CN201766098U - Zero thermal resistance structure of high-power LED (light-emitting diode) and radiator and LED lamp - Google Patents
Zero thermal resistance structure of high-power LED (light-emitting diode) and radiator and LED lamp Download PDFInfo
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- CN201766098U CN201766098U CN201020297025XU CN201020297025U CN201766098U CN 201766098 U CN201766098 U CN 201766098U CN 201020297025X U CN201020297025X U CN 201020297025XU CN 201020297025 U CN201020297025 U CN 201020297025U CN 201766098 U CN201766098 U CN 201766098U
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Abstract
The utility model relates to a zero thermal resistance structure of a high-power LED (light-emitting diode) and a radiator, and an LED lamp based on the zero thermal resistance structure. The zero thermal resistance structure of the high-power LED and the radiator comprises at least one high-power LED, a printed circuit board, and the radiator; the single surface of the printed circuit board is coated by copper insulated base; the printed circuit board is provided with a through hole used for installing the light-emitting diode; an LED electrode lead pin is welded on a conductive wire of the printed circuit board; the outer plane of the LED heat sink is parallel to and higher than the non-conductive layer plane of the printed circuit board; the printed circuit board is installed on the radiator through a fixing device; the assembly glue excluding the solid particles is arranged between the heat sink and the radiator, and is zero in thickness. The advantages are as follows: the thermal resistance from the LED heat sink to the radiator is near to zero; the heat conduction efficiency is high; the LED junction temperature is low; larger working current is used for reducing cost; the lighting efficiency is high; the service life is long; the process is simple; and the cost is low. The zero thermal resistance structure can be used for manufacturing various LED lighting devices.
Description
Technical field
The utility model relates to structure and a kind of LED lamp of a kind of LED and radiator, more particularly, relates to the zero thermal resistance structure of a kind of great power LED and radiator, reaches the LED lamp based on this structure.
Background technology
The great power LED of prior art all needs additional have suitable radiator and good radiating condition ability operate as normal.The LED lighting device is because power is big, and the radiating management of its system is one of the important step of lighting device design especially.
The cooling system of LED, from the chip to LED heat sink, to radiator, arrive surrounding medium at last, as empty G﹠W.Wherein the heat sink hot link to radiator of LED is an important ring.
The structure of the great power LED of prior art has multiple, for example with the high thermal conductivity coefficient alloy be heat sink pedestal, that with the ceramic substrate be pedestal, that chip is installed in is on the metal-base circuit plate, that the band terminal pin is arranged, there have to be that paste on the surface, that single-chip is arranged, that the multicore sheet is arranged, that the garden pedestal is arranged, that rectangular susceptor is arranged, as 3528,5050,9070 or the like.
Great power LED all have one heat sink, be used for being connected with radiator heat, the LED of prior art is heat sink with the hot link of radiator normally, LED at first is connected on the metal-base circuit plate (MPCB) with heat-conducting glue or solder flux, be connected on the radiator with heat-conducting glue or heat conducting film again.Like this, need be through dielectric layer, metal substrate and the second layer heat-conducting glue of first heat-conducting glue or solder flux, aluminium base or copper base metal circuit board, just to radiator from the heat sink of LED to radiator.If ignore the contact heat resistance that respectively contacts interface, LED is heat sink to the thermal resistance (Rtt) of radiator is the summation of the thermal resistance (Rt4) of the thermal resistance (Rt3) of thermal resistance (Rt2), metal substrate of thermal resistance (Rt1), the metal-base circuit plate dielectric layer of first heat-conducting glue and welding flux layer and the second heat conduction glue-line.Dielectric layer on the metallic circuit is generally insulating barriers such as epoxy or low-melting glass, and its conductive coefficient is very little, and promptly thermal resistance Rt2 is very big; The second heat conduction glue-line between metal substrate and the radiator, because area is big, the thickness of heat conduction glue-line often is difficult to accomplish very little, also usually have some adiabatic basically air alveolar layers; If use heat conducting film, not only the conductive coefficient of heat conducting film itself is far below metal, and tended to air layer between two of heat conducting films and heat sink and the radiator, and promptly two contact heat resistance will not allowed to ignore, and this has also just increased Rt4; Simultaneously, the evenness on the plane of aluminium base is generally owed, and this has also increased thermal resistance Rt4.In addition, LED lighting device that has at present even the best brand of product that has, in order to reduce cost, above-mentioned metal-base circuit plate is replaced with common epoxy circuit board, and epoxy plate is the very low insulation board of a kind of conductive coefficient, only about 1 W/mK of its conductive coefficient, far below the 121-238 W/mK of aluminium and aluminium alloy, this has just increased the thermal resistance Rtt between heat sink and the radiator greatly.In a word, the LED of prior art is to the installation method of radiator, and its entire thermal resistance Rtt is very big, and complex process, cost height, consistency are poor.
LED is heat sink to be fallen to the thermal resistance Rtt smooth and easy heat sink radiates that conducts to of a large amount of heats big, that produce when just directly having hindered led chip work of radiator, thereby cause junction temperature of chip to raise the decline of LED luminous efficiency, shortening in useful life, reliability and failure rate variation, illuminant colour drift etc.Particularly with a kind of chip, wish with bigger operating current, with improve its power, when reducing its cost, or when wishing in same encapsulation with multicore sheet more, it is just particularly important to reduce the heat sink thermal resistance Rtt to radiator of LED.
Summary of the invention
The purpose of this utility model is to solve problem set forth above, provides a kind of great power LED the heat sink structure that is close to zero to the thermal resistance Rtt of radiator, reach a kind of its in the LED of this structure lamp.
The technical solution of the utility model is such:
The zero thermal resistance structure of a kind of great power LED and radiator, comprise LED, PCB, radiator, described PCB is that single face covers the copper basic PCB that insulate, PCB is useful on the through hole that LED is installed, LED electrode leading foot is welded on the conductor wire of PCB, the heat sink outerplanar of LED is parallel with the no conductor planes of PCB and exceed the no conductor planes of PCB, and described PCB is installed on the radiator by fixture, and is heat sink between radiator and PCB.
As preferably, described heat sink go up to drip be placed with adhesive glue.
As preferably, described adhesive glue does not contain solid particle.
As preferably, described adhesive glue can be silica gel or epoxide-resin glue or plastic cement.
As preferably, described fixture is screw hole and screw.
As preferably, the difference in height of the no conductor planes of described heat sink outerplanar and PCB is 0.05-5mm.
As preferably, it is epoxy radicals or papery base or glass base PCB that described single face covers the copper basic PCB that insulate.
A kind of LED lamp of the zero thermal resistance structure based on above-mentioned great power LED and radiator, comprise LED, PCB, radiator, described PCB is that single face covers the copper basic PCB that insulate, PCB is useful on the through hole that LED is installed, LED electrode leading foot is welded on the conductor wire of PCB, the heat sink outerplanar of LED is parallel with the no conductor planes of PCB and exceed the no conductor planes of PCB, and described PCB is installed on the radiator by fixture, and is heat sink between radiator and PCB; The driver that also comprises printing opacity cell-shell, electric connector, LED, described driver are positioned in the cavity and electric connector of central authorities of radiator; The input of driver links to each other with electric connector through lead-in wire, is used to connect external power; The output of driver is connected with the electrode of LED through lead-in wire.
As preferably, described heat sink go up to drip be placed with adhesive glue, described adhesive glue does not contain solid particle, can be silica gel or epoxide-resin glue or plastic cement; Described fixture is screw hole and screw.
As preferably, the difference in height of the no conductor planes of described heat sink outerplanar and PCB is 0.05-5mm.
The beneficial effects of the utility model are as follows:
The utility model compared with prior art, have that the heat sink thermal resistance to radiator of LED is close to zero, heat transfer efficiency height, low, the available bigger operating current of LED junction temperature reduce cost, the luminous efficiency height, the life-span is long, technology is simple, low cost and other advantages, can be used for making various LED lighting devices.
Description of drawings
Fig. 1 is the great power LED of prior art and the structural representation of radiator.
Fig. 2 is the structural representation of an embodiment of the zero thermal resistance structure of great power LED and radiator.
Fig. 3 is based on the structural representation of an embodiment of LED lamp of the zero thermal resistance structure of great power LED and radiator.
Among the figure: 1, LED; 2, chip; 3, silicon substrate; 4, solder flux; 5, heat sink; 6, lens; 7, electrode leading foot; 8, MPCB(metal-base circuit plate); 9, metal substrate; 10, dielectric layer; 11, conductive layer; The conductive layer of 11a, fixed L ED; 12, radiator; 13, heat-conducting glue; 14, solder flux; 15, heat-conducting glue; 16, PCB; 17, insulated substrate; 18, conductive layer; 19, the through hole of the last arrangement of PCB LED; 20, screw hole; 21, heat sink outerplanar; 22, the no conductor planes of PCB; 23, adhesive glue; 24, the installed surface of radiator; 25, screw; 26, the glue line between the heat sink and radiator; 27, LED lamp; 28, printing opacity cell-shell; 30, electric connector; 31, driver; 32, driver center cavity; 33, lead-in wire; 34, lead-in wire; D, difference in height.
Embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is further elaborated:
The great power LED of prior art shown in Figure 1 and the mounting structure of radiator, a kind of in the great power LED of existing multiple packing forms of LED1 among Fig. 1, for example be Luxeon emitter LED, its led chip 2 by upside-down mounting silicon substrate 3 is installed in that a high thermal conductivity coefficient alloy makes with solder flux 4 on a slice silicon substrate 3, again heat sink 5 on, the lens 6 of LED1 cover on the led chip 2.LED 1 is fixed on heat-conducting glue or solder flux 13 on the conductive layer 11a of fixed L ED of MPCB8, and the terminal pin 7 of LED1 is welded on the conductive layer 11 of MPCB 8 with solder flux 14; MPCB 8 is fixed on the radiator 12 with heat-conducting glue or heat conducting film 15.
As seen from Figure 1, from heat sink 5 the thermal resistances (Rtt) of LED1 be the summation of the thermal resistance (Rt4) of the thermal resistance (Rt3) of thermal resistance (Rt2), metal substrate 9 of dielectric layer 10 of thermal resistance (Rt1), MPCB8 of first heat-conducting glue and welding flux layer 13 and the second heat conduction glue-line 15 to radiator 12.Dielectric layer 10 on the MPCB8 is generally insulating barriers such as epoxy or low-melting glass, and its conductive coefficient is very little, and promptly thermal resistance Rt2 is very big; The second heat conduction glue-line 15 between metal substrate 9 and the radiator 12, because area is big, the thickness of heat conduction glue-line 15 often is difficult to accomplish very little, also usually have some adiabatic basically air alveolar layers; If use heat conducting film, then not only the conductive coefficient of heat conducting film itself far below metal, and two of heat conducting films and heat sink 5 and radiator 12 between tended to air layer, promptly two contact heat resistance will not allowed to ignore, this has also just increased Rt4; Simultaneously, the area of metal substrate 9 is big, the evenness on its plane is generally owed, and this has also increased thermal resistance Rt4.
In addition, the LED lighting device that has at present, in order to reduce cost, above-mentioned MPCB8 is replaced with common epoxy circuit board, and epoxy plate is the very low insulation board of a kind of conductive coefficient, only about 1 W/mK of its conductive coefficient, far below the 121-238 W/mK of aluminium and aluminium alloy, this just increased greatly heat sink 5 and radiator 12 between thermal resistance Rtt.
The utility model is such:
The zero thermal resistance structure of a kind of great power LED and radiator, comprise at least one great power LED 1, PCB16, radiator 12, it is characterized in that, described PCB16 is that single face covers the copper basic PCB that insulate, PCB16 is useful on the through hole 19 that LED1 is installed, LED1 electrode leading foot 7 is welded on the conductor wire 18 of PCB16, heat sink 5 the outerplanar 21 of LED1 is parallel with the no conductor planes 22 of PCB16, and exceed the no conductor planes 22 of PCB16, described PCB16 is installed on the radiator 12 by fixture, between heat sink (5) and the radiator (12) adhesive glue (23) is arranged, its thickness is close to zero.
Described adhesive glue 23 does not contain solid particle.
Described adhesive glue 23 can be silica gel or epoxide-resin glue or plastic cement.
Described fixture is screw hole 20 and screw 25.
Described heat sink 5 outerplanar 21 is 0.05-5mm with the difference in height D of the no conductor planes 22 of PCB16.
It is epoxy radicals or papery base or glass base PCB that described single face covers the copper basic PCB16 that insulate.
A kind of LED lamp of the zero thermal resistance structure based on above-mentioned great power LED and radiator, comprise at least one great power LED 1, PCB16, radiator 12, described PCB16 is that single face covers the copper basic PCB that insulate, PCB16 is useful on the through hole 19 that LED1 is installed, LED1 electrode leading foot 7 is welded on the conductor wire 18 of PCB16, heat sink 5 the outerplanar 21 of LED1 is parallel with the no conductor planes 22 of PCB16, and exceed the no conductor planes 22 of PCB16, described PCB16 is installed on the radiator 12 by fixture, between heat sink (5) and the radiator (12) adhesive glue (23) is arranged, its thickness is close to zero; The driver 31 that also comprises printing opacity cell-shell 28, electric connector 30, LED, described driver 31 are positioned in the cavity 32 and electric connector 30 of central authorities of radiator 12; The input of driver 31 33 links to each other with electric connector 30 through going between, and is used to connect external power; The output of driver 31 34 is connected with the electrode of LED1 through going between.
Drip on described heat sink 5 and be placed with adhesive glue 23, described adhesive glue 23 does not contain solid particle, can be silica gel or epoxide-resin glue or plastic cement; Described fixture is screw hole 20 and screw 25.
Described heat sink 5 outerplanar 21 is 0.05-5mm with the difference in height D of the no conductor planes 22 of PCB16.
An embodiment of the great power LED of the present utility model shown in Figure 2 and the zero thermal resistance structure of radiator, example for Luxeon emitter LED, the insulated substrate 17 of PCB16, it can be the epoxy substrate, the papery substrate, glass substrate etc., there is the through hole 19 of the arrangement LED1 that equates with LED1 quantity to be used for fixing the screw hole 20 of PCB16 on the described PCB 16 with at least one, LED 1 is positioned in the through hole 19, the electrode leading foot 7 of LED 1 is welded on the conductive layer 18 of PCB16, heat sink 5 the outerplanar 21 of LED 1 is parallel with the no conductive layer one side 22 of PCB16, but heat sink 5 outerplanar 21 exceeds the no conductor planes 22 of PCB, and its difference in height D is 0.05-5mm.
During installation, on heat sink 5 the outer surface 21 of each LED1, drip and put adhesive glue 23, have this one side of glue multiple on the installed surface 24 of radiator 12 then, with screw 25 PCB 16 and radiator 12 are fixed again.
Described adhesive glue 23 can be silica gel, epoxide-resin glue, plastic cement etc., they have good flowability before curing, do not contain solid particle in the glue, if heat sink outerplanar 21 and radiator 12 installed surfaces 24 are all enough flat, then under the pressure of screw 25 and PCB 16, adhesive glue 23 automatically from heat sink 5 and radiator installed surface 24 between extrude, the thickness of glue line 26 therebetween is close to zero easily.We know that thermal resistance is directly proportional with the thickness of heat-conducting layer, and the thickness of glue line 26 is close to zero, is that its thermal resistance is close to zero, promptly heat sink 5 of LED1 and radiator 12 between thermal resistance Rtt be close to zero, thickness is between 0 to 0.1 millimeter.
Described radiator 12 can be equipped with one or more LED 1, heat sink 5 the outerplanar 21 of each LED1 equates with the difference in height D of the no conductor planes 22 of PCB, for this reason, when installing and weld LED1, with a template that one degree of depth groove consistent with difference in height D is arranged at heat sink 5 places of LED1, can guarantee its difference in height D and consistency thereof.
Described each great power LED 1 can include one or more led chips 2.
The zero thermal resistance structure of great power LED of the present utility model is applicable to various high-power LED illuminating devices.
Embodiment 2
Shown in Figure 3 based on great power LED with an embodiment of the LED lamp of the zero thermal resistance structure of radiator, described LED lamp 27 includes a single face that at least one great power LED 1 the is installed basic PCB 16 that insulate, a printing opacity cell-shell 28, a radiator 12, the driver 31 of 30, one LED of an electric connector; Described driver 31 is positioned in the cavity 32 and electric connector 30 of central authorities of radiator 12; The input of driver 33 links to each other with electric connector 30 through going between, and is used to connect external power; The output of driver 34 is connected with the electrode of LED1 through going between.Connect external power, can light LED1.
All the structure with embodiment 2 is identical for the structure of each LED1 and radiator 12, and PCB 16 is used to few screw 25 and is installed on the radiator 12.
Above-described only is preferred implementation of the present utility model; should be understood that; for the heavy those of ordinary skill in present technique field; under the prerequisite that does not break away from core technology feature of the present invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (9)
1. the zero thermal resistance structure of great power LED and radiator, comprise at least one great power LED (1), PCB(16), radiator (12), it is characterized in that, described PCB(16) covers the copper basic PCB that insulate for single face, PCB(16) be useful on LED(1 is installed) through hole (19), LED(1) electrode leading foot (7) is welded on PCB(16) conductor wire (18) on, the outerplanar (21) and the PCB(16 of LED(1) heat sink (5)) no conductor planes (22) parallel, and exceed PCB(16) no conductor planes (22), described PCB(16) is installed on the radiator (12) by fixture, between heat sink (5) and the radiator (12) adhesive glue (23) is arranged, its thickness is close to zero.
2. the zero thermal resistance structure of great power LED according to claim 1 and radiator is characterized in that described adhesive glue (23) does not contain solid particle.
3. the zero thermal resistance structure of great power LED according to claim 2 and radiator is characterized in that, described adhesive glue (23) can be silica gel or epoxide-resin glue or plastic cement.
4. the zero thermal resistance structure of great power LED according to claim 1 and radiator is characterized in that, described fixture is screw hole (20) and screw (25).
5. the zero thermal resistance structure of great power LED according to claim 1 and radiator is characterized in that, the difference in height (D) of outerplanar of described heat sink (5) (21) and no conductor planes (22) PCB(16) is 0.05-5mm.
6. the zero thermal resistance structure of great power LED according to claim 1 and radiator is characterized in that, described single face covers the copper basic PCB(16 that insulate) be epoxy radicals or papery base or glass base PCB.
7. LED lamp based on the zero thermal resistance structure of described great power LED of claim 1 and radiator, comprise at least one great power LED (1), PCB(16), radiator (12), it is characterized in that, described PCB(16) covers the copper basic PCB that insulate for single face, PCB(16) be useful on LED(1 is installed) through hole (19), LED(1) electrode leading foot (7) is welded on PCB(16) conductor wire (18) on, the outerplanar (21) and the PCB(16 of LED(1) heat sink (5)) no conductor planes (22) parallel, and exceed PCB(16) no conductor planes (22), described PCB(16) is installed on the radiator (12) by fixture, between heat sink (5) of LED and the radiator (12) adhesive glue (23) is arranged, its thickness is close to zero; The driver (31) that also comprises printing opacity cell-shell (28), electric connector (30), LED, described driver (31) are positioned in the cavity (32) and electric connector (30) of central authorities of radiator (12); The input of driver (31) links to each other with electric connector (30) through lead-in wire (33), is used to connect external power; The output of driver (31) through the lead-in wire (34) and LED(1) electrode be connected.
8. the LED lamp of the zero thermal resistance structure of great power LED according to claim 7 and radiator, it is characterized in that, described heat sink (5) are gone up to drip and are placed with adhesive glue (23), and described adhesive glue (23) does not contain solid particle, can be silica gel or epoxide-resin glue or plastic cement; Described fixture is screw hole (20) and screw (25).
9. the LED lamp of the zero thermal resistance structure of great power LED according to claim 8 and radiator is characterized in that, the difference in height (D) of outerplanar of described heat sink (5) (21) and no conductor planes (22) PCB(16) is 0.05-5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020297025XU CN201766098U (en) | 2010-08-19 | 2010-08-19 | Zero thermal resistance structure of high-power LED (light-emitting diode) and radiator and LED lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020297025XU CN201766098U (en) | 2010-08-19 | 2010-08-19 | Zero thermal resistance structure of high-power LED (light-emitting diode) and radiator and LED lamp |
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| CN201766098U true CN201766098U (en) | 2011-03-16 |
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| CN201020297025XU Expired - Fee Related CN201766098U (en) | 2010-08-19 | 2010-08-19 | Zero thermal resistance structure of high-power LED (light-emitting diode) and radiator and LED lamp |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102352971A (en) * | 2011-08-23 | 2012-02-15 | 北京觉明光电科技有限公司 | Light emitting diode (LED) light source module and machining method thereof |
| CN102376856A (en) * | 2011-10-24 | 2012-03-14 | 宁波市佰仕电器有限公司 | Thermoelectric separation light-emitting diode (LED) |
| CN103177662A (en) * | 2011-12-21 | 2013-06-26 | 四川柏狮光电技术有限公司 | High-density full color light-emitting diode (LED) display dot matrix module |
| CN103311403A (en) * | 2012-03-06 | 2013-09-18 | 顾淑梅 | Light emitting module |
| CN104534327A (en) * | 2014-12-29 | 2015-04-22 | 苏州汉克山姆照明科技有限公司 | LED illuminating module easy to cool down |
-
2010
- 2010-08-19 CN CN201020297025XU patent/CN201766098U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102352971A (en) * | 2011-08-23 | 2012-02-15 | 北京觉明光电科技有限公司 | Light emitting diode (LED) light source module and machining method thereof |
| CN102376856A (en) * | 2011-10-24 | 2012-03-14 | 宁波市佰仕电器有限公司 | Thermoelectric separation light-emitting diode (LED) |
| CN103177662A (en) * | 2011-12-21 | 2013-06-26 | 四川柏狮光电技术有限公司 | High-density full color light-emitting diode (LED) display dot matrix module |
| CN103177662B (en) * | 2011-12-21 | 2015-01-21 | 四川柏狮光电技术有限公司 | High-density full color light-emitting diode (LED) display dot matrix module |
| CN103311403A (en) * | 2012-03-06 | 2013-09-18 | 顾淑梅 | Light emitting module |
| CN104534327A (en) * | 2014-12-29 | 2015-04-22 | 苏州汉克山姆照明科技有限公司 | LED illuminating module easy to cool down |
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Granted publication date: 20110316 Termination date: 20190819 |
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