述第一覆蓋膜930上形成有一個開口933，所述開口933貫通所述第三膠層931和第二介電層932，部分所述第一導電線路圖形920從所述開口933中暴露出來，從所述開口933中暴露出來的所述第一導電線路圖形920形成一焊墊921。The first cover film 930 includes a third adhesive layer 931 and a second dielectric layer 932. The second cover film 940 includes a fourth adhesive layer 941 and a third dielectric layer 942. The materials of the third and fourth adhesive layers 931 and 941 are high light transmittance epoxy acrylate resin, epoxy resin or the like. The second and third dielectric layers 932, 942 are made of high light transmission polyethylene naphthalate. An opening 933 is formed in the first cover film 930. The opening 933 extends through the third adhesive layer 931 and the second dielectric layer 932, and a portion of the first conductive trace pattern 920 is exposed from the opening 933. The first conductive trace pattern 920 exposed from the opening 933 forms a pad 921.
當然，所述開口133的數量也可以為複數，從而形成複數焊墊121。另外，所述第二覆蓋膜940也可以形成有開口，從而暴露出部分所述第二導電線路圖形922。所述第一及第二覆蓋膜930、940也可以僅包括介電層，藉由塗佈等方式形成於導電線路圖形的一側。Of course, the number of the openings 133 may also be plural, thereby forming a plurality of pads 121. In addition, the second cover film 940 may also be formed with an opening to expose a portion of the second conductive trace pattern 922. The first and second cover films 930 and 940 may also include only a dielectric layer formed on one side of the conductive trace pattern by coating or the like.
第五步，請參閱圖9，在所述焊墊921上藉由印刷的方式形成低溫錫膏層950，並將一電子零件960焊接於所述低溫錫膏層950上，從而形成軟性電路板900。In the fifth step, referring to FIG. 9, a low-temperature solder paste layer 950 is formed on the solder pad 921 by printing, and an electronic component 960 is soldered on the low-temperature solder paste layer 950 to form a flexible circuit board. 900.
常用的無鉛錫膏的熔點一般在216攝氏度至220攝氏度，而PEN材料的最高耐熱溫度一般在175攝氏度左右，即，常用無鉛錫高的熔點超出了PEN材料的耐熱溫度；而低溫錫膏的熔點一般在138攝氏度左右，此溫度在PEN材料的耐熱溫度範圍；故，本案中選用低溫錫膏焊接電子零件960。其中將低溫錫膏印刷於所述焊墊921上形成低溫錫膏層950後，將所述電子零件960置於所述低溫錫膏層950上並過回焊爐以將所述電子零件960焊接於所述低溫錫膏層950上。其中，過回焊爐焊接所述電子零件960的最高溫度不超過PEN的最高耐熱溫度，也即，焊接所述電子零件960時設定焊接的最高溫度在PEN材料的耐熱溫度範圍內。本實施例中，所述低溫錫膏內包括錫鉍合金及焊劑等成分，其中，優選地，錫鉍合金為Sn42Bi58，所述低溫錫膏中焊劑的含量為10.5%±0.5%。當然，也可以藉由其他方式在所述焊墊921上形成低溫錫膏層950。The commonly used lead-free solder pastes generally have a melting point of 216 degrees Celsius to 220 degrees Celsius, while the highest heat resistant temperature of PEN materials is generally around 175 degrees Celsius. That is, the melting point of commonly used lead-free tin is higher than the heat-resistant temperature of PEN materials; and the melting point of low-temperature solder paste Generally at about 138 degrees Celsius, this temperature is in the heat resistant temperature range of the PEN material; therefore, in this case, the low temperature solder paste is used to solder the electronic component 960. After the low temperature solder paste is printed on the solder pad 921 to form the low temperature solder paste layer 950, the electronic component 960 is placed on the low temperature solder paste layer 950 and passed through a reflow oven to solder the electronic component 960. On the low temperature solder paste layer 950. Wherein, the maximum temperature of the electronic component 960 soldered by the over-reflow oven does not exceed the highest heat-resistant temperature of the PEN, that is, the highest temperature at which the soldering of the electronic component 960 is set is within the heat-resistant temperature range of the PEN material. In this embodiment, the low-temperature solder paste includes a composition of a tin-bismuth alloy and a flux. Among them, preferably, the tin-bismuth alloy is Sn42Bi58, and the content of the flux in the low-temperature solder paste is 10.5%±0.5%. Of course, a low temperature solder paste layer 950 can also be formed on the pad 921 by other means.
所述軟性電路板900包括依次相貼的第二介電層932、第三膠層931、第一導電線路圖形920、第一膠層912、第一介電層913、第二膠層914、第二導電線路圖形922、第四膠層941及第三介電層942。所述軟性電路板900包括至少一個貫通所述第一導電線路圖形920、第一膠層912、第一介電層913、第二膠層914及第二導電線路圖形922的導電通孔916，所述導電通孔916電連接所述第一導電線路圖形920及所述第二導電線路圖形922。所述軟性電路板900上形成有一開口933，所述開口933貫通所述第三膠層931和第二介電層932，部分所述第一導電線路圖形920從所述開口933中暴露出來，從所述開口933中暴露出來的所述第一導電線路圖形920形成一焊墊921。所述焊墊921上形成有低溫錫膏層950，所述低溫錫膏層950上焊接有電子零件960，所述電子零件960藉由所述低溫錫膏層950與所述焊墊921電連接。其中，各所述膠層的材質為高透光的環氧丙烯酸酯樹脂或環氧樹脂等。各所述介電層的材質為高透光的聚萘二甲酸乙二醇酯。The flexible circuit board 900 includes a second dielectric layer 932, a third adhesive layer 931, a first conductive trace pattern 920, a first adhesive layer 912, a first dielectric layer 913, and a second adhesive layer 914. The second conductive line pattern 922, the fourth adhesive layer 941 and the third dielectric layer 942. The flexible circuit board 900 includes at least one conductive via 916 extending through the first conductive trace pattern 920, the first adhesive layer 912, the first dielectric layer 913, the second adhesive layer 914, and the second conductive trace pattern 922. The conductive via 916 electrically connects the first conductive trace pattern 920 and the second conductive trace pattern 922. An opening 933 is formed in the flexible circuit board 900. The opening 933 extends through the third adhesive layer 931 and the second dielectric layer 932, and a portion of the first conductive trace pattern 920 is exposed from the opening 933. The first conductive trace pattern 920 exposed from the opening 933 forms a pad 921. A low-temperature solder paste layer 950 is formed on the solder pad 921. The low-temperature solder paste layer 950 is soldered with an electronic component 960. The electronic component 960 is electrically connected to the solder pad 921 by the low-temperature solder paste layer 950. . The material of each of the adhesive layers is a high light transmittance epoxy acrylate resin or epoxy resin. Each of the dielectric layers is made of a highly transparent polyethylene naphthalate.
另外，所述軟性電路板900也可以形成有一第一模組及一第二模組，所述第一模組藉由一第五膠層與所述軟性電路板900的第二介電層932相黏結，所述第二模組藉由一第六膠層與所述軟性電路板900的第三介電層942相黏結。所述第一模組及第二模組可以為高透光的面板等。In addition, the flexible circuit board 900 can also be formed with a first module and a second module. The first module is connected to the second dielectric layer 932 of the flexible circuit board 900 by a fifth adhesive layer. The second module is bonded to the third dielectric layer 942 of the flexible circuit board 900 by a sixth adhesive layer. The first module and the second module may be a high light transmission panel or the like.
本技術方案製作的軟性電路板900，其中的第一導電線路圖形920可以透過軟性電路板900的高透光的第二介電層932及第三膠層931被較清晰的觀測到，其中的第二導電線路圖形922可以透過軟性電路板900的高透光的第三介電層942及第四膠層941被較清晰的觀測到。另外，為了使形成的導電線路圖形的透明感更強，還可以在所述覆銅基板910的所述第一銅箔層911的與所述第一膠層912相貼的第一表面及與所述第一表面相對的第二表面分別形成黑化層，以及在所述第二銅箔層915的與所述第二膠層914相貼的第三表面及與所述第三表面相對的第四表面分別形成黑化層。The flexible circuit board 900 manufactured by the present technical solution, wherein the first conductive line pattern 920 can be clearly observed through the high-transmission second dielectric layer 932 and the third adhesive layer 931 of the flexible circuit board 900, wherein The second conductive trace pattern 922 can be clearly observed through the highly transparent third dielectric layer 942 and the fourth adhesive layer 941 of the flexible circuit board 900. In addition, in order to make the formed conductive pattern more transparent, the first surface of the first copper foil layer 911 of the copper clad substrate 910 and the first adhesive layer 912 may be attached to and The opposite second surface of the first surface respectively forms a blackening layer, and a third surface of the second copper foil layer 915 that is adjacent to the second adhesive layer 914 and opposite to the third surface The fourth surface forms a blackening layer, respectively.
於相較於先前技術，本技術方案提供的軟性電路板及製作方法採用的PEN作為介電層，且採用低溫錫膏層焊接電子零件，因PEN的耐熱性能比PET的耐熱性能好，及低溫錫膏的熔點較低，從而使得所述軟性電路板100、900上可以焊接零件，並且還可以使所述軟性電路板100、900與模組相黏結，從而擴大了軟性電路板的使用範圍。Compared with the prior art, the flexible circuit board and the manufacturing method provided by the technical solution adopt PEN as a dielectric layer, and the low-temperature solder paste layer is used for soldering electronic parts, because the heat resistance of PEN is better than that of PET, and the low temperature is low. The solder paste has a lower melting point, so that the flexible circuit boards 100, 900 can be soldered to the components, and the flexible circuit boards 100, 900 can also be bonded to the module, thereby expanding the range of use of the flexible circuit board.
惟，以上所述者僅為本發明之較佳實施方式，自不能以此限制本案之請求項。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下請求項內。However, the above description is only a preferred embodiment of the present invention, and the claim of the present invention cannot be limited thereby. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included in the following claims.
110,910‧‧‧覆銅基板110,910‧‧‧Copper-clad substrate
111‧‧‧銅箔層111‧‧‧copper layer
112,912‧‧‧第一膠層112,912‧‧‧First layer
113,913‧‧‧第一介電層113,913‧‧‧First dielectric layer
120‧‧‧導電線路圖形120‧‧‧ conductive circuit graphics
101,901‧‧‧電路基板101,901‧‧‧ circuit substrate
130‧‧‧覆蓋膜130‧‧‧ Cover film
131,914‧‧‧第二膠層131,914‧‧‧Second layer
132,932‧‧‧第二介電層132,932‧‧‧second dielectric layer
133,933‧‧‧開口133,933‧‧‧ openings
121,921‧‧‧焊墊121,921‧‧‧ solder pads
140,950‧‧‧低溫錫膏層140,950‧‧‧low temperature solder paste layer
150,960‧‧‧電子零件150,960‧‧‧Electronic parts
100,900‧‧‧軟性電路板100,900‧‧‧Soft circuit board
911‧‧‧第一銅箔層911‧‧‧First copper foil layer
915‧‧‧第二銅箔層915‧‧‧Second copper foil layer
916‧‧‧導電通孔916‧‧‧ conductive through hole
917‧‧‧第一面銅917‧‧‧First copper
918‧‧‧第二面銅918‧‧‧Second copper
920‧‧‧第一導電線路圖形920‧‧‧First conductive line pattern
922‧‧‧第二導電線路圖形922‧‧‧Second conductive line pattern
930‧‧‧第一覆蓋膜930‧‧‧First cover film
940‧‧‧第二覆蓋膜940‧‧‧second cover film
931‧‧‧第三膠層931‧‧‧ third layer
941‧‧‧第四膠層941‧‧‧ fourth layer
942‧‧‧第三介電層942‧‧‧ Third dielectric layer
無no
912‧‧‧第一膠層 912‧‧‧First layer
913‧‧‧第一介電層 913‧‧‧First dielectric layer
914‧‧‧第二膠層 914‧‧‧Second rubber layer
932‧‧‧第二介電層 932‧‧‧Second dielectric layer
950‧‧‧低溫錫膏層 950‧‧‧low temperature solder paste layer
960‧‧‧電子零件 960‧‧‧Electronic parts
900‧‧‧軟性電路板 900‧‧‧Soft circuit board
916‧‧‧導電通孔 916‧‧‧ conductive through hole
920‧‧‧第一導電線路圖形 920‧‧‧First conductive line pattern
922‧‧‧第二導電線路圖形 922‧‧‧Second conductive line pattern
930‧‧‧第一覆蓋膜 930‧‧‧First cover film
940‧‧‧第二覆蓋膜 940‧‧‧second cover film
931‧‧‧第三膠層 931‧‧‧ third layer
941‧‧‧第四膠層 941‧‧‧ fourth layer
942‧‧‧第三介電層 942‧‧‧ Third dielectric layer
Claims (10)
提供覆銅基板，所述覆銅基板包括第一銅箔層及第一介電層，所述第一介電層的材質為聚萘二甲酸乙二醇酯；
將所述第一銅箔層製作形成第一導電線路圖形；
於所述第一導電線路圖形的一側形成覆蓋膜，所述覆蓋膜具有至少一個貫通所述覆蓋膜的開口，部分所述第一導電線路圖形從所述開口中暴露出來，從所述開口中暴露出來的所述第一導電線路圖形形成焊墊；以及
在所述焊墊上形成低溫錫膏層，並將一電子零件焊接於所述低溫錫膏層，所述電子零件藉由所述低溫錫膏層與所述焊墊電連接，從而得到軟性電路板，其中，焊接所述電子零件時設定焊接的最高溫度在所述第一介電層的耐熱溫度範圍內。A method for manufacturing a flexible circuit board, comprising the steps of:
Providing a copper-clad substrate, the copper-clad substrate comprises a first copper foil layer and a first dielectric layer, and the first dielectric layer is made of polyethylene naphthalate;
Forming the first copper foil layer to form a first conductive line pattern;
Forming a cover film on one side of the first conductive line pattern, the cover film having at least one opening penetrating the cover film, a portion of the first conductive trace pattern being exposed from the opening, from the opening Forming the first conductive line pattern exposed to form a solder pad; forming a low temperature solder paste layer on the solder pad, and soldering an electronic component to the low temperature solder paste layer, wherein the electronic component is cooled by the low temperature A solder paste layer is electrically connected to the pad to obtain a flexible circuit board, wherein a soldering of the electronic component sets a maximum temperature of soldering within a heat resistant temperature range of the first dielectric layer.
The flexible circuit board of claim 7, wherein the conductive circuit pattern and the first dielectric layer further comprise a first adhesive layer, and the first adhesive layer is made of epoxy acrylate. Resin or epoxy resin.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310371567.5A CN104427755A (en) | 2013-08-23 | 2013-08-23 | Flexible circuit board and manufacturing method thereof |
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| TW201509257A true TW201509257A (en) | 2015-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW102131934A TW201509257A (en) | 2013-08-23 | 2013-09-05 | Flexible printed circuit board and method for manufacturing same |
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| CN (1) | CN104427755A (en) |
| TW (1) | TW201509257A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI725748B (en) * | 2020-02-21 | 2021-04-21 | 達方電子股份有限公司 | Flexible circuit board connection tail and membrane circuit board |
| TWI725750B (en) * | 2020-02-21 | 2021-04-21 | 達方電子股份有限公司 | Membrane circuit board |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107831610A (en) * | 2017-10-26 | 2018-03-23 | 惠科股份有限公司 | Signal transmitting apparatus and display device |
| CN107831609A (en) * | 2017-10-26 | 2018-03-23 | 惠科股份有限公司 | The manufacture method of signal transmitting apparatus and the manufacture method of display device |
| CN110636702B (en) * | 2018-06-21 | 2021-02-26 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN110416248B (en) * | 2019-08-06 | 2022-11-04 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN113573497A (en) * | 2020-04-29 | 2021-10-29 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN114143980A (en) * | 2020-09-04 | 2022-03-04 | 庆鼎精密电子（淮安）有限公司 | Circuit board connecting structure and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070090170A1 (en) * | 2005-10-20 | 2007-04-26 | Endicott Interconnect Technologies, Inc. | Method of making a circuitized substrate having a plurality of solder connection sites thereon |
| JP5517019B2 (en) * | 2008-05-26 | 2014-06-11 | 住友金属鉱山株式会社 | Printed wiring board and method for manufacturing printed wiring board |
| CN102340937B (en) * | 2010-07-22 | 2013-06-12 | 富葵精密组件(深圳)有限公司 | Manufacturing method of flexible multi-layer circuit board |
-
2013
- 2013-08-23 CN CN201310371567.5A patent/CN104427755A/en active Pending
- 2013-09-05 TW TW102131934A patent/TW201509257A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI725748B (en) * | 2020-02-21 | 2021-04-21 | 達方電子股份有限公司 | Flexible circuit board connection tail and membrane circuit board |
| TWI725750B (en) * | 2020-02-21 | 2021-04-21 | 達方電子股份有限公司 | Membrane circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104427755A (en) | 2015-03-18 |
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