CN201820758U - LED integrated structure with cooling device - Google Patents
LED integrated structure with cooling device Download PDFInfo
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- CN201820758U CN201820758U CN2010205361817U CN201020536181U CN201820758U CN 201820758 U CN201820758 U CN 201820758U CN 2010205361817 U CN2010205361817 U CN 2010205361817U CN 201020536181 U CN201020536181 U CN 201020536181U CN 201820758 U CN201820758 U CN 201820758U
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0083—Array of reflectors for a cluster of light sources, e.g. arrangement of multiple light sources in one plane
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The utility model provides a light emitting diode (LED) integrated structure with a cooling device. The structure comprises a radiating substrate and an LED chip, wherein the LED chip is fixed on the radiating substrate; the cooling device comprises a radiating liquid accommodating tank which is arranged at one side of the radiating substrate departing from the LED chip, and a liquid cooling medium which is sealed in the radiating liquid accommodating tank; the LED chip and the liquid cooling medium are separated by the radiating substrate, and the back side of the LED chip is completely covered by the liquid cooling medium; the side of the radiating substrate departing from the LED chip is directly contacted with the liquid cooling medium and is in a liquid seal together with the liquid cooling medium, and the liquid cooling medium contacted with the radiating substrate is merged into a piece. The LED integrated structure with the cooling device has the advantages that: the liquid cooling medium can meet the cooling requirement without being exchanged with the outside; and flowing between cold liquid and hot liquid can be completed only based on different specific weights of the cold liquid and the hot liquid, without needing any liquid driving channel device. The invention has a simple structure, and has better cooling effect compared with the prior art in which the radiating substrate is directly contacted with the air.
Description
Technical field
The utility model relates to and a kind ofly is used to throw light on, the LED integrated morphology that has cooling device of backlight source module, television set, LED dot matrix display screen, projector equipment etc., particularly relates to a kind of cooling device of high-power LED integrated morphology.
Background technology
Led light source, high-power LED light source particularly, heat is concentrated when luminous, if untimely the distributing of heat that led chip produces, the temperature of led light source is too high, will cause the light efficiency of LED to reduce, the life-span is low etc., therefore the heat that how led chip is produced when luminous has effectively distributed the bottleneck into the popularization and application led light source rapidly.How to improve the light efficiency of led light source, thereby and the heat dispersion that how to improve led light source increase the service life, be the important technology difficult problem on the present industry.The heat dissipation problem of existing solution led light source, a kind of scheme are to improve LED integrated morphology, easier the distributing of heat that led light source is produced, and another kind of scheme is to increase cooling structure.
The integrated again mode of single individual LED luminous tube that existing great power LED integrated morphology commonly used adopts support to be packaged into usually.
Application number is in 200810135621.5 the patent of invention, disclose a kind of encapsulation device of light emitting diode, cooling base and electrode suppor combination and method thereof, this encapsulation device of light emitting diode comprises: cooling base, an electrode suppor, locating unit and a cladding of crystal grain contact placement are made and supplied to a LED crystal particle, by high heat-conducting.Cooling base is made by metal or ceramic contour heat-conducting, comprises the depressed part of chassis, body and body end face.Crystal grain places the bottom surface of depressed part.Electrode suppor is gone out moulding by metal material, comprises that a substrate and a vacancy section periphery from substrate extend axially and define the location wall of an accommodation space.Positioning unit be located at cooling base and electrode suppor at least one of them, with so that the cooling base inlay card be fixed in the accommodation space of this electrode suppor.This positioning unit can be to comprise that at least one from the trip salient point that the location of this electrode suppor wall internal face protrudes, also can be to comprise a flange that radially outward protrudes out from the nearly end face of this cooling base place.Cladding is made with injection molding method, and the cooling base that mutual inlay card is fixing partly coats with electrode suppor and combines.
Existing this encapsulation device of light emitting diode, cooling base and electrode suppor combination and method thereof exist following defective and deficiency:
1) crystal grain is made first radiator by the cooling base of stepped cylindrical, because the not direct ingress of air of the cooling base of column dispels the heat, and it has the solid length of certain metal, owing to need long metal heat loss through conduction apart from heat being distributed in air, and the contact area of cooling base and air is little, so the heat that crystal grain produces when luminous can play hot polymerization collection effect.In order to improve heat dispersion, this cooling base generally also need design heat sinks such as the metal of other high heat dispersion that contact with the conduction of cooling base direct heat or pottery, finally dispels the heat through heat sink.This mode has increased the distance of heat conducting and radiating on the one hand, on the other hand because cooling base and heat sink adhere to two parts separately, both just are to use heat-conducting glue to be bonded together also still huge thermal resistance, basically here temperature is very high can to keep cooling base when crystal grain is luminous, heat sink is temperature and the similar phenomenon of ambient temperature here, do not reach the purpose that the heat on the cooling base is distributed rapidly, radiating effect is very poor.
2) because the cooling base of many columns and electrode suppor etc. are again different parts with heat sink, so the many complex structures of part, thickness is thicker, be unfavorable for assembling, cost is also high; The electric connection of light-emitting diode and Butut circuit conductive layer need be passed through electrode suppor, complex structure, and the thermal resistance of intermediate link is many, has reduced the luminous efficiency and the radiating efficiency of led chip.
Application number is 200720172030 to disclose a kind of encapsulating structure of pinned great power LED device, comprises LED wafer, lens, printing pcb board, metal heat sink body, gold thread and pin; The metal heat sink body comprises the boss on pedestal and this pedestal, and the upper surface area of pedestal is 2 times of upper surface area of boss at least; Printing pcb board and pedestal are glued together; Pedestal below the printing pcb board is provided with through hole, is electrically connected with the printing pcb board by this through-hole pins; Lens cap button LED wafer cements on the printing pcb board with the printing pcb board and by process for filling colloid into.This powerful pinned great power LED device, though increased the pedestal area of metal heat sink body, but radiating effect still is relatively poor, even dispose radiator in addition, the heat on the led chip must be conducted on boss and the pedestal during owing to heat radiation, pass to the metal heat sink body again, conduct to radiator by the metal heat sink body again, because heat conduction has increased intermediate link, and the very long heat-transfer path of very thick metal heat transfer body correspondence, therefore thermal resistance is very high, and heat-conducting effect is very poor.Also have lens to be buckled on the printing pcb board by cover earlier, coming cementation by encapsulating again is to be difficult to realize, because lens are buckled in very difficult accurate positioning when printing on the pcb board by cover earlier, and lens is shifted during encapsulating, and lens position can't accurately define.Pin will be electrically connected and pass printing pcb board and metal heat sink body with the Butut circuit of printing pcb board top, processed complex, technology difficulty is big, and the LED wafer need pass through electrode suppor with the electric connection of printing the Butut circuit on the PCB, complex structure, the thermal resistance of intermediate link is many.
For the heat dissipation problem of the integrated morphology that solves existing great power LED, COB (the Chip on Board) package design of LED integrated morphology has been proposed in the prior art.Compare with existing stand type LED integrated morphology, because this invention directly is fixed on chip on the substrate by elargol or eutectic solder etc., the thermal resistance that can cut down the number of intermediate links to greatest extent, thus the thermal resistance of led chip p-n junction reduced to external environment condition, can improve radiating efficiency and luminous efficiency.The advantage of this COB (Chip on Board) package design is that the electrode of each led chip all goes between directly by bonding electrode and metal pad forms ohmic contact, the formation of LED multi-path chip array is to realize electrically interconnected by the arrangements of electric connection of heat-radiating substrate and led chip, the connection in series-parallel of led chip can be realized, reliability of products and qualification rate can be improved again.And overall dimension is little, and thin thickness is easy to assembling, the occasion of can be used for throwing light on, display instrument etc. being had relatively high expectations to the light source fitted position.This package design mainly contains following several mode:
Application number is in 200920112089.5 the patent of invention, a kind of high-power LED street lamp device of COB encapsulation is disclosed, comprise lens, silica gel, gold thread, chip, heating panel etc., heating panel is provided with 5-50 boss, chip directly is fixed on the boss of heating panel, distributes by the fin on heating panel and the heating panel again.The high-power LED street lamp of this structure, though radiating effect is better, owing to there is not the plastic parts of positioning lens or molded lens, the location of lens is inaccurate, silica gel comes packaged chip on the pre-point in lens, the silica gel consumption is big on the one hand, particularly uses this packaged type, has bubble to produce after encapsulation silica gel solidifies, have a strong impact on the luminous mass of led chip, the light that can cause coming out has hot spot, and optics birth defects such as shade are unfavorable for the optical secondary optimization exploitation of led light source.
Application number is in the patent of invention of 200820214808.X, a kind of high-power LED encapsulation structure of efficiency heat-dissipating luminous high is disclosed, comprise lens, substrate and LED luminescence chip, lens are fixed in upper surface of base plate, the lens lower surface is provided with the installation depression that raises up, the LED luminescence chip places upper surface of base plate and is mounted the depression buckle closure, just be provided with at the upper surface of base plate that depression institute buckle closure is installed, negative lighting electrode, lighting electrode is connected by metal wire with the LED luminescence chip, upper surface of base plate is provided with lighting electrode and just links to each other, negative connection electrode, bonding by the adhesive layer of annular between lens lower surface that the depression outside is installed and upper surface of base plate, fill with silica gel at the endoporus of adhesive layer with installing in the formed cavity of depression, offer on the substrate to the endoporus of adhesive layer with the formed cavity of depression is installed in the glue injection channel that is communicated with, and lens become by the crystal polymorph system with substrate.The high-power LED encapsulation structure of this structure, shortcoming one are the fixing by the adhesive layer bonding of lens and substrate, and bonding is fixing not firm; Shortcoming two is detent mechanisms of no positioning lens, and lens are located by with substrate bonding the time, locatees inaccurately, and lens position is departed from; Shortcoming three is that lens are fixed on the substrate by tack coat, and tack coat stops up glue injection channel easily, influence injection silica gel; Shortcoming four is that the metal wire that electrically connects the LED luminescence chip needs and is fixed on the substrate and places the lighting electrode in the installation depressed part of lens to electrically connect, lighting electrode electrically connects with connection electrode again, connection electrode electrically connects with Butut circuit conductive layer again, the thermal resistance of intermediate link is many, influences radiating efficiency and luminous efficiency.
Application number is in 200420112507.8 the patent of invention, a kind of great power LED light-emitting diode is disclosed, comprise aluminium base, elargol, wafer, gold thread, the reflection lid, aluminium base is a convex-concave bowl cup-shaped, promptly there is a circular groove bottom surface at heart place therein, one bowl of cup-shaped boss is arranged above corresponding with it, plastic frame is housed on the boss, plastic frame is circular, the center is provided with circular hole, with the concentric twice groove that has of circular hole, inside and outside formation is hanged down high twice convex edge, and the bottom surface is arranged with two cylinder pin, and be contained in bowl circular hole on cup-shaped boss both sides, the less flat cover that approaches of cambered surface cover in reflection, and its time bead scribbles bonding glue, dress in the groove of plastic frame.The plastic frame bottom surface scribbles adhesive glue water, is filled with glue in it.It is less that bottom surface distance H value is covered in luminous element wafer and reflection.Aluminium base can be a plum blossom shape, also can be circular.The number of assembling steps of this patent is, earlier elargol is clicked and entered in the aluminium base boss shape bowl cup, again wafer is fixed on the elargol, put into 145C ° of baking box baking 1 hour, weld gold thread then, the both positive and negative polarity of eyeglass is welded on the aluminium base both positive and negative polarity with gold thread respectively, with bonding glue on the plastic frame coated on bottom side, insert in the aluminium base location hole, glue is filled in the plastic frame toasts, to reflect lid again and coat bonding glue, can use in the groove of the plastic frame of packing into.The shortcoming one of this patent is plastic frame and aluminium base to be fixed by bonding glue, in follow-up potting process, and non-refractory, its reliability of fixation can be subjected to very big influence under hot conditions; Shortcoming two is not inject the passage of filling glue on plastic frame, just needs to fill glue before dress reflection lid, if do not use mould, the shape of glue is uncontrollable, if use mould to fill glue, cost height; Shortcoming three is to fill reflection to be covered behind the glue to coat pack into the groove internal fixation of plastic frame of bonding glue again, fixing so on the one hand unreliable, the position relation is fixing inaccurate, in addition can be gapped between reflection lid and glue, have air in the gap, just have air in the reflection lid, influence the illumination effect of light-emitting diode greatly.Also having the aluminium base in this patent of invention is the bowl cup-shaped, has only a boss on it, gold thread electrically connects the both positive and negative polarity of aluminium base, from its literal and the disclosed content of figure, the both positive and negative polarity of aluminium base can not be a Butut circuit conductive layer, but is as disclosed lighting electrode or stent-type pin etc. in the 200820214808.X patent.
Existing by increasing the heat dissipation problem that cooling device improves LED integrated morphology, commonly used is to adopt the coolant flow channel heat radiation.In the patent No. is 200820134860.4 utility model patent, disclose a kind of radiator structure and had the led lamp of this radiator structure, the radiator structure of this utility model includes a cavity, be equipped with a cooling solution therebetween, and be provided with the even number dividing plate, to form a runner, this runner is communicated with in the mode of S shape, and has at least one heat extraction district, at least one heat affected zone and at least one buffering area.Though this utility model is provided with coolant flow channel, but both do not driven the liquid cooling medium flow device and made the interior cold and hot quick exchange of liquid cooling medium of runner, again because the heat extraction district places the both sides of cavity, the runner of one side of coolant flow channel contact light-emitting diode does not join together, therefore the liquid cooling medium in the runner also is difficult to utilize the different proportion of liquid cooling medium to carry out the quick exchange of cold and hot liquids coolant, the cold and hot exchange overwhelming majority of liquid cooling medium is to lean on the heat conduction of liquid cooling medium to exchange, place the heat extraction district area of dissipation of both sides of cavity again little, when the heat of led chip generation is dispersed in the liquid cooling medium, because the heat of liquid cooling medium itself is difficult to distribute, the cold and hot exchange of liquid cooling medium is very slow again, and is therefore bad to the cooling effect of led chip.
The utility model content
Bad for the cooling device cooling effect that solves existing LED integrated morphology, use that uneconomic problem, the technical problems to be solved in the utility model are to provide that a kind of different specific weight, coolant of mobile dependence cold and hot liquids coolant of liquid cooling medium do not need with external world's exchange, heat exchange is fast, cooling effectiveness is high, good cooling results, the LED integrated morphology that has cooling device simple in structure.
A kind of LED integrated morphology that has cooling device, comprise heat-radiating substrate, led chip, led chip and heat-radiating substrate are fixed, and cooling device comprises the radiator liquid storage box that is arranged on heat-radiating substrate and deviates from led chip one side, is sealed in the liquid cooling medium in the radiator liquid storage box; Heat-radiating substrate is with led chip and liquid cooling medium is isolated and the back side of led chip is covered by liquid cooling medium fully; The side that heat-radiating substrate deviates from led chip directly contact with liquid cooling medium and with the liquid cooling medium liquid sealing, the liquid cooling medium of contact heat-radiating substrate joins together.
As first kind of improvement of scheme one, cooling device also comprises refrigerating plant, and the radiator liquid storage box tilts or vertical level arranges that the heat absorbing end of refrigerating plant places the top of radiator liquid storage box.
As second kind of improvement of scheme one, extend at the outer surface of radiator liquid storage box and to be provided with the heat radiation protuberance, in the heat radiation protuberance, be provided with the shrinkage pool that is communicated with the radiator liquid storage box, in shrinkage pool, be filled with liquid cooling medium; The outer surface of radiator liquid storage box contacts with air with the outer surface of heat radiation protuberance.
As the improvement of scheme three, the shrinkage pool in the heat radiation protuberance tilts or vertical level, and led chip places the below of radiator liquid storage box.
Improvement as scheme three or scheme four, LED integrated morphology also comprises lens, the plastic parts of positioning lens or molded lens, be electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, it is characterized in that: on the plastic parts of positioning lens or molded lens, be provided with one or more first through hole, on the end face of the plastic parts of positioning lens or molded lens, extend and be provided with fixed leg, on heat-radiating substrate, be provided with second through hole that cooperates with fixed leg, fixed leg passes second through hole of heat-radiating substrate, is provided with the blocking part in the end of fixed leg; The plastic parts of positioning lens or molded lens is fixed by fixed leg and blocking part and heat-radiating substrate; Led chip directly is fixed on the heat-radiating substrate by solid brilliant technology, and places in the first corresponding through hole; Butut circuit conductive layer stretches between the sidewall and led chip of first through hole, and lead places in first through hole, and lead one end is electrically connected with the electrode of led chip, and the other end of lead and first through hole are electrically connected with Butut circuit conductive layer between the led chip.
As first kind of improvement of scheme five, on heat-radiating substrate, be provided with and the integrated one or more boss of heat-radiating substrate, led chip directly is fixed on the end face of boss by solid brilliant technology; Boss places in the first corresponding through hole.
Second kind of improvement as scheme five, LED integrated morphology also comprises pcb board, Butut circuit conductive layer is set directly on the pcb board, on pcb board, be provided with the third through-hole that cooperates with fixed leg, fixed leg passes third through-hole on the pcb board and the fourth hole on the heat-radiating substrate successively, heat-radiating substrate, pcb board are placed in the mould of plastic parts of moulding positioning lens or molded lens by heat again, when the plastic parts of moulding positioning lens or molded lens, form the blocking part.
Improve as the third of scheme five, LED integrated morphology also comprises and is used for the packing colloid of packaging LED chips and lead; Lens are by with the first through hole tight fit or be fixed on by edging machine hot pressing on the plastic parts of positioning lens or molded lens; The position of corresponding first through hole is provided with the glue injection channel of injecting packing colloid on the plastic parts of positioning lens or molded lens, the Jiao Kou of glue injection channel places on the end face of plastic parts away from blocking part one side of positioning lens or molded lens, and Jiao Kou and glue injection channel are communicated with the madial wall of first through hole; After injecting packing colloid, packing colloid is further fixed lens; The blocking part of moulding fixed leg end during the plastic parts of inherent moulding positioning lens of the mould of the plastic parts by heat-radiating substrate being placed moulding positioning lens or molded lens or molded lens.
As the 4th kind of improvement of scheme five, lens are the packing colloid of packaging LED chips and lead; The blocking part of moulding fixed leg end during the plastic parts of inherent moulding positioning lens of the mould of the plastic parts by heat-radiating substrate being placed moulding positioning lens or molded lens or molded lens.
As the 5th kind of improvement of scheme five, the plastic parts of positioning lens or molded lens is a teething ring, is fixed with two or more separate teething rings on heat-radiating substrate.
The 6th kind of improvement as scheme five, the plastic parts of positioning lens or molded lens comprises teething ring and will set the dowel with the teething ring injection mo(u)lding that the teething ring of number links together that the plastic parts of positioning lens or molded lens comprises two or more teething rings.
As the 7th kind of improvement of scheme five, the plastic parts of positioning lens or molded lens is tabular, is provided with two or more first through holes on the plastic parts of positioning lens or molded lens.
Compared with prior art, Ben beneficial effect is:
1, adopt the radiator liquid storage box, can ccontaining a large amount of liquid cooling medium in the radiator liquid storage box, liquid cooling medium does not need the liquid cooling medium with the outside just to exchange can satisfy the cooling needs; The liquid cooling medium of contact heat-radiating substrate joins together, and the coolant of contact heat-radiating substrate is not spaced, and flowing between the cold and hot liquids only needs to rely on the different specific weight of cold and hot liquids to finish, and do not need any driving liquid flow device, and be simple in structure; The heat transferred that led chip produces is to heat-radiating substrate, liquid cooling medium absorbs the heat of heat-radiating substrate and by the different specific weight generation heat exchange of heat conduction and cold and hot liquids is mobile the heat of heat-radiating substrate is taken away rapidly, therefore heat exchange is faster, can take away the heat that produces by led chip faster and more, therefore contact with air than heat-radiating substrate is direct, cooling effect is better.
2, the radiator liquid storage box tilts or the vertical level layout, the heat absorbing end of refrigerating plant places the top of radiator liquid storage box, make cold liquid cooling medium always place the top layer of radiator liquid storage box, because the proportion of cold coolant is greater than the proportion of the coolant of heat, therefore the liquid cooling medium in the radiator liquid storage box produces the exchange of cold and hot medium automatically fast, thereby make the simple in structure of cooling device, do not need to drive the coolant flow device.On other led light sources that this structure can be mainly used on the LED-backlit source or heat-radiating substrate tilts or vertical level is installed.
3, heat radiation protuberance, increase and the air contact area, in the shrinkage pool of heat radiation protuberance, be filled with liquid cooling medium, increase the contact area of liquid cooling medium and radiator liquid storage box and heat radiation protuberance, make the liquid cooling medium in the radiator liquid storage box faster with extraneous heat exchange, radiating effect is better.
4, the temperature of the liquid cooling medium of close led chip position always is higher than the temperature of other liquid cooling medium.Led chip places the below of radiator liquid storage box, so the high coolant of temperature always places the bottom of liquid cools case.Liquid cooling medium in the shrinkage pool of heat radiation protuberance is because protuberance and air contact area are very big, rapid heat dissipation, so temperature always is lower than the temperature of the liquid cooling medium of other position.Shrinkage pool and horizontal plane in the heat radiation protuberance are not parallel, because the proportion of cold coolant is greater than the proportion of the coolant of heat, therefore the liquid cooling medium in the radiator liquid storage box produces the exchange of coolant automatically fast, thereby make the simple in structure of cooling device, do not need to drive the coolant flow device.
5, led chip directly directly is fixed on the heat-radiating substrate by solid brilliant technology, the side that heat-radiating substrate deviates from led chip directly contacts with heat radiation gas or radiator liquid, the heat-radiating substrate of this structure is a thin plate, and the thickness range of heat-radiating substrate is generally in 0.2mm to 5mm.This COB (the Chip on Board) package design that has the LED integrated morphology of cooling device, compare with the existing LED integrated morphology that has cooling device, because this directly is fixed on led chip on the heat-radiating substrate by elargol or eutectic solder etc., the heat that led chip when work produces through the very thin heat-conducting layer of heat-radiating substrate just directly with dispel the heat gas such as air contacts or contact with radiator liquid, the heat of contact heat-radiating substrate is because hot cold air or fluid density difference flowing effect are pulled away rapidly, thereby take away the heat of substrate, the thermal resistance that can cut down the number of intermediate links to greatest extent, significantly reduce the heat-transfer path distance of led chip p-n junction heat generating part, thereby significantly reduce thermal resistance to extraneous air environment or radiator liquid.
6, owing to be equipped with the plastic parts of positioning lens or molded lens, Butut circuit conductive layer can stretch in the plastic parts of positioning lens or molded lens, lead can directly be electrically connected with Butut circuit conductive layer on the one hand, no longer need lead to be connected with Butut circuit conductive layer or to pass with Butut circuit conductive layer from the heat-radiating substrate that deviates from led chip to be connected by leg by the conducting metal support, the thermal resistance that simplifies the structure and cut down the number of intermediate links to greatest extent, good heat dissipation effect; No longer need weld metal support or leg to be electrically connected on the other hand, do not need Reflow Soldering or wave-soldering, so packing colloid can be with resin or silica gel etc. with Butut circuit conductive layer; But also can guarantee that led chip, electrical connecting wire and two welding ends can not be exposed in the air long-life that helps using.And when needing Reflow Soldering or wave-soldering, because the temperature of Reflow Soldering or wave-soldering is generally at 250C ° or 280C °, packing colloid just cannot use resin.Because the price of silica gel is higher than resin far away, therefore light transmission originally can further save cost than resin difference, improves the optical property of led chip.The advantage of this COB package design is that the electrode of each led chip 2 all passes through the direct and Butut circuit conductive layer formation ohmic contact of bonding lead, the formation of LED multi-path chip array is to realize electrical interconnection by the arrangements of electric connection of heat-radiating substrate and led chip, the connection in series-parallel of led chip can be realized, reliability of products and production qualification rate can be improved again.
7, be provided with on heat-radiating substrate and the integrated a plurality of chip fixing lug boss of heat-radiating substrate, greater than the area at chip fixing lug boss top, led chip directly is fixed on the chip fixing lug boss by solid crystal type the area of heat-radiating substrate greatly.Significantly reducing heat that led chip produces so on the one hand distributes in heat radiation gas and is the intermediate path distance in the air or in the radiator liquid and has increased greatly and the contact area of the radiator liquid and the gas that dispels the heat, significantly reduced the heat localization effect, can improve radiating efficiency greatly and make chip remain in suitable working temperature, thereby keep long-life and effective luminous efficiency of chip.Chip fixing lug boss and heat-radiating substrate are one-body molded, therefore the heat of chip generation only just directly distributes in air through heat-radiating substrate, so thermal resistance is little, radiating rate is fast, must not dispel the heat by other heat sink, radiating effect is just fairly good because the chip fixing lug boss is arranged, and makes the shade of keeping out of light that electrical connecting wire sends led chip drop to minimumly, is beneficial to optical secondary optimization! Saved existing led support, just saved the heat radiating metal spare in the led support, and multilayer intermediate link such as electrode metal pin, especially avoided the high thermal resistance that produces between two parts of heat radiating metal spare and heat-radiating substrate, therefore thermal resistance is little, and the fast good heat dissipation effect of heat conduction is simple and reliable for structure, especially one-body molded design and the assembly technology that more helps light source of chip fixing lug boss and heat-radiating substrate saved cost again.Therefore this is simple and reliable for structure, and part is few, and thin thickness is easy to assembling, is specially adapted to the powerful occasion of light source requirements.
When 8, Butut circuit conductive layer was arranged on the pcb board, the plastic parts of positioning lens or molded lens can realize that again a heat-radiating substrate, pcb board are fixed together.Use pcb board, be convenient to the layout-design of the circuit of Butut circuit conductive layer, save original circuit layout and covered complicated manufacturing process on heat-radiating substrate, used very ripe pcb board, provide cost savings greatly, not only simplified technology but also improved the reliability and the design flexibility of Butut circuit conductive layer.Pcb board has heat-blocking action simultaneously, and the heat that is more conducive on the heat-radiating substrate distributes along a side that contacts with air.
9, the Jiao Kou of glue injection channel places on the end face of plastic cement lens position part away from blocking part one side, and glue injection channel is communicated with the madial wall of plastic cement lens position part, is convenient to injecting glue; Because plastic cement lens position part is a plastic parts, so Jiao Kou and glue injection channel easy-formation.Before injecting packing colloid, lens and plastic cement lens position part tight fit or hot pressing are fixed, the fixing earlier encapsulation again of lens like this, when packaging LED chips, lens can not be shifted, help encapsulating and curing process, it is more reliable particularly to fix lens than existing by the cohesive force by silica gel etc.When packaging LED chips, earlier chip is fixed on the heat-radiating substrate chip fixing lug boss by solid crystal type, weld electrical connecting wire again, and then installation lens, in vacuumizing environment, carry out injecting glue by the gum-injecting port on the plastic cement lens position part, therefore, the accurate installation of the lens position when plastic cement lens position part can be realized encapsulating, and by vacuumize and injecting glue after lens, led chip, electrical connecting wire and two welding ends, heat-radiating substrate and chip fixing lug boss thereof are solidified togather, this structure can be implemented in to vacuumize when particularly encapsulating does not have the bubble generation when packing colloid solidifies under the environment, luminous mass to led chip plays important guarantee effect, the light that can not cause coming out has hot spot, optics birth defects such as shade; Owing to there has not been the optics birth defect of the led chip luminous mass of bubble generation, more help the optical secondary optimization exploitation of led light source, plastic cement lens position part makes lens easy for installation accurately fixing and reliably fixing with realization lens installation site, the gathering of light efficiency is beneficial to the double optimization of optics, final realization optical effect is good, the loading of silica gel was few when plastic cement lens position part and lens made injecting glue again simultaneously, can reduce cost.
10, during the plastic parts of inherent moulding positioning lens of the mould of the plastic parts of the plastic parts of positioning lens or molded lens by heat-radiating substrate being placed moulding positioning lens or molded lens or molded lens the moulding blocking part with heat-radiating substrate location and fixing, fixing reliable, in follow-up potting process, can be high temperature resistant, its reliability of fixation can be not influenced yet under hot conditions.The plastic parts of positioning lens or molded lens by when the plastic parts of injection molded positioning lens or molded lens and heat-radiating substrate fix, save on the one hand plastic parts with positioning lens or molded lens and be installed to installation procedure on the heat-radiating substrate, be provided with for a heat-radiating substrate under the situation of plastic parts of a plurality of positioning lens or molded lens, saved production cost greatly, the plastic parts of positioning lens or molded lens and heat-radiating substrate are axially on the other hand, all there is not the gap in radial direction, even the coolant of liquid also can directly contact with heat-radiating substrate, improve cooling effect, and it is fixing very reliable, position relation between the plastic parts of heat-radiating substrate and positioning lens or molded lens can be very accurate, lens installation site size on the plastic parts of positioning lens or molded lens can be very accurate, thereby improve the optical effect of the LED integrated morphology that has cooling device.
11, chip places in the single plastic cement lens position ring, and the plastic cement consumption significantly reduces when the plastic parts of moulding positioning lens or molded lens, reduces cost.Lens are fixed on the plastic parts of positioning lens or molded lens by tight fit or hot pressing mode, the fixing earlier encapsulation again of lens like this, when packaging LED chips, lens can not be shifted, help encapsulating and curing process, it is more reliable particularly to fix lens than existing by the cohesive force by silica gel etc.
12, when the whole plastic cement locating rings on the heat-radiating substrate can be in injection moulding, connect into the positioning lens of an integral body or the plastic parts of molded lens by dowel; The plastic parts when injection moulding that also the part lens position ring on the heat-radiating substrate can be connected as a whole positioning lens or molded lens is provided with the plastic parts of two or more this positioning lens or molded lens on a heat-radiating substrate.The corresponding plastic cement lens position ring of chip fixing lug boss, the plastic cement consumption is few when forming plastic cement lens position ring, and cost is low.Connect plastic cement lens position ring as a whole by dowel, the firstth, when the plastic parts of injection mo(u)lding positioning lens or molded lens, its mould gate can be arranged on the plastic cement lens position ring or on the dowel, be convenient to the layout of mould gate and when injection moulding, be more conducive to plastic cement filling balance in the mould, and the plastic cement between the different plastic cement lens position rings flows through dowel and realizes, can reduce the quantity and the design of being convenient to mold runner of mould gate, the available two or more plastic cement lens position of a mould gate moulding ring is as can only directly designing a down gate with regard to plastic a plurality of plastic cement lens position rings under the less situation of plastic cement lens position ring number; The secondth, can reduce the number of fixed leg, need on each plastic cement locating ring, not be provided with two or more fixed legs, die manufacturing cost can be reduced so on the one hand, the consumption of plastic cement can be when the plastic parts of injection mo(u)lding positioning lens or molded lens, reduced on the other hand; The 3rd is for onesize plastic cement lens position ring, therefore the position of fixed leg design in plastic cement lens position ring and dowel boundary can be able to be increased the cross section of fixed leg; The 4th is for onesize plastic cement lens position ring, is the die cavity of moulding dowel because the die cavity thin-walled of moulding adjacent lenses locating ring is connected, and therefore can arrange more plastic cement lens position ring, the longer service life of mould in unit are; The 5th is that position relation between plastic cement lens position ring and the plastic cement lens position ring is more accurate, fixing more reliable, thereby makes the position relation between the lens more accurate, improves optical effect.
13, can only be provided with the plastic parts of a tabular positioning lens or molded lens at a heat-radiating substrate; Also can on a heat-radiating substrate, be provided with the two or more tabular positioning lens or the plastic parts of molded lens.The plastic parts of positioning lens or molded lens is tabular, the firstth, and when the plastic parts of injection mo(u)lding positioning lens or molded lens, the design of its mould gate is more flexible, is convenient to the layout of mould gate and is more conducive to plastic cement filling balance in the mould when injection moulding; The secondth, the number of fixed leg can be reduced and the cross section of fixed leg can be increased; The 3rd is can lay more lens in the unit are; The 4th is that position relation between the lens is more accurate, improves optical effect.
Description of drawings
Fig. 1 is the perspective exploded view of the utility model embodiment 1.
Fig. 2 is the perspective exploded view of the utility model embodiment 2.
Fig. 3 is the perspective exploded view that the utility model embodiment 3 only illustrates part-structure
Fig. 4 is the I portion enlarged drawing of Fig. 3.
Fig. 5 is the perspective exploded view that the utility model embodiment 4 only illustrates part-structure.
Fig. 6 is the perspective exploded view that the utility model embodiment 5 only illustrates part-structure.
Fig. 7 is the perspective exploded view of the utility model embodiment 6.
Fig. 8 is the perspective exploded view that the utility model embodiment 6 only illustrates part-structure.
Fig. 9 is the perspective exploded view of the utility model embodiment 7.
Embodiment 1
As shown in Figure 1, a kind of LED integrated morphology that has cooling device, comprise cover plate 1, reflecting plate 2, heat-radiating substrate 3, led chip 4, lens 5, lens position ring 6, be electrically connected led chip 4 electrode gold thread 7 and be electrically connected gold thread 7 Butut circuit conductive layer 8, be used for the packing colloid 9 of packaging LED chips 4 and gold thread 7.
The radiator liquid storage box of the liquid sealing that the liquid accommodation space 11 that cooling device comprises the heat sink that is provided with liquid accommodation space 11 10 that is arranged on heat-radiating substrate 3 and deviates from led chip one side, heat sink 10 and heat-radiating substrate 3 form, be sealed in the liquid cooling medium in the radiator liquid storage box.Heat-radiating substrate 3 is with led chip and liquid cooling medium is isolated and the back side of led chip is covered by liquid cooling medium fully, and the liquid cooling medium of contact heat-radiating substrate 3 joins together.The side that heat-radiating substrate 3 deviates from led chip directly contact with liquid cooling medium and with the liquid cooling medium liquid sealing.Outer surface extension at heat sink 10 is provided with heat radiation protuberance 12, is provided with the shrinkage pool 23 that is communicated with liquid accommodation space 11 in heat radiation protuberance 12, is filled with liquid cooling medium in shrinkage pool 23.The outer surface of heat sink 10 contacts with air with the outer surface of heat radiation protuberance 12.Shrinkage pool 23 vertical level in the heat radiation protuberance 12, led chip places the below of heat sink 10.
Reflecting plate 2 places on the heat-radiating substrate 3, and cover plate 1 places on the reflecting plate 2, and heat-radiating substrate 3 places on the heat sink 10.On reflecting plate 2, be provided with and lens 5 through hole 13 one to one, on cover plate 1, be equipped with and lens 5 reflector 14 one to one.Heat sink 10 is the heating panel of heat conduction.
Heat-radiating substrate 3 is stamped to form by the thin-sheet metal or the metal alloy of high heat-conducting, and its material can be stainless steel, copper, tungsten, aluminium, aluminium nitride, chromium etc. or its alloy.Heat-radiating substrate 3 comprises a flat base plate, and with a plurality of chip fixing lug boss 20 of heat-radiating substrate 3 integrated protrusion base plates, corresponding each chip fixing lug boss 20 is provided with second through hole 21 that cooperates with fixed leg 16.The cross section of chip fixing lug boss 20 is circular, and the area of the cross section of base plate greater than the area of the cross section of chip fixing lug boss 20, is more than three times or three times of area of the cross section of chip fixing lug boss 20 greatly at least.Be provided with the depressed part 22 with the concentric storing led chip 4 of chip fixing lug boss 20 at the top of chip fixing lug boss 20, the bottom surface of depressed part 22 is for placing the plane of led chip 4.A side that deviates from chip fixing lug boss 20 at heat-radiating substrate 3 is provided with and places in the chip fixing lug boss 20 the heat radiation blind hole (not shown) concentric with chip fixing lug boss 20.The side that heat-radiating substrate 3 deviates from chip fixing lug boss 20 directly contacts with cooling water.
The fixed leg 16 of lens position ring 6 passes second through hole 21 of heat-radiating substrate 3, and blocking part 17 heat-radiating substrates 3 of the end by fixed leg 16 are fixing, and heat-radiating substrate 3 and lens position ring 6 are fixed together like this.Chip fixing lug boss 20 places in first through hole 15 of corresponding lens position ring 6, Butut circuit conductive layer 8 is set directly at the side of heat-radiating substrate 3 towards boss 20, Butut circuit conductive layer 8 stretches between the madial wall and chip fixing lug boss 20 lateral walls of first through hole 15, led chip 4 directly is fixed on the end face of chip fixing lug boss 20 by solid brilliant technology, gold thread 7 places in the lens position ring 6, gold thread 7 one ends are electrically connected with the electrode of led chip 4, and the other end of gold thread 7 is electrically connected with Butut circuit conductive layer 8 in stretching into lens position ring 6; Lens 5 are installed on the lens position ring 6 and are tightly fixed with lens position ring 6.Further that lens 5 are fixing by the packing colloid 9 that glue mouth 19 and glue injection channel 18 are injected.
Embodiment 2
As shown in Figure 2, as different from Example 1, a kind of LED integrated morphology that has cooling device also comprises pcb board 60.Lens position ring 61 is selected resistant to elevated temperatures PPO+GF plastics for use.Heat-radiating substrate 66 is formed by the die casting such as pottery of high heat-conducting.Butut circuit conductive layer 62 is set directly on the pcb board 60, and Butut circuit conductive layer 62 is distributed on the same plane.Corresponding each chip fixing lug boss 63 is provided with fourth hole 64 that cooperates with chip fixing lug boss 63 and the third through-hole 65 that cooperates with fixed leg 68 on pcb board 60, pcb board 60 places heat-radiating substrate 66 to be provided with a side of chip fixing lug boss 63 and directly contacts with heat-radiating substrate 66, and the side that pcb board 60 is provided with Butut circuit conductive layer 62 deviates from the contact-making surface that contacts heat-radiating substrate 66.
The chip fixing lug boss 63 of heat-radiating substrate 66 is passed the fourth hole 64 of pcb board 60, the fixed leg 68 of lens position ring 61 pass third through-hole 65 on the pcb board 60, heat-radiating substrate 66 second through hole 67 and with second through hole, 67 liquid sealings, the end by hot melt fixed leg 68 forms blocking part 69 and fixing with pcb board 60, heat-radiating substrate 66.
As shown in Figure 3, Figure 4, as different from Example 2, plastic cement lens position ring 101 links as a whole by dowel 102.In the top depression portion 104 of chip fixing lug boss 103, be fixed with R look led chip 108, G look led chip 109, B look led chip 110 by solid brilliant technology.When heat-radiating substrate 100, pcb board 123 and plastic cement lens position ring 101 are fixed together, chip fixing lug boss 103 places in first through hole 124 of corresponding plastic cement lens position ring 101, be arranged between the lateral wall that Butut circuit conductive layer 112,114,116,118,120,122 on the pcb board 123 stretches into the madial wall of first through hole 124 and chip fixing lug boss 103 and independently of one another, gold thread 111,113,115,117,119,121 places in first through hole 124.The positive pole of the led chip 108 of R look is electrically connected by the first Butut circuit conductive layer 112 between the lateral wall of gold thread 111 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103, and the negative pole of the led chip 108 of R look is electrically connected by the Butut circuit conductive layer 114 between the lateral wall of gold thread 113 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103.The positive pole of the led chip 109 of G look is electrically connected by the Butut circuit conductive layer 116 between the lateral wall of gold thread 115 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103, and the negative pole of the led chip 109 of G look is electrically connected by the Butut circuit conductive layer 118 between the lateral wall of gold thread 117 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103.The positive pole of the led chip 110 of B look is electrically connected by the Butut circuit conductive layer 120 between the lateral wall of gold thread 119 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103, and the negative pole of the led chip 110 of B look is electrically connected by the Butut circuit conductive layer 122 between the lateral wall of gold thread 121 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103.
Embodiment 4
As shown in Figure 5, as different from Example 2, plastic cement lens position part is a lens position plastic plate 150, and the number of lens position plastic plate 150 is one.On lens position plastic plate 150, be provided with six and be used for positioning lens 154 and coat first through hole 153 of packing colloid 158 with the chip fixing lug boss 152 of heat-radiating substrate 151 cooperates one by one.Lens 154 are by being tightly fixed in first through hole 153.Extension is provided with fixed leg 155 on the end face of lens position plastic plate 150, forms blocking part 157 in the end of fixed leg 155 in the mould of plastic plate 150 by heat-radiating substrate 351, pcb board 156 being placed molded lens locate when molded lens is located plastic plate 150.On lens position plastic plate 150, be provided with the glue injection channel 159 of injecting packing colloid 158, the glue mouth 160 of glue injection channel 159 places on the end face of lens position plastic plate 150 away from blocking part one side, and glue mouth 160 and glue injection channel 159 are communicated with the sidewall of first through hole 153.
As shown in Figure 6, different with embodiment 1, a kind of LED integrated morphology that has cooling device, comprise heat-radiating substrate 200, led chip 201, lens 202, plastic cement lens moulding ring 203 is electrically connected the lead 204 of led chip 201 electrodes and the Butut circuit conductive layer 205 of electrical connecting wire 204.Heat-radiating substrate 200 is formed by the die casting such as pottery of high heat-conducting.Heat-radiating substrate 200 comprises a flat base plate 211, and with a plurality of boss 212 of heat-radiating substrate 200 integrated protrusion base plates 211, corresponding each boss 212 is provided with second through hole 213 that cooperates with fixed leg 207.Butut circuit conductive layer 205 is set directly on the heat-radiating substrate 200, and Butut circuit conductive layer 205 is distributed on the same plane.Lens 202 place in the through hole 206 of plastic cement lens moulding ring and with plastic cement lens moulding ring and fix, and lens 202 are with led chip 201, lead 204 encapsulation.
Shown in Fig. 7,8, as different from Example 5, on heat-radiating substrate 250, be not provided with the chip fixing lug boss, heat-radiating substrate 250 is a flat board, led chip 254 directly is fixed on the heat-radiating substrate 250.
Cooling device comprise the liquid accommodation space of the heat sink that is provided with the liquid accommodation space 251 that is arranged on heat-radiating substrate 250 and deviates from led chip 254 1 sides, heat sink 251 and the liquid sealing that heat-radiating substrate 250 forms radiator liquid storage box (not shown), be sealed in liquid cooling medium, refrigerating plant 252, fin 253 in the radiator liquid storage box.Heat-radiating substrate 250 is with led chip 254 and liquid cooling medium is isolated and the back side of led chip 254 is covered by liquid cooling medium fully, and the liquid cooling medium of contact heat-radiating substrate 250 joins together.The side that heat-radiating substrate 250 deviates from led chip 254 directly contact with liquid cooling medium and with the liquid cooling medium liquid sealing.Radiator liquid storage box vertical level arranges that the heat absorbing end of refrigerating plant 252 places the top of radiator liquid storage box, and the heating end is fitted with fin 253.
As shown in Figure 9, a kind of LED integrated morphology that has cooling device comprises heat-radiating substrate, led chip (not shown), and led chip and heat-radiating substrate 301 are fixing.The radiator liquid storage box of the liquid sealing that the liquid accommodation space 302 that cooling device comprises the heat sink that is provided with liquid accommodation space 302 303 that is arranged on heat-radiating substrate 301 and deviates from led chip one side, heat sink 303 and heat-radiating substrate 301 form, be sealed in the liquid cooling medium in the radiator liquid storage box.Heat-radiating substrate 301 is with led chip and liquid cooling medium is isolated and the back side of led chip is covered by liquid cooling medium fully, and the liquid cooling medium of contact heat-radiating substrate 301 joins together.The side that heat-radiating substrate 301 deviates from led chip directly contact with liquid cooling medium and with the liquid cooling medium liquid sealing.The outer surface of heat sink 303 contacts with air.
The utility model is not limited to the foregoing description.The shape of the utility model heat-radiating substrate can design different shape as required, even can be designed to the product appearance part, and the utility model just intercepts partial L ED chip unit illustrative.Chip fixing lug boss number in the utility model can be from one to a lot of, and the utility model just exemplifies several LED integrated morphology unit that have cooling device.Butut circuit conductive layer in the utility model is an illustrative.On a chip fixing lug boss, can fix a led chip, also can fix the led chip of two different colours, the chip of three R, G, B different colours, or the chip more than three.When the chip number not simultaneously, the design corresponding modify of Butut circuit conductive layer belongs to prior art, the utility model no longer describes in detail.Pcb board also can two-sidedly be equipped with Butut circuit conductive layer, as long as the Butut conductive layer surface of a side that contacts with heat-radiating substrate and heat-radiating substrate insulation.Led chip can directly be fixed on the heat-radiating substrate, or be fixed on the integrated depressed part of heat-radiating substrate in, or it is first-class to be fixed on heat-radiating substrate by alternate manner, that is to say, cooling device of the present utility model is suitable for all LED integrated morphology, only need the heat-radiating substrate liquid sealing to get final product,, in the utility model, discuss in detail no longer one by one owing to be not utility model point of the present utility model.
Claims (12)
1. LED integrated morphology that has cooling device, comprise heat-radiating substrate, led chip, led chip and heat-radiating substrate are fixed, and it is characterized in that: cooling device comprises the radiator liquid storage box that is arranged on heat-radiating substrate and deviates from led chip one side, is sealed in the liquid cooling medium in the radiator liquid storage box; Heat-radiating substrate is with led chip and liquid cooling medium is isolated and the back side of led chip is covered by liquid cooling medium fully; The side that heat-radiating substrate deviates from led chip directly contact with liquid cooling medium and with the liquid cooling medium liquid sealing, the liquid cooling medium of contact heat-radiating substrate joins together.
2. a kind of LED integrated morphology that has cooling device as claimed in claim 1, it is characterized in that: cooling device also comprises refrigerating plant, the radiator liquid storage box tilts or vertical level arranges that the heat absorbing end of refrigerating plant places the top of radiator liquid storage box.
3. a kind of LED integrated morphology that has cooling device as claimed in claim 1, it is characterized in that: the outer surface extension at the radiator liquid storage box is provided with the heat radiation protuberance, in the heat radiation protuberance, be provided with the shrinkage pool that is communicated with the radiator liquid storage box, in shrinkage pool, be filled with liquid cooling medium; The outer surface of radiator liquid storage box contacts with air with the outer surface of heat radiation protuberance.
4. a kind of LED integrated morphology that has cooling device as claimed in claim 3 is characterized in that: the shrinkage pool in the heat radiation protuberance tilts or vertical level, and led chip places the below of radiator liquid storage box.
5. as claim 3 or 4 described a kind of LED integrated morphologies that have cooling device, it is characterized in that LED integrated morphology also comprises lens, the plastic parts of positioning lens or molded lens, be electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, it is characterized in that: on the plastic parts of positioning lens or molded lens, be provided with one or more first through hole, on the end face of the plastic parts of positioning lens or molded lens, extend and be provided with fixed leg, on heat-radiating substrate, be provided with second through hole that cooperates with fixed leg, fixed leg passes second through hole of heat-radiating substrate, is provided with the blocking part in the end of fixed leg; The plastic parts of positioning lens or molded lens is fixed by fixed leg and blocking part and heat-radiating substrate; Led chip directly is fixed on the heat-radiating substrate by solid brilliant technology, and places in the first corresponding through hole; Butut circuit conductive layer stretches between the sidewall and led chip of first through hole, and lead places in first through hole, and lead one end is electrically connected with the electrode of led chip, and the other end of lead and first through hole are electrically connected with Butut circuit conductive layer between the led chip.
6. a kind of LED integrated morphology that has cooling device as claimed in claim 5, it is characterized in that: be provided with on heat-radiating substrate and the integrated one or more boss of heat-radiating substrate, led chip directly is fixed on the end face of boss by solid brilliant technology; Boss places in the first corresponding through hole.
7. a kind of LED integrated morphology that has cooling device as claimed in claim 5, it is characterized in that: LED integrated morphology also comprises pcb board, Butut circuit conductive layer is set directly on the pcb board, on pcb board, be provided with the third through-hole that cooperates with fixed leg, fixed leg passes third through-hole on the pcb board and the fourth hole on the heat-radiating substrate successively, heat-radiating substrate, pcb board are placed in the mould of plastic parts of moulding positioning lens or molded lens by heat again, when the plastic parts of moulding positioning lens or molded lens, form the blocking part.
8. a kind of LED integrated morphology that has cooling device as claimed in claim 5 is characterized in that: LED integrated morphology also comprises and is used for the packing colloid of packaging LED chips and lead; Lens are by with the first through hole tight fit or be fixed on by edging machine hot pressing on the plastic parts of positioning lens or molded lens; The position of corresponding first through hole is provided with the glue injection channel of injecting packing colloid on the plastic parts of positioning lens or molded lens, the Jiao Kou of glue injection channel places on the end face of plastic parts away from blocking part one side of positioning lens or molded lens, and Jiao Kou and glue injection channel are communicated with the madial wall of first through hole; After injecting packing colloid, packing colloid is further fixed lens; The blocking part of moulding fixed leg end during the plastic parts of inherent moulding positioning lens of the mould of the plastic parts by heat-radiating substrate being placed moulding positioning lens or molded lens or molded lens.
9. a kind of LED integrated morphology that has cooling device as claimed in claim 5, it is characterized in that: lens are the packing colloid of packaging LED chips and lead; The blocking part of moulding fixed leg end during the plastic parts of inherent moulding positioning lens of the mould of the plastic parts by heat-radiating substrate being placed moulding positioning lens or molded lens or molded lens.
10. a kind of LED integrated morphology that has cooling device as claimed in claim 5, it is characterized in that: the plastic parts of positioning lens or molded lens is a teething ring, is fixed with two or more separate described teething rings on heat-radiating substrate.
11. a kind of LED integrated morphology that has cooling device as claimed in claim 5, it is characterized in that: the plastic parts of positioning lens or molded lens comprises teething ring and will set the dowel with the teething ring injection mo(u)lding that the teething ring of number links together that the plastic parts of positioning lens or molded lens comprises two or more described teething rings.
12. a kind of LED integrated morphology that has cooling device as claimed in claim 5, it is characterized in that: the plastic parts of positioning lens or molded lens is tabular, is provided with two or more described first through holes on the plastic parts of positioning lens or molded lens.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205361817U CN201820758U (en) | 2010-09-15 | 2010-09-15 | LED integrated structure with cooling device |
| PCT/CN2010/079718 WO2012034332A1 (en) | 2010-09-15 | 2010-12-13 | Led integral structure with cooling equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205361817U CN201820758U (en) | 2010-09-15 | 2010-09-15 | LED integrated structure with cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201820758U true CN201820758U (en) | 2011-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205361817U Expired - Fee Related CN201820758U (en) | 2010-09-15 | 2010-09-15 | LED integrated structure with cooling device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN201820758U (en) |
| WO (1) | WO2012034332A1 (en) |
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| WO2013044636A1 (en) * | 2011-09-30 | 2013-04-04 | Yang Dongzuo | Led lamp |
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-
2010
- 2010-09-15 CN CN2010205361817U patent/CN201820758U/en not_active Expired - Fee Related
- 2010-12-13 WO PCT/CN2010/079718 patent/WO2012034332A1/en active Application Filing
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| WO2012034332A1 (en) | 2012-03-22 |
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Granted publication date: 20110504 Termination date: 20130915 |