CN201393207Y - Plastic double-bracket quartz crystal resonator packaged by ultra-thin metal casing - Google Patents
Plastic double-bracket quartz crystal resonator packaged by ultra-thin metal casing Download PDFInfo
- Publication number
- CN201393207Y CN201393207Y CN200920171766U CN200920171766U CN201393207Y CN 201393207 Y CN201393207 Y CN 201393207Y CN 200920171766 U CN200920171766 U CN 200920171766U CN 200920171766 U CN200920171766 U CN 200920171766U CN 201393207 Y CN201393207 Y CN 201393207Y
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- crystal resonator
- quartz crystal
- plastic
- insulation sheet
- bracket
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- Expired - Fee Related
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The utility model discloses a plastic double-bracket quartz crystal resonator packaged by an ultra-thin metal casing, which comprises a metal bottom plate (6), a pin (8), a mounting bracket, a wafer (4) and a metal casing (1). The mounting bracket consists of a pair of plastic insulating discs (2 and 5) made of epoxy resin or polyphenylene sulfide (PPS) plastic, the plastic insulating discs (2 and 5) are arranged on the surface of the bottom plate (6) and are both printed with an electrode (9) thereon, and the electrode (9) is electronically connected with the pin (8). The height of the quartz crystal resonator product provided by the utility model is reduced to 1.5mm, and the quartz crystal resonator product remains the advantages of the all-metal packaged quartz crystal resonator, including good sealing performance, rapid heat radiation and low manufacturing cost.
Description
Technical field
The utility model relates to quartz-crystal resonator, specifically a kind of ultrathin metal shell-packaged quartz crystal resonator.
Background technology
Metal shell-packaged quartz crystal resonator is made up of metal shell, pin, mounting bracket, wafer and metal shell, and mounting bracket is a pair of two metal clipss on the pin that are separately fixed at, and wafer is installed on the metal clips.Since metal clips can be along with the vibration of crystal up-down vibration, run into base plate and cause short circuit for avoiding wafer to run into shell or shell fragment, the metal clips upper and lower side need leave the above space of 0.7mm at least, therefore, the whole height of this quartz-crystal resonator is higher, usually about 4mm, the thinlyyest can not be lower than 2mm yet, can not satisfy the requirement of hyundai electronics complete machine slimming.
Though the SMD of surface attaching type is thinner, height can reach below the 1.0mm, owing to adopt ceramic cavity configuration, and the cost height of ceramic base, and because the sealing of ceramic base and metal top cover will be adopted Parallel Seam Sealing Technology, apparatus expensive, manufacturing cost are very high.
Be to reduce the cost of SMD product,,, cause when crystal uses easily by environmental pollution performance depreciation, even failure of oscillation with the problem of advancing also to bring poor sealing though adopt the mode of ceramic loam cake, glass cement hot curing encapsulation can reduce the product height.
Therefore, formed the parallel soldering and sealing type of high added value use for electronic products quartz crystal oscillator on present market, glass packaging SMD is used for the general crystal oscillator that requires, the ordinary electronic product situation of 49S crystal oscillator.
Summary of the invention
The purpose of this utility model provides a kind of ultrathin metal shell encapsulated plastic double bracket quartz-crystal resonator, and this resonator can effectively reduce the product height, and simple in structure, production cost is low.
The utility model is achieved by following proposal: comprise metal base plate, pin, mounting bracket, wafer and metal shell, mounting bracket is made up of a pair of plastic insulation sheet of being made by epoxy resin or pps plastics, the plastic insulation sheet is placed on backplate surface, be printed with electrode respectively on each plastic insulation sheet, described electrode is electrically connected with respective pins.Because the thin slice that mounting bracket adopts plastic insulation material to make, its controllable thickness is built in 0.1-0.25mm, do not need insulation between plastic insulation sheet and metal shell and the base plate, can directly be placed on the base plate, gap between plastic insulation sheet and the metal shell also can reduce, thereby the product height can be reduced to 1.5mm, make product ultra-thin.
For convenience being connected of plastic insulation sheet and pin, priority scheme is to have the installing hole that cooperates with pin on each plastic insulation sheet.
The utility model is not owing to need insulation between plastic insulation sheet and metal shell and the base plate, thereby can make the quartz-crystal resonator product height of common metal shell encapsulation be reduced to 1.5mm, make product ultra-thin, meet the modern electronic technology development need, and kept all-metal packaged quartz crystal resonator good seal performance, rapid heat dissipation, advantage of low manufacturing cost, both can make plug-in type and also can make the SMD type.
Description of drawings
Fig. 1 is the utility model structural representation.
Fig. 2 is a plastic insulation chip architecture schematic diagram.
Fig. 3 is the another kind of structural representation of plastic insulation sheet.
Among the above-mentioned figure: 1, metal shell, 2, the plastic insulation sheet, 3, conducting resinl, 4, wafer, 5, the plastic insulation sheet, 6, base plate, 7, bead, 8, pin, 9, electrode, 10, installing hole.
Execution mode
The utility model structure as shown in Figure 1, comprise metal base plate 6, pin 8, mounting bracket, wafer 4 and metal shell 1, mounting bracket is made up of a pair of plastic insulation sheet of being made by epoxy resin or pps plastics 2,5, plastic insulation sheet 2,5 is placed on base plate 6 surfaces, be printed with silver electrode 9 respectively on the plastic insulation sheet 2,5, as shown in Figures 2 and 3, the shape of plastic insulation sheet can be square or circular, has the installing hole 10 that is connected with pin on the every plastic insulation sheet.Electrode 9 on the plastic insulation sheet 2,5 and respective pins 8 are electrically connected by conducting resinl.Wafer 4 is installed on the plastic insulation sheet 2,5 and is electrically connected with electrode 9 on the plastic insulation sheet with conducting resinl 3.Pin shown in Fig. 18 is a plug-in type, and the utility model pin also can be processed into the SMD type.
Because the thin slice that the plastic insulation sheet adopts insulating material to make, its controllable thickness is built in 0.1-0.25mm, do not need insulation between plastic insulation sheet and metal shell and the base plate, can directly be placed on the base plate, gap between plastic insulation sheet and the metal shell also can reduce, thereby the product height can be reduced to 1.5mm, make product ultra-thin.
Claims (2)
1, ultrathin metal shell encapsulated plastic double bracket quartz-crystal resonator, comprise metal base plate [6], pin [8], mounting bracket, wafer [4] and metal shell [1], it is characterized in that: mounting bracket is made up of a pair of plastic insulation sheet of being made by epoxy resin or pps plastics [2,5], plastic insulation sheet [2,5] is placed on base plate [6] surface, the plastic insulation sheet is printed with electrode [9] respectively on [2,5], and described electrode [9] is electrically connected with respective pins [8].
2, ultrathin metal shell encapsulated plastic double bracket quartz-crystal resonator according to claim 1 and 2 is characterized in that each plastic insulation sheet [2,5] is provided with the installing hole [10] that cooperates with pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920171766U CN201393207Y (en) | 2009-04-24 | 2009-04-24 | Plastic double-bracket quartz crystal resonator packaged by ultra-thin metal casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920171766U CN201393207Y (en) | 2009-04-24 | 2009-04-24 | Plastic double-bracket quartz crystal resonator packaged by ultra-thin metal casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201393207Y true CN201393207Y (en) | 2010-01-27 |
Family
ID=41600028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920171766U Expired - Fee Related CN201393207Y (en) | 2009-04-24 | 2009-04-24 | Plastic double-bracket quartz crystal resonator packaged by ultra-thin metal casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201393207Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101873112A (en) * | 2010-07-07 | 2010-10-27 | 铜陵市晶赛电子有限责任公司 | Ultrathin ceramic-packaged quartz crystal resonator |
| CN107733388A (en) * | 2017-09-20 | 2018-02-23 | 戴承萍 | The processing method of resonator and resonator |
-
2009
- 2009-04-24 CN CN200920171766U patent/CN201393207Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101873112A (en) * | 2010-07-07 | 2010-10-27 | 铜陵市晶赛电子有限责任公司 | Ultrathin ceramic-packaged quartz crystal resonator |
| CN107733388A (en) * | 2017-09-20 | 2018-02-23 | 戴承萍 | The processing method of resonator and resonator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Changxing Electronics Co., Ltd. of Qiangyue County of Fujian Province Assignor: Tongling Jingweite Electronics Co.,Ltd. Contract record no.: 2010350000092 Denomination of utility model: Plastic double-bracket quartz crystal resonator packaged by ultra-thin metal casing Granted publication date: 20100127 License type: Exclusive License Record date: 20100524 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100127 Termination date: 20120424 |