CN201717837U - All-metal packaged quartz crystal resonator - Google Patents
All-metal packaged quartz crystal resonator Download PDFInfo
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- CN201717837U CN201717837U CN2010200460799U CN201020046079U CN201717837U CN 201717837 U CN201717837 U CN 201717837U CN 2010200460799 U CN2010200460799 U CN 2010200460799U CN 201020046079 U CN201020046079 U CN 201020046079U CN 201717837 U CN201717837 U CN 201717837U
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Abstract
The utility model provides an all-metal packaged quartz crystal resonator, which relates to the technical field of quartz crystal resonators. A shell is a metal shell; a base is a metal base; the metal shell is welded with the metal base; the metal base is provided with a hole in which an insulator is packaged; a vibrator lead-out lead is buried in the insulator; a vibrator is fixed on the metal base; and an insulation spacer is arranged below the metal base. The all-metal packaged quartz crystal resonator solves the problems of miniaturization and lamination of a metal packaged surface mounted device (SMD) existing in the prior art and has the characteristics of miniaturization, lamination, novel structure, high production efficiency, low cost, excellent performance, sufficient material, convenience for large-scale batch production, high economic benefit and the like. An all-metal electric resistance welding-packaged laminated SMD quartz crystal resonator can replace 8045GLASS-SMD ceramic glass cement-packaged and 5032SEAM-SMD ceramic/metal resistance welding-packaged products with the same size and specification.
Description
Technical field
The utility model relates to the quartz-crystal resonator technical field.
Background technology
In chip type SMD quartz-crystal resonator series of products, the pedestal of quartz-crystal resonator great majority adopt ceramic/metal (SEAM) and two kinds of packing forms of ceramic/glass glue (GLASS).And these two kinds packing forms adopted all is base of ceramic, packing forms (but crown cap and the welding of base of ceramic valve collar electric resistance welding, the base of ceramic encapsulate) similarities and differences just with ceramic cap employing glass cement.But, because of China starts late to surface mounting technology (SMT), chip type SMD quartz crystal components and parts miniaturization processes technology fell behind 3～5 years than American-European and Japan relatively, though China is very swift and violent in the development of this industry in recent years, from the basic material (pedestal, loam cake, glass cement) of industrial chain front end dependence on import still so far.Yet under the market environment that mobile communication, mobile PC, the development of portable small-sizedization phonotape and videotape electronic terminal product are maked rapid progress, the chip type rate of crystal element and device constantly promotes.According to incompletely statistics, the chip type rate of the various frequency components and parts of 2009 annual global production and marketing is near 50%, and the production capacity of China's (containing overseas-funded enterprise) accounts for more than 80% of the whole world.But, because of the leading basic material of its this industrial chain is controlled by Japan.After impacted by international financial crisis, owing to underestimating market, Japanese pedestal manufacturer stops production or decrement, thereby cause this year annual each size ceramic pedestal in short supply, make foreign capitals (Japanese, Taiwan investment) enterprise's material supplies can guarantee normal operation substantially; And Chinese Enterprise is controlled by it, and " the cleverest housewife can't cook a meal without rice " makes it rate of capacity utilization less than 70%.Because of the monopolization of foreign trader's material is restricting the development of China chip type SMD crystal element and device industry, and on value of the product (main base material expense occupies 35%) we are doing manual work to the foreigner always.How to break through the bottleneck of our development of restriction, will lean on we innovation, go to develop oneself industry by our intellectual property, defeat the rival who monopolizes us., in addition, the encapsulation of above-mentioned ceramic/metal lid electric resistance welding and two kinds of forms of ceramic/glass glue encapsulation have been determined its several deficiencies by its process attribute:
1. ceramic/metal lid electric resistance welding encapsulation
1) different because of its encapsulating material difference (pottery and metal) thermal coefficient of expansion separately, must eliminate stress through twice The high temperature anneal so will realize the high accuracy product requirement, make it equipment investment and energy consumption and improve;
2) packaging technology is that prewelding adds the parallel resistance weldering, and the equipment combination is loaded down with trivial details, cost is high, makes it to invest utilance and reduces.
2. ceramic/glass glue encapsulation
1) it adopts the encapsulation of sintering furnace sintering, and the nearly 15 meters large-scale professional sintering furnace of length is removed outside the high equipment cost, and electrically heated pure resistance circuit has determined its highly energy-consuming factor;
Thermal evaporation when 2) glass cement solidifies causes serious environmental to be polluted; In addition, can the environmental requirement of relative European Union its glass cement up to standard will be the critical point that is difficult to break through to the ROHS detection of product;
3) base of ceramic is easy to generate when being subjected to high pressure or impacting and breaks in processing (prewelding, welding, test) processing procedure, causes gas leakage or disabler.
The utility model content
The purpose of this utility model provides a kind of all-metal material packaged type quartz-crystal resonator, and this product has that volume is little, chip type, superior performance, easy to use, characteristics such as cost is low, good manufacturability.
The utility model is achieved in that a kind of all-metal material packaged type quartz-crystal resonator, comprise metal shell and oscillator, it is characterized in that having metal base, it between metal shell and metal base Welding Structure, oscillator is fixed on the metal base, and metal base is provided with the hole, is packaged with insulator in the hole, be embedded with oscillator in the insulator and draw lead, be provided with the tape insulation pad below the metal base.
Described Welding Structure is preferable, the good leak tightness of electric resistance welding soldering and sealing structure.
It is preferable that described insulation spacer is provided with printed wire, and oscillator is drawn lead and linked to each other with printed wire, and printed wire is provided with the external connection terminal.
Described metal shell can be made by the punching press of Zn-Cu-Ni alloy strip material, and technology is simple, be easy to automation, industrialization production;
Described metal base can be made by the punching press of cold-rolled steel sheet material, and the material cost is low, technology simple, be easy to automation, industrialization production;
Described metal shell, the used metal material of metal base also can be other coloured or ferrous material if the two can weld.
Described glass insulator is that glass dust is rolling, sintering forms, and technical maturity, easily is automated;
Can be to be the bonded structure of the bonding agent of main material preparation with epoxy resin and silver powder between described metal base and oscillator.
The utility model structure can change on specification.As 8036 specifications being dwindled into 5032 specifications, be characterized in that size is little, difficulty of processing is big.The product of the reliable two kinds of all-metals encapsulation of the utility model specification substitutes the product specification of two kinds of chip type SMD ceramic packaging, as substituting the 8045 type products that the GLASS glass cement encapsulates by 8036; Lean on 5032 products of 5032 alternative SEAM ceramic/metals encapsulation etc.
The utlity model has outstanding technological innovation effect: it has overcome the deficiency of prior art, has finely solved that prior art is medium-term and long-term to be existed and miniaturization, the chip type problem of unsolved metallic packaging SMD always; Characteristics such as the utility model product has that volume is little, chip type, superior performance, cost are low, good manufacturability; The chip type SMD quartz-crystal resonator of electric resistance welding encapsulation that can all-metal material has substituted the encapsulation of 8045GLASS-SMD glass-ceramic glue and 5032SEAM-SMD ceramic/metal electric resistance welding encapsulating products of corresponding size specification.Its preparation technology's good manufacturability, production efficiency height, cost is low, material is sufficient, be convenient to large-scale mass production, the economic benefit height.
Be described further below in conjunction with an accompanying drawing and an embodiment, but not as to qualification of the present utility model.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment 1.
Fig. 2 is the A-A cutaway view of Fig. 1.
Fig. 3 is the upward view of Fig. 1.
Number in the figure explanation: 1, metal shell, 2, metal base, 3, conducting resinl, 4, oscillator, 5, insulation spacer, 6, printed wire, 7, glass insulator.
Embodiment
Embodiment 1:
Referring to Fig. 1～Fig. 2, this all-metal quartz-crystal resonator, comprise shell and pedestal, it is characterized in that shell is that metal shell 1, pedestal are metal base 2,2 of metal shell 1 and metal bases are Welding Structure, and metal base 2 is provided with the hole, be packaged with insulator in the hole, be embedded with oscillator 4 in the insulator and draw lead, oscillator 4 is fixed on the metal base 2, is provided with insulation spacer 5 below the metal base 2.Welding Structure is an electric resistance welding soldering and sealing structure.Metal shell 1 is made by the punching press of Zn-Cu-Ni alloy strip material.Metal base 2 is made by the punching press of cold-rolled steel sheet material.Insulator is the insulator 7 of glass dust sintering.4 of metal base 2 and oscillators are to be the bonded structure of the bonding agent of main material preparation with epoxy resin and silver powder.Insulation spacer 5 is provided with printed wire 6.Printed wire not only plays insulating effect, the printed wire on the while pad and the realization of the circuit on the PCB welding of quartz-crystal resonator and PCB.
For example the utility model can be made the product of JS-SMD 8036,5,032 two kinds of specifications of JS-SMD, and the two is that size is different with parameter.JS-SMD5032 all-metal quartz-crystal resonator frequency can cover 8.000MHz ~ 125.000MHz, and the frequency size is by the tangential of wafer and thickness decision; JS-SMD8036 all-metal quartz-crystal resonator frequency can cover different frequency between 4.000MHz ~ 125.000MHz.The utility model is a kind of new structure of SMD quartz-crystal resonator.
Preparation technology is:
Main technique is with in rammed two holes on the metal base 2, imbed glass insulator 7 and sinter two lead-in wires that have the head of a nail that insulate with substrate into, on the head of a nail that is embedded with the pedestal inner chamber of drawing lead-in wire, 4 adhesive curings of quartz vibrator are made it to form the loop at two ends by conducting resinl, thereafter welding forms airtight cavity volume by electric resistance welding with shell 1, the last insulation spacer 5 that puts on the bottom surface of pedestal 2 is printed the wiring circuit by silk screen printing in the wire terminals of pad and pedestal again.Specifically can be following operation:
1), shell forms by the punching press of Zn-Cu-Ni alloy strip material, material thickness 0.1mm, plating nickel on surface, the depth of parallelism is less than 0.02mm;
2), strike out pedestal substrate with cold rolling A3 steel plate materials;
3), on pedestal substrate, go between with the glass dust sintering;
4), according to requirements such as frequency, cut type, vibration mode designs resonator specifications parameter, process the quartz wafer of 3018 specifications or 5018 specifications;
5), plated film makes it to meet the necessary electrode of inverse piezoelectric effect on wafer;
6), quartz wafer is used conductive adhesive on pedestal lead-in wire (head of a nail) solder side;
7), pedestal, wafer, conducting resinl solidify in curing oven jointly;
8), adjusting frequency makes it to adhere to specification, shell is buckled on the oscillator that pedestal, wafer and conducting resinl form;
9), shell and oscillator are formed airtight cavity volume with the soldering and sealing of resistance welder, the sealing technique maturation, leak rate is low;
10), insulation spacer is enclosed within on the lead-in wire of quartz-crystal resonator, go between with screen printer print at insulation spacer, lead-in wire adopts the mode of silk screen printing can realize that volume is little, and is indeformable;
11), product is worn out and the electrical property sorting.
The utility model has been realized the brand-new encapsulation technology of the SMD quartz-crystal resonator of alternative pottery and glass packaging.By processing, can produce the SMD quartz-crystal resonator of different frequency between 4.000MHz～125.000MHz to quartz wafer.
Claims (6)
1. all-metal material packaged type quartz-crystal resonator, comprise metal shell (1) and oscillator (4), it is characterized in that having metal base (2), between metal shell (1) and metal base (2) is Welding Structure, oscillator (4) is fixed on the metal base (2), and metal base (2) is provided with the hole, is packaged with insulator in the hole, be embedded with oscillator (4) in the insulator and draw lead, be provided with insulation spacer (5) below the metal base (2).
2. all-metal material packaged type quartz-crystal resonator according to claim 1 is characterized in that described Welding Structure is an electric resistance welding soldering and sealing structure.
3. all-metal material packaged type quartz-crystal resonator according to claim 1, it is characterized in that described insulation spacer (5) is provided with printed wire (6), oscillator (4) is drawn lead and is linked to each other with printed wire (6), and printed wire (6) is provided with the external connection terminal.
4. all-metal material packaged type quartz-crystal resonator according to claim 1 is characterized in that described metal shell (1) made by the punching press of Zn-Cu-Ni alloy strip material.
5. all-metal material packaged type quartz-crystal resonator according to claim 1 is characterized in that described metal base (2) made by the punching press of cold-rolled steel sheet material.
6. all-metal material packaged type quartz-crystal resonator according to claim 1 is characterized in that described insulator is glass insulator (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200460799U CN201717837U (en) | 2010-01-11 | 2010-01-11 | All-metal packaged quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010200460799U CN201717837U (en) | 2010-01-11 | 2010-01-11 | All-metal packaged quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201717837U true CN201717837U (en) | 2011-01-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010200460799U Expired - Fee Related CN201717837U (en) | 2010-01-11 | 2010-01-11 | All-metal packaged quartz crystal resonator |
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| CN (1) | CN201717837U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101777883A (en) * | 2010-01-11 | 2010-07-14 | 三河奥斯特电子有限公司 | All-metal material packaged type quartz-crystal resonator and preparation process thereof |
-
2010
- 2010-01-11 CN CN2010200460799U patent/CN201717837U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101777883A (en) * | 2010-01-11 | 2010-07-14 | 三河奥斯特电子有限公司 | All-metal material packaged type quartz-crystal resonator and preparation process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110119 Termination date: 20140111 |