CN113075818A - Backlight module and display device - Google Patents
Backlight module and display device Download PDFInfo
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- CN113075818A CN113075818A CN202110311514.9A CN202110311514A CN113075818A CN 113075818 A CN113075818 A CN 113075818A CN 202110311514 A CN202110311514 A CN 202110311514A CN 113075818 A CN113075818 A CN 113075818A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
- G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention provides a backlight module and a display device, which comprise a substrate base plate, a plurality of light sources arranged on the substrate base plate at intervals, and a heat dissipation layer arranged on one side of the substrate base plate far away from the light sources, wherein the heat dissipation layer comprises at least one heat dissipation cavity and heat dissipation liquid filled in the heat dissipation cavity, and the heat generated by the light sources is absorbed through the conversion of the heat dissipation liquid between a liquid state and a gas state, so that the heat dissipation efficiency is improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a backlight module and a display device.
Background
Backlight technology has found wide application in the field of liquid crystal displays, which rely on a backlight source to increase the brightness of a liquid crystal display. The traditional backlight source mostly adopts a cold cathode tube, but with the continuous development of the LED technology, the LED will gradually replace the traditional backlight source due to the characteristics of low power consumption, low heat productivity, high brightness, long service life and the like.
When the LED backlight works, because the LED belongs to a photoelectric element, 15% -25% of electric energy can be converted into light energy in the working process, most of the rest electric energy is almost converted into heat energy, so that the temperature of the LED element is increased, and the whole backlight system is in a relatively sealed space.
Disclosure of Invention
To solve the above technical problem, an embodiment of the present invention provides a backlight module, including:
a substrate base plate;
a plurality of light sources arranged on the substrate at intervals;
and the heat dissipation layer is arranged on one side of the substrate base plate, which is far away from the light source, and comprises at least one heat dissipation cavity and heat dissipation liquid filled in the heat dissipation cavity.
According to the backlight module provided by the embodiment of the invention, the heat dissipation layer comprises the heat dissipation substrate, at least one concave part is arranged on one side of the heat dissipation substrate facing the substrate base plate, and the heat dissipation substrate is attached to one side of the substrate base plate far away from the light source, so that the heat dissipation cavity is formed between the concave part and the substrate base plate.
According to the backlight module provided by the embodiment of the invention, the attaching mode of the heat dissipation substrate and the substrate comprises welding or bonding.
According to the backlight module provided by the embodiment of the invention, the orthographic projection of the light source on the substrate base plate is at least partially overlapped with the orthographic projection of the heat dissipation cavity on the substrate base plate.
According to the backlight module provided by the embodiment of the invention, the boiling point of the heat dissipation liquid is 50-70 ℃.
According to the backlight module provided by the embodiment of the invention, a plurality of first sub-convex parts are formed on the surface of the substrate base plate, which is attached to the heat dissipation base plate, corresponding to the heat dissipation cavity.
According to the backlight module provided by the embodiment of the invention, the surface of the heat dissipation substrate, which is far away from the substrate, is provided with a plurality of second sub-convex parts.
According to the backlight module provided by the embodiment of the invention, the material of the heat dissipation substrate comprises glass, ceramic or metal.
According to the backlight module provided by the embodiment of the invention, the light source is a mini LED lamp bead.
On the other hand, the embodiment of the invention also provides a display device, which comprises the backlight module.
The backlight module and the display device have the advantages that the backlight module and the display device comprise a substrate base plate, a plurality of light sources arranged on the substrate base plate at intervals, and a heat dissipation layer arranged on one side, far away from the light sources, of the substrate base plate, wherein the heat dissipation layer comprises at least one heat dissipation cavity and heat dissipation liquid filled in the heat dissipation cavity, heat generated by the light sources is absorbed through conversion of the heat dissipation liquid between a liquid state and a gas state, the heat dissipation efficiency is improved, in addition, the heat dissipation area can be increased through a plurality of first sub-convex parts formed on the surface, corresponding to the heat dissipation cavity, of one side, where the substrate base plate is attached to the heat dissipation base plate, and a plurality of second sub-convex parts formed on the surface, far away from the substrate base plate, of the heat dissipation.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required in the embodiments are briefly described below. The drawings in the following description are only some embodiments of the present application, and it will be obvious to those skilled in the art that other drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a backlight module according to an embodiment of the present invention;
fig. 2 is a schematic top view of a heat dissipation layer according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation substrate according to an embodiment of the present invention;
fig. 4 is a partially enlarged structural view of the heat dissipating substrate in fig. 3;
fig. 5 is a schematic top view of a backlight module according to an embodiment of the invention.
Detailed Description
Specific structural and functional details disclosed herein are merely representative and are provided for purposes of describing example embodiments of the present application. This application may, however, be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified. Furthermore, the term "comprises" and any variations thereof is intended to cover non-exclusive inclusions.
Directional phrases used in this disclosure, such as [ upper ], [ lower ], [ inner ], [ outer ], etc., refer only to the directions of the appended drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
For the convenience of understanding the technical solutions of the present invention, the technical solutions of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, an embodiment of the present invention provides a backlight module 1, which includes a substrate 10, a plurality of light sources 20 disposed on the substrate 10 at intervals, and a heat dissipation layer 30 disposed on a side of the substrate 10 away from the light sources 20, wherein the heat dissipation layer 30 includes at least one heat dissipation cavity and a heat dissipation liquid 34 filled in the heat dissipation cavity, and the heat dissipation liquid 34 absorbs heat generated by the light sources 20 through conversion between a liquid state and a gaseous state, thereby improving heat dissipation efficiency.
The operation of the heat dissipating liquid 34 is as follows: when the backlight module is started, the light source 20 starts to emit light and generate a large amount of heat, the heat generated by the light source 20 is conducted to the substrate 10, and since the heat dissipation layer 30 is disposed on the side of the substrate 10 away from the light source 20, the heat dissipation layer 30 includes at least one heat dissipation cavity and the heat dissipation liquid 34 filled in the heat dissipation cavity, the heat dissipation liquid 34 and the substrate 10 can be in completely seamless contact; at this time, the heat dissipating liquid 34 in the heat dissipating cavity absorbs the heat generated by the light source 20, the heat dissipating liquid 34 is very easy to vaporize when heated, the volatile liquid vaporizes and absorbs the heat when heated, the heat is transferred to the side of the heat dissipating layer 30 away from the substrate 10, the gas condenses at a lower temperature, and the liquid state is recovered, so that the gas can be recycled. The heat of the heat dissipating liquid 34 is continuously conducted out in the circulation conversion process of the liquid gas and the liquid, so that the outward heat conduction of the light source 20 is greatly improved, the temperature of the light source 20 is prevented from being too high, and the overall heat dissipating effect of the backlight module is improved.
Specifically, the heat dissipation liquid 34 vaporized by heating is stored in the heat dissipation cavity, and the liquid stored in the heat dissipation cavity is a low-boiling-point and high-volatility solvent. Further, a heat conduction layer is disposed on a side of the substrate 10 away from the light source 20, that is, the heat conduction layer (not shown in the figure) is disposed between the heat dissipation layer 30 and the substrate 10, and the heat conduction layer is made of a thermal interface material, wherein the thermal interface material is a bonding and curing heat conduction glue, a phase change material or a heat conduction elastomer material, and preferably a heat conduction gel or a silica gel. By forming the heat conducting layer with a heat conducting gel or silica gel, it can be ensured that the heat generated by the light source 20 can be effectively transferred to the heat dissipating liquid 34 in the heat dissipating cavity through the heat conducting layer on the side of the substrate 10 away from the light source 20. The heat generated by the light source 20 is conducted to the heat dissipation cavity through the thermal interface material, the heat dissipation liquid 34 in the heat dissipation cavity is heated and vaporized to become steam, the heat is rapidly transferred to the side, away from the substrate base plate 10, of the heat dissipation layer 30 through the circulation of the steam in the heat dissipation cavity, the steam is condensed to become liquid at a lower temperature position, and therefore the circulation and the transfer of the heat are completed in the heat dissipation cavity in cycles, and the whole set of system is a sustainable heat dissipation device which really realizes the circulation. The heat generated by the light source 20 is uniformly transferred to the side of the heat dissipation layer 30 far away from the substrate base plate 10 through the heat dissipation liquid 34 and is finally dissipated into the air, so that the temperature of the whole backlight module is relatively low, and the user experience of heat generation cannot be brought.
On the other hand, the temperature distribution gradient in the backlight module is reduced while the overall temperature of the backlight module is effectively reduced, so that the problems of expansion with heat and contraction with cold caused by the change difference of the temperature gradient of optical components in the backlight module and the internal stress of the optical components are effectively solved. In addition, the heat dissipation layer 30 disposed on the substrate 10 away from the light source 20 effectively conducts heat generated by the light source 20 on the substrate 10, so that the temperature of the chip controlling the light source 20 can be effectively reduced, the life of the light source 20 is prolonged, and the backlight module can also use a light source with higher power due to the improvement of the heat dissipation effect.
In a specific embodiment, in the backlight module provided by the present invention, the heat dissipation layer 30 includes a heat dissipation substrate 36, at least one concave portion 362 is disposed on a side of the heat dissipation substrate 36 facing the substrate 10, and the heat dissipation substrate 36 is attached to a side of the substrate 10 away from the light source 20, so that the concave portion 362 and the substrate 10 form the heat dissipation cavity therebetween.
In this embodiment, the heat dissipation layer 30 is disposed on a side of the substrate 10 away from the light source 20, the heat dissipation layer 30 includes a heat dissipation base 36 disposed in contact with the substrate 10, specifically, the heat dissipation base 36 is disposed in contact with the substrate 10, at least one concave portion 362 is disposed on a side of the heat dissipation base 36 facing the substrate 10, correspondingly, the heat dissipation base 36 further includes a convex portion 364 facing a side of the substrate 10 adjacent to the concave portion 362, and the convex portion 364 is attached to a side of the substrate 10 away from the light source 20, so that a closed accommodation space, i.e., the heat dissipation cavity, is formed between the concave portion 362 and the substrate 10. The surface of the heat dissipation substrate 36 on the side away from the substrate 10 is exposed at the bottom of the backlight module, and can rapidly exchange heat with air circulating outside through a back plate of a display device, so that heat emitted from the light source 20 can be rapidly dissipated to the outside through the heat dissipation substrate 36. Compared with the prior art, the heat dissipation performance of the backlight module in the embodiment is improved, which is beneficial to improving the working stability of the light source 20 and prolonging the service life of the light source.
On the other hand, the heat dissipating substrate 36 supports the internal structural components of the backlight module, so that the heat dissipating cavity is formed between the heat dissipating substrate 36 and the substrate 10, heat generated by the light source 20 is homogenized, and the local temperature is prevented from being too high, and the heat dissipating substrate can also be used as a supporting component of the backlight module, thereby further improving the processing performance of the product.
In a specific embodiment, in the backlight module provided by the present invention, the attaching manner of the heat dissipation substrate 36 and the substrate 10 includes welding or bonding.
Specifically, the heat dissipating base plate 36 is attached to the substrate base plate 10, at least one concave portion 362 is disposed on one side of the heat dissipating base plate 36 facing the substrate base plate 10, correspondingly, the heat dissipating base plate 36 further includes a convex portion 364 facing one side of the substrate base plate 10 and adjacent to the concave portion 362, and the convex portion 364 of the heat dissipating base plate 36 is welded or bonded to one side of the substrate base plate 10 away from the light source 20, so that a closed accommodating space, i.e., the heat dissipating cavity, is formed between the concave portion 362 and the substrate base plate 10; on the other hand, the heat dissipation substrate 36 can support the substrate 10, thereby improving the processing performance of the product.
As shown in fig. 1, the convex portion 364 may be connected to the substrate 10 through a thermal conductive adhesive layer 366, so that the heat dissipation substrate 36 is attached to the substrate 10, and the thermal conductive adhesive layer 366 may not only fix the substrate 10, but also quickly conduct heat dissipated by the light source 20 during operation to the heat dissipation cavity through the thermal conductive adhesive layer 366.
The heat dissipation base plate 36 and the substrate base plate 10 can be connected and fixed by a detachable connection manner such as a lock screw, and even if the heat dissipation base plate 36 or the heat dissipation liquid 34 needs to be replaced later, the heat dissipation base plate 36 or the heat dissipation liquid 34 can be conveniently replaced by loosening the lock screw.
As shown in fig. 1, in the backlight module provided by the present invention, an orthographic projection of the light source 20 on the substrate 10 at least partially overlaps an orthographic projection of the heat dissipation cavity on the substrate 10, specifically, the backlight module includes a substrate 10, a light source 20 and a heat dissipation layer 30, the light source 20 is located on the substrate 10, the heat dissipation layer 30 is disposed on a side of the substrate 10 away from the light source 20, that is, the substrate 10 is located between the light source 20 and the heat dissipation layer 30 as a heat conduction medium, the heat dissipated by the light source 20 is conducted to a heat dissipation liquid 34 in the heat dissipation layer 30, further, the orthographic projection of the light source 20 on the substrate 10 at least partially overlaps the orthographic projection of the heat dissipation cavity on the substrate 10, so that the heat dissipated by the light source 20 can be directly conducted to a range where the heat dissipation cavity contacts the substrate 10, the heat conduction path is reduced, and the heat dissipation effect is further enhanced.
Fig. 2 is a schematic top view of a heat dissipation layer according to an embodiment of the present invention, and in fig. 2, the light source 20 is a light source for providing direct backlight to the backlight module, and in other embodiments, a light source for providing side-in backlight to the backlight module. As shown in fig. 2, the heat dissipation cavities are arranged in an array on the heat dissipation layer 30, and the heat on the substrate 10 can be uniformly dissipated through the heat dissipation liquid 34 in the heat dissipation cavities by the heat dissipation cavities arranged in an array, so as to ensure uniformity of heat dissipation effect.
Optionally, the heat dissipating liquid 34 has a boiling point of 50-70 ℃. Specifically, the light source 20 is mounted on the substrate base plate 10, the heat dissipation layer 30 is mounted on the other surface of the substrate base plate 10, and the heat dissipation layer 30 includes the heat dissipation cavity containing a heat dissipation solution with a boiling point of 50-70 ℃. When the backlight module is started, the light source 20 starts to emit light and generate a large amount of heat, the heat generated by the light source 20 is conducted to the substrate base plate 10, the dissipated heat is absorbed by the heat dissipation solution in the heat dissipation cavity on the other side of the substrate base plate 10, when the absorbed heat enables the temperature of the heat dissipation solution to reach the boiling point of the heat dissipation solution, the heat dissipation solution is vaporized and absorbs the heat, the heat is transferred to the side, away from the substrate base plate 10, of the heat dissipation layer 30, gas is condensed at a position with lower temperature, and the liquid state is recovered, so that the heat is recycled. The heat generated by the light source 20 is continuously conducted out by the heat dissipation liquid 34 in the circulation conversion process of the liquid gas and the liquid, so that the heat conduction of the light source 20 is greatly improved, the temperature of the light source 20 is prevented from being too high, and the heat dissipation effect of the whole backlight module is improved.
The heat-dissipating liquid 34 has a very high thermal conductivity, and can rapidly conduct heat on the substrate 10, so as to stabilize the ambient temperature around the light source 20 during operation, thereby ensuring the service life of the device.
In a specific embodiment, as shown in fig. 3, in the backlight module provided by the present invention, a plurality of first sub-protrusions 368 are formed on a surface of the substrate 10, which is attached to the heat dissipation substrate 36, corresponding to the heat dissipation cavity; specifically, the heat generated by the light source 20 is transferred from the substrate base plate 10 to the surface 361 of the heat dissipation base plate 36 near the side of the heat dissipation cavity through the heat dissipation liquid 34, and the heat is transferred in liquid through the heat dissipation liquid 34 according to three heat transfer manners of conduction, convection and radiation in the present embodiment
The heat is continuously conducted in the cycle conversion process of the gas and the liquid, so the heat transfer mode of the heat dissipating liquid 34 to the surface 361 of the heat dissipating substrate 36 close to the heat dissipating cavity is mainly convection, and the formula of the heat convection is as follows: q ═ hxaa × Δ T; wherein Q represents heat, i.e., the heat carried away by thermal convection; h is the thermal convection coefficient value, A represents the effective contact area of thermal convection; Δ T represents the temperature difference between the solid surface and the zone fluid. As shown in fig. 4, a plurality of first sub-protrusions 368 are formed on a surface 361 of the heat dissipation substrate 36 close to the heat dissipation cavity, and the first sub-protrusions 368 increase the area of the surface 361 of the heat dissipation substrate 36 close to the heat dissipation cavity, that is, the contact area between the heat dissipation substrate 36 and the heat dissipation liquid 34, which is equivalent to the effective contact area of thermal convection, so that the amount of heat carried away by the thermal convection increases, thereby improving the heat dissipation efficiency of the heat dissipation substrate 36.
Further, the heat emitted by the light source 20 is transferred from the substrate base plate 10 to the surface 361 of the heat dissipation base plate 36 close to the heat dissipation cavity through the heat dissipation liquid 34, and then transferred to the surface 363 of the heat dissipation base plate 36 far from the substrate base plate 10, as shown in fig. 4, a plurality of second sub-convex portions 369 are formed on the surface 363 of the heat dissipation base plate 36 far from the substrate base plate 10, and the heat dissipation area of the heat dissipation base plate 36 is increased by the second sub-convex portions 369, so that the heat dissipation effect of the backlight module is further enhanced.
In a specific embodiment of the backlight module provided by the present invention, the material of the heat dissipation substrate 36 includes glass, ceramic or metal.
Optionally, the heat dissipation substrate 36 is made of graphite, which is a brand new heat conduction and dissipation material, and conducts heat uniformly along two directions, and the thermal conductivity in the horizontal direction is much greater than that in the vertical direction, generally speaking, the thermal conductivity in the horizontal direction of graphite is between 150 and 1500W/(m.k), and the thermal conductivity in the vertical direction of graphite is 15-25W/(m.k), so that graphite is a good material with uniform heat, and the heat dissipation substrate 36 is made of graphite, which can further improve the effect of uniform heat dissipation of the backlight module.
Optionally, the heat dissipation substrate 36 is made of a copper foil material, and since the copper foil is an isotropic material, the electrical conductivity of the copper foil in each direction reaches 401W/(m.k), and the copper foil is an excellent heat conduction material, and can effectively dissipate heat of the light source 20 transferred to the heat dissipation liquid 34, thereby improving the heat dissipation efficiency.
On the other hand, common friction, personnel walk, and contact/separation all can produce static, heat dissipation base plate 36 adopts electrically conductive metal material, can lead away static, reduces static and strikes components and parts, can effectively reduce static risk, ensures light source 20's service environment. Meanwhile, the heat dissipating liquid 34 has high thermal conductivity, and the heat dissipating base 36 is provided with a plurality of recesses 362 on the side close to the substrate 10, thereby allowing a thinner heat dissipating base to be designed to save metal materials and reduce cost.
In a specific embodiment, in the backlight module provided by the present invention, the light source 20 is a mini LED lamp bead. Specifically, the mini LED lamp bead is a cuboid, the size of a long edge and a wide edge of the mini LED lamp bead is 0.25mm-0.5mm, the height of the mini LED lamp bead is about 0.1mm, and five faces of the mini LED lamp bead can emit light. Compare in the backlight unit that adopts traditional LED as the light source, the backlight unit that uses mini LED can adopt denser chip to arrange and reduce mixed light distance, makes backlight unit accomplish ultra-thinly. In addition, the display device adopting the mini LED can obtain better contrast and display effect by matching with the local dimming control.
The number of LEDs of a single product is tens of thousands or even hundreds of thousands, the number of the LEDs is increased by dozens of times compared with that of LEDs of a conventional direct type backlight, and heat in unit area is concentrated, so that the mini backlight product needs to be radiated by a fan or other modes, noise is increased, temperature sensible by a user is increased, and user experience is influenced; there are two ways of mini backlight in the market at present, one is mini LED of aluminum base plate; the other kind is glass substrate's mini LED, relatively speaking, more meticulous scheme can be accomplished to glass substrate's mini LED, but because glass substrate's mini LED integrated quantity is very big, leads to the heat dissipation of lamp plate higher, and overall temperature is uncontrollable, needs to increase the heat dissipation scheme and just can have the volume production benefit. In the backlight module provided by the embodiment of the invention, the heat generated by the light source 20 is uniformly transferred to the side of the heat dissipation layer 30 far away from the substrate base plate 10 through the heat dissipation liquid 34 and is finally dissipated into the air, so that the overall temperature of the backlight module is relatively low, the product can be controlled within a certain temperature rise range, and the application of the mini LED is expanded.
In a specific embodiment, the backlight module provided in the present invention includes a metal trace 21 disposed on a side of the substrate 10 close to the light source 20. Specifically, as shown in fig. 5, fig. 5 is a schematic top view structure diagram of a backlight module according to an embodiment of the present invention, in fig. 5, the light source 20 is an exemplary light source 20 for providing direct backlight to the backlight module, and in other embodiments, the light source 20 for providing side-in backlight to the backlight module; the light sources 20 are arranged on the substrate base plate 10 in an array manner, and the electrical connection between the light sources 20 is realized through the metal traces 21 on the substrate base plate 10. As the temperature of the substrate 10 is high in the process of light emission of the light source 20 and operation of other components, and the temperature difference between the LED region and the non-LED region is very large, the heat dissipation layer 30 is added on the side of the substrate 10 away from the light source 20, the heat generated by the light source 20 is uniformly transferred to the side of the heat dissipation layer 30 away from the substrate 10 through the heat dissipation liquid 34, the heat of the light source 20 is transferred to the heat dissipation substrate 36 through the conversion between liquid and gas by the heat dissipation liquid 34, and the heat on the substrate 10 can be uniformly dissipated through the heat dissipation liquid 34 in the heat dissipation cavity by the heat dissipation cavities arranged in an array, so that the uniformity of the heat dissipation effect is improved.
The substrate base plate 10 can be made of glass, the metal wires 21 are arranged on the substrate base plate 10, and the metal wires 21 are pulled or extruded to be easily broken to affect the display effect, so that the heat dissipation base plate 36 made of a metal material can provide good fixing and supporting effects for the substrate base plate 10 made of a glass material, and the substrate base plate 10 is prevented from being deformed too much to affect the metal wires 21; in addition, structural members can be added to fix the substrate base plate 10, so that the processing performance of the product is further improved.
The metal trace 21 is used to form a circuit structure of the light source 20, optionally, in this embodiment, the metal trace 21 is made of a copper foil material, which can satisfy a good conductive effect of a conductive layer, and the copper foil is an isotropic material, and the conductivity of the copper foil in each direction reaches 401W/(m.k), which is an excellent heat conductive material, and can effectively conduct heat generated by the light source 20.
Optionally, the metal trace 21 may be disposed on the substrate base plate 10 by an etching method, and then the light source 20 is soldered to a circuit structure formed by the metal trace 21 by a soldering technique, and the light source 20 is directly soldered to the circuit structure without being fixed by a PCB and a thermal conductive adhesive, thereby further simplifying the process.
The embodiment of the invention also provides a display device, which comprises the backlight module and the display panel, wherein the display panel is arranged on one side close to the light-emitting surface of the backlight module.
In summary, the present invention provides a backlight module and a display device, including a substrate, a plurality of light sources spaced apart from the substrate, and a heat dissipation layer disposed on a side of the substrate away from the light sources, wherein the heat dissipation layer includes at least one heat dissipation cavity and a heat dissipation liquid filled in the heat dissipation cavity, and the heat dissipation layer absorbs heat generated by the light sources through the conversion of the heat dissipation liquid between a liquid state and a gaseous state, so as to improve heat dissipation efficiency.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. A backlight module, comprising:
a substrate base plate;
a plurality of light sources arranged on the substrate at intervals;
and the heat dissipation layer is arranged on one side of the substrate base plate, which is far away from the light source, and comprises at least one heat dissipation cavity and heat dissipation liquid filled in the heat dissipation cavity.
2. The backlight module as claimed in claim 1, wherein the heat dissipation layer comprises a heat dissipation substrate, at least one recess is disposed on a side of the heat dissipation substrate facing the substrate, and the heat dissipation substrate is attached to a side of the substrate facing away from the light source, such that the heat dissipation cavity is formed between the recess and the substrate.
3. The backlight module as claimed in claim 2, wherein the heat-dissipating substrate is attached to the substrate by soldering or bonding.
4. The backlight module of claim 1, wherein an orthographic projection of the light source on the substrate base plate at least partially overlaps with an orthographic projection of the heat dissipation cavity on the substrate base plate.
5. The backlight module as claimed in claim 1, wherein the heat dissipating liquid has a boiling point of 50-70 ℃.
6. The backlight module as claimed in claim 1, wherein a plurality of first sub-protrusions are formed on the surface of the substrate corresponding to the heat dissipation cavity.
7. The backlight module as claimed in claim 1 or 6, wherein a plurality of second sub-protrusions are formed on a surface of the heat dissipating substrate away from the substrate.
8. The backlight module as claimed in claim 1, wherein the heat-dissipating substrate is made of glass, ceramic or metal.
9. The backlight module as claimed in claim 1, wherein the light source is a mini LED lamp bead.
10. A display device comprising a backlight module according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110311514.9A CN113075818A (en) | 2021-03-24 | 2021-03-24 | Backlight module and display device |
| PCT/CN2021/084671 WO2022198711A1 (en) | 2021-03-24 | 2021-03-31 | Backlight module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110311514.9A CN113075818A (en) | 2021-03-24 | 2021-03-24 | Backlight module and display device |
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| Publication Number | Publication Date |
|---|---|
| CN113075818A true CN113075818A (en) | 2021-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110311514.9A Pending CN113075818A (en) | 2021-03-24 | 2021-03-24 | Backlight module and display device |
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| Country | Link |
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| CN (1) | CN113075818A (en) |
| WO (1) | WO2022198711A1 (en) |
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| WO2022198711A1 (en) | 2022-09-29 |
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