CN101963295A

CN101963295A - LED (Light Emitting Diode) integrated structure, manufacturing method, lamp, display screen, backlight device, projecting device and injection mould of forming plastic part

Info

Publication number: CN101963295A
Application number: CN2010102309596A
Authority: CN
Inventors: 杨东佐
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-07-07
Filing date: 2010-07-07
Publication date: 2011-02-02
Also published as: WO2012003699A1

Abstract

The invention relates to an LED (Light Emitting Diode) integrated structure comprising a radiating base plate, an LED chip, a lens, a plastic piece of a positioning lens or a forming lens, a conducting wire and a layout circuit conducting layer, wherein two or more than two chip fixing lug bosses which are integrally formed with the radiating base plate are arranged on the radiating base plate, a first through hole of the positioning lens or the forming lens is arranged on the plastic piece of the positioning lens or the forming lens, the chip fixing lug bosses are arranged in the first through hole, the layout circuit conducting layer is extended between the inside wall of the first through hole and the outside walls of the chip fixing lug bosses, one end of the conducting wire is electrically connected with the LED chip, and the other end of the conducting wire is electrically connected with the layout circuit conducting layer which is extended between the inside wall of the first through hole and the outside walls of the chip fixing lug bosses. The LED integrated structure has the advantages of low thermal resistance of an intermediate link, good heat radiating performance, accurate position relation of the lens and the chip, high luminous flux, simple structure, simple assembly, good radiating effect and good optical effect.

Description

The injection mould of LED integrated morphology and manufacture method, lamp, display screen, back lighting device, projection arrangement, forming plastic cement spare

Technical field

The present invention relates to a kind ofly to be used to throw light on, the LED integrated morphology and the manufacture method of backlight source module, television set, LED dot matrix display screen, projector equipment etc., particularly relate to a kind of high-power LED integrated morphology and manufacture method.The invention still further relates to a kind of LED lamp, LED dot matrix display screen, back lighting device, projection arrangement of the LED of having integrated morphology.The invention still further relates to the injection mould of the plastic parts of a kind of positioning lens of moulding LED integrated morphology or molded lens.

Background technology

Semiconductor LED is as the novel solid light source, and its conventional package is to electrically connect the such straight cutting structure of led chip with epoxy resin enclosed led chip, pin, to the eighties in last century, begins to adopt the surface pasting technology.Led light source, high-power LED light source particularly, heat is concentrated when luminous, if untimely the distributing of heat that led chip produces, the temperature of led light source is too high, will cause the light efficiency of LED to reduce, the life-span is low etc., therefore the heat that how led chip is produced when luminous has effectively distributed the bottleneck into the popularization and application led light source rapidly.How to improve the light transmittance of led light source, thereby and the heat dispersion that how to improve led light source increase the service life, be the important technology difficult problem on the present industry.

The integrated again mode of single individual LED luminous tube that existing great power LED integrated morphology commonly used adopts support to be packaged into usually.

Application number is in 200810135621.5 the patent of invention, disclose a kind of encapsulation device of light emitting diode, cooling base and electrode suppor combination and method thereof, this encapsulation device of light emitting diode comprises: cooling base, an electrode suppor, locating unit and a cladding of crystal grain contact placement are made and supplied to a LED crystal particle, by high heat-conducting.Cooling base is made by metal or ceramic contour heat-conducting, comprises the depressed part of chassis, body and body end face.Crystal grain places the bottom surface of depressed part.Electrode suppor is gone out moulding by metal material, comprises that a substrate and a vacancy section periphery from substrate extend axially and define the location wall of an accommodation space.Positioning unit be located at cooling base and electrode suppor at least one of them, with so that the cooling base inlay card be fixed in the accommodation space of this electrode suppor.This positioning unit can be to comprise that at least one from the trip salient point that the location of this electrode suppor wall internal face protrudes, also can be to comprise a flange that radially outward protrudes out from the nearly end face of this cooling base place.This preparation method comprises following steps:

Step (A) a: cooling base is provided;

Step (B): go out moulding one electrode suppor, make this electrode suppor comprise the substrate of a central hollow out, reach one from the axially extended location of vacancy section periphery of this substrate wall, this location wall defines an accommodation space;

Step (C): be located at this cooling base and this electrode suppor positioning unit of one of them at least by one, this cooling base inlay card is fixed in the accommodation space of this electrode suppor; Step (D): fixing cooling base and the electrode suppor of this mutual inlay card partly coated combination with injection molding method.Existing this encapsulation device of light emitting diode, cooling base and electrode suppor combination and method thereof exist following defective and deficiency:

1) crystal grain is made first radiator by the cooling base of stepped cylindrical, because the not direct ingress of air of the cooling base of column dispels the heat, and it has the solid length of certain metal, owing to need long metal heat loss through conduction apart from heat being distributed in air, and the contact area of cooling base and air is little, so the heat that crystal grain produces when luminous can play hot polymerization collection effect.In order to improve heat dispersion, this cooling base generally also need design radiating pieces such as the metal of other high heat dispersion that contact with the conduction of cooling base direct heat or pottery, finally dispels the heat through radiating piece.This mode has increased the distance of heat conducting and radiating on the one hand, on the other hand because cooling base and radiating piece adhere to two parts separately, both just are to use heat-conducting glue to be bonded together also still huge thermal resistance, basically here temperature is very high can to keep cooling base when crystal grain is luminous, radiating piece is temperature and the similar phenomenon of environment temperature here, do not reach the purpose that the heat on the cooling base is distributed rapidly, radiating effect is very poor.

2) because the cooling base of many columns and electrode suppor etc. are again different parts with radiating piece, and part is many, the supporting structure complexity, thickness is thicker, is unfavorable for assembling, and cost is also high; The electric connection of light emitting diode and Butut circuit need be passed through electrode suppor, complex structure, and the thermal resistance of intermediate link is many, has reduced the luminous efficiency and the radiating efficiency of led chip.

3) need moulding cooling base and electrode suppor respectively in its preparation method, particularly because of the electrode suppor complex structure, go out the shaped electrode support and need multiple working procedure, the stamping die complex structure of electrode suppor, also need increase the operation that electrode suppor and heat-radiating substrate are installed together, so operation is many in its preparation method, complex process, the mould structure complexity, the cost of manufacture height.

4) ejection formation moulding cladding and the cooling base of will this mutual inlay card fixing and electrode suppor partly coat in conjunction with the time, because electrode suppor complexity, therefore cladding is in the forming surface complexity of electrode suppor cooperation, the accommodation space complexity of ccontaining cooling base and electrode suppor in the injection mould, the die joint complexity of injection mould, during ejection formation with the cooling base and the electrode suppor detent mechanism complexity that is seated in desired location of combination, when Butut circuit conductive layer places on the pcb board, can't when ejection formation, pcb board, cooling base and electrode suppor be fixed together.

Application number is 200720172030 to disclose a kind of encapsulating structure of pinned great power LED device, comprises LED wafer, lens, printing pcb board, metal heat sink body, gold thread and pin; The metal heat sink body comprises the boss on pedestal and this pedestal, and the upper surface area of pedestal is 2 times of upper surface area of boss at least; Printing pcb board and pedestal are glued together; Pedestal below the printing pcb board is provided with through hole, is electrically connected with the printing pcb board by this through-hole pins; Lens cap button LED wafer cements on the printing pcb board with the printing pcb board and by process for filling colloid into.This powerful pinned great power LED device, though increased the pedestal area of metal heat sink body, but radiating effect still is relatively poor, even dispose radiator in addition, the heat on the led chip must be conducted on boss and the pedestal during owing to heat radiation, pass to the metal heat sink body again, conduct to radiator by the metal heat sink body again, because the heat conduction has increased intermediate link, and the very long heat-transfer path of very thick metal heat transfer body correspondence, therefore thermal resistance is very high, and heat-conducting effect is very poor.Also have lens to be buckled on the printing pcb board by cover earlier, coming cementation by encapsulating again is to be difficult to realize, because lens are buckled in very difficult accurate positioning when printing on the pcb board by cover earlier, and lens is shifted during encapsulating, and lens position can't accurately define.Pin will be electrically connected and pass printing pcb board and metal heat sink body with the Butut circuit of printing pcb board top, processed complex, and technology difficulty is big; The LED wafer need pass through electrode suppor with the electric connection of printing the Butut circuit on the PCB, complex structure, and the thermal resistance of intermediate link is many.

For the heat dissipation problem of the integrated morphology that solves existing great power LED, COB (the Chip on Board) package design of LED integrated morphology has been proposed in the prior art.Compare with existing stand type LED integrated morphology, because the present invention directly is fixed on chip on the substrate by elargol or eutectic solder etc., the thermal resistance that can cut down the number of intermediate links to greatest extent, thus the thermal resistance of led chip p-n junction reduced to external environment condition, can improve radiating efficiency and luminous efficiency.The advantage of this COB (Chip on Board) package design is that the electrode of each led chip all goes between directly by bonding electrode and metal pad forms Ohmic contact, the formation of LED multi-path chip array is to realize electrically interconnected by the arrangements of electric connection of heat-radiating substrate and led chip, the connection in series-parallel of led chip can be realized, reliability of products and qualification rate can be improved again.And appearance and size is little, and thin thickness is easy to assembling, the occasion of can be used for throwing light on, display instrument etc. being had relatively high expectations to the light source fitted position.This package design mainly contains following several mode:

Application number is in 200920136646.7 the utility model patent, a kind of white light LEDs integrated array lighting source based on the encapsulation of COB technology is disclosed, comprise a substrate and some led chips, this substrate is provided with some grooves, form electronic circuit by wiring on it, the printing pcb board that this electronic circuit and surface mount elements on being arranged at substrate cooperate formation to have specific function and be electrically connected; Led chip is bonded in the bottom portion of groove of substrate, and its contact conductor is bonded on the pad of appointment and forms the loop with electronic circuit and surface mount elements, also is coated with fluorescent material on this led chip; LED light-emitting zone top on the substrate is provided with transparent silica gel.The shortcoming one of above-mentioned COB encapsulation technology is the bottom portion of groove that led chip is bonded in substrate, during packaging LED chips, need to fill a large amount of silica gel, because silica gel costs an arm and a leg, therefore increased cost, shortcoming two is that led chip is difficult to the distance that realization needs according to lens focus; Shortcoming three is that the encapsulated electrode lead-in wire must be electrically connected on the Butut circuit of pedestal upper surface from the led chip of base bottom, the light that led chip sends can be because the obstruction of long lead-in wire produces shade, influence optical effect, especially be unfavorable for secondary optics optimization exploitation.Also have this utility model openly how not electrically connect between electronic circuit and surface mount elements, because electronic circuit all places in the reflector, figure one disclosed content particularly from its figure, its electronic circuit also needs be connected by pin from substrate back with electric connection between surface mount elements.

Application number is in 200920112089.5 the utility model patent, a kind of high-power LED street lamp device of COB encapsulation is disclosed, comprise lens, silica gel, gold thread, chip, heat sink etc., heat sink is provided with 5-50 boss, chip directly is fixed on the boss of heat sink, distributes by the fin on heat sink and the heat sink again.The high-power LED street lamp of this structure, though radiating effect is better, owing to there is not the plastic parts of positioning lens or molded lens, the location of lens is inaccurate, silica gel comes packaged chip on the pre-point in lens, the silica gel consumption is big on the one hand, particularly uses this packaged type, has bubble to produce after encapsulation silica gel solidifies, have a strong impact on the luminous mass of led chip, the light that can cause coming out has hot spot, and optics birth defects such as shade are unfavorable for the optical secondary optimization exploitation of led light source.

Application number is in the utility model patent of 200820214808.X, a kind of high-power LED encapsulation structure of efficiency heat-dissipating luminous high is disclosed, comprise lens, substrate and LED luminescence chip, lens are fixed in upper surface of base plate, the lens lower surface is provided with the installation depression that raises up, the LED luminescence chip places upper surface of base plate and is mounted the depression buckle closure, just be provided with at the upper surface of base plate that depression institute buckle closure is installed, negative lighting electrode, lighting electrode is connected by metal wire with the LED luminescence chip, upper surface of base plate is provided with lighting electrode and just links to each other, the negative electrode that connects, bonding by the adhesive layer of annular between lens lower surface that the depression outside is installed and upper surface of base plate, fill with silica gel at the endoporus of adhesive layer with installing in the formed cavity of depression, offer on the substrate to the endoporus of adhesive layer with the formed cavity of depression is installed in the glue injection channel that is communicated with, and lens become by the crystal polymorph system with substrate.The high-power LED encapsulation structure of this structure, shortcoming one are the fixing by the adhesive layer bonding of lens and substrate, and bonding is fixing not firm; Shortcoming two is detent mechanisms of no positioning lens, and lens are located by with substrate bonding the time, locatees inaccurately, and lens position is departed from; Shortcoming three is that lens are fixed on the substrate by tack coat, and tack coat stops up glue injection channel easily, influence injection silica gel; Shortcoming four is that the metal wire that electrically connects the LED luminescence chip needs and is fixed on the substrate and places the lighting electrode in the installation depressed part of lens to electrically connect, lighting electrode again be connected electrode and electrically connect, connecting electrode electrically connects with Butut circuit conductive layer again, the thermal resistance of intermediate link is many, influences radiating efficiency and luminous efficiency; Shortcoming five is that the distance of LED luminescence chip and lens recess portion is big, and the anaclasis loss is big, and luminous efficiency is low.

Application number is that providing a kind of is the LED encapsulation construction of substrate with the pottery in 200710143495.3 the patent of invention, and it comprises: ceramic substrate, conductive unit, hollow ceramic housing, a plurality of light-emitting diode chip for backlight unit and packing colloid.This ceramic substrate has a body, plurality of bump, a plurality of through hole and a plurality of chadless that is formed at respectively between this body side and per two projections that runs through these projections; This conductive unit has a plurality of be formed separately first conductive layer in these lug surfaces, a plurality of being formed separately in second conductive layer and a plurality of the 3rd conductive layer of filling full these through holes respectively of the bottom surface of the inner surface of these chadlesses and this body; This hollow ceramic housing is fixed on the end face of this body to form an accommodation space; These light-emitting diode chip for backlight unit are arranged at respectively in this accommodation space; This packing colloid is filled in this accommodation space.This invention be that the preparation method of the LED encapsulation construction of substrate comprises the following steps: with the pottery

One ceramic substrate is provided, and has a body, a plurality of projections that are separated from each other and extend from the end face of this body respectively, a plurality of through hole that runs through these corresponding projections respectively, and a plurality of chadless between being formed between this body side and each projection respectively;

Be formed separately a plurality of first conductive layers in the surface of these projections, and be formed separately the bottom surface of a plurality of second conductive layers in inner surface and this body of these half through holes;

Fill full a plurality of the 3rd conductive layers respectively in these through holes, to be electrically connected between this first conductive layer and this second conductive layer;

Fix a hollow ceramic body on the end face of the body of this ceramic substrate forming an accommodation space, and this accommodation space exposes the end face of these first conductive layers;

A plurality of light-emitting diode chip for backlight unit are set respectively in this accommodation space, and the positive and negative extreme first different conductive layer that is electrically connected at respectively of each light-emitting diode chip for backlight unit; And fill a packing colloid in this accommodation space, to cover these light-emitting diode chip for backlight unit.Shortcoming one in this invention is a light-emitting diode chip for backlight unit to be needed just can to electrically connect with outside Butut circuit conductive layer through first conductive layer of lug surface, the 3rd conductive layer in the through hole, second conductive layer, bottom surface pin in half through hole etc. in the electric connection of external circuit, the electric connection complexity of light-emitting diode chip for backlight unit, the intermediate link thermal resistance is too much; Shortcoming two is that a light-emitting diode chip for backlight unit needs two projections, all projections all place in the accommodation space of ceramic shell, cause the distance meeting between the light emitting diode bigger like this, can't realize the independent encapsulation of each light-emitting diode chip for backlight unit, the packing colloid that needs is many, and optical effect is bad.In the preparation method of this invention, the making of through hole is very difficult when sintered ceramic; Conductive layer in through hole and half through hole is made difficulty.

Application number is in 200420112507.8 the utility model patent, a kind of great power LED light emitting diode is disclosed, comprise aluminium base, elargol, wafer, gold thread, the reflection lid, aluminium base is a convex-concave bowl cup-shaped, promptly there is a circular groove bottom surface at heart place therein, one bowl of cup-shaped boss is arranged above corresponding with it, plastic frame is housed on the boss, plastic frame is circular, the center is provided with circular hole, with the concentric twice groove that has of circular hole, inside and outside formation is hanged down high twice convex edge, and the bottom surface is arranged with two cylinder pin, and be contained in bowl circular hole on cup-shaped boss both sides, the less flat cover that approaches of cambered surface cover in reflection, and its time bead scribbles bonding glue, dress in the groove of plastic frame.The plastic frame bottom surface scribbles adhesive glue water, is filled with glue in it.It is less that bottom surface distance H value is covered in illuminator wafer and reflection.Aluminium base can be a plum blossom shape, also can be circular.Technology and the present invention of this patent disclosure are the most approaching.The number of assembling steps of this patent is, earlier elargol is clicked and entered in the aluminium base boss shape bowl cup, again wafer is fixed on the elargol, put into 145 ℃ of baking box bakings 1 hour, weld gold thread then, the both positive and negative polarity of eyeglass is welded on the aluminium base both positive and negative polarity with gold thread respectively, with bonding glue on the plastic frame coated on bottom side, insert in the aluminium base locating hole, glue is filled in the plastic frame toasts, to reflect lid again and coat bonding glue, can use in the groove of the plastic frame of packing into.The shortcoming one of this patent is plastic frame and aluminium base to be fixed by bonding glue, in follow-up potting process, and non-refractory, its reliability of fixation can be subjected to very big influence under hot conditions; Shortcoming two is not inject the passage of filling glue on plastic frame, just needs to fill glue before dress reflection lid, if do not use mould, the shape of glue is uncontrollable, if use mould to fill glue, cost height; Shortcoming three is to fill reflection to be covered behind the glue to coat bonding glue and pack into fixing in the groove of plastic frame again, fixing so on the one hand unreliable, the position relation is fixing inaccurate, in addition can be gapped between reflection lid and glue, have air in the gap, just have air in the reflection lid, influence the illumination effect of light emitting diode greatly.Also having the aluminium base in this utility model patent is the bowl cup-shaped, has only a boss on it, gold thread electrically connects the both positive and negative polarity of aluminium base, from its literal and the disclosed content of figure, the both positive and negative polarity of aluminium base can not be a Butut circuit conductive layer, but is as disclosed lighting electrode or stent-type pin etc. in the 200820214808.X patent.

Summary of the invention

Not smooth in order to solve the heat radiation that existing LED integrated morphology intermediate link thermal resistance too much causes, life-span is short, luminous efficiency is low, the not high yield that causes of reliability that reaches the chip electric interconnection is low to be waited and the bad problem of the integrated structured light effect of COB technology encapsulated LED chip, first technical problem that will solve of the present invention is to provide a kind of intermediate link thermal resistance little, thermal diffusivity is good, chip directly is electrically connected to Butut circuit conductive layer, do not need Reflow Soldering or wave-soldering, packing colloid can be with resin or silica gel etc., and the position relation of lens and chip accurately, has high light flux, simple in structure, assembling is simple, good heat dissipation effect, the LED integrated morphology that optical effect is good.

Second technical problem that will solve of the present invention is the manufacture method that a kind of LED integrated morphology also will be provided.

The 3rd technical problem that will solve of the present invention is the LED lamp that a kind of LED of having integrated morphology also will be provided.

The 4th technical problem that will solve of the present invention be LED dot matrix display screen that a kind of LED of having integrated morphology also will be provided,

The 5th technical problem that will solve of the present invention is the back lighting device that a kind of LED of having integrated morphology also will be provided.

The 6th technical problem that will solve of the present invention is the projection arrangement that a kind of LED of having integrated morphology also will be provided.

The 7th technical problem that will solve of the present invention is the injection mould that the plastic parts of a kind of positioning lens of moulding LED integrated morphology or molded lens also will be provided.

In order to solve the problems of the technologies described above, the all technical schemes of the present invention are all improved heat-radiating substrate, be provided with on the heat-radiating substrate and the integrated chip fixing lug boss more than two or two of heat-radiating substrate, the area of the cross section of heat-radiating substrate is more than three times or three times of area of the cross section of a chip fixing lug boss, led chip directly is fixed on the boss by solid brilliant technology, and the side that heat-radiating substrate deviates from the chip fixing lug boss directly contacts with heat radiation gas or radiator liquid; Be equipped with the plastic parts of positioning lens or molded lens, on the plastic parts of positioning lens or molded lens, be provided with the chip fixing lug boss and cooperate, first through hole of positioning lens or molded lens, lens, the chip fixing lug boss, the number of first through hole is corresponding one by one, the plastic parts of positioning lens or molded lens is by hot melt fixed leg and heat-radiating substrate location and fixing, or the moulding blocking part or is located heat-radiating substrate location and fixing and fix by securing member and heat-radiating substrate by detent mechanism and heat-radiating substrate during the plastic parts of inherent moulding positioning lens of the mould of the plastic parts by heat-radiating substrate being placed moulding positioning lens or molded lens or molded lens; Butut circuit conductive layer is improved, and Butut circuit conductive layer stretches between the lateral wall of the madial wall of first through hole and chip fixing lug boss.

In order to solve the problems of the technologies described above, first kind of technical scheme provided by the invention is a kind of LED integrated morphology, comprise heat-radiating substrate, led chip, lens, plastic cement lens position part, be electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, be used for the packing colloid of packaging LED chips and lead, be provided with on the heat-radiating substrate and the integrated chip fixing lug boss more than two or two of heat-radiating substrate, the area of the cross section of heat-radiating substrate is more than three times or three times of area of the cross section of a chip fixing lug boss, all directly is fixed with led chip by solid brilliant technology on the end face of each chip fixing lug boss; On plastic cement lens position part, be provided with the chip fixing lug boss cooperate, first through hole of positioning lens and coating packing colloid, the number of lens, chip fixing lug boss, first through hole is corresponding one by one; On the end face of plastic cement lens position part, extend and be provided with two or more fixed legs, on heat-radiating substrate, be provided with second through hole that cooperates with fixed leg, fixed leg passes second through hole of heat-radiating substrate, form the blocking part when forming the blocking part by hot melting mode in the end of fixed leg or heat-radiating substrate being placed in the mould of forming plastic cement lens position part at forming plastic cement lens position part, plastic cement lens position part is fixed by fixed leg and blocking part and heat-radiating substrate; The chip fixing lug boss places in the first corresponding through hole, Butut circuit conductive layer stretches between the lateral wall of the madial wall of first through hole and chip fixing lug boss, lead places in first through hole, lead one end is electrically connected with the electrode of led chip, and the other end of lead and the madial wall that stretches into first through hole are electrically connected with Butut circuit conductive layer between the chip fixing lug boss lateral wall; The position of corresponding first through hole is provided with the glue injection channel of injecting packing colloid on plastic cement lens position part, and the Jiao Kou of glue injection channel places on the end face of plastic cement lens position part away from blocking part one side, and glue injection channel is communicated with the madial wall of first through hole; Before injecting packing colloid, lens and plastic cement lens position part are fixed; After injecting packing colloid, packing colloid is further fixed lens; The side that heat-radiating substrate deviates from the chip fixing lug boss directly contacts with heat radiation gas or radiator liquid.

As first kind of improvement of such scheme, a side that deviates from the chip fixing lug boss at heat-radiating substrate is provided with heat radiation blind hole or the heat radiation ladder hole that places in the chip fixing lug boss, and led chip covers the aperture of heat radiation ladder hole fully.

As further improvement, deviate from the periphery of heat radiation periphery of blind hole or the big end of ladder heat radiation through hole on the heat-radiating substrate of a side of chip fixing lug boss and be provided with and the integrated heat radiation convex tendon of substrate, be provided with heat insulation blind hole in the heat radiation convex tendon, heat insulation blind hole is communicated with heat-radiating substrate towards a side of chip fixing lug boss.

As second kind of improvement of such scheme, the chip fixing lug boss is cylindrical, is provided with the depressed part of putting led chip at the top of chip fixing lug boss, and the bottom surface of depressed part is for placing the plane of led chip.

The third improvement as such scheme, also comprise pcb board, pcb board places heat-radiating substrate to be provided with a side of chip fixing lug boss, Butut circuit conductive layer is set directly on the pcb board, on pcb board, be provided with the fourth hole of empty avoiding chip fixing lug boss and the third through-hole that cooperates with fixed leg, the chip fixing lug boss of heat-radiating substrate is passed fourth hole, the side that pcb board is provided with Butut circuit conductive layer deviates from the contact-making surface that contacts heat-radiating substrate, fixed leg passes third through-hole on the pcb board and second through hole on the heat-radiating substrate successively, forms the blocking part by hot melting mode again or with heat-radiating substrate, pcb board forms the blocking part when placing the inherent forming plastic cement lens position of the mould of forming plastic cement lens position part part.

As the 4th kind of improvement of such scheme, heat-radiating substrate is nonmetal heat conductive insulating plate, and Butut circuit conductive layer is set directly on the heat-radiating substrate and towards plastic cement lens position part.

As the 5th kind of improvement of such scheme, heat-radiating substrate is a metal substrate, and Butut circuit conductive layer is set directly on the heat-radiating substrate and towards plastic cement lens position part, is provided with an insulating barrier between Butut circuit conductive layer and metal substrate.

As first kind of such scheme common the improvement, plastic cement lens position part is a plastic cement lens position ring, the corresponding plastic cement lens position ring independently of chip fixing lug boss, and Butut circuit conductive layer is distributed on the same plane; Lens are fixed with the first corresponding through hole tight fit or by edging machine and the hot pressing of plastic cement lens position part.

Second kind of common improvement as such scheme, plastic cement lens position part comprises plastic cement lens position ring and the dowel with the injection mo(u)lding of plastic cement lens position ring that plastic cement lens position ring is linked together, the corresponding plastic cement lens position ring of chip fixing lug boss, Butut circuit conductive layer is distributed on the same plane; Lens are fixed with the first corresponding through hole tight fit or by edging machine and the hot pressing of plastic cement lens position part.

The third common improvement as such scheme, the number of plastic cement lens position part is one, for tabular, on plastic cement lens position part, be provided with two or more first through holes, one first through hole on the corresponding plastic cement lens position of the chip fixing lug boss part on the heat-radiating substrate, Butut circuit conductive layer is distributed on the same plane; Lens are fixed with the first corresponding through hole tight fit or by edging machine and the hot pressing of plastic cement lens position part.

In order to solve the problems of the technologies described above, second kind of technical scheme provided by the invention is the LED lamp with above-mentioned LED integrated morphology.

In order to solve the problems of the technologies described above, the third technical scheme provided by the invention is the LED dot matrix display screen with above-mentioned LED integrated morphology, also comprise imaging controller in the LED dot matrix display screen, the Butut circuit conductive layer of each chip is electrically connected separately with imaging controller.

In order to solve the problems of the technologies described above, the 4th kind of technical scheme provided by the invention is the back lighting device with above-mentioned LED integrated morphology, comprises the LGP and the LED-backlit source module that are installed together, and LED-backlit source module comprises above-mentioned LED integrated morphology.

In order to solve the problems of the technologies described above, the 5th kind of technical scheme provided by the invention is the projection arrangement with above-mentioned LED integrated morphology, comprises led light source, imaging system and projection imaging screen, and led light source comprises above-mentioned LED integrated morphology.

In order to solve the problems of the technologies described above, the 6th kind of technical scheme provided by the invention is a kind of manufacture method of LED integrated morphology, and technical process comprises:

1) in the chip fixing lug boss of moulding on the heat-radiating substrate more than two or two, second through hole that cooperates with fixed leg, the area of the cross section of heat-radiating substrate are more than three times or three times of area of the cross section of a chip fixing lug boss;

2) insulation moulding Butut circuit conductive layer on heat-radiating substrate, Butut circuit conductive layer apart from the distance at chip fixing lug boss center greater than chip fixing lug boss lateral wall to the distance at chip fixing lug boss center less than the madial wall of first through hole distance to the first through hole center;

3) heat-radiating substrate is placed on desired location in the forming plastic cement lens position part injection mold, injection mo(u)lding plastic cement lens position part, first through hole, fixed leg and blocking part, Jiao Kou and the glue injection channel of forming plastic cement lens position part simultaneously; When injection mo(u)lding plastic cement lens position part, the fixed leg of plastic cement lens position part passes second through hole on the heat-radiating substrate and by the blocking part plastic cement lens position part and heat-radiating substrate is fixed, and the chip fixing lug boss places in the first corresponding through hole;

4) led chip is fixed on the end face of chip fixing lug boss by solid brilliant technology;

5) lead that is electrically connected with the led chip electrode of weldering, lead with stretch into the first through hole madial wall and be electrically connected with Butut circuit conductive layer between the chip fixing lug boss lateral wall;

6) lens are fixed on the plastic cement lens position part;

7) place specific environment to vacuumize in lens, heat-radiating substrate, plastic cement lens position part, led chip, lead;

8) in vacuum environment, pass through Jiao Kou, glue injection channel to lens inner chamber encapsulating,, further lens are fixed by the curing of packing colloid to led chip and lead encapsulation.

In order to solve the problems of the technologies described above, the 7th kind of technical scheme provided by the invention provides a kind of manufacture method of LED integrated morphology, and technical process comprises:

2) fourth hole of third through-hole that moulding cooperates with fixed leg on pcb board and empty avoiding chip fixing lug boss;

3) moulding Butut circuit conductive layer on pcb board, Butut circuit conductive layer apart from the distance at the fourth hole center of empty avoiding chip fixing lug boss greater than the fourth hole sidewall of empty avoiding chip fixing lug boss to the distance at the fourth hole center of empty avoiding chip fixing lug boss less than the madial wall of first through hole distance to the first through hole center;

4) pcb board, heat-radiating substrate are placed on the desired location of the injection mold of forming plastic cement lens position part, chip fixing lug boss on the heat-radiating substrate is passed fourth hole, injection mo(u)lding plastic cement lens position part, first through hole, fixed leg and blocking part, Jiao Kou and the glue injection channel of forming plastic cement lens position part simultaneously; When injection mo(u)lding plastic cement lens position part, the fixed leg of plastic cement lens position part passes the third through-hole, second through hole on the heat-radiating substrate of pcb board successively and by the blocking part plastic cement lens position part and pcb board, heat-radiating substrate is fixed, and the chip fixing lug boss places in the first corresponding through hole;

5) led chip is fixed on the end face of chip fixing lug boss by solid brilliant technology;

6) lead that is electrically connected with the led chip electrode of weldering, lead with stretch into the first through hole madial wall and be electrically connected with Butut circuit conductive layer between the chip fixing lug boss lateral wall;

7) lens are fixed on the plastic cement lens position part;

8) place specific environment to vacuumize lens, heat-radiating substrate, plastic cement lens position part, led chip, lead, pcb board;

9) in vacuum environment, pass through Jiao Kou, glue injection channel to lens inner chamber encapsulating,, further lens are fixed by the curing of packing colloid to led chip and lead encapsulation.

In order to solve the problems of the technologies described above, the 8th kind of technical scheme provided by the invention provides a kind of manufacture method of LED integrated morphology, and technical process comprises:

1) injection mo(u)lding plastic cement lens position part, first through hole of moulding simultaneously, fixed leg, Jiao Kou and glue injection channel, the length of fixed leg is greater than the thickness of heat-radiating substrate;

2) in the chip fixing lug boss of moulding on the heat-radiating substrate more than two or two, second through hole that cooperates with fixed leg, the area of the cross section of heat-radiating substrate are more than three times or three times of area of the cross section of a chip fixing lug boss;

3) insulation moulding Butut circuit conductive layer on heat-radiating substrate, Butut circuit conductive layer apart from the distance at chip fixing lug boss center greater than chip fixing lug boss lateral wall to the distance at chip fixing lug boss center less than the madial wall of first through hole distance to the first through hole center;

4) fixed leg of plastic cement lens position part is passed second through hole and moulding blocking part, hot melt fixed leg end on the heat-radiating substrate, plastic cement lens position part and heat-radiating substrate are fixed by the blocking part;

6) lead that is electrically connected with the led chip electrode of weldering, lead with stretch into first through-hole side wall and be electrically connected with Butut circuit conductive layer between the chip fixing lug boss sidewall;

7) lens are fixed on the plastic cement lens position part;

8) place specific environment to vacuumize in lens, heat-radiating substrate, plastic cement lens position part, led chip, lead;

In order to solve the problems of the technologies described above, the 9th kind of technical scheme provided by the invention provides a kind of manufacture method of LED integrated morphology, and technical process comprises:

1) injection mo(u)lding plastic cement lens position part, first through hole of moulding simultaneously, fixed leg, Jiao Kou and glue injection channel, the length of fixed leg is greater than the thickness sum of heat-radiating substrate and pcb board;

3) fourth hole of third through-hole that moulding cooperates with fixed leg on pcb board and empty avoiding chip fixing lug boss;

4) moulding Butut circuit conductive layer on pcb board, Butut circuit conductive layer apart from the distance at fourth hole center greater than the fourth hole sidewall to the distance at fourth hole center less than the sidewall of first through hole distance to the first through hole center;

5) the chip fixing lug boss on the heat-radiating substrate being passed fourth hole is installed on the heat-radiating substrate pcb board, the fixed leg of plastic cement lens position part passes third through-hole, second through hole on the heat-radiating substrate and the moulding blocking part, hot melt fixed leg end on the pcb board successively simultaneously, by the blocking part plastic cement lens position part and pcb board, heat-radiating substrate is fixed;

6) led chip is fixed on the end face of chip fixing lug boss by solid brilliant technology;

7) lead that is electrically connected with the led chip electrode of weldering, lead with stretch into first through-hole side wall and be electrically connected with Butut circuit conductive layer between the chip fixing lug boss lateral wall;

8) lens are fixed on the plastic cement lens position part;

9) place specific environment to vacuumize in lens, heat-radiating substrate, plastic cement lens position part, pcb board, led chip, lead;

10) in vacuum environment, pass through Jiao Kou, glue injection channel to lens inner chamber encapsulating,, further lens are fixed by the curing of packing colloid to led chip and lead encapsulation.

In order to solve the problems of the technologies described above, the provided by the invention ten kind of technical scheme provides a kind of LED integrated morphology, comprises heat-radiating substrate, led chip, lens are electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, also comprise lens forming plastic cement spare; Be provided with on the heat-radiating substrate and the integrated chip fixing lug boss more than two or two of heat-radiating substrate, the area of the cross section of heat-radiating substrate is more than three times or three times of area of the cross section of a chip fixing lug boss, all directly is fixed with led chip by solid brilliant technology on the end face of each chip fixing lug boss; On lens forming plastic cement spare, be provided with the chip fixing lug boss cooperate, first through hole of molded lens, the number of lens, chip fixing lug boss, first through hole is corresponding one by one; On the end face of lens forming plastic cement spare, extend and be provided with two or more fixed legs, on heat-radiating substrate, be provided with second through hole that cooperates with fixed leg, fixed leg passes second through hole on the heat-radiating substrate, forms the blocking part when forming the blocking part by hot melting mode in the end of fixed leg or heat-radiating substrate being placed in the mould of molded lens forming plastic cement spare at molded lens forming plastic cement spare; Lens forming plastic cement spare is fixed by fixed leg and blocking part and heat-radiating substrate; The chip fixing lug boss places in the corresponding lens forming plastic cement spare, Butut circuit conductive layer stretches between the madial wall and chip fixing lug boss lateral wall of lens forming plastic cement spare, lead places in the lens forming plastic cement spare, lead one end is electrically connected with the electrode of led chip, and the other end of lead and the madial wall that stretches into lens forming plastic cement spare are electrically connected with Butut circuit conductive layer between the chip fixing lug boss lateral wall; Lens are the transparent enclosure colloid of packaging LED chips and lead; The side that heat-radiating substrate deviates from the chip fixing lug boss directly contacts with heat radiation gas or radiator liquid.

As improvement, the sidewall of first through hole comprises up big and down small taper, and the lens upper surface is the plane.Under the effect of the gravity and first through-hole side wall, become opposite planar behind the some glue.

As first kind of common improvement, lens forming plastic cement spare is a lens forming plastic cement ring, the corresponding lens forming plastic cement ring independently of chip fixing lug boss, and Butut circuit conductive layer is distributed on the same plane.

As second kind of common improvement, lens forming plastic cement spare comprises lens forming plastic cement ring and the dowel with the injection mo(u)lding of lens forming plastic cement ring that lens forming plastic cement ring is linked together, the corresponding lens forming plastic cement ring of chip fixing lug boss, Butut circuit conductive layer is distributed on the same plane.

As the third common improvement, the number of lens forming plastic cement spare is one, for tabular, on lens forming plastic cement spare, be provided with two or more first through holes, one first through hole on the corresponding lens forming plastic cement spare of a chip fixing lug boss on the heat-radiating substrate, Butut circuit conductive layer is distributed on the same plane.

In order to solve the problems of the technologies described above, the 11 kind of technical scheme provided by the invention provides a kind of method of the LED of manufacturing integrated morphology, and technical process comprises:

3) heat-radiating substrate is placed on desired location in the molded lens forming plastic cement spare injection mold, injection mo(u)lding lens forming plastic cement spare; First through hole, fixed leg and the blocking part of while molded lens forming plastic cement spare; When injection mo(u)lding lens forming plastic cement spare, the fixed leg of lens forming plastic cement spare passes second through hole on the heat-radiating substrate and by the blocking part lens forming plastic cement spare and heat-radiating substrate is fixed, and the chip fixing lug boss places in the first corresponding through hole;

5) lead that is electrically connected with the led chip electrode of weldering, lead with stretch into first through-hole side wall and be electrically connected with Butut circuit conductive layer between the chip fixing lug boss sidewall;

6) by the mould encapsulating molded lens of molded lens and to led chip and lead encapsulation, adhesive curing lens and lens forming plastic cement spare, led chip, lead and heat-radiating substrate are fixed.

In order to solve the problems of the technologies described above, the 12 kind of technical scheme provided by the invention provides a kind of method of the LED of manufacturing integrated morphology, and technical process comprises:

3) moulding Butut circuit conductive layer on pcb board, Butut circuit conductive layer apart from the distance at fourth hole center greater than the fourth hole sidewall to the distance at fourth hole center less than the sidewall of first through hole distance to the first through hole center;

4) pcb board, heat-radiating substrate are placed on the desired location of the injection mold of molded lens forming plastic cement spare, the chip fixing lug boss on the heat-radiating substrate is passed the fourth hole of PCB; Injection mo(u)lding lens forming plastic cement spare, first through hole, fixed leg and the blocking part of molded lens forming plastic cement spare simultaneously; When injection mo(u)lding lens forming plastic cement spare, the fixed leg of lens forming plastic cement spare passes third through-hole on the pcb board, second through hole on the heat-radiating substrate successively and by fixed leg and blocking part lens forming plastic cement spare and pcb board, heat-radiating substrate is fixed, and the chip fixing lug boss places in the first corresponding through hole;

7) by the mould encapsulating molded lens of molded lens and to led chip and lead encapsulation, the chip fixing lug boss and the pcb board of adhesive curing lens and lens forming plastic cement spare, led chip, lead heat-radiating substrate are fixed.

In order to solve the problems of the technologies described above, the 13 kind of technical scheme provided by the invention provides a kind of method of the LED of manufacturing integrated morphology, and technical process comprises:

1) injection mo(u)lding lens forming plastic cement spare, first through hole, the fixed leg of while molded lens forming plastic cement spare, the length of fixed leg is greater than the thickness of heat-radiating substrate;

3) insulation moulding Butut circuit conductive layer on heat-radiating substrate, Butut circuit conductive layer apart from the distance at chip fixing lug boss center greater than chip fixing lug boss lateral wall to the distance at chip fixing lug boss center less than the distance of first through-hole side wall to the first through hole center;

4) fixed leg of lens forming plastic cement spare is passed second through hole and moulding blocking part, hot melt fixed leg end on the heat-radiating substrate, lens forming plastic cement spare and heat-radiating substrate are fixed by the blocking part;

7) by the mould encapsulating molded lens of molded lens and to led chip and lead encapsulation, adhesive curing lens and lens forming plastic cement spare, led chip, lead and heat-radiating substrate are fixed.

In order to solve the problems of the technologies described above, the 14 kind of technical scheme provided by the invention provides a kind of method of the LED of manufacturing integrated morphology, and technical process comprises:

1) injection mo(u)lding lens forming plastic cement spare, first through hole of moulding simultaneously, fixed leg, the length of fixed leg is greater than the thickness sum of heat-radiating substrate and pcb board;

4) moulding Butut circuit conductive layer on pcb board, Butut circuit conductive layer apart from the distance at fourth hole center greater than the fourth hole sidewall to the distance at chip fixing lug boss empty avoiding fourth hole center less than the distance of first through-hole side wall to the first through hole center;

5) fourth hole that the chip fixing lug boss on the heat-radiating substrate is passed PCB is installed on the heat-radiating substrate pcb board, the fixed leg of lens forming plastic cement spare is passed the third through-hole of pcb board, second through hole and moulding blocking part, hot melt fixed leg end on the heat-radiating substrate successively, lens forming plastic cement spare and pcb board, heat-radiating substrate are fixed by the blocking part;

7) lead that is electrically connected with the led chip electrode of weldering, lead with stretch into first through-hole side wall and be electrically connected with Butut circuit conductive layer between the chip fixing lug boss sidewall;

8) by the mould encapsulating molded lens of molded lens and to led chip and lead encapsulation, adhesive curing lens and lens forming plastic cement spare, led chip, lead and heat-radiating substrate are fixed.

In order to solve the problems of the technologies described above, the 15 kind of technical scheme provided by the invention provides a kind of LED integrated morphology, comprise heat-radiating substrate, led chip, lens, the plastic parts of positioning lens or molded lens, be electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, be provided with on the heat-radiating substrate and the integrated chip fixing lug boss more than two or two of heat-radiating substrate, the area of the cross section of heat-radiating substrate is more than three times or three times of area of the cross section of a chip fixing lug boss, all directly is fixed with led chip by solid brilliant technology on the end face of each chip fixing lug boss; The plastic parts of positioning lens or molded lens comprises teething ring and teething ring is linked together with the dowel of teething ring injection mo(u)lding; On teething ring, be provided with first through hole of positioning lens or molded lens; The number of lens, first through hole and chip fixing lug boss is corresponding one by one; The chip fixing lug boss places in the first corresponding through hole, Butut circuit conductive layer stretches between the lateral wall of the madial wall of first through hole and chip fixing lug boss, lead places in first through hole, lead one end is electrically connected with the electrode of led chip, and the other end of lead and the madial wall that stretches into first through hole are electrically connected with Butut circuit conductive layer between the chip fixing lug boss lateral wall; Also be provided with the pinpoint detent mechanism of plastic parts of heat-radiating substrate and positioning lens or molded lens and securing member that heat-radiating substrate and plastic parts are fixed together; The side that heat-radiating substrate deviates from the chip fixing lug boss directly contacts with heat radiation gas or radiator liquid.

As improvement, also comprise pcb board, pcb board places heat-radiating substrate to be provided with a side of chip fixing lug boss, Butut circuit conductive layer is set directly on the pcb board, the side that pcb board is provided with Butut circuit conductive layer deviates from the contact-making surface that contacts heat-radiating substrate, detent mechanism is accurately located the plastic parts of heat-radiating substrate, pcb board and positioning lens or molded lens, and securing member is fixed together the plastic parts of heat-radiating substrate, pcb board and positioning lens or molded lens.

In order to solve the problems of the technologies described above, the 16 kind of technical scheme provided by the invention provides a kind of LED integrated morphology, comprise heat-radiating substrate, led chip, lens, the plastic parts of positioning lens or molded lens, be electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, be provided with on the heat-radiating substrate and the integrated chip fixing lug boss more than two or two of heat-radiating substrate, the area of the cross section of heat-radiating substrate is more than three times or three times of area of the cross section of a chip fixing lug boss, all directly is fixed with led chip by solid brilliant technology on the end face of each chip fixing lug boss; The plastic parts of positioning lens or molded lens is tabular, is provided with two or more first through holes on the plastic parts of positioning lens or molded lens, and the number of lens, first through hole and chip fixing lug boss is corresponding one by one; The chip fixing lug boss places in the first corresponding through hole, Butut circuit conductive layer stretches between the lateral wall of the madial wall of first through hole and chip fixing lug boss, lead places in first through hole, lead one end is electrically connected with the electrode of led chip, and the other end of lead and the madial wall that stretches into first through hole are electrically connected with Butut circuit conductive layer between the chip fixing lug boss lateral wall; Also be provided with the pinpoint detent mechanism of plastic parts of heat-radiating substrate and positioning lens or molded lens and securing member that heat-radiating substrate and plastic parts are fixed together; The side that heat-radiating substrate deviates from the chip fixing lug boss directly contacts with heat radiation gas or radiator liquid.

In order to solve the problems of the technologies described above, the 17 kind of technical scheme provided by the invention provides the injection mould of the plastic parts of a kind of positioning lens of moulding LED integrated morphology or molded lens, LED integrated morphology comprises heat-radiating substrate, the plastic parts of positioning lens or molded lens, Butut circuit conductive layer; Injection mould comprises cover half device, dynamic model device, advances adhesive dispenser and liftout attachment, advance adhesive dispenser and be arranged on cover half device one side, be provided with on the heat-radiating substrate and the integrated boss that is used for fixing led chip more than two or two of heat-radiating substrate, the area of the cross section of heat-radiating substrate is more than three times or three times of area of the cross section of each boss; On positioning lens or molded lens, be provided with boss cooperate, first through hole of positioning lens or molded lens, the number of lens, boss, first through hole is corresponding one by one; On the end face of positioning lens or molded lens, extend and be provided with two or more fixed legs, on heat-radiating substrate, be provided with second through hole that cooperates with fixed leg, fixed leg passes second through hole of heat-radiating substrate, form the blocking part in the end of fixed leg during at moulding positioning lens or molded lens in by the mould that heat-radiating substrate is placed moulding positioning lens or molded lens, positioning lens or molded lens are fixed by fixed leg and blocking part and heat-radiating substrate; Boss places in the first corresponding through hole, and Butut circuit conductive layer stretches between the lateral wall of the madial wall of first through hole and boss; Injection mould comprises the plastic parts body die cavity of forming plastic cement spare body and is convexly equipped with the boss of moulding first through hole in plastic parts body die cavity, the blocking part die cavity of moulding blocking part, the containing cavity of ccontaining heat-radiating substrate is placed on heat-radiating substrate the detent mechanism of containing cavity desired location; Plastic parts body die cavity and boss are arranged on the homonymy of die joint, and blocking part die cavity and plastic parts body die cavity are arranged on the heteropleural of die joint, and containing cavity is communicated with plastic parts body die cavity or is communicated with the blocking part die cavity; Be provided with chip fixing lug boss emptiness avoiding hole in mould, chip fixing lug boss emptiness avoiding hole and plastic parts body die cavity are arranged on the homonymy of die joint, are provided with the empty avoiding gap between chip fixing lug boss emptiness avoiding hole and chip fixing lug boss.

As first kind of improvement, plastic parts body die cavity, boss are arranged on the cover half part, and the blocking part die cavity is arranged on the dynamic model part, and ejecting mechanism is arranged on the dynamic model part, and the cast gate that advances adhesive dispenser is communicated with the bottom of plastic parts body die cavity; Plastic parts body die cavity and boss are big along the forming surface demoulding tapering of stripping direction, and the blocking part die cavity of dynamic model part does not have demoulding tapering or is back taper along the forming surface of stripping direction.

As second kind of improvement, plastic parts body die cavity, boss are arranged on the cover half part, and the blocking part die cavity is arranged on the dynamic model part, and ejecting mechanism is arranged on the cover half part, and the cast gate that advances adhesive dispenser is communicated with the bottom of plastic parts body die cavity.

As the third improvement, plastic parts body die cavity, boss are arranged on the dynamic model part, and the blocking part die cavity is arranged on the cover half part, and ejecting mechanism is arranged on the dynamic model part, and the cast gate that advances adhesive dispenser is communicated with the bottom of blocking part die cavity.

As the 4th kind of improvement, Butut circuit conductive layer is set directly on the heat-radiating substrate and towards the plastic parts of positioning lens or molded lens; Detent mechanism is the locating hole that cooperates with the chip fixing lug boss, and locating hole and plastic parts body die cavity are at the homonymy of die joint.

As the 5th kind of improvement, a side that deviates from the chip fixing lug boss at heat-radiating substrate is provided with heat radiation blind hole or the heat radiation ladder hole that places in the chip fixing lug boss; Deviate from the heat-radiating substrate of a side of chip fixing lug boss being provided with and the integrated heat radiation convex tendon of substrate at the periphery of the periphery of heat radiation blind hole or heat radiation ladder hole big end, in the heat radiation convex tendon, be provided with heat insulation blind hole; Be provided with heat radiation convex tendon emptiness avoiding hole on injection mould, heat radiation convex tendon emptiness avoiding hole and blocking part die cavity are provided with the empty avoiding gap at the homonymy of die joint between heat radiation convex tendon emptiness avoiding hole and heat radiation convex tendon.

As the 6th kind of improvement, keeper is a locating shaft, and locating shaft cooperates with heat-radiating substrate.

As the 7th kind of improvement, also comprise pcb board, Butut circuit conductive layer is set directly on the pcb board, the side that pcb board is provided with Butut circuit conductive layer deviates from the contact-making surface that contacts heat-radiating substrate, and fixed leg passes pcb board and heat-radiating substrate successively and is fixed together by plastic parts, pcb board and the heat-radiating substrate of blocking part with positioning lens or molded lens; Keeper is a locating shaft, is provided with ringent locating slot on the side of pcb board, locating shaft be multidiameter and with plastic parts body die cavity homonymy, the little axle of locating shaft cooperates with heat-radiating substrate, adjacent with little of locating shaft cooperates with locating slot on the pcb board.

As first kind of common improvement, the plastic parts of positioning lens or molded lens is the lens position plastic parts of positioning lens, on the lens position plastic parts, be provided with the glue injection channel of injecting packing colloid, the Jiao Kou of glue injection channel places on the end face of lens position plastic parts away from blocking part one side, and glue injection channel is communicated with the madial wall of first through hole; On the sidewall of boss, be provided with the protuberance of moulding glue injection channel.

As second kind of common improvement, the plastic parts of positioning lens or molded lens is a teething ring, is fixed with two or more separate teething rings on heat-radiating substrate; The cast gate that advances adhesive dispenser is some cast gate, corresponding one or two cast gate of each teething ring.

As the third common improvement, the plastic parts of positioning lens or molded lens comprises teething ring and will set the dowel with the teething ring injection mo(u)lding that the teething ring of number links together that the plastic parts of positioning lens or molded lens comprises two or more teething rings; Be provided with the dowel forming cavity that is communicated with plastic parts body die cavity on mould, the cast gate that advances adhesive dispenser is communicated with plastic parts body die cavity and/or dowel die cavity; The cast gate that advances adhesive dispenser is a cast gate or down gate.

As the 4th kind of common the improvement, the plastic parts of positioning lens or molded lens is tabular, is provided with two or more first through holes on the plastic parts of positioning lens or molded lens, and the cast gate that advances adhesive dispenser is some cast gate or down gate.

As the 5th kind of common the improvement, the cover half part also comprises TOP-TIP.

The invention has the beneficial effects as follows:

First advantage is that led chip directly is fixed on the chip fixing lug boss by solid brilliant technology, and the side that heat-radiating substrate deviates from the chip fixing lug boss directly contacts with heat radiation gas or radiator liquid.The COB of this LED integrated morphology (Chip on Board) package design, compare with existing LED integrated morphology, because the present invention directly is fixed on led chip on the chip fixing lug boss of substrate by elargol or eutectic solder etc., the heat that led chip when work produces through the very thin heat-conducting layer of the chip fixing lug boss of heat-radiating substrate just directly with dispel the heat gas such as air contacts or contact with radiator liquid, the heat of contact heat-radiating substrate is because hot cold air or fluid density difference flowing effect are pulled away rapidly, thereby take away the heat of substrate, the thermal resistance that can cut down the number of intermediate links to greatest extent, significantly reduce the heat-transfer path distance of led chip p-n junction heating portion, thereby significantly reduce thermal resistance to extraneous air environment or radiator liquid.The heat-radiating substrate of this structure is a thin plate, the thickness range of heat-radiating substrate is generally in 0.2mm to 5mm, mainly be applied as on heat-radiating substrate and the one-body molded a plurality of chip fixing lug boss of heat-radiating substrate, the area of substrate is greatly greater than the area at chip fixing lug boss top.Significantly reducing heat that led chip produces so on the one hand distributes in heat radiation gas and is the intermediate path distance in the air or in the radiator liquid and has increased greatly and the contact area of the radiator liquid and the gas that dispels the heat, significantly reduced the heat localization effect, can improve radiating efficiency greatly and make chip remain in suitable operating temperature, thereby keep long-life and effective luminous efficiency of chip.Chip fixing lug boss and heat-radiating substrate are one-body molded, so the heat that produces of chip only sees through heat-radiating substrate and just directly distribute in air, so thermal resistance is little, radiating rate is fast, must not dispel the heat by other radiating piece, and radiating effect is just fairly good.Led chip directly is fixed on the chip fixing lug boss by solid crystal type, led chip directly is electrically connected with Butut circuit conductive layer by lead, because the chip fixing lug boss is arranged, make the shade of keeping out of light that electrical connecting wire sends led chip drop to minimumly, be beneficial to optical secondary optimization! Saved existing led support, just saved the heat radiating metal spare in the led support, and multilayer intermediate link such as electrode metal pin, especially avoided the high thermal resistance that produces between two parts of heat radiating metal spare and heat-radiating substrate, therefore thermal resistance is little, and the fast good heat dissipation effect of heat conduction is simple and reliable for structure, especially one-body molded design and the assembly technology that more helps light source of chip fixing lug boss and heat-radiating substrate saved cost again.Therefore the present invention is simple and reliable for structure, and part is few, and thin thickness is easy to assembling, is specially adapted to the powerful occasion of light source requirements.

Second advantage is owing to be equipped with the plastic parts of positioning lens or molded lens, Butut circuit conductive layer can stretch in the plastic parts of positioning lens or molded lens, lead can directly be electrically connected with Butut circuit conductive layer on the one hand, no longer need lead to be connected with Butut circuit conductive layer or to pass with Butut circuit conductive layer from the heat-radiating substrate that deviates from the chip fixing lug boss to be connected by the wiring pin by the conducting metal support, the thermal resistance that simplifies the structure and cut down the number of intermediate links to greatest extent, good heat dissipation effect; No longer need weld metal support or wiring pin to be electrically connected on the other hand, do not need Reflow Soldering or wave-soldering, so packing colloid can be with resin or silica gel etc. with Butut circuit conductive layer; But also can guarantee that led chip, electrical connecting wire and two welding ends can not be exposed in the air long-life that helps using.And when needing Reflow Soldering or wave-soldering, because the temperature of Reflow Soldering or wave-soldering is generally at 250 ℃ or 280 ℃, packing colloid just cannot use resin.Because the price of silica gel is higher than resin far away, light transmission is than resin difference, so the present invention can further save cost, the optical property of raising led chip.The advantage of this COB package design is that the electrode of each led chip 2 all passes through the direct and Butut circuit conductive layer formation Ohmic contact of bonding lead, the formation of LED multi-path chip array is to realize electrical interconnection by the arrangements of electric connection of heat-radiating substrate and led chip, the connection in series-parallel of led chip can be realized, reliability of products and production qualification rate can be improved again.

The plastic parts that the 3rd advantage is positioning lens or molded lens by the hot melt fixed leg with the heat-radiating substrate location with fix, or during the plastic parts of inherent moulding positioning lens of the mould of the plastic parts by heat-radiating substrate being placed moulding positioning lens or molded lens or molded lens the moulding blocking part with heat-radiating substrate location and fixing, or fix by detent mechanism and heat-radiating substrate location with by securing member and heat-radiating substrate, fixing reliable, in follow-up potting process, can be high temperature resistant, its reliability of fixation can be not influenced yet under hot conditions; With respect to fixing with securing member, the technical program is not because of needing designs fix hole on the plastic parts of positioning lens or molded lens, for the first onesize through hole, can reduce the distance between adjacent first through hole, therefore can in unit are, arrange more lens.Particularly the plastic parts of positioning lens or molded lens by when the plastic parts of injection molded positioning lens or molded lens and heat-radiating substrate fix, save on the one hand plastic parts with positioning lens or molded lens and be installed to installation procedure on the heat-radiating substrate, be provided with for a heat-radiating substrate under the situation of plastic parts of a plurality of positioning lens or molded lens, saved production cost greatly, the plastic parts of positioning lens or molded lens and heat-radiating substrate are axially on the other hand, all there is not the gap in radial direction, fixing very reliable, position relation between the plastic parts of heat-radiating substrate and positioning lens or molded lens can be very accurate, lens installation site size on the plastic parts of positioning lens or molded lens can be very accurate, thereby improve the optical effect of LED integrated morphology.

The 4th advantage is the area of dissipation that heat radiation blind hole or heat radiation ladder hole increase heat-radiating substrate, significantly reduce the distance between led chip and the air, just significantly reduce the led chip heat and distribute intermediate path distance in air, thereby significantly reduce the heat localization effect, so the good heat dissipation effect of louvre than atresia arranged.

The 5th advantage is that convex tendon further increases the area that heat-radiating substrate contacts with air, makes radiating effect better.Because when led chip is luminous, the atmosphere draught-free in the heat insulation blind hole, therefore heat insulation blind hole has heat-blocking action to the heat that led chip produces, and the heat that led chip is produced mainly is dispersed in the air along chip fixing lug boss and heat radiation convex tendon.

The 6th advantage is installation and the location that depressed part is convenient to led chip, makes the location of led chip more accurate, more helps the light that chip the sends orientation of going ahead of the rest is gathered, and improves light efficiency.

The 7th advantage is that heat-radiating substrate is the non-metal board of insulation, and Butut circuit conductive layer is set directly on the heat-radiating substrate, and be simple in structure, good heat dissipation effect.Heat-radiating substrate insulating heat-conductive nonmetallic materials, therefore can obtain low thermal resistance, can avoid the short circuit of Butut circuit conductive layer, and the heat that chip is produced during operation conducts by insulating heat-conductive material substrate, and good heat conduction makes the encapsulation of high density great power LED integrated chip to realize.

The 8th advantage is that heat-radiating substrate adopts metal material, therefore can obtain low thermal resistance, Butut circuit conductive layer above it adopts the quite little insulating barrier of thickness to separate, this insulating barrier can be avoided the short circuit of metal matter substrate, and the heat that chip is produced during operation conducts by metal substrate again, and good heat conduction makes the encapsulation of high density great power LED integrated chip to realize.

The 9th advantage is Butut circuit conductive layer when being arranged on the pcb board, and the plastic parts of positioning lens or molded lens can realize that again a heat-radiating substrate, pcb board are fixed together.Use pcb board, be convenient to the layout-design of the circuit of Butut circuit conductive layer, saved the complicated manufacturing process of original circuit layout on heat-radiating substrate, used very ripe pcb board, provide cost savings greatly, not only simplified technology but also improved the reliability and the design flexibility of Butut circuit conductive layer.Pcb board has heat-blocking action simultaneously, and the heat that is more conducive on the heat-radiating substrate distributes along a side that contacts with air.

The tenth advantage is the corresponding plastic cement lens position ring of a chip fixing lug boss, and the plastic cement consumption significantly reduces when the plastic parts of moulding positioning lens or molded lens, reduces cost.Lens are fixed on the plastic parts of positioning lens or molded lens by tight fit or hot pressing mode, the fixing earlier encapsulation again of lens like this, when packaging LED chips, lens can not be shifted, help encapsulating and curing process, it is more reliable particularly to fix lens than existing by the cohesive force by silica gel etc.

The 11 advantage is to connect into the positioning lens of an integral body or the plastic parts of molded lens by dowel when the whole plastic cement locating rings on the heat-radiating substrate can be in injection moulding; The plastic parts when injection moulding that also the part lens position ring on the heat-radiating substrate can be connected as a whole positioning lens or molded lens is provided with the plastic parts of two or more this positioning lens or molded lens on a heat-radiating substrate.The corresponding plastic cement lens position ring of chip fixing lug boss, the plastic cement consumption is few when forming plastic cement lens position ring, and cost is low.Connect plastic cement lens position ring as a whole by dowel, the firstth, when the plastic parts of injection mo(u)lding positioning lens or molded lens, its mould gate can be arranged on the plastic cement lens position ring or on the dowel, be convenient to the layout of mould gate and when injection moulding, be more conducive to plastic cement filling balance in the mould, and the plastic cement between the different plastic cement lens position rings flows through dowel and realizes, can reduce the quantity and the design of being convenient to mold runner of mould gate, the available two or more plastic cement lens position of a mould gate moulding ring is as can only directly designing a down gate with regard to plastic a plurality of plastic cement lens position rings under the less situation of plastic cement lens position ring number; The secondth, can reduce the number of fixed leg, need on each plastic cement locating ring, not be provided with two or more fixed legs, die manufacturing cost can be reduced so on the one hand, the consumption of plastic cement can be when the plastic parts of injection mo(u)lding positioning lens or molded lens, reduced on the other hand; The 3rd is for onesize plastic cement lens position ring, therefore the position of fixed leg design in plastic cement lens position ring and dowel boundary can be able to be increased the cross section of fixed leg; The 4th is for onesize plastic cement lens position ring, is the die cavity of moulding dowel because the die cavity thin-walled of moulding adjacent lenses locating ring is connected, and therefore can arrange more plastic cement lens position ring, the longer service life of mould in unit are; The 5th is that position relation between plastic cement lens position ring and the plastic cement lens position ring is more accurate, fixing more reliable, thereby makes the position relation between the lens more accurate, improves optical effect.Lens are fixed on the plastic parts of positioning lens or molded lens by tight fit or hot pressing mode, the fixing earlier encapsulation again of lens like this, when packaging LED chips, lens can not be shifted, help encapsulating and curing process, it is more reliable particularly to fix lens than existing by the cohesive force by silica gel etc.

The 12 advantage is the plastic parts that can only be provided with a tabular positioning lens or molded lens at a heat-radiating substrate; Also can on a heat-radiating substrate, be provided with the two or more tabular positioning lens or the plastic parts of molded lens.The plastic parts of positioning lens or molded lens is tabular, the firstth, and when the plastic parts of injection mo(u)lding positioning lens or molded lens, the design of its mould gate is more flexible, is convenient to the layout of mould gate and is more conducive to plastic cement filling balance in the mould when injection moulding; The secondth, the number of fixed leg can be reduced and the cross section of fixed leg can be increased; The 3rd is can lay more lens in the unit are; The 4th is that position relation between the lens is more accurate, improves optical effect.Lens are fixed on the plastic parts of positioning lens or molded lens by tight fit or hot pressing mode, the fixing earlier encapsulation again of lens like this, when packaging LED chips, lens can not be shifted, help encapsulating and curing process, it is more reliable particularly to fix lens than existing by the cohesive force by silica gel etc.

The 13 advantage be, the plastic parts of positioning lens or molded lens is tabular, and fixed leg places the center of per four first adjacent through holes.For the first onesize through hole, can reduce the distance between adjacent first through hole to greatest extent, therefore can in unit are, arrange more lens to greatest extent, when being applied to dot matrix display screen, can realize to greatest extent that high-definition image shows.

The 14 advantage is provided in a side of the coat of silicon carbide on heat-radiating substrate surface, has advantages such as high thermoconductivity and high-heating radiation rate simultaneously, do not having under the application of forcing the fan convection current, and for example LED illumination more can manifest its heat sinking function.Carborundum have excellence thermal conduction characteristic (130～160W/m.K), good insulation performance, and have the thermal emissivity rate higher 5～8 times, and be nonmetal etc. application than metals such as copper, aluminium.For example aluminium Fin sheet is sprayed after the carborundum heat radiation coating, not only effectively temperature is reduced by 5 degree～7 degree, integral heat sink efficient more increases by 10%～15%.

In order to solve the problems of the technologies described above, the Jiao Kou of the glue injection channel in first kind of technical scheme provided by the invention places on the end face of plastic cement lens position part away from blocking part one side, and glue injection channel is communicated with the madial wall of plastic cement lens position part, is convenient to injecting glue; Because plastic cement lens position part is a plastic parts, so Jiao Kou and glue injection channel easy-formation.Before injecting packing colloid, lens and plastic cement lens position part tight fit or hot pressing are fixed, the fixing earlier encapsulation again of lens like this, when packaging LED chips, lens can not be shifted, help encapsulating and curing process, it is more reliable particularly to fix lens than existing by the cohesive force by silica gel etc.When packaging LED chips, earlier chip is fixed on the heat-radiating substrate chip fixing lug boss by solid crystal type, weld electrical connecting wire again, and then installation lens, in vacuumizing environment, carry out injecting glue by the gum-injecting port on the plastic cement lens position part, therefore, the accurate installation of the lens position when plastic cement lens position part can be realized encapsulating, and by vacuumize and injecting glue after lens, led chip, electrical connecting wire and two welding ends, heat-radiating substrate and chip fixing lug boss thereof are solidified togather, this structure can be implemented in to vacuumize when particularly encapsulating does not have the bubble generation when packing colloid solidifies under the environment, luminous mass to led chip plays important guarantee effect, the light that can not cause coming out has hot spot, optics birth defects such as shade; Owing to there has not been the optics birth defect of the led chip luminous mass of bubble generation, more help the optical secondary optimization exploitation of led light source, plastic cement lens position part makes lens easy for installation accurately fixing and reliably fixing with realization lens installation site, the gathering of light efficiency is beneficial to the double optimization of optics, final realization optical effect is good, the loading of silica gel was few when plastic cement lens position part and lens made injecting glue again simultaneously, can reduce cost.

In order to solve the problems of the technologies described above, the 17 kind of technical scheme provided by the invention provides the injection mould of the plastic parts of a kind of positioning lens of moulding LED integrated morphology or molded lens, and advantage is as follows:

1) in injection mould, is provided with the containing cavity of ccontaining heat-radiating substrate, detent mechanism is with the spacing desired location in injection mould of heat-radiating substrate during the plastic parts of injection mo(u)lding positioning lens or molded lens, injection mould is when the plastic parts of moulding positioning lens or molded lens, the plastic parts and the heat-radiating substrate of positioning lens or molded lens are fixed, saved the installation procedure of the plastic parts of positioning lens or molded lens, and the plastic parts of positioning lens or molded lens and heat-radiating substrate are axially, all there is not the gap in radial direction, fixed form is very reliable, position relation between the plastic parts of heat-radiating substrate and positioning lens or molded lens can be very accurate, the lens position relation of the plastic parts of positioning lens or molded lens is very accurate, thereby improves the optical effect of LED integrated morphology.Plastic parts body die cavity and blocking part die cavity place the heteropleural of die joint, are convenient to the demoulding of product.Be provided with the empty avoiding gap between chip fixing lug boss emptiness avoiding hole and chip fixing lug boss, can reduce the machining accuracy of chip fixing lug boss emptiness avoiding hole, the chip fixing lug boss is not interfered with mould when guaranteeing to be placed on heat-radiating substrate in the mould.

2) plastic parts body die cavity, boss are arranged on the cover half part, the filling balance of plastic cement when being convenient to the setting of the cast gate of adhesive dispenser into and injection moulding.Ejecting mechanism is arranged on dynamic model partly makes mould structure simple.Since in the forming surface of cover half part stripping direction greater than forming surface at dynamic model part stripping direction, therefore the plastic parts body die cavity of cover half part and boss want big along the forming surface demoulding tapering of stripping direction when mfg. moulding die, the blocking part die cavity of dynamic model part does not have demoulding tapering or is back taper along the forming surface of stripping direction, and product is stayed dynamic model one side in the time of can guaranteeing dynamic model part and cover half part somatotype like this.

Plastic parts body die cavity, boss are arranged on the cover half part, are convenient to the into setting of the cast gate of adhesive dispenser and the filling balance of injection moulding plastic cement.Since in the forming surface of cover half part stripping direction greater than forming surface at dynamic model part stripping direction, product can be stayed cover half one side when dynamic model part and cover half part somatotype, ejecting mechanism is arranged on cover half one side, just adopt the upside-down mounting mould, be convenient to ejecting of product, and the mould molding face of stripping direction does not need particular design.

3) in the forming surface of dynamic model part stripping direction greater than forming surface at cover half part stripping direction, can guarantee when dynamic model part and cover half part somatotype that product can stay dynamic model mould one side, be convenient to ejecting of product.Ejecting mechanism is arranged on dynamic model one side, and mould structure is simple.

4) adopt chip fixing lug boss and locating hole location, simple in structure.Under the situation that a lot of chip fixing lug boss are arranged on the heat-radiating substrate, only two to four locating holes that cooperate with the chip fixing lug boss need be set, remaining design is an emptiness avoiding hole.

5) heat radiation convex tendon emptiness avoiding hole be regular shape, the processing of the convex tendon emptiness avoiding hole of being convenient to dispel the heat.Be provided with the empty avoiding gap between heat radiation convex tendon emptiness avoiding hole and heat radiation convex tendon, can reduce the machining accuracy of heat radiation convex tendon emptiness avoiding hole, the heat radiation convex tendon is not interfered with mould when guaranteeing to be placed on heat-radiating substrate in the mould.

6) locating shaft can cooperate etc. with the neighboring of heat-radiating substrate or the locating hole on the heat-radiating substrate or the locating slot on the heat-radiating substrate.Adopt locating shaft location heat-radiating substrate, simple in structure.

Because the area of pcb board is less than or equal to the area of heat-radiating substrate, or is provided with flange on heat-radiating substrate, the locating shaft of mode that adopts locating slot to cooperate with locating shaft can be located from both direction.

7) owing to a plurality of independently teething rings of moulding in a mold, the some cast gate is convenient to penetrate in nozzle glue is diverted to each independently forming cavity.

8) cast gate that advances adhesive dispenser only can be and is communicated with plastic parts body die cavity, only also can be to be communicated with the dowel die cavity, also can comprise comprising cast gate that advances adhesive dispenser that is communicated with plastic parts body die cavity and the cast gate that advances adhesive dispenser that is communicated with the dowel die cavity simultaneously.Cast gate is generally a cast gate, under the less situation of teething ring number, also can use down gate, can make mould structure simple like this.

9) cast gate is generally a cast gate, under the less situation of the plastic parts of positioning lens or molded lens, also can use down gate, can make mould structure simple like this.

Adopt hot flow path, when the plastic parts of injection moulding positioning lens or molded lens, can not produce waste materials such as the mouth of a river, reduce the consumption of plastics, and can improve the plastic parts injection moulding quality of positioning lens or molded lens.

Description of drawings

Fig. 1 is the front view of the embodiment of the invention 1.

Fig. 2 is the cutaway view along the A-A of Fig. 1.

Fig. 3 is the perspective exploded view of the embodiment of the invention 1.

Fig. 4 is the perspective exploded view of the embodiment of the invention 1 from another direction projection.

Fig. 5 is the perspective exploded view of the embodiment of the invention 3.

Fig. 6 is the front view of the embodiment of the invention 4.

Fig. 7 is the cutaway view along the B-B of Fig. 6.

Fig. 8 is the perspective exploded view of the embodiment of the invention 4.

Fig. 9 is the perspective exploded view of the embodiment of the invention 5.

Figure 10 is the I portion enlarged drawing of Fig. 9.

Figure 11 is the perspective exploded view of the embodiment of the invention 6.

Figure 12 is the perspective exploded view of the embodiment of the invention 7.

Figure 13 is the perspective exploded view of the embodiment of the invention 8.

Figure 14 is the schematic perspective view of the plastic cement lens position plate of the embodiment of the invention 9.

Figure 15 is the schematic perspective view of the embodiment of the invention 10.

Figure 16 is the schematic perspective view of the embodiment of the invention 11.

Figure 17 is the schematic perspective view of the embodiment of the invention 11 from another direction projection.

Figure 18 is the schematic perspective view of the LED integrated morphology of the embodiment of the invention 11.

Figure 19 is the schematic perspective view of the embodiment of the invention 12.

Figure 20 is the schematic perspective view of the embodiment of the invention 13.

Figure 21 is the schematic perspective view of the embodiment of the invention 14.

Figure 22 is the front view of the embodiment of the invention 15.

Figure 23 is the cutaway view along the C-C of Figure 22.

Figure 24 is the perspective exploded view of the embodiment of the invention 15.

Figure 25 is the perspective exploded view of the embodiment of the invention 17.

Figure 26 is the perspective exploded view of the embodiment of the invention 18.

Figure 27 is the perspective exploded view of the embodiment of the invention 19.

Figure 28 is the II portion enlarged drawing of Figure 27.

Figure 29 is the perspective exploded view of the embodiment of the invention 20.

Figure 30 is the perspective exploded view of the embodiment of the invention 21.

Figure 31 is the perspective exploded view of the embodiment of the invention 22.

Figure 32 is the schematic perspective view of the plastic cement lens position plate of the embodiment of the invention 23.

Figure 33 is that the master of the embodiment of the invention 24 looks schematic diagram.

Figure 34 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the embodiment of the invention 24, the perspective exploded view of detent mechanism.

Figure 35 is the dynamic model mold insert, cover half mold insert, LED integrated morphology, detent mechanism of the embodiment of the invention 24 perspective exploded view from another direction projection.

Figure 36 is the III portion enlarged drawing of Figure 34.

Figure 37 is the detent mechanism of the embodiment of the invention 24 and the schematic perspective view of LED integrated morphology.

Figure 38 is that schematic diagram is looked on the right side of the embodiment of the invention 25.

Figure 39 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the embodiment of the invention 25, the perspective exploded view of detent mechanism.

Figure 40 is the dynamic model mold insert, cover half mold insert, LED integrated morphology, detent mechanism of the embodiment of the invention 25 perspective exploded view from another direction projection.

Figure 41 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the embodiment of the invention 26, the perspective exploded view of detent mechanism.

Figure 42 is the dynamic model mold insert, cover half mold insert, LED integrated morphology, detent mechanism of the embodiment of the invention 26 perspective exploded view from another direction projection.

Figure 43 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the embodiment of the invention 27, the perspective exploded view of detent mechanism.

Figure 44 is the dynamic model mold insert, cover half mold insert, LED integrated morphology, detent mechanism of the embodiment of the invention 27 perspective exploded view from another direction projection.

Figure 45 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the embodiment of the invention 28, the perspective exploded view of detent mechanism.

Figure 46 is dynamic model mold insert, cover half mold insert, the LED integrated morphology of the embodiment of the invention 29, the perspective exploded view of detent mechanism.

Embodiment 1

As shown in Figures 1 to 4, a kind of LED integrated morphology comprises heat-radiating substrate 1, pcb board 2, led chip 3, lens 4, lens position ring 5, be electrically connected led chip 3 electrode gold thread 6 and be electrically connected the Butut circuit conductive layer 7 of gold thread 6, be used for the packing colloid 8 of packaging LED chips 3 and gold thread 6.Lens position ring 5 is selected resistant to elevated temperatures PPA plastics for use.

On lens position ring 5, be provided with first through hole 23 of positioning lens 4 and coating packing colloid 8, extend on the lens position ring 5 and be provided with fixed leg 9, form blocking part 10 during at the forming plastic cement locating ring in by the mould that heat-radiating substrate 1 is placed molded lens locating ring 5 in the end of fixed leg 9.Be provided with the glue injection channel 11 of injecting packing colloid 8 on lens position ring 5, the glue mouth 12 of glue injection channel 11 places on the end face of lens position ring 5 away from blocking part one side, and glue mouth 12 and glue injection channel 11 are communicated with the sidewall of first through hole 23.

Heat-radiating substrate 1 is stamped to form by the thin-sheet metal or the metal alloy of high heat-conducting, and its material can be stainless steel, copper, tungsten, aluminium, aluminium nitride, chromium etc. or its alloy.Heat-radiating substrate 1 comprises a flat base plate 13, and with a plurality of chip fixing lug boss 14 of heat-radiating substrate 1 integrated protrusion base plate 13, corresponding each chip fixing lug boss 14 is provided with second through hole 15 that cooperates with fixed leg 9.The cross section of chip fixing lug boss 14 is circular, and the area of the cross section of base plate 13 greater than the area of the cross section of chip fixing lug boss 13, is more than three times or three times of area of the cross section of chip fixing lug boss 13 greatly at least.Be provided with the depressed part 16 with the concentric storing led chip 3 of chip fixing lug boss 14 at the top of chip fixing lug boss 14, the bottom surface of depressed part 16 is for placing the plane of led chip 3.A side that deviates from chip fixing lug boss 14 at heat-radiating substrate 1 is provided with macropore 17, the aperture 22 that places in the chip fixing lug boss 14 with the concentric heat radiation ladder hole of chip fixing lug boss 14.Deviate from the periphery of the macropore 17 of ladder hole on the heat-radiating substrate 1 of chip fixing lug boss 14 1 sides and be provided with and heat-radiating substrate 1 integrated heat radiation convex tendon 18, be provided with heat insulation blind hole 19 in heat radiation convex tendon 18, heat insulation blind hole 19 is communicated with towards chip fixing lug boss 14 1 sides with the base plate 13 of heat-radiating substrate 1 towards a side of chip fixing lug boss 14.The side that heat-radiating substrate 1 deviates from chip fixing lug boss 14 directly contacts with heat radiation gas.

Butut circuit conductive layer 7 is set directly on the pcb board 2, and Butut circuit conductive layer 7 is distributed on the same plane.Corresponding each chip fixing lug boss 14 is provided with fourth hole 20 that cooperates with chip fixing lug boss 14 and the third through-hole 21 that cooperates with fixed leg 9 on pcb board 2, pcb board 2 places heat-radiating substrate 1 to be provided with a side of chip fixing lug boss 14 and directly contacts with heat-radiating substrate 1, and the side that pcb board 2 is provided with Butut circuit conductive layer 7 deviates from the contact-making surface that contacts heat-radiating substrate 1.

The chip fixing lug boss 14 of heat-radiating substrate 1 is passed the fourth hole 20 of pcb board 2, the fixed leg 9 of lens position ring 5 passes the third through-hole 21 on the pcb board 2, second through hole 15 of heat-radiating substrate 1, the blocking part 10 of the end by fixed leg 9 and pcb board 2, heat-radiating substrate 1 are fixing, and pcb board 2 and heat-radiating substrate 1 and lens position ring 5 are fixed together like this.Chip fixing lug boss 14 places in first through hole 23 of corresponding lens position ring 5, Butut circuit conductive layer 7 stretches between the madial wall and chip fixing lug boss 14 lateral walls of first through hole 23, led chip 3 directly is fixed on the end face of chip fixing lug boss 14 by solid brilliant technology, gold thread 6 places in the lens position ring 5, gold thread 6 one ends are electrically connected with the electrode of led chip 3, and the other end of gold thread 6 is electrically connected with Butut circuit conductive layer 7 in stretching into lens position ring 5; Lens 4 are installed on the lens position ring 5 and are tightly fixed with lens position ring 5.Further that lens 4 are fixing by the packing colloid 8 that glue mouth 12 and glue injection channel 11 are injected.

The manufacture method of above-mentioned LED integrated morphology, technical process comprises:

1) the heat insulation blind hole 19 in the macropore 17, aperture 22 by the chip fixing lug boss 14 on the punch forming heat-radiating substrate 1, heat radiation shoulder hole, heat radiation convex tendon 18, the heat radiation convex tendon 18, second through hole 15 that cooperates with the fixed leg 9 of lens position ring 5 on heat-radiating substrate 1;

2) third through-hole 21 that moulding cooperates with the fixed leg 9 of lens position ring 5 on pcb board 2 and the fourth hole 20 that cooperates with chip fixing lug boss 14;

3) moulding Butut circuit conductive layer 7 on pcb board 2, Butut circuit conductive layer 7 apart from the distance at fourth hole center greater than fourth hole 20 sidewalls to the distance at fourth hole 20 centers less than the madial wall of first through hole 23 distance to first through hole, 23 centers;

4) pcb board 2, heat-radiating substrate 1 are placed on the desired location of the injection mold of molded lens locating ring 5, chip fixing lug boss 14 on the heat-radiating substrate 1 is passed the fourth hole 20 of PCB, injection mo(u)lding lens position ring 5, fixed leg 9 and blocking part 10, glue mouth 12 and the glue injection channel 11 of molded lens locating ring 5 simultaneously; When injection mo(u)lding lens position ring 5, the fixed leg 9 of lens position ring 5 passes third through-hole 21, second through hole 15 on the heat-radiating substrate 1 on the pcb board 2 successively and passes through blocking part 10 lens position ring 5 and pcb board 2, heat-radiating substrate 1 are fixed;

5) led chip 3 is fixed on the end face of chip fixing lug boss 14 by solid brilliant technology;

6) gold thread 6 that is electrically connected with the electrode of led chip 3 of weldering, Butut circuit conductive layer 7 interior between the lateral wall of gold thread 6 and the madial wall that stretches into first through hole 23 and chip fixing lug boss 14 is electrically connected;

7) lens 4 are installed on the lens position ring 5 by the tight fit mode;

8) place specific environment to vacuumize lens 4, heat-radiating substrate 1, lens position ring 5, led chip 3, gold thread 6, pcb board 2;

9) in vacuum environment, pass through glue mouth 12, glue injection channel 11 to lens 4 inner chamber encapsulatings, to led chip 3 and gold thread 6, further fixing to lens 4 by the curing of packing colloid 8.

Embodiment 2

As shown in Figures 1 to 4, as different from Example 1, the manufacture method of LED integrated morphology, technical process comprises:

1) injection mo(u)lding lens position ring 5, moulding is simultaneously extended fixed leg 9, glue mouth 12 and the glue injection channel 11 that is provided with from an end face of lens position ring 5, and the length of fixed leg 9 is greater than the thickness sum of heat-radiating substrate 1 and pcb board 2;

2) heat insulation blind hole 19 in the convex tendon 18 of the macropore 17 by the chip fixing lug boss 14 on the punch forming heat-radiating substrate 1, heat radiation ladder hole, heat radiation convex tendon 18, heat radiation, second through hole 15 that cooperates with the fixed leg 9 of lens position ring 5 on heat-radiating substrate 1;

3) aperture 22 of the heat radiation ladder hole of macropore 17 connections of laser cutting moulding heat radiation ladder hole;

4) third through-hole 21 that moulding cooperates with fixed leg 9 on pcb board 2 and the fourth hole 20 that cooperates with chip fixing lug boss 14;

5) moulding Butut circuit conductive layer 7 on pcb board 2, Butut circuit conductive layer 7 arrive the distance at lens position ring 5 centers less than the madial wall of lens position ring 5 to the distance at fourth hole 20 centers greater than fourth hole 20 sidewalls apart from the distance at fourth hole 20 centers;

6) fourth hole 20 that the chip fixing lug boss 14 on the heat-radiating substrate 1 is passed PCB2 is installed on the heat-radiating substrate 1 pcb board 2, the fixed leg 9 of lens position ring 5 is passed successively second through hole 15 on the third through-hole 21, heat-radiating substrate 1 of pcb board 2 and the moulding blocking part, end 10 of hot melt fixed leg 9, by blocking part 10 that lens position ring 5 and pcb board 2, heat-radiating substrate 1 is fixing;

7) led chip 3 is fixed on the end face of chip fixing lug boss 14 by solid brilliant technology;

8) gold thread 6 that is electrically connected with led chip 3 electrodes of weldering, gold thread 6 with stretch into lens position ring 5 madial walls and be electrically connected with Butut circuit conductive layer 7 between chip fixing lug boss 14 lateral walls;

9) lens 4 are installed on the lens position ring 5 by the fixing mode of hot pressing;

10) place specific environment to vacuumize lens 4, heat-radiating substrate 1, lens position ring 5, pcb board 2, led chip 3, gold thread 6;

11) in vacuum environment, pass through glue mouth 12, glue injection channel 11 to lens 4 inner chamber encapsulatings, to led chip 3 and gold thread 6 encapsulation, further fixing to lens 4 by the curing of packing colloid 8.

Embodiment 3

As shown in Figure 5, as different from Example 1, a kind of LED integrated morphology, comprise heat-radiating substrate 50, led chip 51, lens 52, lens position ring 53, be electrically connected the lead 54 of led chip 51 electrodes and the Butut circuit conductive layer 55 of electrical connecting wire 54, be used for the packing colloid 56 of packaging LED chips 51 and lead 54.Lens position ring 53 is selected resistant to elevated temperatures PPO+GF plastics for use, and the number of lens position ring is six.On heat-radiating substrate 50, be not provided with heat radiation convex tendon and heat insulation blind hole.

Heat-radiating substrate 50 is formed by the die casting such as pottery of high heat-conducting.Butut circuit conductive layer 55 is set directly on the heat-radiating substrate 50, and Butut circuit conductive layer 55 is distributed on the same plane.

It is fixing with heat-radiating substrate 50 by the blocking part 58 of fixed leg 57 and fixed leg 57 ends that the fixed leg 57 of lens position ring 53 passes heat-radiating substrate 50, and heat-radiating substrate 50 is fixed together with lens position ring 53 like this.

1) the sinter molding ceramic heat-dissipating substrate 50, the simultaneously macropore of the chip fixing lug boss 62 on the moulding heat-radiating substrate 50, heat radiation ladder hole, aperture, second through hole 63 that cooperates with the fixed leg 57 of lens position ring 53, the depressed part 64 of chip fixing lug boss 62 top fixed L ED chips 51;

2) insulation moulding Butut circuit conductive layer 55 on heat-radiating substrate 50, Butut circuit conductive layer 55 arrives the distance at lens position ring 53 centers less than the madial wall of lens position ring 53 to the distance at chip fixing lug boss 62 centers greater than chip fixing lug boss 62 lateral walls apart from the distance at chip fixing lug boss 62 centers;

3) heat-radiating substrate 50 is placed on desired location in molded lens locating ring 53 injection molds, injection mo(u)lding lens position ring 53, the fixed leg 57 of molded lens locating ring 53 and first through hole 61 of blocking part 58, glue mouth 60 and glue injection channel 59, positioning lens and coating packing colloid simultaneously; When injection mo(u)lding lens position ring 53, the fixed leg 57 of lens position ring 53 passes second through hole 63 on the heat-radiating substrate 50 and passes through blocking part 58 lens position ring 53 is fixing with heat-radiating substrate 50;

4) led chip 51 is fixed on the depressed part 64 of end face of chip fixing lug boss 62 by solid brilliant technology;

5) lead 54 that is electrically connected with led chip 51 electrodes of weldering, lead 54 with stretch into Butut circuit conductive layer 55 interior between first through hole, 61 madial walls and chip fixing lug boss 62 lateral walls and be electrically connected;

6) lens 52 are installed on the lens position ring 53 by the fixing mode of hot pressing;

7) place specific environment to vacuumize in lens 52, heat-radiating substrate 50, lens position ring 53, led chip 51, lead 54;

8) in vacuum environment, pass through glue mouth 60, glue injection channel 59 to lens 52 inner chamber encapsulatings, to led chip 51 and lead 54 encapsulation, further fixing to lens 52 by the curing of packing colloid 56.

Embodiment 4

Extremely shown in Figure 8 as Fig. 6, as different from Example 3, heat-radiating substrate 100 is stamped to form by the thin-sheet metal or the metal alloy of high heat-conducting, its material can be stainless steel, copper, tungsten, aluminium, aluminium nitride, chromium etc. or its alloy, be provided with one deck coat of silicon carbide (not shown) on heat-radiating substrate 100 surfaces, the number of lens position ring is three.A side that deviates from chip fixing lug boss 101 at heat-radiating substrate 100 is provided with and places in the chip fixing lug boss 101 the heat radiation blind hole 102 concentric with chip fixing lug boss 101.

Extension is provided with fixed leg 104 on lens position ring 106, forms blocking part 105 in the end of fixed leg 104 by hot melting mode.

It is fixing by fixed leg hot melt blocking part, 104 end and heat-radiating substrate 100 that the fixed leg 104 of lens position ring 106 passes heat-radiating substrate 100, and heat-radiating substrate 100 is fixed together with lens position ring 106 like this.

1) injection mo(u)lding lens position ring 106, simultaneously moulding positioning lens 113 or coat packing colloid 114 first through hole 103, extend fixed leg 104, glue mouth 108 and the glue injection channel 109 that is provided with from an end face of lens position ring 106, the length of fixed leg 104 is greater than the thickness of heat-radiating substrate 100;

2) second through hole 115 of the depressed part 111 at the chip fixing lug boss 101 on the punch forming heat-radiating substrate 100, chip fixing lug boss 101 tops, heat radiation blind hole 102, lens position ring fixed leg 104;

3) insulation moulding Butut circuit conductive layer 107 on heat-radiating substrate 100, Butut circuit conductive layer 107 apart from the distance at chip fixing lug boss 101 centers greater than chip fixing lug boss 101 lateral walls to the distance at chip fixing lug boss 101 centers less than the madial wall of first through hole 103 distance to first through hole, 103 centers;

4) fixed leg 104 of lens position ring 106 is passed second through hole 115 that cooperates with lens position ring fixed leg 104 on the heat-radiating substrate 100, the moulding blocking part, fixed leg 104 end 105 by hot melt lens position ring 106 makes lens position ring 106 fixing with heat-radiating substrate 100;

5) led chip 110 is fixed on the bottom surface of depressed part 111 at chip fixing lug boss 101 tops by solid brilliant technology;

6) gold thread 112 that is electrically connected with led chip 110 electrodes of weldering, gold thread 112 with stretch into lens position ring 106 madial walls and be electrically connected with Butut circuit conductive layer 107 between chip fixing lug boss 101 lateral walls;

7) lens 113 are installed on the lens position ring 106 by the fixing mode of hot pressing;

8) place specific environment to vacuumize lens 113, heat-radiating substrate 100, lens position ring 106, led chip 110, gold thread 112;

9) in vacuum environment, adorn colloid 114 to lens 113 inner chamber embeddings by glue mouth 108 and glue injection channel 109, to led chip 110 and gold thread 112 encapsulation, further fixing to lens 113 by the curing of packing colloid 114.

Embodiment 5

As Fig. 9, shown in Figure 10, as different from Example 1, plastic cement lens position ring 201 links as a whole by dowel 202.In the top depression portion 204 of chip fixing lug boss 203, be fixed with R look led chip 208, G look led chip 209, B look led chip 210 by solid brilliant technology.When heat-radiating substrate 200, pcb board 223 and plastic cement lens position ring 201 are fixed together, chip fixing lug boss 203 places in first through hole 224 of corresponding plastic cement lens position ring 201, Butut circuit conductive layer 212,214,216,218,220,222 stretches between the lateral wall of the madial wall of first through hole 224 and chip fixing lug boss 203 and is independently of one another, and gold thread 211,213,215,217,219,221 places in first through hole 224.The positive pole of the led chip 208 of R look is electrically connected by the first Butut circuit conductive layer 212 between the lateral wall of gold thread 211 and the madial wall that stretches into first through hole 224 and chip fixing lug boss 203, and the negative pole of the led chip 208 of R look is electrically connected by the Butut circuit conductive layer 214 between the lateral wall of gold thread 213 and the madial wall that stretches into first through hole 224 and chip fixing lug boss 203.The positive pole of the led chip 209 of G look is electrically connected by the Butut circuit conductive layer 216 between the lateral wall of gold thread 215 and the madial wall that stretches into first through hole 224 and chip fixing lug boss 203, and the negative pole of the led chip 209 of G look is electrically connected by the Butut circuit conductive layer 218 between the lateral wall of gold thread 217 and the madial wall that stretches into first through hole 224 and chip fixing lug boss 203.The positive pole of the led chip 210 of B look is electrically connected by the Butut circuit conductive layer 220 between the lateral wall of gold thread 219 and the madial wall that stretches into first through hole 224 and chip fixing lug boss 203, and the negative pole of the led chip 210 of B look is electrically connected by the Butut circuit conductive layer 222 between the lateral wall of gold thread 221 and the madial wall that stretches into first through hole 224 and chip fixing lug boss 203.

Embodiment 6

As shown in figure 11, as different from Example 5, plastic cement lens position part is a lens position plastic plate 250, and the number of lens position plastic plate 250 is one.On lens position plastic plate 250, be provided with six and be used for positioning lens 254 and coat first through hole 253 of packing colloid 258 with the chip fixing lug boss 252 of heat-radiating substrate 251 cooperates one by one.Lens 254 are by being tightly fixed in first through hole 253.Extension is provided with fixed leg 255 on the end face of lens position plastic plate 250, forms blocking part 257 in the end of fixed leg 255 in the mould of plastic plate 250 by heat-radiating substrate 251, pcb board 256 being placed molded lens locate when molded lens is located plastic plate 250.On lens position plastic plate 250, be provided with the glue injection channel 259 of injecting packing colloid 258, the glue mouth 260 of glue injection channel 259 places on the end face of lens position plastic plate 250 away from blocking part one side, and glue mouth 260 and glue injection channel 259 are communicated with the sidewall of first through hole 253.

Embodiment 7

As shown in figure 12, as different from Example 5.Also be connected with dowel 281,282,283,284 in addition on 280 on plastic cement lens position ring.On the end face of plastic cement lens position ring 280, be provided with reference column 291, on heat-radiating substrate 285, be provided with the locating hole 286 that cooperates with reference column 291, be provided with the locating hole 288 that cooperates with reference column 291 on pcb board 287, pcb board 287, heat-radiating substrate 285 are accurately located by reference column 291.Pcb board 287, heat-radiating substrate 285, plastic cement lens position part 289 are fixed together by screw 290, rather than are fixed together by fixed leg and blocking part.Fixing hole 292 on plastic cement lens position part 289 places the junction of dowel and plastic cement lens position ring 280.

Embodiment 8

As shown in figure 13, as different from Example 6, on heat-radiating substrate 300, convex with reference column 301, be provided with the locating hole 304 that cooperates with reference column 301 at plastic cement lens position part 303, be provided with the locating hole 306 that cooperates with reference column 301 on pcb board 305, plastic cement lens position part 303, pcb board 305 are accurately located by reference column 301 and heat-radiating substrate 300.Pcb board 305, heat-radiating substrate 300, plastic cement lens position part 303 are fixed together by screw 302, rather than will be fixed together by fixed leg and blocking part.

Embodiment 9

As shown in figure 14, as different from Example 6, the number of first through hole 311 on plastic cement lens position plate 310 is 24.Fixed leg 312 is evenly distributed on the center of per four first adjacent through holes 311 and the outside of first through hole 311.

Embodiment 10

As shown in figure 15, a kind of LED lamp comprises light cover 321 and LED integrated morphology.The heat-radiating substrate 322 of light cover 321 and LED integrated morphology is fixed together, and heat-radiating substrate 322 directly directly contacts with air outside.LED integrated morphology and embodiment 4 are together.

Embodiment 11

To shown in Figure 180, a kind of LED dot matrix display screen comprises top cover 331, transparent panel 332 and LED integrated morphology as Figure 16.Transparent panel 332 is installed together with top cover 331, top cover 331 is installed together with the heat-radiating substrate 333 of LED integrated morphology.As different from Example 6, LED integrated morphology also comprises imaging controller 334, and the Butut circuit conductive layer of each chip is electrically connected separately with imaging controller 334.

Embodiment 12

As shown in figure 19, a kind of downward back electro-optical device comprises the LGP 340 and the LED-backlit source module 341 that are installed together, and LED-backlit source module 341 comprises LED integrated morphology, and LED integrated morphology is identical with enforcement 5.

Embodiment 13

As shown in figure 20, a kind of side-light type back lighting device comprises the LGP 350 and the LED-backlit source module 351 that are installed together, and LED-backlit source module 351 comprises LED integrated morphology, and LED integrated morphology is identical with enforcement 5.

Embodiment 14

As shown in figure 21, a kind of projection arrangement comprises led light source 360, imaging system 361 and projection imaging screen 362, and led light source 360 comprises LED integrated morphology, and LED integrated morphology is identical with enforcement 5.

Embodiment 15

Extremely shown in Figure 24 as Figure 22, as different from Example 1, a kind of LED integrated morphology, comprise heat-radiating substrate 401, pcb board 402, led chip 403, lens 404, plastic cement lens moulding ring 405, the Butut circuit conductive layer 407 of the gold thread 406 of the electrode of electrical connection led chip 403 and electrical connection gold thread 406.

First through hole 408 is the bellmouth of molded lens 404.By encapsulating to the mould encapsulating molded lens 404 of molded lens 404 and to led chip 403 and gold thread 406, adhesive curing lens 404 are fixing with chip fixing lug boss 414, the pcb board 402 of lens moulding ring 405, led chip 403, gold thread 406 and heat-radiating substrate 401.The sidewall of lens 404 is taper by 408 moulding of first through hole, and the top of lens 404 is arc by the mould molding of molded lens 404.

1) the heat insulation blind hole 419 in the macropore 417, aperture 422 by the chip fixing lug boss 414 on the punch forming heat-radiating substrate 401, heat radiation shoulder hole, heat radiation convex tendon 418, the heat radiation convex tendon 418, second through hole 415 that cooperates with the fixed leg 409 of lens moulding ring 405, the depressed part 416 at boss top on heat-radiating substrate 401;

2) third through-hole 421 that moulding cooperates with the fixed leg 409 of lens moulding ring 405 on pcb board 402 and the fourth hole 420 that cooperates with chip fixing lug boss 414;

3) moulding Butut circuit conductive layer 407 on pcb board 402, Butut circuit conductive layer 407 apart from the distance at fourth hole 420 centers greater than boss fourth hole 420 sidewalls to the distance at fourth hole 420 centers less than the madial wall of lens moulding ring 405 distance to lens moulding ring 405 centers;

4) pcb board 402, heat-radiating substrate 401 are placed on the desired location of the plastic mould of molded lens moulding ring 405, chip fixing lug boss 414 on the heat-radiating substrate 401 is passed the boss fourth hole 420 of pcb board 402, injection mo(u)lding lens moulding ring 405, the fixed leg 409 and the blocking part 410 of molded lens moulding ring 405 simultaneously; When injection mo(u)lding lens moulding ring 405, the fixed leg 409 of lens moulding ring 405 passes third through-hole 421, second through hole 415 on the heat-radiating substrate 401 on the pcb board 402 successively and passes through blocking part 410 lens moulding ring 405 and pcb board 402, heat-radiating substrate 401 are fixed;

5) led chip 403 is fixed on the bottom surface of depressed part 416 of end face of chip fixing lug boss 414 by solid brilliant technology;

6) gold thread 406 that is electrically connected with the electrode of led chip 403 of weldering, gold thread 406 with stretch into Butut circuit conductive layer 407 interior between lens moulding ring 405 madial walls and chip fixing lug boss 414 lateral walls and be electrically connected;

7) by the mould encapsulating molded lens 404 of molded lens 404 and to led chip 403 and gold thread 406 encapsulation, adhesive curing lens 404 are fixing with chip fixing lug boss 414, the pcb board 402 of lens moulding ring 405, led chip 403, gold thread 406 and heat-radiating substrate 401.

Embodiment 16

Shown in Figure 22 to 24, as different from Example 15, the manufacture method of LED integrated morphology, technical process comprises:

1) injection mo(u)lding lens moulding ring 405, and moulding is simultaneously extended the fixed leg 409 that is provided with from an end face of lens moulding ring 405, and the length of fixed leg 409 is greater than the thickness sum of heat-radiating substrate 401 and pcb board 402;

2) heat insulation blind hole 419 in the convex tendon 418 of the macropore 417 by the chip fixing lug boss 414 on the punch forming heat-radiating substrate 401, heat radiation ladder hole, heat radiation convex tendon 418, heat radiation, second through hole 415 that cooperates with the fixed leg 409 of lens moulding ring 405, the depressed part 416 at boss top on heat-radiating substrate 401;

3) aperture 422 of the heat radiation ladder hole of macropore 417 connections of laser cutting moulding heat radiation ladder hole;

4) third through-hole 421 that moulding cooperates with fixed leg 409 on pcb board 402 and the fourth hole 420 that cooperates with chip fixing lug boss 414;

5) moulding Butut circuit conductive layer 407 on pcb board 402, Butut circuit conductive layer 407 apart from the distance at boss fourth hole 420 centers greater than boss fourth hole 420 sidewalls to the distance at boss fourth hole 420 centers less than the madial wall of lens moulding ring 405 distance to lens moulding ring 405 centers;

6) fourth hole 420 that the chip fixing lug boss 414 on the heat-radiating substrate 401 is passed pcb board 402 is installed on the heat-radiating substrate 401 pcb board 402, the fixed leg 409 of lens moulding ring 405 is passed successively second through hole 415 on the third through-hole 421, heat-radiating substrate 401 of pcb board 402 and the moulding blocking part, end 410 of hot melt fixed leg 409, by blocking part 410 that lens moulding ring 405 and pcb board 402, heat-radiating substrate 401 is fixing;

7) led chip 403 is fixed in the depressed part 416 of end face of chip fixing lug boss 414 by solid brilliant technology;

8) gold thread 406 that is electrically connected with led chip 403 electrodes of weldering, gold thread 406 with stretch into lens moulding ring 405 madial walls and be electrically connected with Butut circuit conductive layer 407 between chip fixing lug boss 414 lateral walls;

9) by the mould encapsulating molded lens 404 of molded lens 404 and to led chip 403 and gold thread 406 encapsulation, adhesive curing lens 404 are fixing with chip fixing lug boss 414, the pcb board 402 of lens moulding ring 405, led chip 403, gold thread 406 and heat-radiating substrate 401.

Embodiment 17

As shown in figure 25, as different from Example 15, a kind of LED integrated morphology, comprise heat-radiating substrate 450, led chip 451, lens 452, plastic cement lens moulding ring 453 is electrically connected the lead 454 of led chip 451 electrodes and the Butut circuit conductive layer 455 of electrical connecting wire 454.

The top of lens 452 is the plane.

Heat-radiating substrate 450 is formed by the die casting such as pottery of high heat-conducting.Heat-radiating substrate 450 comprises a flat base plate 461, and with a plurality of boss 462 of heat-radiating substrate 450 integrated protrusion base plates 461, corresponding each boss 462 is provided with second through hole 463 that cooperates with fixed leg 457.Butut circuit conductive layer 455 is set directly on the heat-radiating substrate 450, and Butut circuit conductive layer 455 is distributed on the same plane.

1) the sinter molding ceramic heat-dissipating substrate 450, the depressed part 464 of the macropore of the boss 462 on the heat-radiating substrate of moulding simultaneously 450, heat radiation ladder hole, aperture, second through hole 463 that cooperates with the fixed leg 457 of lens moulding ring 453, chip fixing lug boss 462 top fixed L ED chips;

2) insulation moulding Butut circuit conductive layer 455 on heat-radiating substrate 450, Butut circuit conductive layer 455 apart from the distance at boss 462 centers greater than boss 462 lateral walls to the distance at boss 462 centers less than the madial wall of lens moulding ring 453 distance to lens moulding ring 453 centers;

3) heat-radiating substrate 450 is placed on desired location in molded lens moulding ring 453 plastic moulds, injection mo(u)lding lens moulding ring 453, fixed leg 457, blocking part 458 and first through hole 456 of molded lens moulding ring 453 simultaneously; When injection mo(u)lding lens moulding ring 453, the fixed leg 457 of lens moulding ring 453 passes second through hole 463 on the heat-radiating substrate 450 and passes through blocking part 458 lens moulding ring 453 is fixing with heat-radiating substrate 450;

4) led chip 451 is fixed on the end face of boss 462 by solid brilliant technology;

5) lead 454 that is electrically connected with led chip 451 electrodes of weldering, lead 454 with stretch into Butut circuit conductive layer 455 interior between lens moulding ring 453 madial walls and boss 462 lateral walls and be electrically connected;

6) by the mould encapsulating molded lens 452 of molded lens 452 and to led chip 451 and lead 454 encapsulation, adhesive curing lens 452 are fixing with lens moulding ring 453, led chip 451, lead 454 and heat-radiating substrate 450.

Embodiment 18

As shown in figure 26, as different from Example 17, heat-radiating substrate 500 is stamped to form by the thin-sheet metal or the metal alloy of high heat-conducting, its material can be stainless steel, copper, tungsten, aluminium, aluminium nitride, chromium etc. or its alloy, be provided with one deck coat of silicon carbide (not shown) on heat-radiating substrate 500 surfaces, the number of lens position ring is six.A side that deviates from boss 501 at heat-radiating substrate 500 is provided with and places in the boss 501 the heat radiation blind hole concentric with boss 501.The side that heat-radiating substrate 500 deviates from boss 501 directly contacts with heat radiation gas.

It is fixing with heat-radiating substrate 500 by hot melt blocking part, fixed leg 504 end 505 that the fixed leg 504 of lens moulding ring 506 passes heat-radiating substrate 500, and heat-radiating substrate 500 is fixed together with lens moulding ring 506 like this.

The top of lens 503 is a sphere.

1) injection mo(u)lding lens moulding ring 506, and an end face from lens moulding ring 506 extends the fixed leg 504 that is provided with simultaneously, and the length of fixed leg 504 is greater than the thickness of heat-radiating substrate 500;

2) second through hole 515 of the boss 501 on the punch forming heat-radiating substrate 500, heat radiation blind hole, lens moulding ring fixed leg 504;

3) insulation moulding Butut circuit conductive layer 507 on heat-radiating substrate 500, Butut circuit conductive layer 507 apart from the distance at boss 501 centers greater than boss 501 lateral walls to the distance at boss 501 centers less than the madial wall of lens moulding ring 506 distance to lens moulding ring 506 centers;

4) fixed leg 504 of lens moulding ring 506 is passed second through hole 515 that cooperates with lens moulding ring fixed leg 504 on the heat-radiating substrate 500, the moulding blocking part, fixed leg 504 end 505 by hot melt lens moulding ring 506 makes lens moulding ring 506 fixing with heat-radiating substrate 500;

5) led chip 510 is fixed on the bottom surface of depressed part 511 at boss 501 tops by solid brilliant technology;

6) gold thread 512 that is electrically connected with led chip 510 electrodes of weldering, gold thread 512 with stretch into lens moulding ring 506 madial walls and be electrically connected with Butut circuit conductive layer 507 between boss 501 lateral walls;

7) by the mould encapsulating molded lens 503 of molded lens 503 and to led chip 510 and gold thread 512 encapsulation, adhesive curing lens 503 are fixing with lens moulding ring 506, led chip 510, gold thread 512 and heat-radiating substrate 500.

Embodiment 19

As Figure 27, shown in Figure 28, as different from Example 15, the plastic parts 519 of the molded lens that plastic cement lens moulding ring 521 links as a whole by dowel 522.In the top of boss 523 cavity 524, be fixed with R look led chip 528, G look led chip 529, B look led chip 530 by solid brilliant technology.When the plastic parts 519 of heat-radiating substrate 520, pcb board 543 and molded lens is fixed together, boss 523 places in first through hole 544 of corresponding plastic cement lens moulding ring 521, Butut circuit conductive layer 532,534,536,538,540,542 stretches between the lateral wall of the madial wall of first through hole 544 and boss 523 and is independently of one another, and gold thread 531,533,535,537,539,541 places in first through hole 544.The positive pole of the led chip 528 of R look is electrically connected by the first Butut circuit conductive layer 532 between the lateral wall of gold thread 531 and the madial wall that stretches into first through hole 544 and boss 523, and the negative pole of the led chip 528 of R look is electrically connected by the Butut circuit conductive layer 534 between the lateral wall of gold thread 533 and the madial wall that stretches into first through hole 544 and boss 523.The positive pole of the led chip 529 of G look is electrically connected by the Butut circuit conductive layer 536 between the lateral wall of gold thread 535 and the madial wall that stretches into first through hole 544 and boss 523, and the negative pole of the led chip 529 of G look is electrically connected by the Butut circuit conductive layer 538 between the lateral wall of gold thread 537 and the madial wall that stretches into first through hole 544 and boss 523.The positive pole of the led chip 530 of B look is electrically connected by the Butut circuit conductive layer 540 between the lateral wall of gold thread 539 and the madial wall that stretches into first through hole 544 and boss 523, and the negative pole of the led chip 530 of B look is electrically connected by the Butut circuit conductive layer 542 between the lateral wall of lead 541 and the madial wall that stretches into first through hole 544 and boss 523.The reinforcement fixed leg 527 that hole 526 on the plastic parts 519 that is provided with on the lens 525 with molded lens cooperates.

Embodiment 20

As shown in figure 29, as different from Example 15, lens forming plastic cement spare is a lens forming plastic cement plate 600, and the number of lens forming plastic cement plate 600 is one.On lens forming plastic cement plate 600, be provided with first through hole 603 that is used for molded lens 604 that cooperates one by one with the boss 602 of heat-radiating substrate 601.On the end face of lens forming plastic cement plate 600, extend and be provided with fixed leg 605, form blocking part 607 during at molded lens forming plastic cement plate 600 in by the mould that heat-radiating substrate 601, pcb board 606 is placed molded lens forming plastic cement plate 600 in the end of fixed leg 605.

Embodiment 21

As shown in figure 30, as different from Example 19.Also be connected with dowel 621,622,623,624 in addition on 620 on plastic cement lens position ring.On the end face of plastic cement lens position ring 620, be provided with reference column 631, on heat-radiating substrate 625, be provided with the locating hole 626 that cooperates with reference column 631, be provided with the locating hole 628 that cooperates with reference column 631 on pcb board 627, pcb board 627, heat-radiating substrate 625 are accurately located by reference column 631.Pcb board 627, heat-radiating substrate 625, plastic cement lens position part 629 are fixed together by screw 630, rather than are fixed together by fixed leg and blocking part.Fixing hole 632 on plastic cement lens position part 629 places the junction of dowel and plastic cement lens position ring 620.

Embodiment 22

As shown in figure 31, as different from Example 20, on heat-radiating substrate 650, convex with reference column 651, be provided with the locating hole 654 that cooperates with reference column 651 at plastic cement lens position part 653, be provided with the locating hole 656 that cooperates with reference column 651 on pcb board 655, plastic cement lens position part 653, pcb board 655 are accurately located by reference column 651 and heat-radiating substrate 650.Pcb board 655, heat-radiating substrate 650, plastic cement lens position part 653 are fixed together by screw 652, rather than will be fixed together by fixed leg and blocking part.

Embodiment 23

Shown in figure 32, as different from Example 21, the number of first through hole 671 on plastic cement lens position plate 670 is 24.Fixed leg 672 is evenly distributed on the center of per four first adjacent through holes 671 and the outside of first through hole 671.

Embodiment 24

Extremely shown in Figure 37 as Figure 33, the injection mould of a kind of positioning lens of moulding LED integrated morphology or the plastic parts of molded lens, LED integrated morphology, the plastic parts that comprises heat-radiating substrate 701, pcb board 702, Butut circuit conductive layer 703, positioning lens or molded lens, injection mould comprise cover half device, dynamic model device, advance adhesive dispenser, liftout attachment and heat-radiating substrate 701 and pcb board 702 are placed on the positioner of the desired location in the injection mould when injection mo(u)lding lens position ring.

The plastic parts of positioning lens or molded lens is a lens position ring 704, lens position ring 704 comprises the independently plastic parts body 705 of ring-type, be provided with first through hole 706 of positioning lens at the axis direction of plastic parts body 705, on the end face of plastic parts body 705, extend and be provided with four fixed legs 707, form cross section during at molded lens locating ring 704 in the end of fixed leg 707 in by the mould that heat-radiating substrate 701 is placed molded lens locating ring 704 and be circular blocking part 708.Be provided with the glue injection channel 709 of injecting packing colloid on plastic parts body 705, the glue mouth 710 of glue injection channel 709 places on the end face of plastic parts body 705 away from blocking part 708 1 sides, and glue mouth 710 and glue injection channel 709 are communicated with the sidewall of first through hole 706.

Convex with in the bottom of heat-radiating substrate 701 and heat-radiating substrate 701 integrated a plurality of chip fixing lug boss 711, second through hole 712 that cooperates with fixed leg 707.The cross section of chip fixing lug boss 711 is circular, is provided with the depressed part 712 with the concentric storing led chip of chip fixing lug boss 711 at the top of chip fixing lug boss 711, and the bottom surface of depressed part 712 is for placing the plane of led chip.A side that deviates from chip fixing lug boss 711 at heat-radiating substrate 701 is provided with macropore (not shown), the aperture 713 that places in the chip fixing lug boss 711 with the concentric heat radiation ladder hole of chip fixing lug boss 711, and led chip covers the aperture 713 of heat radiation ladder hole fully.Deviate from the periphery of the big end of ladder hole on the heat-radiating substrate 701 of chip fixing lug boss 711 1 sides and be provided with and heat-radiating substrate 701 integrated heat radiation convex tendons 714, be provided with heat insulation blind hole 715 in heat radiation convex tendon 714, heat insulation blind hole 715 is communicated with towards chip fixing lug boss 711 1 sides with the base plate of heat-radiating substrate 701 towards a side of chip fixing lug boss 711.The side that heat-radiating substrate 701 deviates from chip fixing lug boss 711 directly contacts with heat radiation gas.

Butut circuit conductive layer 703 is set directly on the pcb board 702, and Butut circuit conductive layer 703 is distributed on the same plane.On pcb board 702, be provided with fourth hole 716 that cooperates with chip fixing lug boss 711 and the third through-hole 717 that cooperates with fixed leg 707, pcb board 702 places heat-radiating substrate 701 to be provided with a side of chip fixing lug boss 711 and directly contacts with heat-radiating substrate 701, and the side that pcb board 702 is provided with Butut circuit conductive layer 703 deviates from the contact-making surface that contacts heat-radiating substrate 701.

The chip fixing lug boss 711 of heat-radiating substrate 701 is passed the fourth hole 716 of pcb board 702, and the fixed leg 707 of lens position ring 704 passes the third through-hole 717 on the pcb board 702, second through hole 712 of heat-radiating substrate 701 is fixed with pcb board 702, heat-radiating substrate 701 by the blocking part 708 of fixed leg 707 ends.Chip fixing lug boss 711 places in first through hole 706 of corresponding plastic parts body 705, and Butut circuit conductive layer 703 stretches between the madial wall and chip fixing lug boss 711 lateral walls of first through hole 706.

The cover half device comprises the top clamping plate 718 that is fixed on the injection machine, and with the cover half backing plate 719 that top clamping plate 718 is fixed, the solid plate 720 with cover half backing plate 719 is fixed is fixed on the cover half mold insert 721 in the solid plate 720.

The dynamic model device comprises the Bottom clamp plate 722 that is fixed on the injection machine, and with two cushion blocks 723 that Bottom clamp plate 722 is fixed, the moving platen 724 with two cushion blocks 723 are fixed is fixed on the dynamic model mold insert 725 in the moving platen 724.

Advance adhesive dispenser and comprise six some cast gates that are communicated with runner 726 and nozzle 727.Each lens position ring 704 corresponding two some cast gate, the some cast gate is communicated with plastic parts body die cavity 732, is symmetrically distributed in the both sides of the protuberance of moulding glue injection channel 709.Nozzle 727 is fixed in top clamping plate 718 and the cover half backing plate 719.

Liftout attachment comprises thimble backing plate 728, thimble fixed head 729, thimble 730, and thimble 730 is fixed on the thimble fixed head 729 and stretches in moving platen 724 and the dynamic model mold insert 725.Thimble backing plate 728 and thimble fixed head 729 are installed between two cushion blocks 723.

Along the base plane somatotype that heat-radiating substrate 701 deviates from chip fixing lug boss 711, die joint is the plane.

On cover half mold insert 721, be provided with ccontaining heat-radiating substrate 701 and pcb board 702 rectangle cavity 731, the degree of depth of rectangle cavity 731 equals the thickness sum of heat-radiating substrate 701 and pcb board 702, is provided with the empty avoiding gap between the sidewall of the sidewall of rectangle cavity 731 and heat-radiating substrate 701.

Be provided with the groove 734 of the plastic parts body die cavity 732 of forming plastic cement spare body 705, the boss 733 that is convexly equipped with moulding first through hole 706 in plastic parts body die cavity 732, moulding Butut circuit conductive layer 703, the recessed circular hole 735 of empty avoiding of empty avoiding chip fixing lug boss 733 in the bottom of rectangle cavity 731, on the sidewall of boss 733, be provided with the protuberance 736 of moulding glue injection channel 709.Boss 733 and plastic parts body die cavity 732 form the depressed part of ring-type.Be provided with the blocking part die cavity 737 of moulding blocking part 708 and the emptiness avoiding hole 738 of empty avoiding heat radiation convex tendon 714 on dynamic model mold insert 725, blocking part die cavity 737 is circular shrinkage pool for the cross section.Also be provided with the detent mechanism that heat-radiating substrate 701 and pcb board 702 is placed on the containing cavity desired location.Detent mechanism comprises the U-shaped locating slot 739 that is arranged on 702 two opposite flanks of pcb board, is fixed on four cylindrical ladder locating shaft 740 and four ladder locating shafts 741 with three ladders with two ladders in the cover half mold insert 721.On dynamic model mold insert 725, be provided with little 742 emptiness avoiding hole 743 of cylindrical ladder locating shaft 740 and little emptiness avoiding hole 744 of ladder locating shaft 741.The axis 745 of ladder locating shaft 741 cooperates with U-shaped locating slot 739.Folding mould direction is that horizontal direction is a Y direction, heat-radiating substrate 701 and pcb board 702 are placed in the injection mould, two U-shaped sides of 742 pairs of heat-radiating substrates 701 of little axle of cylindrical ladder locating shaft 740 position in Z-direction, 745 pairs of pcb boards 702 of the axis of ladder locating shaft 741 position from Z-direction and X-direction both direction, and 746 pairs of heat-radiating substrates of the little axle of ladder locating shaft 741 701 position from X-direction.Plastic parts body die cavity 732 and boss 733 are that the forming surface demoulding tapering of Y direction is big along stripping direction, and the blocking part die cavity 737 of dynamic model part is that the forming surface of Y direction does not have demoulding tapering along stripping direction.

Embodiment 25

To shown in Figure 40, as different from Example 24, ejecting mechanism is arranged on cover half device one side, is the upside-down mounting mould as Figure 38.

The cover half device comprises the top clamping plate 763 that is fixed on the injection machine, and with two cushion blocks 764 that top clamping plate 763 is fixed, the solid plate 765 with two cushion blocks 764 are fixed is fixed on the cover half mold insert 754 in the solid plate 765.

The dynamic model device comprises the Bottom clamp plate 766 that is fixed on the injection machine, and the moving platen 767 with Bottom clamp plate 766 is fixed is fixed on the dynamic model mold insert 761 in the moving platen 767.

Liftout attachment comprise thimble backing plate 768, with fixing thimble fixed head 769, the thimble 770 of thimble backing plate 768, thimble 770 is fixed on the thimble fixed head 769 and stretches into that solid plate 765 and cover half mold insert 754 are interior to be communicated with plastic parts body die cavity 755.Thimble backing plate 768 and thimble fixed head 769 are installed between two cushion blocks 764.Thimble backing plate 768 links together with moving platen 767 by connecting guide pad 771.

Plastic cement lens position part 751 comprises the plastic parts body 752 of ring-type and the dowel 753 with 752 injection mo(u)ldings of plastic parts body that plastic parts body 752 is linked together.The number of plastic parts body 752 is six.

On cover half mold insert 754, also be provided with the dowel die cavity 756 of the moulding dowel 753 that is communicated with plastic parts body die cavity 755.Dowel die cavity 756 is communicated with the depressed part that boss 772 and plastic parts body die cavity 755 form ring-type.On dynamic model mold insert 761, be provided with the blocking part die cavity 758 of moulding blocking part 757 and the emptiness avoiding hole 760 of empty avoiding heat radiation convex tendon 759.Dynamic model mold insert 761 and cover half mold insert 754 design routinely along the demoulding tapering of the forming surface of folding mould direction.

Cast gate 762 is a down gate, and number is one, is communicated with dowel die cavity 756 bottoms, and places the centre position of dowel die cavity 756.

Embodiment 26

As Figure 41, shown in Figure 42, as different from Example 24, the plastic parts of positioning lens or molded lens is a lens forming plastic cement spare 780, lens forming plastic cement spare 780 comprises tabular plastic parts body 781, on plastic parts body 781, be provided with six first through holes 782, extension is provided with fixed leg 783 on the end face of plastic parts body 781, is provided with blocking part 784 in the end of fixed leg 783.First through hole 782 is for having the through hole of bellmouth, also is provided with equally distributed four columniform lens fixing holes 785 in the periphery of each first through hole 782.Be not provided with heat radiation convex tendon and heat insulation blind hole on the heat-radiating substrate 794 in the present embodiment.

Be provided with the end face somatotype of Butut circuit conductive layer 787 along pcb board 786, die joint is the plane.

On cover half mold insert 788, also be provided with the plastic parts body die cavity 789 of rectangle, be convexly equipped with boss 790 at bottom moulding first through hole 782 of plastic parts body die cavity 789, the cylindrical mold insert axle 791 of molded lens fixing hole 785 is provided with the emptiness avoiding hole 793 of empty avoiding chip fixing lug boss 792 in boss 790.Cylindrical mold insert axle 791 is fixed on the cover half mold insert 788 and is convexly equipped with bottom at plastic parts body die cavity 789.The degree of depth of plastic parts body die cavity 789 equals the thickness sum of the thickness and the Butut circuit conductive layer 787 of tabular plastic parts body 781.

The bottom of the rectangle cavity 796 of ccontaining heat-radiating substrate 794 and pcb board 786 is provided with the positioning boss 798 that the blocking part die cavity 797 of moulding blocking part 784 and four cooperate with heat radiation blind hole 799 in the chip fixing lug boss 792 on dynamic model mold insert 795.When injection mo(u)lding lens forming plastic cement spare 780, cooperate with positioning boss 798 by the heat radiation blind hole 799 on the heat-radiating substrate 794, heat-radiating substrate 794 and pcb board 786 are seated in desired location in the injection mould.

Cast gate 700 is the some cast gate, and number is two, is communicated with plastic parts body die cavity 789 bottoms.

Embodiment 27

As Figure 43, shown in Figure 44, as different from Example 24, LED integrated morphology comprises heat-radiating substrate 800, Butut circuit conductive layer 801 and lens forming plastic cement spare.Butut circuit conductive layer 801 is set directly on the heat-radiating substrate 800.Lens forming plastic cement spare comprise ring-type plastic parts body 803 and with plastic parts body 803 link together with dowel 804. first through holes 805 of plastic parts body 803 injection mo(u)ldings for having the through hole of bellmouth, also be provided with equally distributed four columniform lens fixing holes 806 in the periphery of each first through hole 805.Lens forming plastic cement spare is fixed together by fixed leg and blocking part and heat-radiating substrate 800.The number of moulding ring is 24.In the present embodiment, be not provided with the chip fixing lug boss on the heat-radiating substrate 800 and place heat radiation blind hole, heat radiation convex tendon and heat insulation blind hole in the boss, chip directly is fixed on the plane of heat-radiating substrate 800 and places in first through hole 805.

Deviate from the bottom somatotype of Butut circuit conductive layer 801 along heat-radiating substrate 800 base plates, die joint is the plane.

On cover half mold insert 807, also be provided with the dowel die cavity 809 of the moulding dowel 804 that is communicated with plastic parts body die cavity 808.Dowel die cavity 809 is communicated with the depressed part that boss 810 and plastic parts body die cavity 808 form ring-type.The containing cavity of ccontaining heat-radiating substrate 800 is the rectangle cavity 810 that is arranged on the cover half mold insert, and the degree of depth of rectangle cavity 810 equals the thickness sum of heat-radiating substrate 800 and pcb board, is provided with the empty avoiding gap between the sidewall of the sidewall of rectangle cavity 810 and heat-radiating substrate 800.

On dynamic model mold insert 811, be provided with the blocking part die cavity 812 of moulding blocking part.Also be provided with the TOP-TIP (not shown) in the cover half device of present embodiment, the number of the cast gate (not shown) that is communicated with runner 802 is six, is communicated with dowel die cavity 809 bottoms.The corresponding hot-runner nozzle (not shown) of each cast gate.

Embodiment 28

As shown in figure 45, as different from Example 24, be provided with on heat-radiating substrate 830 and heat-radiating substrate 830 integrated boss 831, boss 831 deviates from pcb board, is provided with the blind hole (not shown) of fixed chip in boss 831.

In a cover injection mould, place four heat-radiating substrates 830 simultaneously.

Along the base plane somatotype of heat-radiating substrate base plate towards boss 831, die joint is the plane.

The containing cavity 832 of heat-radiating substrate 830 and pcb board 833 is the rectangle cavity, is arranged on the solid plate, is provided with the empty avoiding gap between the sidewall of containing cavity and heat-radiating substrate 830.

On the dynamic model mold insert, be provided with the emptiness avoiding hole (not shown) of boss 831.

Embodiment 29

As shown in figure 46, as different from Example 26, on dynamic model mold insert 850, also be provided with the plastic parts body die cavity (not shown) of rectangle, be convexly equipped with boss at bottom moulding first through hole of plastic parts body die cavity, the cylindrical mold insert axle of molded lens fixing hole is provided with the emptiness avoiding hole of empty avoiding chip fixing lug boss in boss.Cylindrical mold insert axle is fixed on the cover half mold insert and is convexly equipped with bottom at plastic parts body die cavity.

The bottom of the rectangle cavity 854 of ccontaining heat-radiating substrate 852 and pcb board 853 is provided with the positioning boss 857 that the blocking part die cavity 855 of moulding blocking part and four cooperate with heat radiation blind hole in the chip fixing lug boss 856 on cover half mold insert 851.The cast gate that is communicated with runner 858 is a cast gate, and number is 7, is communicated with blocking part die cavity 855 bottoms.

The present invention is not limited to the foregoing description.The shape of heat-radiating substrate of the present invention can design different shape as required, even can be designed to the product appearance part, the present invention just intercepts wherein led chip unit, so mould die joint of the present invention is an illustrative, can determine die joint according to the shape of substrate.Chip fixing lug boss number among the present invention can be from two to a lot of, and the present invention just exemplifies several LED integrated morphologies unit.Butut circuit conductive layer among the present invention is an illustrative.On a chip fixing lug boss, can fix a led chip, also can fix the led chip of two different colours, the chip of three R, G, B different colours, or the chip more than three.When the chip number not simultaneously, the design corresponding modify of Butut circuit conductive layer belongs to prior art, the present invention no longer describes in detail.Heat-radiating substrate among the present invention directly contacts with radiator liquid, only needs heat-radiating substrate no leakage body to get final product, so no longer illustrate with embodiment in the present invention.

In the present invention, if the dimensional accuracy height of heat-radiating substrate and pcb board, the periphery location of also available heat-radiating substrate and pcb board.

Claims

1. LED integrated morphology, comprise heat-radiating substrate, led chip, lens, plastic cement lens position part, be electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, be used for the packing colloid of packaging LED chips and lead, it is characterized in that: be provided with on the heat-radiating substrate and the integrated chip fixing lug boss more than two or two of heat-radiating substrate, the area of the cross section of heat-radiating substrate is more than three times or three times of area of the cross section of a chip fixing lug boss, all directly is fixed with described led chip by solid brilliant technology on the end face of each chip fixing lug boss; On plastic cement lens position part, be provided with the chip fixing lug boss cooperate, first through hole of positioning lens and coating packing colloid, the number of lens, chip fixing lug boss, first through hole is corresponding one by one; On the end face of plastic cement lens position part, extend and be provided with two or more fixed legs, on heat-radiating substrate, be provided with second through hole that cooperates with fixed leg, fixed leg passes second through hole of heat-radiating substrate, form the blocking part when forming the blocking part by hot melting mode in the end of fixed leg or heat-radiating substrate being placed in the mould of forming plastic cement lens position part at forming plastic cement lens position part, plastic cement lens position part is fixed by fixed leg and blocking part and heat-radiating substrate; The chip fixing lug boss places in the first corresponding through hole, Butut circuit conductive layer stretches between the lateral wall of the madial wall of first through hole and chip fixing lug boss, lead places in first through hole, lead one end is electrically connected with the electrode of led chip, and the other end of lead and the madial wall that stretches into first through hole are electrically connected with Butut circuit conductive layer between the chip fixing lug boss lateral wall; The position of corresponding first through hole is provided with the glue injection channel of injecting packing colloid on plastic cement lens position part, and the Jiao Kou of glue injection channel places on the end face of plastic cement lens position part away from blocking part one side, and glue injection channel is communicated with the madial wall of first through hole; Before injecting packing colloid, lens and plastic cement lens position part are fixed; After injecting packing colloid, packing colloid is further fixed lens; The side that heat-radiating substrate deviates from the chip fixing lug boss directly contacts with heat radiation gas or radiator liquid.

2. a kind of LED integrated morphology as claimed in claim 1, it is characterized in that: a side that deviates from the chip fixing lug boss at heat-radiating substrate is provided with heat radiation blind hole or the heat radiation ladder hole that places in the chip fixing lug boss, and led chip covers the aperture of heat radiation ladder hole fully.

3. a kind of LED integrated morphology as claimed in claim 2, it is characterized in that: deviate from the heat-radiating substrate of a side of chip fixing lug boss being provided with and the integrated heat radiation convex tendon of substrate at the periphery of the periphery of heat radiation blind hole or heat radiation ladder hole big end, be provided with heat insulation blind hole in the heat radiation convex tendon, heat insulation blind hole is communicated with heat-radiating substrate towards a side of chip fixing lug boss.

4. a kind of LED integrated morphology as claimed in claim 1 is characterized in that: the chip fixing lug boss is cylindrical, is provided with the depressed part of putting led chip at the top of chip fixing lug boss, and the bottom surface of depressed part is for placing the plane of led chip.

5. a kind of LED integrated morphology as claimed in claim 1, it is characterized in that: also comprise pcb board, pcb board places heat-radiating substrate to be provided with a side of chip fixing lug boss, Butut circuit conductive layer is set directly on the pcb board, on pcb board, be provided with the fourth hole of empty avoiding chip fixing lug boss and the third through-hole that cooperates with fixed leg, the chip fixing lug boss of heat-radiating substrate is passed fourth hole, the side that pcb board is provided with Butut circuit conductive layer deviates from the contact-making surface that contacts heat-radiating substrate, fixed leg passes third through-hole on the pcb board and second through hole on the heat-radiating substrate successively, forms the blocking part by hot melting mode again or with heat-radiating substrate, pcb board forms the blocking part when placing the inherent forming plastic cement lens position of the mould of forming plastic cement lens position part part.

6. a kind of LED integrated morphology as claimed in claim 1 is characterized in that: heat-radiating substrate is nonmetal heat conductive insulating plate, and Butut circuit conductive layer is set directly on the heat-radiating substrate and towards plastic cement lens position part.

7. a kind of LED integrated morphology as claimed in claim 1, it is characterized in that: described heat-radiating substrate is a metal substrate, Butut circuit conductive layer is set directly on the heat-radiating substrate and towards plastic cement lens position part, is provided with an insulating barrier between Butut circuit conductive layer and metal substrate.

8. a kind of LED integrated morphology as claimed in claim 1 is characterized in that: be provided with one deck coat of silicon carbide on described heat-radiating substrate surface.

9. as any described a kind of LED integrated morphology of claim 1 to 8, it is characterized in that: plastic cement lens position part is a plastic cement lens position ring, the corresponding plastic cement lens position ring independently of chip fixing lug boss, Butut circuit conductive layer is distributed on the same plane; Lens are fixed with the first corresponding through hole tight fit or by edging machine and the hot pressing of plastic cement lens position part.

10. as any described a kind of LED integrated morphology of claim 1 to 8, it is characterized in that: plastic cement lens position part comprises plastic cement lens position ring and the dowel with the injection mo(u)lding of plastic cement lens position ring that plastic cement lens position ring is linked together, the corresponding plastic cement lens position ring of chip fixing lug boss, Butut circuit conductive layer is distributed on the same plane; Lens are fixed with the first corresponding through hole tight fit or by edging machine and the hot pressing of plastic cement lens position part.

11. as any described a kind of LED integrated morphology of claim 1 to 8, it is characterized in that: the number of plastic cement lens position part is one, for tabular, on plastic cement lens position part, be provided with two or more described first through holes, described first through hole on the corresponding plastic cement lens position of the described chip fixing lug boss part on the heat-radiating substrate, Butut circuit conductive layer is distributed on the same plane; Lens are fixed with the first corresponding through hole tight fit or by edging machine and the hot pressing of plastic cement lens position part.

12. a kind of LED integrated morphology as claimed in claim 11 is characterized in that: fixed leg places the center of per four first adjacent through holes.

13. LED lamp that has as any described LED integrated morphology of claim 1 to 8.

14. one kind has as any described LED dot matrix display screen of claim 1 to 8, in described LED dot matrix display screen, comprise described LED integrated morphology, described LED integrated morphology also comprises imaging controller, and the Butut circuit conductive layer of each chip is electrically connected separately with imaging controller.

15. a back lighting device that has as any described LED integrated morphology of claim 1 to 8 comprises the LGP and the LED-backlit source module that are installed together, LED-backlit source module comprises described LED integrated morphology.

16. a projection arrangement that has as any described LED integrated morphology of claim 1 to 8 comprises led light source, imaging system and projection imaging screen, led light source comprises described LED integrated morphology.

17. the manufacture method of a LED integrated morphology, LED integrated morphology comprises heat-radiating substrate, led chip, lens, plastic cement lens position part is electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, be used for the packing colloid of packaging LED chips and lead, first through hole that it is characterized in that on plastic cement lens position part, being provided with positioning lens and coat packing colloid, extension is provided with fixed leg on the end face of plastic cement lens position part, and technical process comprises:

4) led chip is fixed on the item face of chip fixing lug boss by solid brilliant technology;

6) lens are fixed on the plastic cement lens position part;

18. the manufacture method of a LED integrated morphology, LED integrated morphology comprises heat-radiating substrate, pcb board, led chip, lens, plastic cement lens position part, be electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, be used for the packing colloid of packaging LED chips and lead, first through hole that it is characterized in that on plastic cement lens position part, being provided with positioning lens and coat packing colloid, extension is provided with fixed leg on the end face of plastic cement lens position part, and technical process comprises:

7) lens are fixed on the plastic cement lens position part;

19. the manufacture method of a LED integrated morphology, LED integrated morphology comprises heat-radiating substrate, led chip, lens, plastic cement lens position part is electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, be used for the packing colloid of packaging LED chips and lead, first through hole that it is characterized in that on plastic cement lens position part, being provided with positioning lens and coat packing colloid, extension is provided with fixed leg on the end face of plastic cement lens position part, and technical process comprises:

7) lens are fixed on the plastic cement lens position part;

20. the manufacture method of a LED integrated morphology, LED integrated morphology comprises heat-radiating substrate, pcb board, led chip, lens, plastic cement lens position part is electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, be used for the packing colloid of packaging LED chips and lead, first through hole that it is characterized in that on plastic cement lens position part, being provided with positioning lens and coat packing colloid, extension is provided with fixed leg on the end face of plastic cement lens position part, and technical process comprises:

8) lens are fixed on the plastic cement lens position part;

21. a LED integrated morphology comprises heat-radiating substrate, led chip, and lens are electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, it is characterized in that: also comprise lens forming plastic cement spare; Be provided with on the heat-radiating substrate and the integrated chip fixing lug boss more than two or two of heat-radiating substrate, the area of the cross section of heat-radiating substrate is more than three times or three times of area of the cross section of a chip fixing lug boss, all directly is fixed with described led chip by solid brilliant technology on the end face of each chip fixing lug boss; On lens forming plastic cement spare, be provided with the chip fixing lug boss cooperate, first through hole of molded lens, the number of lens, chip fixing lug boss, first through hole is corresponding one by one; On the end face of lens forming plastic cement spare, extend and be provided with two or more fixed legs, on heat-radiating substrate, be provided with second through hole that cooperates with fixed leg, fixed leg passes second through hole on the heat-radiating substrate, forms the blocking part when forming the blocking part by hot melting mode in the end of fixed leg or heat-radiating substrate being placed in the mould of molded lens forming plastic cement spare at molded lens forming plastic cement spare; Lens forming plastic cement spare is fixed by fixed leg and blocking part and heat-radiating substrate; The chip fixing lug boss places in the corresponding lens forming plastic cement spare, Butut circuit conductive layer stretches between the madial wall and chip fixing lug boss lateral wall of lens forming plastic cement spare, lead places in the lens forming plastic cement spare, lead one end is electrically connected with the electrode of led chip, and the other end of lead and the madial wall that stretches into lens forming plastic cement spare are electrically connected with Butut circuit conductive layer between the chip fixing lug boss lateral wall; Lens are the transparent enclosure colloid of packaging LED chips and lead; The side that heat-radiating substrate deviates from the chip fixing lug boss directly contacts with heat radiation gas or radiator liquid.

22. a kind of LED integrated morphology as claimed in claim 20 is characterized in that: the side that heat-radiating substrate deviates from the chip fixing lug boss directly contacts with heat radiation gas; A side that deviates from the chip fixing lug boss at heat-radiating substrate is provided with heat radiation blind hole that is beneficial to chip cooling or the heat radiation ladder hole that places in the chip fixing lug boss; The chip fixing lug boss is cylindrical, is provided with the depressed part of putting led chip at the top of chip fixing lug boss, and the bottom surface of depressed part is for placing the plane of led chip.

23. a kind of LED integrated morphology as claimed in claim 21, it is characterized in that: deviate from the heat-radiating substrate of a side of chip fixing lug boss being provided with and the integrated heat radiation convex tendon of substrate at the periphery of the periphery of heat radiation blind hole or heat radiation ladder hole big end, be provided with heat insulation blind hole in the heat radiation convex tendon, heat insulation blind hole is communicated with towards chip fixing lug boss one side with the base plate of heat-radiating substrate towards a side of chip fixing lug boss.

24. a kind of LED integrated morphology as claimed in claim 20, it is characterized in that: also comprise pcb board, pcb board places heat-radiating substrate to be provided with a side of chip fixing lug boss, Butut circuit conductive layer is set directly on the pcb board, on pcb board, be provided with the fourth hole of empty avoiding chip fixing lug boss and the third through-hole that cooperates with fixed leg, the chip fixing lug boss of heat-radiating substrate is passed fourth hole, the side that pcb board is provided with Butut circuit conductive layer deviates from the contact-making surface that contacts heat-radiating substrate, fixed leg passes third through-hole on the pcb board and second through hole on the heat-radiating substrate successively, forms the blocking part by hot melting mode again or with heat-radiating substrate, pcb board forms the blocking part when placing the inherent forming plastic cement lens position of the mould of forming plastic cement lens position part part.

25. a kind of LED integrated morphology as claimed in claim 20 is characterized in that: Butut circuit conductive layer is set directly on the heat-radiating substrate.

26. a kind of LED integrated morphology as claimed in claim 20, it is characterized in that: the sidewall of first through hole comprises up big and down small taper, and the lens upper surface is the plane.Under the effect of the gravity and first through-hole side wall, become opposite planar behind the some glue.

27. as any described a kind of LED integrated morphology of claim 20 to 26, it is characterized in that: lens forming plastic cement spare is a lens forming plastic cement ring, the corresponding lens forming plastic cement ring independently of chip fixing lug boss, Butut circuit conductive layer is distributed on the same plane.

28. as any described a kind of LED integrated morphology of claim 20 to 26, it is characterized in that: lens forming plastic cement spare comprises lens forming plastic cement ring and the dowel with the injection mo(u)lding of lens forming plastic cement ring that lens forming plastic cement ring is linked together, the corresponding lens forming plastic cement ring of chip fixing lug boss, Butut circuit conductive layer is distributed on the same plane.

29. as any described a kind of LED integrated morphology of claim 20 to 26, it is characterized in that: the number of lens forming plastic cement spare is one, for tabular, on lens forming plastic cement spare, be provided with two or more described first through holes, described first through hole on the corresponding lens forming plastic cement spare of a described chip fixing lug boss on the heat-radiating substrate, Butut circuit conductive layer is distributed on the same plane.

30. a kind of LED integrated morphology as claimed in claim 20 is characterized in that: fixed leg places the center of per four first adjacent through holes.

31. make the method for LED integrated morphology, LED integrated morphology comprises heat-radiating substrate, led chip, lens, lens forming plastic cement spare is electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, it is characterized in that being provided with on lens forming plastic cement spare first through hole of molded lens, extension is provided with fixed leg on the end face of lens forming plastic cement spare, and technical process comprises:

32. make the method for LED integrated morphology, LED integrated morphology comprises heat-radiating substrate, pcb board, led chip, lens, lens forming plastic cement spare, be electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, it is characterized in that being provided with on lens forming plastic cement spare first through hole of molded lens, extension is provided with fixed leg on the end face on the lens forming plastic cement spare, and technical process comprises:

33. the manufacture method of a LED integrated morphology, LED integrated morphology comprises heat-radiating substrate, led chip, lens, lens forming plastic cement spare is electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, it is characterized in that being provided with on lens forming plastic cement spare first through hole of molded lens, extension is provided with fixed leg on the end face on the lens forming plastic cement spare, and technical process comprises:

34. the manufacture method of a LED integrated morphology, LED integrated morphology comprises heat-radiating substrate, pcb board, led chip, lens, lens forming plastic cement spare is electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, be used for the packing colloid of packaging LED chips and lead, it is characterized in that being provided with on lens forming plastic cement spare first through hole of molded lens, extension is provided with fixed leg on the end face on the lens forming plastic cement spare, and technical process comprises:

35. LED integrated morphology, comprise heat-radiating substrate, led chip, lens, the plastic parts of positioning lens or molded lens, be electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, it is characterized in that: be provided with on the heat-radiating substrate and the integrated chip fixing lug boss more than two or two of heat-radiating substrate, the area of the cross section of heat-radiating substrate is more than three times or three times of area of the cross section of a chip fixing lug boss, all directly is fixed with described led chip by solid brilliant technology on the end face of each chip fixing lug boss; The plastic parts of positioning lens or molded lens comprises teething ring and teething ring is linked together with the dowel of teething ring injection mo(u)lding; On teething ring, be provided with first through hole of positioning lens or molded lens; The number of lens, first through hole and chip fixing lug boss is corresponding one by one; The chip fixing lug boss places in the first corresponding through hole, Butut circuit conductive layer stretches between the lateral wall of the madial wall of first through hole and chip fixing lug boss, lead places in first through hole, lead one end is electrically connected with the electrode of led chip, and the other end of lead and the madial wall that stretches into first through hole are electrically connected with Butut circuit conductive layer between the chip fixing lug boss lateral wall; Also be provided with the pinpoint detent mechanism of plastic parts of heat-radiating substrate and positioning lens or molded lens and securing member that heat-radiating substrate and plastic parts are fixed together; The side that heat-radiating substrate deviates from the chip fixing lug boss directly contacts with heat radiation gas or radiator liquid.

36. a kind of LED integrated morphology as claimed in claim 33, it is characterized in that: also comprise pcb board, pcb board places heat-radiating substrate to be provided with a side of chip fixing lug boss, Butut circuit conductive layer is set directly on the pcb board, the side that pcb board is provided with Butut circuit conductive layer deviates from the contact-making surface that contacts heat-radiating substrate, detent mechanism is accurately located the plastic parts of heat-radiating substrate, pcb board and positioning lens or molded lens, and securing member is fixed together the plastic parts of heat-radiating substrate, pcb board and positioning lens or molded lens.

37. LED integrated morphology, comprise heat-radiating substrate, led chip, lens, the plastic parts of positioning lens or molded lens, be electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire, it is characterized in that: be provided with on the heat-radiating substrate and the integrated chip fixing lug boss more than two or two of heat-radiating substrate, the area of the cross section of heat-radiating substrate is more than three times or three times of area of the cross section of a chip fixing lug boss, all directly is fixed with described led chip by solid brilliant technology on the end face of each chip fixing lug boss; The plastic parts of positioning lens or molded lens is tabular, is provided with two or more described first through holes on the plastic parts of positioning lens or molded lens, and the number of lens, first through hole and chip fixing lug boss is corresponding one by one; The chip fixing lug boss places in the first corresponding through hole, Butut circuit conductive layer stretches between the lateral wall of the madial wall of first through hole and chip fixing lug boss, lead places in first through hole, lead one end is electrically connected with the electrode of led chip, and the other end of lead and the madial wall that stretches into first through hole are electrically connected with Butut circuit conductive layer between the chip fixing lug boss lateral wall; Also be provided with the pinpoint detent mechanism of plastic parts of heat-radiating substrate and positioning lens or molded lens and securing member that heat-radiating substrate and plastic parts are fixed together; The side that heat-radiating substrate deviates from the chip fixing lug boss directly contacts with heat radiation gas or radiator liquid.

38. a kind of LED integrated morphology as claimed in claim 35, it is characterized in that: also comprise pcb board, pcb board places heat-radiating substrate to be provided with a side of chip fixing lug boss, Butut circuit conductive layer is set directly on the pcb board, the side that pcb board is provided with Butut circuit conductive layer deviates from the contact-making surface that contacts heat-radiating substrate, detent mechanism is accurately located the plastic parts of heat-radiating substrate, pcb board and positioning lens or molded lens, and securing member is fixed together the plastic parts of heat-radiating substrate, pcb board and positioning lens or molded lens.

39. the injection mould of the positioning lens of a moulding LED integrated morphology or the plastic parts of molded lens, LED integrated morphology comprises heat-radiating substrate, the plastic parts of positioning lens or molded lens, Butut circuit conductive layer; Injection mould comprises cover half device, dynamic model device, advances adhesive dispenser and liftout attachment, advance adhesive dispenser and be arranged on cover half device one side, it is characterized in that: be provided with on the heat-radiating substrate and the integrated boss that is used for fixing led chip more than two or two of heat-radiating substrate, the area of the cross section of heat-radiating substrate is more than three times or three times of area of the cross section of each boss; On positioning lens or molded lens, be provided with boss cooperate, first through hole of positioning lens or molded lens, the number of lens, boss, first through hole is corresponding one by one; On the end face of positioning lens or molded lens, extend and be provided with two or more fixed legs, on heat-radiating substrate, be provided with second through hole that cooperates with fixed leg, fixed leg passes second through hole of heat-radiating substrate, form the blocking part in the end of fixed leg during at moulding positioning lens or molded lens in by the mould that heat-radiating substrate is placed moulding positioning lens or molded lens, positioning lens or molded lens are fixed by fixed leg and blocking part and heat-radiating substrate; Boss places in the first corresponding through hole, and Butut circuit conductive layer stretches between the lateral wall of the madial wall of first through hole and boss; Injection mould comprises the plastic parts body die cavity of forming plastic cement spare body and is convexly equipped with the boss of moulding first through hole in plastic parts body die cavity, the blocking part die cavity of moulding blocking part, the containing cavity of ccontaining heat-radiating substrate is placed on heat-radiating substrate the detent mechanism of containing cavity desired location; Plastic parts body die cavity and boss are arranged on the homonymy of die joint, and blocking part die cavity and plastic parts body die cavity are arranged on the heteropleural of die joint, and containing cavity is communicated with plastic parts body die cavity or is communicated with the blocking part die cavity; Be provided with chip fixing lug boss emptiness avoiding hole in mould, chip fixing lug boss emptiness avoiding hole and plastic parts body die cavity are arranged on the homonymy of die joint, are provided with the empty avoiding gap between chip fixing lug boss emptiness avoiding hole and chip fixing lug boss.

40. the injection mould of the positioning lens of moulding LED integrated morphology as claimed in claim 39 or the plastic parts of molded lens, it is characterized in that: plastic parts body die cavity, boss are arranged on the cover half part, the blocking part die cavity is arranged on the dynamic model part, ejecting mechanism is arranged on the dynamic model part, and the cast gate that advances adhesive dispenser is communicated with the bottom of plastic parts body die cavity; Plastic parts body die cavity and boss are big along the forming surface demoulding tapering of stripping direction, and the blocking part die cavity of dynamic model part does not have demoulding tapering or is back taper along the forming surface of stripping direction.

41. the injection mould of the positioning lens of moulding LED integrated morphology as claimed in claim 39 or the plastic parts of molded lens, it is characterized in that: plastic parts body die cavity, boss are arranged on the cover half part, the blocking part die cavity is arranged on the dynamic model part, ejecting mechanism is arranged on the cover half part, and the cast gate that advances adhesive dispenser is communicated with the bottom of plastic parts body die cavity.

42. the injection mould of the positioning lens of moulding LED integrated morphology as claimed in claim 39 or the plastic parts of molded lens, it is characterized in that: plastic parts body die cavity, boss are arranged on the dynamic model part, the blocking part die cavity is arranged on the cover half part, ejecting mechanism is arranged on the dynamic model part, and the cast gate that advances adhesive dispenser is communicated with the bottom of blocking part die cavity.

43. the injection mould of the positioning lens of moulding LED integrated morphology as claimed in claim 39 or the plastic parts of molded lens is characterized in that: Butut circuit conductive layer is set directly on the heat-radiating substrate and towards the plastic parts of positioning lens or molded lens; Detent mechanism is the locating hole that cooperates with the chip fixing lug boss, and locating hole and plastic parts body die cavity are at the homonymy of die joint.

44. the injection mould of the positioning lens of moulding LED integrated morphology as claimed in claim 39 or the plastic parts of molded lens is characterized in that: a side that deviates from the chip fixing lug boss at heat-radiating substrate is provided with heat radiation blind hole or the heat radiation ladder hole that places in the chip fixing lug boss; Deviate from the heat-radiating substrate of a side of chip fixing lug boss being provided with and the integrated heat radiation convex tendon of substrate at the periphery of the periphery of heat radiation blind hole or heat radiation ladder hole big end, in the heat radiation convex tendon, be provided with heat insulation blind hole; Be provided with heat radiation convex tendon emptiness avoiding hole on injection mould, heat radiation convex tendon emptiness avoiding hole and blocking part die cavity are provided with the empty avoiding gap at the homonymy of die joint between heat radiation convex tendon emptiness avoiding hole and heat radiation convex tendon.

45. the injection mould of the positioning lens of moulding LED integrated morphology as claimed in claim 39 or the plastic parts of molded lens is characterized in that: keeper is a locating shaft, and locating shaft cooperates with heat-radiating substrate.

46. the injection mould of the positioning lens of moulding LED integrated morphology as claimed in claim 39 or the plastic parts of molded lens, it is characterized in that: also comprise pcb board, Butut circuit conductive layer is set directly on the pcb board, the side that pcb board is provided with Butut circuit conductive layer deviates from the contact-making surface that contacts heat-radiating substrate, and fixed leg passes pcb board and heat-radiating substrate successively and is fixed together by plastic parts, pcb board and the heat-radiating substrate of blocking part with positioning lens or molded lens; Keeper is a locating shaft, is provided with ringent locating slot on the side of pcb board, locating shaft be multidiameter and with plastic parts body die cavity homonymy, the little axle of locating shaft cooperates with heat-radiating substrate, adjacent with little of locating shaft cooperates with locating slot on the pcb board.

47. injection mould as the plastic parts of the positioning lens of any described moulding LED integrated morphology of claim 39 to 45 or molded lens, it is characterized in that: the plastic parts of positioning lens or molded lens is the lens position plastic parts of positioning lens, on the lens position plastic parts, be provided with the glue injection channel of injecting packing colloid, the Jiao Kou of glue injection channel places on the end face of lens position plastic parts away from blocking part one side, and glue injection channel is communicated with the madial wall of first through hole; On the sidewall of boss, be provided with the protuberance of moulding glue injection channel.

48. injection mould as the plastic parts of the positioning lens of any described moulding LED integrated morphology of claim 39 to 45 or molded lens, it is characterized in that: the plastic parts of positioning lens or molded lens is a teething ring, is fixed with two or more separate described teething rings on heat-radiating substrate; The cast gate that advances adhesive dispenser is some cast gate, corresponding one or two cast gate of each teething ring.

49. injection mould as the plastic parts of the positioning lens of any described moulding LED integrated morphology of claim 39 to 45 or molded lens, it is characterized in that: the plastic parts of positioning lens or molded lens comprises teething ring and will set the dowel with the teething ring injection mo(u)lding that the teething ring of number links together that the plastic parts of positioning lens or molded lens comprises two or more described teething rings; Be provided with the dowel forming cavity that is communicated with plastic parts body die cavity on mould, the cast gate that advances adhesive dispenser is communicated with plastic parts body die cavity and/or dowel die cavity; The cast gate that advances adhesive dispenser is a cast gate or down gate.

50. injection mould as the plastic parts of the positioning lens of any described moulding LED integrated morphology of claim 39 to 45 or molded lens, it is characterized in that: the plastic parts of positioning lens or molded lens is tabular, be provided with two or more described first through holes on the plastic parts of positioning lens or molded lens, the cast gate that advances adhesive dispenser is a cast gate or down gate.

51. as the injection mould of the plastic parts of the positioning lens of any described moulding LED integrated morphology of claim 39 to 45 or molded lens, it is characterized in that: the cover half part also comprises TOP-TIP.